JP2973982B2 - Image inspection method of molded terminal of electronic component and chip type electronic component - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inspecting an image of a molded terminal of an electronic component and a chip-type electronic component, and more particularly to a method of extracting an electrode terminal from a molded resin sheath with a lead frame and molding the same along the mold of the electronic component. The present invention relates to a technology that can be effectively used to inspect the shape of a terminal of a chip-type electronic component by an image processing device.

[0002]

2. Description of the Related Art A conventional image inspection method for a molded terminal of an electronic component will be described with reference to FIGS. The two electrode terminals 51a, 51b are arranged along the side surface of the mold 52 from the center of the side surface of the mold resin outer casing (hereinafter, referred to as a mold) 52, and further, the cut ends 53a, 53 of the terminals 51a, 51b.
b is bent to the center of the bottom surface of the mold 52, a camera 54 is arranged so that the bottom surface of the chip type electronic component can be photographed, and the terminals 51a and 51b of the terminals 51a and 51b are not shown. Bent parts 55a, 5
The length A from 5b to the cut ends 53a, 53b is measured as the terminal length, and then the bent portion 5 of each terminal 51a, 51b is measured.
The distance B between 5a and 55b was measured as the total length of the product, and was compared with a specified value to check that the terminals 51a and 51b were formed into a desired shape length.

[0003]

The problem with the prior art is that the surface image processing apparatus cannot accurately detect the bent portions 55a and 55b of the terminals 51a and 51b. The reason is that the bent portions 55a of the terminals 51a, 51b,
55b is because it is difficult for the image processing apparatus to accurately extract the boundary between the bent portions 55a and 55b because the state of light reflection gradually changes.

Accordingly, the present invention provides an inspection method and an electronic component for using an edge (edge portion) where a terminal boundary is clear as a measurement point without using a bent portion of the terminal having poor measurement accuracy as a tide fixed point. To improve the reliability of inspection.

[0005]

In order to solve the above-mentioned problems, in the inspection method according to the present invention, a mold resin sheathing is performed, and an electrode terminal is taken out from an opposite side surface of the mold resin sheath by a lead frame. In an electronic component molded along the side surface to the bottom surface, a characteristic shape is formed in advance in a part of an electrode terminal in a state of a lead frame, and the lead frame is cut and molded. In this method, the characteristic shape, the length to the cut end, and the length between both cut ends were measured, and a comparison with a specified value was performed to determine whether the molded shape was a desired shape. As the characteristic shape in this case, a notch or a hole can be adopted, but preferably a notch or a hole including an edge portion parallel to the cut end of the electrode terminal is preferable. As the target electronic component, a chip-type electronic component is particularly suitable. On the other hand, in the electronic component of the present invention, the molding resin exterior is performed, the electrode terminal is taken out from the opposite side surface of the molding resin exterior by a lead frame, and the lead frame is cut into a required length as an electrode terminal to form the molding resin exterior. In a chip-type electronic component molded along the bottom surface from the side surface, the electrode terminal portion along the bottom surface of the mold resin exterior has a characteristic shape with cutouts and holes including an edge portion parallel to the cut end of the electrode terminal. The configuration was formed.

According to the present invention, the total length of the terminal from the cut end to the base of the terminal is determined by measuring the characteristic shape formed on the terminal and the length to the cut end and determining whether the length is within a specified value. Guarantee. Next, the length between the cut ends of both terminals is measured, and if the total length of the cut end and the base of the terminal is guaranteed by determining whether the length is within a specified value, the bottom of the mold is used. The length of each terminal that can be measured and the overall length of the chip-type electronic component can be maintained.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below with reference to FIGS. (Embodiment 1) FIG. 1 is a front view showing an image inspection method for an electronic component molded terminal according to Embodiment 1, FIG. 2 is a bottom view of the electronic component, and FIG. Positional relationship diagram showing cutting position and characteristic shape, FIGS. 4 to 6
FIG. 4 is a front view showing a defective state of terminal molding.

In the present embodiment, as shown in FIG. 3 showing the state of the lead frame before the terminals are formed, portions of the lead frame 10 from which the electrodes are taken out from the opposite side surfaces of the mold 2 become the terminals 1a and 1b. Have cutouts 6a and 6b including edge portions 6aa and 6bb parallel to cut ends 3a and 3b described later. The positions of the notches 6a and 6b are confined from the side surface of the mold 2, and are cut from the center at the position of the symbol X in the cutting process. This is referred to as condition 1.

FIG. 1 shows a state where the cutting and molding of the terminals 1a and 1b are completed and the inspection is performed. Lead frame 10
Are cut along the side surfaces of the mold 2 and further through the bent portions 5a and 5b, the chip-type electronic component T formed toward the center of the bottom surface of the mold 2 is imaged so that the bottom surface can be photographed. The camera 4 of the processing device is provided. The cutouts 6 a and 6 b formed by cutting the lead frame 10 into an L shape can be recognized by the camera 4.

Next, a procedure for measuring by the image processing apparatus will be described. First, the notches 6a, 6b and the cut ends 3a, 3a
By measuring the length C up to b and determining whether the length is within a specified value, the cut ends 3a, 3b and the roots 7a, 7 of the terminals are determined.
The length L up to b is guaranteed. “Length from cut end to terminal base L = length from cut end to cutout C + length from terminal base to cutout M”, where M is condition 1
Therefore, if the dimension C is within the specified value, the dimension L can be guaranteed. This is condition 2.

Next, when the length L between the cut ends 3a, 3b and the roots 7a, 7b of the terminals is guaranteed (condition 2), the length D between the cut ends of both terminals is measured. By determining whether the values are within the specified values, the length A of each terminal and the total length B of the chip-type electronic component T can be guaranteed.

[0012]. FIG.
The reason will be described with reference to FIG. When the L dimension is guaranteed (condition 2), there are three types of molding defects that occur. FIG. 4 shows the case where the bending angles of the roots 7a and 7b of the terminals 1a and 1b are insufficient, and FIG. 5 shows the bent portions 5a and 5b of the terminals.
FIG. 6 shows the bent portions 5a and 5b
Are shifted, and the D dimension becomes longer in each case. That is, if the D dimension is within the specified value, the molding shape is uniquely determined to be the desired shape, and the terminal length A can be guaranteed. At the same time, “the total length B of the chip-type electronic component = the length A of the left terminal + the length D between the cut ends of both terminals + the length A of the right terminal” is satisfied. The total length B of the part T can be guaranteed.

(Embodiment 2) Next, Embodiment 2 of the present invention will be described focusing on differences from Embodiment 1.
This will be described with reference to FIGS. 7 and 8 corresponding to FIGS. 1 and 2 described above.

First, with regard to the difference between the horizontal and horizontal components, the terminal 1
The characteristic shape formed at a fixed position of a, 1b is
a and 11b. The characteristic shape may be a square hole or the like as long as the position can be recognized by the image processing device.

Next, regarding the difference in the method of measurement by the image processing apparatus, the center of the round holes 11a and 11b is calculated,
That is, the length up to the cut ends 3a and 3b is set to the dimension C. Other measurement methods are the same as in the first embodiment.

When the characteristic shape is a square hole, for example, a triangle, a quadrangle, and a polygon having more than that can be adopted. However, in that case, the cut ends 3a, 3a
b (eg, 6aa, 6bb in FIG. 2)
It is desirable to have a shape of a hole having an edge portion shown by ().

The reason is that it is not necessary to calculate the center of the hole. That is, since the edge portion of the hole becomes a clear edge, the length from the cut end to the edge portion can be measured, and this can be set as the dimension C.

In each of the above embodiments, the configuration of the chip-type electronic component T and the inspection method thereof have been described. However, the present invention is also applied to electronic components with terminals other than the chip-type electronic component. be able to.

[0019]

An advantage of the present invention is that the molded shape of the terminal of an electronic component can be inspected with high precision by an image processing apparatus. The reason is that the formation of the characteristic shape on a part of the terminal makes it possible to make all the points for determining the shape of the terminal into edges (edge portions) where the boundaries of the terminals are clear. In addition, since the chip-type electronic component according to the present invention has the notch or the hole including the edge portion where the boundary of the terminal is clear, when the inspection method using the image processing apparatus having the edge portion as the measurement point, the inspection is performed. Can be improved. In addition, this characteristic shape can be formed simultaneously and easily, for example, in the step of cutting the lead frame.

[Brief description of the drawings]

FIG. 1 is a front view showing an image inspection method for an electronic component molded terminal according to Embodiment 1 of the present invention.

FIG. 2 is a bottom view showing an image inspection method for an electronic component molded terminal according to Embodiment 1 of the present invention.

FIG. 3 is a positional relationship diagram showing a cutting position and a characteristic shape of a lead frame before forming a terminal according to the first embodiment of the present invention.

FIG. 4 is a front view showing a first example of a defective state of terminal molding.

FIG. 5 is a front view showing a second example of a defective state of the terminal molding.

FIG. 6 is a front view showing a third example of a defective state of the terminal molding.

FIG. 7 is a front view showing an image inspection method for an electronic component molded terminal according to Embodiment 2 of the present invention.

FIG. 8 is a bottom view showing an image inspection method of an electronic component molded terminal according to Embodiment 2 of the present invention.

FIG. 9 is a front view illustrating a conventional image inspection method for an electronic component molded terminal.

FIG. 10 is a bottom view showing a conventional image inspection method for an electronic component molded terminal.

[Explanation of symbols]

 1a, 1b, 51a, 51b Terminal (electrode terminal) 2, 52 Mold (mold resin exterior) 3a, 3b, 53a, 53b Cut end 4, 54 Camera 5a, 5b, 55a, 55b Bend 6a, 6b Notch (features) Shape) 6aa, 6bb Edge 7a, 7b Terminal base 10 Lead frame 11a, 11b Round hole (characteristic shape) T, T1 Electronic component

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) G01B 11/00-11/30 102 G01N 21/84-21/91 H05K 3/30 H05K 13/00-13 / 04

Claims (6)

(57) [Claims] 1. An electronic component formed by molding a resin package, extracting electrode terminals from a side surface of the molding resin package facing the opposite side by a lead frame, and molding the electronic terminal along a side surface to a bottom surface of the molding resin package. After forming a characteristic shape in a part of the portion to be an electrode terminal in, cutting and molding the lead frame,
Using an image processing device, the characteristic shape, the length to the cut end and the length between both cut ends are measured, and a comparison with a specified value is performed to check whether or not the molded shape is a desired shape. An image inspection method for a molded terminal of an electronic component. 2. The method for inspecting an image of a molded terminal of an electronic component according to claim 1, wherein the characteristic shape is a notch. 3. The method for inspecting an image of a molded terminal of an electronic component according to claim 1, wherein the characteristic shape is a hole. 4. The molding of an electronic component according to claim 1, wherein the characteristic shape is a notch or a hole including an edge portion parallel to a cut end of the electrode terminal. Image inspection method for terminals. 5. The method for inspecting an image of a molded terminal of an electronic component according to claim 1, wherein said electronic component is a chip-type electronic component. 6. A mold resin sheathing is performed, an electrode terminal is taken out from an opposite side surface of the mold resin sheath by a lead frame, the lead frame is cut into a required length as an electrode terminal, and the mold resin sheath is cut from a side surface to a bottom surface. In the chip-type electronic component molded along the shape, the electrode terminal portion along the bottom surface of the mold resin exterior has a characteristic shape having cutouts and holes including an edge portion parallel to the cut end of the terminal. A chip-type electronic component.