JP2990866B2 - Electronic component mounting equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for mounting an electronic component on a printed circuit board.

[0002]

2. Description of the Related Art In recent years, as a conventional technique for mounting and inserting an electronic component on a printed circuit board, a structure as shown in FIGS. 5 and 6 has been generally used. Hereinafter, the configuration will be described.

[0005] As shown in FIG. 5, the mounting electronic component 32 is housed in an embossed taping 33 and is supplied from a parts cassette 34. The mounting head 3 of the mounting device
5 is connected to the suction type chuck unit 36,
The ball screw 38 is rotated by the servomotor 37 and moves up and down. The mounting board 40 conveyed by the rail guide 39 is supported by support pins 41.

[0006] As shown in FIG. 6, the suction type chuck unit 36 is replaced with the insertion chuck unit 42, and holds the insertion electronic component 43. Insertion board 44
In addition to the electronic component 43 for insertion, the axial component 45
And a DIP type IC are inserted.

Next, the operation will be described. FIG.
As shown in (a), the emboss taping 33 supplied by the parts cassette 34 and positioned at the suction position.
The mounting electronic component 32 inside the suction type chuck unit 3
6, the mounting head 35 is driven by a head vertical AC servomotor 37 to drive the ball screw 38.
Is raised to the upper limit.

Thereafter, the mounting head 35 is mounted on the mounting substrate 4.
After moving to the 0 side and being positioned above the mounting point, contrary to the above, it is lowered by the operation of the AC servomotor 37, and the mounting electronic component 32 is mounted at a predetermined position on the mounting substrate 40. At this time, the support pins 41 are
Performs a role that does not bend down.

In FIG. 6, the operation from the component positioning to the insertion into the insertion substrate 44 is the same as that described above, except that the suction type chuck unit 36 is replaced with the insertion chuck unit 42.

[0008]

In such a conventional electronic component insertion apparatus, when the mounting electronic component 32 is mounted on a mounting board 47 having an upward sled as shown in FIG. As shown in FIG. 3D, the lands of the substrate 47 having the upper sled even after the positioning is completed at the predetermined position and the mounting head unit 35 is lowered and mounted.
There is a shift of Δe as compared with the land of the non-defective mounting substrate 40 shown in FIG. Therefore, a mounting position shift of Δf occurs between the lead terminal of the mounting electronic component 32 and the land of the board 47 having the upward sled. FIG.
As shown in (e), the lead terminal 1 of the mounting electronic component 32
The book receives the reaction force R of the board 47 having an upward sled from obliquely downward, and the lead terminals of the mounting electronic component 32 may be bent. Further, FIGS. 6A and 6B
As shown in (1), when the insertion electronic component 43 is to be mounted at a high density between the axial component 45 and the DIP-type IC 46 already inserted in the insertion substrate 44, the lead wire of the insertion electronic component 43 is narrowed. It is often difficult to hold it because of adjacent parts. Therefore, the insertion electronic component 43
, The outer shape of the body is irregular, so that it comes into contact with the insertion chuck unit 42 and the tip of the lead wire of the held electronic component 43 for insertion varies.
The reliability of insertion is significantly reduced.

An object of the present invention is to solve the above problem and to provide a high-performance electronic component mounting apparatus.

[0010]

In order to achieve the above object, the present invention provides a mechanism for swinging the head section in the XY direction and a mounting land recognition camera in the mounting head section, or an XY head in the insertion head section. Equipped with a lead wire recognition camera and a separate lead wire recognition camera, and based on the correction information from the camera, the deviation of the lead wire tip position variation due to warpage of the mounting board or when the inserted parts are pinched is recognized based on the correction information from the camera. Is swung to a predetermined angle.

[0011]

According to the present invention, in the above-described configuration, when there is a warp of the mounting substrate and a variation in the position of the lead wire tip when the electronic component is held, the mounting head is swung to a predetermined angle based on the correction information from the recognition camera. Therefore, the component is always mounted at a correct position with respect to the land and the insertion hole.

[0012]

(Embodiment 1) An embodiment of an electronic component mounting apparatus according to the present invention will be described below with reference to FIGS.

As shown in the drawing, the mounting electronic component 1 is housed in an embossed taping 2 and a parts cassette 3
Supplied from A suction type chuck unit 4 and a Y-direction swing frame 5 are connected to a mounting head portion of the mounting apparatus, and the Y-direction swing frame 5 is an X-direction swing frame 7 around a Y-direction swing frame fulcrum pin 6. Is mounted to be swingable. Also, the X-direction swing frame 7 is X
It is swingably attached to the insertion head frame 9 around the fulcrum frame fulcrum pin 8. The insertion head frame 9 is driven by an AC servomotor 10 to drive the ball screw 1.
It moves up and down by one rotation. Lever for Y-direction swing 1
The Y-direction rocking roller 14 is rotatably mounted on the Y-direction rocking roller pin 13 provided on the base 2, holds the Y-direction rocking frame 5, and is driven by the Y-direction rocking AC servomotor 15. Ball screw for Y-direction swing 1
6, the Y-direction swing lever 12 is moved up and down via the Y-direction swing connection rod 17, the rod end pin 18, and the X-direction bending rod end 19. The mounting board land recognition camera 20 is fixed to the Y-direction swing frame 5.

An X-direction rocking roller 23 is rotatably mounted on an X-direction rocking roller pin 22 provided on the X-direction rocking lever 21 to hold the X-direction rocking frame 7. AC servo motor for swing 24
To rotate the Y-direction swing ball screw 25,
The X-direction swing lever 21 is moved up and down via the X-direction swing connection rod 26.

The operation of the above configuration will be described. The mounting electronic component 1 in the embossed taping 2 supplied by the parts cassette 3 and positioned at the suction position is sucked by the suction type chuck unit 4 and then inserted into the insertion head. The frame 9 is pulled up to the upper limit via the ball screw 11 by the driving force of the AC servomotor 10 for head up / down.

Thereafter, the insertion head frame 9 moves onto the mounting substrate 27 having the sled, and performs positioning above the mounting point. At this time, the mounting board land recognition camera 20
As shown in FIG. 1B, the inclination [θ = cos ⁻¹ (l ₁ / l)] of the mounting board 27 having the upward sledge is calculated from the land length 1 and the land apparent length l ₁ as shown in FIG. . The calculated angle is fed back, and Δh = L ₁ sin
The calculation of θ ₁ is performed, and the Y-direction swing frame 5 is tilted. That is, the driving force of the Y-direction rocking AC servomotor 15 is transmitted to the Y-direction rocking roller 14 and the Y-direction rocking lever 12, and the Y-direction rocking frame 5 is lifted. In this embodiment, only the inclination in the Y direction is limited. However, if the inclination in the X direction is necessary, the rotation driving force is applied to the X direction oscillation ball screw 25 by using the X direction oscillation AC servomotor 24, and the linear driving force is applied. Instead, the X-direction swing frame 7 is inclined. The X-direction bending rod end 19 plays a role in releasing the X-direction force applied to the Y-direction rocking lever 12 when tilted in both the X and Y directions. As described above, after the suction type chuck unit 4 is inclined at the same angle as the mounting board 27 having the upward sled, the AC servomotor 10 for head up / down is rotated to lower the insertion head frame 9, and as shown in FIG. The mounting of the mounting electronic component 1 is accurately completed on the land.

Embodiment 2 Next, a second embodiment shown in FIGS. 3 and 4 will be described. In the figure, reference numeral 28 denotes a component lead wire recognition camera. The operation is described in the first section.
The processing proceeds in substantially the same manner as in the embodiment. The difference is that the insertion electronic unit 30 is held by the insertion chuck unit 29,
It moves to the position of the component lead wire recognition camera 28, where the position of the lead wire of the insertion electronic component 30 is checked. FIG.
As shown in (b), when the deviation of Δl is found, the AC servo motors 15 and 24 for driving in the Y and X directions are used to swing the Y and X directions until the lead wire becomes the center of the camera, that is, Δl = 0. The frames 5 and 7 are inclined. In this state, the head up / down AC servomotor 10 is driven to complete the insertion into the high-density insertion substrate 31.

[0018]

As is apparent from the above description of the embodiment, according to the present invention, the mounting head according to the inclination of the board by the combination of the XY swing head and the board recognizing camera with respect to the upside board. The components can be mounted from a direction perpendicular to the land without any displacement, and the mounting position accuracy and the quality of the lead terminals can be ensured.

In addition, when applied to an insertion head, the positional deviation of the lead wire tip caused when the external shape of the irregularly shaped component is pinched can be constantly corrected by the combination of the lead wire recognition camera and the XY swing head. The reliability of insertion of irregular parts is also improved.

[Brief description of the drawings]

FIG. 1A is a front sectional view of a mounting head of an electronic component mounting apparatus according to a first embodiment of the present invention; FIG.

FIG. 2 is an explanatory diagram of angle correction for the warpage of the substrate according to the first embodiment.

FIG. 3A is a front sectional view of a mounting head portion of an electronic component mounting apparatus according to a second embodiment of the present invention; FIG.

FIG. 4A is a side view showing a state in which an irregularly shaped external component according to the second embodiment is inserted into a board; FIG. Of angle correction for

5A is a side view showing a mounting process of a conventional electronic component mounting apparatus; FIG. 5B is a side view showing a state where the electronic component is mounted on a board having an upper sled; FIG. FIG. 4D is an explanatory view showing the land of the board without warpage and the position of the lead terminal of the electronic component, and FIG. , Side view showing the force applied to the lead terminals when mounting electronic components on a board having a top sled

FIG. 6A is a side view showing a state in which an irregularly shaped external component according to another conventional example is inserted into a substrate. FIG. Illustrated illustration

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 mounting electronic component 4 suction type chuck unit 5 Y-direction swing frame 7 X-direction swing frame 10 AC servomotor 12 Y-direction swing lever 15 Y-direction swing AC servomotor 20 Recognition camera 21 X-direction swing lever 24 AC servomotor for swinging in X direction 27 Mounting board with sled 28 Camera for recognition 29 Chuck unit for insertion 30 Electronic parts for insertion

Continuation of the front page (56) References JP-A-63-252440 (JP, A) JP-A-56-118391 (JP, A) JP-A-3-141700 (JP, A) JP-A-61-175516 (JP) , A) JP-A-60-261199 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H05K 13/04

Claims (2)

(57) [Claims] 1. A suction tool for picking up an electronic component, a camera for recognizing an inclination angle generated in a warp of a board on which the electronic component is mounted, and an error of the board land pattern angle being fed back to the suction tool for XY. An electronic component mounting apparatus, comprising: a mounting motor having a servomotor for changing an angle in a direction and a connecting lever structure thereof; and a means for correcting a mounting position accuracy with respect to a warp of the substrate. 2. A holding tool for holding an electronic component, a camera for recognizing positional accuracy of a leading end of a lead wire generated when an electronic component for insertion having an irregular outer shape is held, and a camera according to claim 1. An electronic component mounting apparatus having an insertion head having a Y swing function and having means for correcting a position error of the lead wire tip.