JP2987673B2 - Lead frame manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame manufacturing apparatus, and more particularly to a lead frame manufacturing apparatus capable of coping with various types.

[0002]

2. Description of the Related Art A lead frame used in the manufacture of a semiconductor device is composed of an inner lead, a tie bar, an outer lead, a die pad, a support bar, and the like. Noble metal plating such as silver, nickel, and palladium is performed. At this time, the support bar is pressed and bent by a predetermined height so that the upper surface of the semiconductor chip mounted on the die pad in the mounted state and the tip of the inner lead connected to the semiconductor chip are located on the same plane. Depressing to mutate downward is performed.

[0003] In the case of reel-type plating in which a lead frame wound in a coil shape is continuously plated, the lead frame is formed through a depressing step and a cutting step in which a unit lead frame is cut into 4 to 5 pieces.

[0004] Usually, a depress is used to bend a predetermined portion of a support bar with a die, and is composed of an upper die provided with a bending punch and a lower die having an opening corresponding to the amount of bending. Further, as shown in FIG. 5, the cutting die 2 is also incorporated in this die, and similarly, the cutting is performed using a cutting die of a type corresponding to each type.

[0005] As described above, conventionally, depressing and cutting are performed by a single die provided with each processing station, and are produced for each type having different product dimensions and cut sizes.

[0006]

As described above, conventionally, it is necessary to prepare a mold for each kind, and in the case of small-lot production of many kinds, the cost for the production equipment rises, which increases the product price. The result was reflected.

The present invention has been made in view of the above circumstances, and has as its object to provide a lead frame manufacturing apparatus capable of coping with high-mix low-volume production and forming a low-cost lead frame.

[0008]

SUMMARY OF THE INVENTION Accordingly, an apparatus of the present invention comprises an upper die and a lower die, and pushes down a support bar of a lead frame to displace a die pad supported by the support bar downward. In a lead frame manufacturing apparatus in which a plurality of configured depress dies are arranged and depress processing is performed while running a roll-shaped or plate-shaped lead frame assembly, the depress dies have a support base. The upper part is configured to be movable, and the distance between the depress dies is variable.

Preferably, the depress die is configured to be movable on a support table having a positioning recess formed at a predetermined interval, and is disposed on the bottom of the depress mold so as to correspond to the recess. It is configured such that it can be fixed at a predetermined position on the support table and the distance between the depress dies is variable.

[0010] More preferably, the depress die is configured to be movable on the support base, and a plurality of support blocks of a predetermined length which are removably installed between the depress die are provided. By providing one of the support blocks on a support base, the depress die can be fixed at a predetermined position on the support base, and the distance between the depress die can be changed. According to the second aspect of the present invention, the die pad is constituted by an upper die and a lower die, and is configured to depress the support bar of the lead frame to displace the die pad supported by the support bar downward. A depressing die is disposed, and a depressing process is performed while running a roll-shaped lead frame assembly. In the device, Di press mold and cut means, the upper support table, movably configured, distance Di press die and cutting means cross is variable.

[0011]

According to the first configuration, the position of the depressing die can be changed according to the product pitch of the target product, and it is possible to cope with the manufacture of lead frames of a plurality of products. This is extremely advantageous for the production of many varieties in small quantities.

Further, according to the second configuration, since the depressing die and the cutting means are independent, the position can be set in accordance with the product pitch of the target product, and the production of a plurality of products is possible. It is possible to cope with it, and it is very advantageous for the production of many kinds in small quantities as in the first configuration.

At the time of these positioning, a depressing die or a cutting die is configured to be movable on a support table having a positioning concave portion formed at a predetermined interval, so as to correspond to the concave portion. And a projection provided at the bottom of the depress die, which can be fixed at a predetermined position on the support table, and the distance between the depress die or the cutting die can be easily adjusted. Also, positioning can be easily performed by preparing a plurality of types of support blocks and placing them between the molds.

[0014]

Embodiments of the present invention will be described below in detail with reference to the drawings.

In this lead frame manufacturing apparatus, after performing shape processing such as punching, the lead frame assembly is subjected to depressing while running a roll-shaped lead frame assembly, and is cut at a predetermined number, for example, every 5 units. The depress dies 1a and 1b and the cutting dies 2 are
The upper part is configured to be movable, and the depressed dies 1a, 1b
And the interval between the cutting dies 2 is variable.

In particular, a gauge 4 is provided on the upper surface of the support base 3.
At the same time, concave portions 5 for positioning are formed at predetermined intervals, and a predetermined portion on the support base 3 is formed by using a convex portion 6 provided on the bottom of the depress die so as to correspond to the concave portion 5. Depress dies 1a and 1b and cutting dies 2 at positions
Can be fixed, the distance between the depressing die and the cutting die can be adjusted according to the type of lead frame, and can be applied to a plurality of types of lead frames.

The cutting die can be adjusted by the intermittent driving device 7 to adjust the cutting timing.
The cutting can be performed at an appropriate position according to the type of the lead frame.

Next, a method of forming a lead frame using this lead frame manufacturing apparatus will be described.

First, as shown in FIG. 2, a strip material having copper as a main component was provided with a punching die such as an inner lead 11, an outer lead 12, a tie bar 13, a die pad 14, and a support bar 15 having a desired shape. Mold (not shown)
To perform patterning by pressing.

After passing through the plating step, FIG.
As shown in the figure, the strip-shaped material 10 is set on a feeder 8 provided at an end of the support 3 of the lead frame manufacturing apparatus. In accordance with the type of the lead frame, positioning is performed in accordance with the gauge 4 provided on the support table 3, and the depressions 5 on the surface of the support table are provided with the depressed dies 1 a and 1 b and the projection 6 on the bottom of the cutting die 2. Are fitted to each other to position and fix the depress dies 1a and 1b and the cutting die 2 on the support 3.

Then, the punch 9 of the depress die is lowered together with the upper die, and the die pad portion 14 of the lead frame is pushed down. As shown in FIG. 3, the bonding when the semiconductor chip is mounted on the die pad portion 14 is performed. The pad is molded so that the height of the pad is the same as the height of the tip of the inner lead.

Then, the lead frame is cut by a cutting die, the driving timing of which is controlled by the intermittent driving device 7, at intervals of five lead frames to form a plate-like body.

As described above, according to the lead frame manufacturing apparatus of the present invention, it is not necessary to re-manufacture the die apparatus for each type, it is possible to cope with various types, to prevent a rise in product price, and to reduce cost. Can be manufactured.

In the above embodiment, the lead frame manufacturing apparatus provided with two depressing dies and a cutting die has been described. However, as shown in FIG. The present invention is also applicable to those having a metal mold. Here, the positioning is not performed by fitting the concave portion and the convex portion for positioning, but by providing a positioning block 20 of a predetermined length between the depressing die 1 and the cutting die 2. Is determined.

Further, it is needless to say that the present invention can be applied to a device using three or more depressing dies. No mold is required.

Further, without being limited to the above-described embodiment,
Changes can be made as appropriate without departing from the spirit of the present invention.

[0027]

As described above, according to the present invention,
According to the doframe manufacturing apparatus, the position of the depress mold can be changed according to the product pitch of the target product,
It is possible to cope with the production of multiple types of lead frames, and it is possible to form low-cost and highly reliable lead frames.

[Brief description of the drawings]

FIG. 1 is a diagram showing a lead frame manufacturing apparatus according to an embodiment of the present invention;

FIG. 2 is a view showing a lead frame before molding by the lead frame manufacturing apparatus.

FIG. 3 is a view showing a lead frame after molding by the lead frame manufacturing apparatus.

FIG. 4 is a view showing a lead frame manufacturing apparatus according to another embodiment of the present invention;

FIG. 5 is a diagram showing a conventional lead frame manufacturing apparatus.

[Explanation of symbols]

 1a, 1b Depressing die 2 Cutting die 3 Support 4 Gauge 5 Positioning recess 6 Convex 7 Intermittent drive 8 Feeder 9 Punch 10 Lead frame strip 11 Inner lead 12 Outer lead C 13 Tie bar 14 Die pad 15 Support bar 20 Positioning block

Claims (4)

(57) [Claims] A plurality of depressing dies, each of which comprises an upper die and a lower die, are arranged so as to depress a support bar of a lead frame to displace a die pad supported by the support bar downward. In a lead frame manufacturing apparatus, wherein a depressing process is performed while running a roll-shaped or plate-shaped lead frame assembly, the depressing die is configured to be movable on a support table. An apparatus for manufacturing a lead frame, wherein an interval between press dies is variable. 2. The depress die is configured to be movable on a support table having a positioning recess formed at a predetermined interval, and disposed on the bottom of the depress die so as to correspond to the recess. Provided with a convex portion provided, can be fixed at a predetermined position on the support table, and configured so that the distance between the depress dies is variable. ). 3. The depress die is configured to be movable on a support table, and includes a plurality of types of support blocks of a predetermined length that are removably installed between the depress die, By installing one of the support blocks, the depress die can be fixed at a predetermined position on a support table, and the distance between the depress die is variable. The lead frame manufacturing apparatus according to claim 1, wherein: 4. A depressing die comprising an upper die and a lower die, wherein a depressing die configured to push down a support bar of a lead frame to displace a die pad supported by the support bar downward. And a cutting means for performing depressing while running a roll-shaped lead frame assembly, and cutting at predetermined intervals, wherein the depressing die and the cutting means comprise a support base. An apparatus for manufacturing a lead frame, wherein the distance between the depress die and the cutting means is variable, and the upper part is movable.