JP2983016B2 - High frequency switch module for multi-band - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency composite component, and more particularly to a multi-band high-frequency switch module which handles a plurality of transmission / reception systems having different pass bands.

[0002]

2. Description of the Related Art In a digital portable telephone or the like, a high-frequency switch is used to switch a connection between an antenna ANT and a transmission circuit TX and a connection between an antenna ANT and a reception circuit RX. As this high frequency switch,
There is one disclosed in JP-A-6-197040.

This conventional high-frequency switch includes a first diode having an anode connected to a transmitting circuit and a cathode connected to an antenna, a strip line connected between the antenna and the receiving circuit, and a strip line connected to the receiving circuit. The strip line includes a second diode connected to the anode and the cathode connected to the ground side, the strip line is built in the multilayer substrate, and the first diode and the second diode are mounted on the multilayer substrate. Further, this conventional high-frequency switch simply corresponds to one transmission / reception system (single band).

[0004]

The spread of mobile phones in recent years has been remarkable, and the functions and services of mobile phones have been improved. As this new mobile phone,
Proposals for dual band mobile phones have been made. This dual-band mobile phone handles two transmission / reception systems while a normal mobile phone handles only one transmission / reception system. As a result, the user can select and use a convenient transmission / reception system.

[0005] In this dual-band mobile phone, if a dedicated circuit is configured for each transmission / reception system,
This leads to larger equipment and higher costs. It is advantageous to use a common part as much as possible for the common part to reduce the size and cost of the device.

The present invention provides a multi-band high-frequency switch module having a common antenna and capable of switching between a transmission circuit and a reception circuit of a first transmission / reception system and a transmission circuit and a reception circuit of a second transmission / reception system. It is an object of the present invention to provide a multi-band high-frequency switch module for handling a plurality of transmission / reception systems having different pass bands, and to constitute the multi-band high-frequency switch module with one chip.

[0007]

Means for Solving the Problems A first invention of the present invention is:
A high-frequency switch module for handling a plurality of transmission / reception systems having different pass bands, the switch comprising: a demultiplexing circuit for demultiplexing a signal into the plurality of transmission / reception systems; and a switch for switching between a transmission system and a reception system for each of the transmission / reception systems. A circuit, wherein the branching circuit is composed of an LC circuit, the switch circuit has a diode and a transmission line as main components, and the LC circuit of the branching circuit and the transmission line of the switch circuit are formed of an electrode pattern and a dielectric. The diode is configured by being disposed on the laminate, and the electrode pattern for the transmission line of the switch circuit is sandwiched between ground electrodes in the laminate. The electrode pattern for the capacitance component of the demultiplexing circuit is formed in the region above the ground electrode on the upper side of the ground electrodes sandwiching the electrode pattern for the transmission line. An electrode pattern for an inductance component of the branching circuit is formed on a top of the electrode through a dielectric layer, and an electrode pattern for an inductance component of the branching circuit is formed on the top of the electrode pattern for the capacitance component via a dielectric layer. On the surface, a common terminal of the plurality of transmission / reception systems, a transmission system terminal of each of the transmission / reception systems, and a reception system terminal are formed. It is a high-frequency switch module.

According to a second aspect of the present invention, there is provided a high-frequency switch module for handling a plurality of transmission / reception systems having different pass bands, comprising a demultiplexing circuit for demultiplexing a signal to the plurality of transmission / reception systems. Each has a switch circuit for switching between a transmission system and a reception system, each transmission system of the switch circuit has a low-pass filter, the branching circuit is configured by an LC circuit, and the switch circuit includes a diode and a transmission line. The main configuration, the low-pass filter is configured by an LC circuit, the LC circuit of the demultiplexing circuit, the LC circuit of the low-pass filter, and the transmission line of the switch circuit are disposed in a laminate of an electrode pattern and a dielectric layer. An electrode pattern, wherein the diode is arranged on the laminate, and an outer surface of the laminate has a common terminal for the plurality of transmission / reception systems; Serial is a respective transmission system terminals, high-frequency switch module for multi-band handle multiple reception systems having different pass bands, wherein the reception system terminals are formed for each transmission and reception system.

According to a third aspect of the present invention, in the laminate of the second aspect, an electrode pattern for a transmission line of the switch circuit is formed in a region sandwiched between ground electrodes, and a capacitance of the branching circuit is provided. The electrode pattern for the component and the electrode pattern for the capacitance component of the low-pass filter circuit are:
Among the ground electrodes sandwiching the transmission line electrode pattern, an electrode pattern for the inductance component of the branching circuit and an inductance pattern for the low-pass filter circuit are formed above the upper ground electrode via a dielectric layer. Is a multi-band high-frequency switch module characterized by being formed above a capacitor component electrode pattern via a dielectric layer.

According to a fourth aspect of the present invention, in the laminate of the second or third aspect, the branching circuit and the low-pass filter circuit are formed separately in different regions in the horizontal direction of the laminate. This is a multi-band high-frequency switch module characterized in that:

According to a fifth aspect of the present invention, there is provided a high-frequency switch module for handling a plurality of transmission / reception systems having different pass bands, comprising: a demultiplexing circuit for demultiplexing a signal to the plurality of transmission / reception systems; Each has a switch circuit for switching between a transmission system and a reception system, the demultiplexing circuit is configured by an LC circuit, the switch circuit has a diode and a transmission line as a main configuration, and the LC circuit of the demultiplexing circuit and the switch. The transmission line of the circuit is configured by the electrode pattern in a laminate of an electrode pattern and a dielectric layer, and the diode is configured to be disposed on the laminate, and an outer surface of the laminate includes A common terminal of a plurality of transmitting and receiving systems, a transmitting terminal and a receiving terminal of each of the transmitting and receiving systems are formed, and at least one ground terminal is formed on each side surface of the laminate. It is a high-frequency switch module for multi-band, wherein.

According to a sixth aspect of the present invention, there is provided a high-frequency switch module for handling a plurality of transmission / reception systems having different pass bands, comprising: a demultiplexing circuit for dividing a signal into the plurality of transmission / reception systems; Each has a switch circuit for switching between a transmission system and a reception system, the demultiplexing circuit is configured by an LC circuit, the switch circuit has a diode and a transmission line as a main configuration, and the LC circuit of the demultiplexing circuit and the switch. The transmission line of the circuit is configured by the electrode pattern in a laminate of an electrode pattern and a dielectric layer, and the diode is configured to be disposed on the laminate, and an outer surface of the laminate includes A plurality of common terminals of the transmission / reception systems, respective transmission system terminals of the respective transmission / reception systems, and reception system terminals are formed, and between the high-frequency terminals (the common terminals, the respective transmission system terminals, and the respective reception system terminals), Land terminal or switch circuit control terminal is arranged, which is a high-frequency switch module for multi-band, characterized in that is arranged in a structure in which the high-frequency terminals are not adjacent to each other.

According to a seventh aspect of the present invention, there is provided a high-frequency switch module for handling a plurality of transmission / reception systems having different pass bands, comprising: a demultiplexing circuit for demultiplexing a signal to the plurality of transmission / reception systems; Each has a switch circuit for switching between a transmission system and a reception system, the demultiplexing circuit is configured by an LC circuit, the switch circuit has a diode and a transmission line as a main configuration, and the LC circuit of the demultiplexing circuit and the switch. The transmission line of the circuit is configured by the electrode pattern in a laminate of an electrode pattern and a dielectric layer, and the diode is configured to be disposed on the laminate, and an outer surface of the laminate includes A plurality of common terminals of the transmission / reception systems, respective transmission system terminals of the respective transmission / reception systems, and reception system terminals are formed, and between the high-frequency terminals (the common terminals, the respective transmission system terminals, and the respective reception system terminals), Without even a high-frequency switch module for multi-band, characterized in that one ground terminal is disposed.

According to an eighth aspect of the present invention, there is provided a multi-band high-frequency switch module according to the fifth, sixth, and seventh aspects, wherein each transmission system of the switch circuit has a low-pass filter.

According to a ninth aspect of the present invention, in any one of the first to eighth aspects, a metal case surrounding the chip element disposed on the laminate is disposed on the laminate. Is a multi-band high frequency switch module.

[0016]

[0017]

[0018]

[0019]

[0020]

[0021]

[0022]

[0023]

[0024]

[0025]

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention relates to a multi-band high-frequency switch module for handling a plurality of transmission / reception systems having different pass bands. The multi-band high-frequency switch module has a laminated structure and a chip component on the laminated body. By arranging, it is configured to be small. For example,
A high-frequency device that shares an antenna, connects the transmitting system and the receiving system of the first transmitting / receiving system, the transmitting system and the receiving system of the second transmitting / receiving system having different passbands from the first transmitting / receiving system, and the antenna, and switches as appropriate. Switch module can be obtained,
For example, it is effective in a dual band mobile phone or the like.

According to the present invention, a common terminal for a plurality of transmission / reception systems,
The transmission system terminal and the reception system terminal of each transmission / reception system are formed on the side surface of the multilayer body, and can be surface-mounted. Each terminal formed on this side surface may be extended to its upper surface or lower surface. At least one ground terminal is formed on each side surface. By arranging the ground terminals on each side surface, it is possible to reduce the loss of the multiband high-frequency switch module of the present invention.

According to the present invention, a common terminal for a plurality of transmission / reception systems,
The transmission system terminal and the reception system terminal of each transmission / reception system are terminals for high frequency signals, and are called high frequency terminals. The high-frequency terminals are formed on side surfaces of the laminate, and are arranged so that the high-frequency terminals are not adjacent to each other. A ground terminal or a switch circuit control terminal is arranged between the high frequency terminals. Preferably, at least one ground terminal is arranged between the high-frequency terminals. Thus, by preventing the high-frequency terminals from being adjacent to each other and by arranging the ground terminals between the high-frequency terminals, it is possible to suppress interference between the high-frequency terminals and reduce the loss.

The switch circuit of each transmission / reception system of the present invention can use a diode switch circuit. This diode switch circuit uses a control terminal for applying a predetermined voltage to the diode. This control terminal is formed on the side surface of the laminate.

In the present invention, it is preferable that the transmission system terminal and the reception system terminal are arranged so close to each other that the transmission system terminals and the reception system terminals are not adjacent to each other. In addition, it is preferable that the transmission system terminal and the reception system terminal are respectively arranged in different regions with respect to the center line of the laminate. Further, it is preferable that the transmission system terminal and the reception system terminal are arranged in line symmetry. With this configuration,
In a device that handles a plurality of transmission / reception systems on which a high-frequency switch module is mounted, it is easy to connect to a transmission system circuit and a reception system circuit.

In the present invention, it is preferable that the common terminal and the transmission terminal and the reception terminal of each transmission / reception system are formed in different regions when the laminate is divided into two parts by a plane perpendicular to the mounting surface. Since the high-frequency switch module is disposed between the antenna and the transmission / reception circuit, this terminal arrangement allows the antenna and the high-frequency switch module and the transmission / reception circuit and the high-frequency switch module to be connected with the shortest line, and an extra loss Can be prevented.

The present invention also provides a transmission / reception system which is provided on one side of an area opposite to the common terminal when the laminated body is divided into two, and the other side is divided into two parts by a plane perpendicular to the mounting surface. It is preferable that the transmission terminals of the respective transmission and reception systems are formed on the other side. For example, since two transmitting circuits and two receiving circuits are arranged collectively, the transmitting terminals and the receiving terminals of the multi-band high-frequency switch module are arranged close to each other, so that the shortest path connection is possible. , Preventing extra losses.

Also, in the present invention, in the laminate, a common terminal of a first transmission / reception system and a second transmission / reception system of the branching circuit, a transmission terminal of the first transmission / reception system, a reception terminal, Each terminal of the transmission terminal and the reception terminal of the second transmission / reception system is:
A ground terminal is formed on the side surface of the laminate, between the terminals. Each input / output terminal is arranged between the ground terminals. As a result, signal leakage between the terminals is blocked, interference is eliminated, and isolation between the signal terminals is ensured.

The laminate of the present invention can incorporate the transmission lines of the branching circuit and the switch circuit. The transmission line of the switch circuit is preferably formed in a region between the ground electrodes. Further, the branching circuit can be configured by an inductance component and a capacitance component.
This branching circuit is preferably arranged above the transmission line in the laminate. It is preferable that a capacitance component is disposed further above the ground electrode above the ground electrode with the transmission line interposed therebetween, and an inductance component is disposed above the capacitance component.

In the present invention, it is preferable to provide each transmission system with a low-pass filter function. As one means for providing this low-pass filter function, a low-pass filter circuit can be built in. This low-pass filter circuit can be composed of an inductance component and a capacitance component. The low-pass filter circuit is preferably disposed above the transmission line in the laminate.
That is, it is preferable that the capacitance component is disposed further above the ground electrode above the ground electrode with the transmission line interposed therebetween, and the inductance component is disposed above the capacitance component.
Further, it is preferable that the low-pass filter circuit and the demultiplexing circuit are arranged in different regions in the horizontal direction of the laminate.

A notch is formed in the ground electrode above the ground electrode sandwiching the transmission line, and a through hole is formed in the notch to conduct to the transmission line. And can be connected.

In the present invention, it is preferable to arrange a metal case so as to surround the chip components arranged on the laminate. This metal case is preferably mounted with the terminal electrodes on the side surfaces of the laminate exposed. Further, the metal case can be fixed to the upper surface of the laminate by soldering. Further, the high-frequency switch module of the present invention can be mounted on the mounter device by using the metal case.

The present invention deals with a plurality of transmission / reception systems having different passbands. Hereinafter, the case where two transmission / reception systems are handled will be described in detail with reference to the drawings.

FIG. 1 shows a circuit block diagram of a first embodiment according to the present invention. In FIG. 1, the high-frequency switch module for multiband of the present invention is a portion surrounded by a broken line. Also, this part is made into one chip. The multi-band high-frequency switch module of the present invention has a dual-band mobile phone antenna ANT, a GSM system as a first transmission / reception system, and a DCS1800 system as a second transmission / reception system. It can be used for distribution with the transmission and reception circuits of the DCS system and the DCS system.

The first embodiment is different from the first embodiment in which the first and second passbands are different.
A high-frequency switch module that handles a transmission / reception system (GSM) and a second transmission / reception system (DCS), and switches a transmission signal and a reception signal of the first transmission / reception system (GSM). A first low-pass filter circuit and a second transmission / reception system (D
CS), a second switch circuit for switching between the transmission signal and the reception signal, a second low-pass filter circuit connected to the transmission line of the second switch circuit, and demultiplexing the first transmission / reception system and the second transmission / reception system. It is composed of a demultiplexing circuit.

FIG. 2 shows an equivalent circuit diagram of an embodiment according to the present invention. In the branching circuit portion connected to the antenna ANT, two notch circuits are the main circuit. That is,
One notch circuit is formed by the inductor LF1 and the capacitor CF1, and another notch circuit is formed by the inductor LF2 and the capacitor CF2. The capacitor CF3 connected to the ground is connected to one notch circuit. This capacitor CF3 is connected for the purpose of improving the low-pass filter characteristics of the demultiplexing characteristics. Further, another notch circuit has an inductor LF3 connected to the ground and a capacitor CF4 connected in series. This inductor LF3 and capacitor CF4
Are connected for the purpose of improving the high-pass filter characteristic of the demultiplexing characteristic.

This demultiplexing circuit may be composed of only two notch circuits. In addition, for example, a band-pass circuit, a low-pass circuit, a high-pass circuit, or the like, other than the notch circuit, may be used as the branching circuit, and these may be appropriately combined.

Next, the first switch circuit will be described. The first switch circuit is a switch circuit on the upper side of FIG. 2 and switches between GSM transmission TX and reception RX. This switch circuit SW has two diodes D
G1 and DG2 and two transmission lines LG1 and LG2. The diode DG1 has an anode connected to the antenna ANT side, a cathode connected to the transmission TX side, and a transmission line LG1 connected to the ground connected to the cathode side. Have been. Then, the transmission line L is placed between the antenna side and the reception RX.
G2 is connected, a diode DG2 whose cathode is connected to its receiving side is connected, a capacitor CG6 is connected to the anode of the diode DG2 and the ground, and a series circuit of a resistor RG and an inductor LG is interposed therebetween. Connected to the control circuit VC1.

The low-pass filter circuit inserted on the transmission TX circuit side is composed of an inductor LG3 and capacitors CG3, CG4, CG7.
It is inserted between the W diode DG1 and the transmission line LG1.

Next, the second switch circuit will be described. The second switch circuit is a switch circuit on the lower side in FIG. 2 and switches between DCS transmission TX and reception RX. This switch circuit SW has two diodes D
P1 and DP2 and two transmission lines LP1 and LP2. The diode DP1 has an anode connected to the antenna ANT side, a cathode connected to the transmission TX side, and a transmission line LP1 connected to the ground connected to the cathode side. Have been. Then, the transmission line L is placed between the antenna side and the reception RX.
P2 is connected, and a diode DP2 having a cathode connected to the reception RX side is connected to the diode DP2.
A capacitor CP6 is connected between the anode and the ground, a series circuit of a resistor RP and an inductor LP is connected therebetween, and connected to the control circuit VC2.

The low-pass filter circuit inserted on the transmission TX circuit side is composed of an inductor LP3 and capacitors CP3, CP4 and CP7.
It is inserted between the W diode DP1 and the transmission line LP1.

Next, FIG. 3 is a plan view of an embodiment according to the present invention, FIG. 4 is a perspective view of a laminated body portion of the embodiment, and FIG. 5 is an internal structure of the laminated body. In this embodiment, a transmission line of a demultiplexing circuit, a low-pass filter circuit, and a switch circuit is formed in a multilayer body, and a diode and a chip capacitor are mounted on the multilayer body. It is what constituted.

The internal structure of the laminate will be described.
In this laminate, a green sheet made of a ceramic dielectric material that can be fired at a low temperature is prepared, and a conductive paste mainly composed of Ag is printed on the green sheet to form a desired electrode pattern. It is configured by laminating and integrally firing.

The internal structure will be described according to the order of lamination.
First, the ground electrode 31 is formed on almost the entire surface of the lower green sheet 11. Then, terminal electrodes 81, 83, 85, 87, 89, 91 formed on the side surfaces,
Connection portions for connecting to 93, 94, and 95 are provided.

Next, a dummy green sheet 12 on which no electrode pattern is printed is laminated. On the green sheet 13 thereon, three line electrodes 41, 42, 43
Are formed, and four line electrodes 44, 45, 46, 47 are formed on the green sheet 14 thereon.
A green sheet 15 on which two through-hole electrodes (the ones with a cross in the figure are cross-holes in the figure are the through-hole electrodes, the same applies hereinafter) is laminated thereon, and a ground electrode 32 is formed thereon. Green sheets 16 are stacked.

The line electrodes formed in the region sandwiched between the two ground electrodes 31 and 32 are appropriately connected to form a transmission line for the first and second switch circuits SW. The line electrodes 42 and 46 are connected by through-hole electrodes to form a transmission line LG1 of an equivalent circuit.
1 and 45 are connected by through-hole electrodes to form a transmission line LG2 of an equivalent circuit; line electrodes 43 and 47 are connected by through-hole electrodes to form a transmission line LP1 of an equivalent circuit; Of the transmission line LP2.

The green sheet 17 laminated on the green sheet 16 has electrodes 61 and 62 for capacitors,
63, 64, 65 and 66 are formed. The green sheet 18 laminated thereon also has the capacitor electrode 6
7, 68, 69 and 70 are formed. On the green sheet 19 laminated thereon, a capacitor electrode 71 is formed.

Further, a green sheet 20 on which line electrodes 48 and 49 are formed is laminated thereon.
Green sheets 21 on which line electrodes 50, 51, 52, 53, 54, 55 are formed are stacked. The uppermost green sheet 22 has lands 23, 24, 25, 26, 27, 28, 29, 33, 3 for mounting element connection.
4, 35, 36 and 37 are formed.

The capacitor electrodes 61, 62, 63, 64, 65 of the green sheet 17 laminated on the green sheet 16 on which the upper earth electrode 32 is formed form a capacitance with the earth electrode 32. The capacitor electrode 61 is connected to the CG4 of the equivalent circuit by the capacitor electrode 62.
Is the equivalent circuit CG3, the capacitor electrode 63 is the equivalent circuit CP4, the capacitor electrode 64 is the equivalent circuit CP3, and the capacitor electrode 65 is the equivalent circuit CF3.
3.

The capacitor electrodes formed on the green sheets 17, 18, and 19 form a capacitance between each other, and constitute an equivalent circuit CF4 between the capacitor electrodes 66 and 70. 69, an equivalent circuit CP7 is formed, and between the capacitor electrodes 62 and 67,
The CG 7 of the equivalent circuit is formed, and the capacitor electrodes 70 and 71
, An equivalent circuit CF2 is formed, and the capacitor electrode 6
8 and 71 constitute an equivalent circuit CF1. In the capacitor electrode 66, a capacitance is formed facing the capacitor electrode 70. At this time, a cutout portion is formed in the ground electrode 32 so as not to face the ground electrode 32. In addition, a through-hole electrode that conducts to the transmission line is formed by using the notch.

In the green sheets 20 and 21, the line electrodes 48 and 55 constitute the equivalent circuit LF1, the line electrodes 54 and 56 constitute the equivalent circuit LF2, and the line electrodes 49 and 53 constitute the equivalent circuit LF3. The line electrode 50 constitutes an equivalent circuit LG3, and the line electrode 52 constitutes an equivalent circuit LP3. The line electrode 51
Is a DC line.

These green sheets were pressed and fired integrally to obtain a laminate. A terminal electrode 8 is provided on the side surface of the laminate.
1, 82, 83, 84, 85, 86, 87, 88, 8
9, 90, 91, 92, 93, 94, 95, 96 were formed. This external view is shown in FIG.

On this laminate, diodes DG1 and D
G2, DP1, DP2, chip capacitors CG1, CG
6, CP1 and CP6. Further, a chip inductor LP4 and a chip capacitor CP8 are mounted. This LC series circuit is connected to improve the isolation characteristics between the transmission TX of this switch circuit and the antenna ANT when the diode is OFF, but it is not always necessary to mount it. FIG. 3 is a plan view showing a state where the mounting element is mounted. FIG. 3 also shows a mounting configuration of the high-frequency switch module. This figure 3
And GRD means a terminal connected to the ground. In this embodiment, in the equivalent circuit shown in FIG.
P2, CP5, CG2, CG5, RG, LG, RP, L
P is formed on a circuit on which the chip component of this embodiment is mounted. Further, the capacitor CP1 may be omitted.

According to this embodiment, when the transmission lines of the first and second switch circuits are formed in the laminate, they are arranged in a region sandwiched between the ground electrodes. This allows
This prevents interference between the switch circuit, the demultiplexing circuit, and the low-pass filter circuit. A region sandwiched between the ground electrodes is arranged below the stacked body to make it easier to obtain a ground potential. Then, an electrode constituting a capacitor connected to the ground is formed so as to face the upper ground electrode.

Further, in this embodiment, each terminal is formed on the side surface of the laminated body, so that the structure can be surface-mounted. In addition, ANT terminal which is a high frequency terminal, DCS type TX terminal, GS
The M-system TX terminal, the GSM-system RX terminal, and the DCS-system RX terminal are arranged so as not to be adjacent to each other, and a ground terminal (GRD) or a control terminal (VC1, VC2) is arranged between the high-frequency terminals. ing. At least one ground terminal is arranged between the high-frequency terminals. Further, at least one ground terminal is arranged on each side surface of the laminate.

In the terminal electrode formed on the side surface of the laminate of this embodiment, a GSM transmission TX terminal is provided on the opposite side of the antenna ANT terminal from which the laminate is divided by a plane perpendicular to the mounting surface. , A reception RX terminal, a transmission TX terminal of the DCS system, and a reception RX terminal. further,
On the other side, a transmission TX terminal of the GSM system and a transmission TX terminal of the DCS system are formed on one half, and a reception RX terminal of the GSM system and a reception RX terminal of the DCS system are formed on the other half. ing.

Further, in the laminate of this embodiment, the antenna ANT terminal formed on the side surface, the GSM transmission TX terminal, the reception RX terminal, the DCS transmission TX terminal, and the reception RX
Each of the high-frequency terminals is sandwiched between ground terminals when viewed in the circumferential direction on the side surface.

According to the embodiment of the present invention, an antenna ANT, a transmission system and a reception system of the GSM system, a transmission system of the DCS1800 system, and a reception system of the dual band portable telephone handling both the GSM system and the DCS1800 system. The multi-band high-frequency switch module capable of switching between the two can be obtained. Further, the present invention is not limited to the above embodiment, and can provide a multi-band high-frequency switch module that handles a plurality of transmission / reception systems having different pass bands.

[0064]

According to the present invention, it is possible to provide a multi-band high-frequency switch module which is extremely useful, for example, in a dual-band portable telephone.
According to the present invention, the multi-band high-frequency switch module can be made compact and one-chip by using a laminated structure. This allows
In a dual-band mobile phone or the like, this is effective for miniaturization of equipment.

[Brief description of the drawings]

FIG. 1 is a circuit block diagram of one embodiment according to the present invention.

FIG. 2 is an equivalent circuit diagram of one embodiment according to the present invention.

FIG. 3 is a plan view of one embodiment according to the present invention.

FIG. 4 is a perspective view of a laminate according to one embodiment of the present invention.

FIG. 5 is an internal structural view of a laminated body according to one embodiment of the present invention.

[Explanation of symbols]

11, 12, 13, 14, 15, 1, 17, 18, 1,
9, 20, 21, 22 Dielectric green sheet 31, 32 Earth electrode 41, 42, 43, 44, 45, 46, 47, 48, 4,
9, 50, 51, 52, 53, 54, 55, 56 Line electrodes 61, 62, 63, 64, 65, 66, 67, 68, 6
9, 70, 71 Electrode for capacitor 81, 82, 83, 84, 85, 86, 87, 88, 8
9, 90, 91, 92, 93, 94, 95, 96 terminal electrodes

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-7-58659 (JP, A) JP-A-9-260901 (JP, A) JP-A-7-312568 (JP, A) 197040 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H04B 1/50 H01L 25/04 H01L 25/18 H01P 1/15

Claims (9)

(57) [Claims] 1. A high-frequency switch module for handling a plurality of transmission / reception systems having different passbands, comprising: a demultiplexing circuit for demultiplexing a signal to the plurality of transmission / reception systems; A switching circuit for switching a receiving system, wherein the demultiplexing circuit is configured by an LC circuit;
The switch circuit has a diode and a transmission line as main components.
The LC line of the circuit and the transmission line of the switch circuit are
In the laminate of the electrode pattern and the dielectric layer, the electrode pattern is provided.
And the diode is disposed on the laminate.
And the switch is arranged in the laminate.
The electrode pattern for the transmission line of the
It is formed in a region sandwiched between the capacitors and serves as a capacitance component of the branching circuit.
An electrode pattern sandwiches the transmission line electrode pattern.
Dielectric on top of the upper ground electrode
Layer, and the inductance component of the branching circuit is formed.
The electrode pattern for sharing is an electrode pattern for the capacitance component.
Formed on top of a dielectric layer via an outer surface of the laminate
A common terminal of the plurality of transmission / reception systems,
The transmission system terminal and the reception system terminal of each
Multiple transmission / reception systems with different passbands
Multi-band high frequency switch module to handle . 2. A plurality of transmission / reception systems having different pass bands are handled.
A high frequency switch module, wherein the plurality of transmission / reception
The system has a demultiplexing circuit for demultiplexing a signal, and the
Each has a switch circuit that switches between the transmission system and the reception system.
A low-pass filter for each transmission system of the switch circuit
The demultiplexing circuit is constituted by an LC circuit, and the switch
The switch circuit is mainly composed of a diode and a transmission line.
The low pass filter is composed of an LC circuit,
An LC circuit, an LC circuit of the low-pass filter, and the switch.
The transmission line of the switch circuit consists of an electrode pattern and a dielectric layer.
The laminated body is constituted by the electrode pattern,
The iodine is arranged and configured on the laminate, and the
On the outer surface of the layered body, a common terminal of the plurality of transmitting / receiving systems,
The transmission and reception terminals of each transmission / reception system are
A plurality of different passbands characterized by
Multi-band high-frequency switch module that handles transmission and reception systems . 3. The switch circuit in the laminate.
Electrodes pattern of transmission line of the road is sandwiched a ground electrode
Electrode formed in a separated area and for a capacitance component of the demultiplexing circuit
For the pattern and the capacitance component of the low-pass filter circuit.
An electrode pattern sandwiches the transmission line electrode pattern.
Dielectric on top of the upper ground electrode
Layer, and the inductance component of the branching circuit is formed.
Electrode pattern and the low-pass filter circuit
The electrode pattern for the conductance component is
Is formed on top of the electrode pattern via a dielectric layer
3. The multi-band high-frequency switch module according to claim 2, wherein: 4. In the laminated body, the demultiplexing circuit and the front
The low-pass filter circuit is a circuit in the horizontal direction of the laminate.
Claims characterized by being formed separately in different areas
4. The high-frequency switch module for multiband according to 2 or 3 . 5. A plurality of transmission / reception systems having different pass bands are handled.
A high frequency switch module, wherein the plurality of transmission / reception
The system has a demultiplexing circuit for demultiplexing a signal, and the
Each has a switch circuit that switches between the transmission system and the reception system.
The demultiplexing circuit is configured by an LC circuit, and the switch
The switch circuit has a diode and a transmission line as main components.
The LC line of the circuit and the transmission line of the switch circuit are
In the laminate of the electrode pattern and the dielectric layer, the electrode pattern is provided.
And the diode is disposed on the laminate.
Arranged on the outer surface of the laminate,
Common terminals of the transmitting and receiving systems,
A communication terminal and a reception terminal are formed, and each side surface of the laminate is formed.
Has at least one ground terminal formed therein.
A high-frequency switch module for a multi-band, comprising: 6. A plurality of transmission / reception systems having different pass bands are handled.
A high frequency switch module, wherein the plurality of transmission / reception
The system has a demultiplexing circuit for demultiplexing a signal, and the
Each has a switch circuit that switches between the transmission system and the reception system.
The demultiplexing circuit is configured by an LC circuit, and the switch
The switch circuit has a diode and a transmission line as main components.
The LC line of the circuit and the transmission line of the switch circuit are
In the laminate of the electrode pattern and the dielectric layer, the electrode pattern is provided.
And the diode is disposed on the laminate.
Arranged on the outer surface of the laminate,
Common terminals of the transmitting and receiving systems,
A communication terminal and a reception terminal are formed, and the high-frequency terminal (front
Between the common terminal, each transmission system terminal, and each reception system terminal) .
The land terminal or switch circuit control terminal is
Make sure that the high-frequency terminals are
High-frequency switch module for multi-band, characterized. 7. A plurality of transmission / reception systems having different pass bands are handled.
A high frequency switch module, wherein the plurality of transmission / reception
The system has a demultiplexing circuit for demultiplexing a signal, and the
Each has a switch circuit that switches between the transmission system and the reception system.
The demultiplexing circuit is configured by an LC circuit, and the switch
The switch circuit has a diode and a transmission line as main components.
The LC line of the circuit and the transmission line of the switch circuit are
In the laminate of the electrode pattern and the dielectric layer, the electrode pattern is provided.
And the diode is disposed on the laminate.
Arranged on the outer surface of the laminate,
Common terminals of the transmitting and receiving systems,
A communication terminal and a reception terminal are formed, and the high-frequency terminal (front
(Common terminal, each transmission system terminal, each reception system terminal)
It is noted that at least one ground terminal is
High-frequency switch module for multi-band and butterflies. 8. A low pass to each transmission system of said switch circuit.
8. The apparatus according to claim 5, further comprising a filter.
Any of the above multi-band high frequency switch modules. 9. A chip device disposed on the laminate,
Make sure that the surrounding metal case is placed on the laminate.
The high-frequency switch module for a multi-band according to any one of claims 1 to 8, wherein