JP2994473B2 - Magnesium alloy plating film structure - Google Patents
Magnesium alloy plating film structureInfo
- Publication number
- JP2994473B2 JP2994473B2 JP3016354A JP1635491A JP2994473B2 JP 2994473 B2 JP2994473 B2 JP 2994473B2 JP 3016354 A JP3016354 A JP 3016354A JP 1635491 A JP1635491 A JP 1635491A JP 2994473 B2 JP2994473 B2 JP 2994473B2
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- magnesium alloy
- coating portion
- layer
- electrolytic plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Chemically Coating (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、表面導電性および
熱伝導性を有するとともに、耐食性も高いマグネシウム
合金基材に関するものである。 The present invention relates to the co as having surface conductivity and thermal conductivity, corrosion resistance high magnesium
It relates to an alloy substrate .
【０００２】航空宇宙機器、情報処理機器、あるいは精
密機器等に使用される金属材料として、機器の軽量化を
図るためにマグネシウム合金が使用されている。As a metal material used for aerospace equipment, information processing equipment, precision equipment, etc., a magnesium alloy is used to reduce the weight of the equipment.
【０００３】しかしながら、マグネシウム合金は活性な
金属で、腐食し易いため、耐食性を高める表面処理が必
要とされている。[0003] However, magnesium alloy is an active metal and easily corrodes, so that a surface treatment for improving corrosion resistance is required.
【０００４】[0004]
【従来の技術】従来、マグネシウム合金の表面処理とし
て、陽極酸化処理あるいは塗装による非金属処理が行わ
れているが、表面導電性が必要な部位において使用され
る場合には、図２に示すように、マグネシウム合金の基
材１の表面に亜鉛置換層２１とストライクメッキ層２２
とよりなる下処理層２を介し電解メッキ層３を形成し、
その表面に無電解メッキ層４を形成してなるメッキ膜構
造が使用されている。2. Description of the Related Art Conventionally, as a surface treatment of a magnesium alloy, anodizing treatment or non-metallic treatment by painting is performed. However, when it is used in a part requiring surface conductivity, as shown in FIG. First, a zinc substitution layer 21 and a strike plating layer 22 are formed on the surface of the magnesium alloy substrate 1.
Forming an electrolytic plating layer 3 via a lower treatment layer 2 consisting of
A plating film structure having an electroless plating layer 4 formed on its surface is used.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、従来の
メッキ膜構造では、表面の無電解メッキ層４に多数のピ
ンホールが発生するため、中間の電解メッキ層３上に積
層することによりピンホールによる腐食を防止するよう
にしている。しかし、電解メッキ層３は、膜厚管理が難
しいため、基材１に均一な膜厚で電解メッキ層３を形成
することが困難である。従って、高い精度を要求される
タップや小孔を有するマグネシウム合金部品には充分な
厚さでメッキ膜を形成できず、ピンホールによる腐食が
発生し易いという欠点を有するものであった。However, in the conventional plating film structure, a large number of pinholes are generated in the electroless plating layer 4 on the surface. We try to prevent corrosion. However, since it is difficult to control the thickness of the electrolytic plating layer 3, it is difficult to form the electrolytic plating layer 3 with a uniform thickness on the substrate 1. Therefore, a magnesium alloy component having taps and small holes that require high precision cannot form a plating film with a sufficient thickness, and has a disadvantage that corrosion due to pinholes is likely to occur.
【０００６】本発明は、以上の欠点を解消すべくなされ
たものであって、表面導電性に優れ、耐食性にも優れた
マグネシウム合金基材の提供を目的とする。 [0006] The present invention was made to solve the above drawbacks, superior in surface conductivity, excellent corrosion resistance
The purpose is to provide a magnesium alloy substrate.
【０００７】[0007]
【課題を解決するための手段】本発明を実施例に対応す
る図１に基づいて説明すると、マグネシウム合金の基材
１の表面に下処理層２を介して電解メッキ層３を形成
し、さらに電解メッキ層３上に無電解メッキ層４を積層
してなる第一皮膜部５を形成する。そして、第一皮膜部
５上には、第一皮膜部５と同様に電解メッキ層３と無電
解メッキ層４とを一組以上積層してなる第二皮膜部６を
積層して構成する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to FIG. 1 corresponding to an embodiment. An electrolytic plating layer 3 is formed on a surface of a base material 1 of a magnesium alloy via a lower treatment layer 2, and A first coating portion 5 is formed by laminating an electroless plating layer 4 on the electrolytic plating layer 3. Then, on the first coating portion 5, a second coating portion 6 formed by stacking one or more sets of the electrolytic plating layer 3 and the electroless plating layer 4 is formed in the same manner as the first coating portion 5.
【０００８】[0008]
【作用】上記構成に基づき、本発明においては、マグネ
シウム合金の基材１に電解メッキ層３と無電解メッキ層
４とをそれぞれ積層してなる第一皮膜部５と第二皮膜部
６とを形成して電解メッキ層３と無電解メッキ層４をさ
らに多層化している。したがって、それぞれの第一およ
び第二皮膜部５、６に多少のピンホールが発生していて
も積層された皮膜部によってそのピンホールが互いに塞
がれて基材１へ貫通することがなく、耐食性を高めるこ
とができる。According to the present invention, the first coating portion 5 and the second coating portion 6 formed by laminating an electrolytic plating layer 3 and an electroless plating layer 4 on a magnesium alloy base material 1 are formed in the present invention. Then, the electrolytic plating layer 3 and the electroless plating layer 4 are further multilayered. Therefore, even if some pinholes are generated in the first and second coating portions 5 and 6, the pinholes are not mutually closed by the stacked coating portions and do not penetrate into the base material 1, Corrosion resistance can be increased.
【０００９】さらに、それぞれの第一および第二皮膜部
５、６においては電解メッキ層３を膜厚管理が可能な膜
厚に薄くすることができるため、高い精度を要求される
加工部品の表面にも耐食性の高いメッキ膜を形成するこ
とが可能となる。Further, in each of the first and second coating portions 5, 6, the electrolytic plating layer 3 can be thinned to a thickness capable of controlling the thickness, so that the surface of the processed component requiring high precision is required. In addition, it is possible to form a plating film having high corrosion resistance.
【００１０】[0010]
【実施例】図１は、本発明の実施例を示す説明図であ
り、マグネシウム合金の基材１の表面に第一皮膜部５と
第二皮膜部６が積層されている。FIG. 1 is an explanatory view showing an embodiment of the present invention, in which a first coating portion 5 and a second coating portion 6 are laminated on the surface of a magnesium alloy base material 1.
【００１１】第一皮膜部５はマグネシウム合金基材１の
表面に形成される下処理層２を介して電解メッキ層３を
形成し、さらにその上層に無電解メッキ層４を積層して
形成するもので、下処理層２は基材１の表面を置換して
形成される亜鉛置換層２１と銅のストライクメッキ層２
２とよりなり、電解メッキ層３の密着性を高めている。
電解メッキ層３は例えば銅が用いられ、無電解メッキ層
４としてはニッケル等を用いる。そして、無電解メッキ
層４により膜厚を管理して均一な膜厚で第一皮膜部５を
形成することができる。The first coating portion 5 is formed by forming an electrolytic plating layer 3 via a pretreatment layer 2 formed on the surface of a magnesium alloy base material 1 and further laminating an electroless plating layer 4 thereon. The sub-treatment layer 2 comprises a zinc substitution layer 21 formed by substituting the surface of the substrate 1 and a copper strike plating layer 2.
2 to improve the adhesion of the electrolytic plating layer 3.
For example, copper is used for the electrolytic plating layer 3, and nickel or the like is used for the electroless plating layer 4. Then, the first coating portion 5 can be formed with a uniform film thickness by controlling the film thickness by the electroless plating layer 4.
【００１２】さらに、第一皮膜部５の表面、すなわちニ
ッケルの無電解メッキ層４の表面には、異種金属メッキ
層２３を形成する。異種金属メッキ層２３はニッケル無
電解メッキ層４と密着性の良好なクロムメッキ等が好ま
しく、その表面にストライクメッキ層２２を形成して第
二皮膜部６の下処理層２を形成している。Further, a dissimilar metal plating layer 23 is formed on the surface of the first coating 5, that is, on the surface of the nickel electroless plating layer 4. The dissimilar metal plating layer 23 is preferably chromium plating or the like having good adhesion to the nickel electroless plating layer 4, and the strike plating layer 22 is formed on the surface thereof to form the lower layer 2 of the second coating 6. .
【００１３】そして、第二皮膜部６の下処理層２の上に
さらに第一皮膜部５と同様の電解メッキ層３および無電
解メッキ層４を積層して第二皮膜部６を構成する。The second coating portion 6 is formed by further laminating the same electrolytic plating layer 3 and electroless plating layer 4 as the first coating portion 5 on the lower treatment layer 2 of the second coating portion 6.
【００１４】また、第二皮膜部６の最上層の無電解メッ
キ層４がニッケルメッキ層の場合は、クロム酸処理を行
うことにより耐食性をより高めることができる。When the uppermost electroless plating layer 4 of the second coating portion 6 is a nickel plating layer, the corrosion resistance can be further improved by performing chromic acid treatment.
【００１５】なお、上記実施例では、第二皮膜部６に一
組の電解メッキ層３と無電解メッキ層４を有するもので
説明したが、さらに多層に電解メッキ層３および無電解
メッキ層４の積層を繰り返すことにより、より耐食性を
高めることができる。In the embodiment described above, the second film portion 6 has a pair of the electrolytic plating layer 3 and the electroless plating layer 4. However, the electrolytic plating layer 3 and the electroless plating layer 4 By repeating the lamination, the corrosion resistance can be further improved.
【００１６】[0016]
【発明の効果】以上の説明から明らかなように、本発明
によるマグネシウム合金のメッキ膜構造によれば、表面
導電性や熱伝導性を損なうことなく、耐食性を高めるこ
とができ、しかも膜厚管理を容易にして、マグネシウム
合金の加工部品を高精度に形成することができる。As is apparent from the above description, according to the magnesium alloy plating film structure of the present invention, corrosion resistance can be increased without impairing surface conductivity and thermal conductivity, and the film thickness can be controlled. , And a magnesium alloy processed part can be formed with high precision.
【００１７】そして、本発明によれば１０μｍ以上のメ
ッキ膜厚を形成することにより、マグネシウム合金は塩
水噴霧試験４８時間をクリアすることができた。According to the present invention, by forming a plating film thickness of 10 μm or more, the magnesium alloy was able to pass the salt spray test for 48 hours.
【図１】本発明の実施例を示す説明図である。FIG. 1 is an explanatory diagram showing an embodiment of the present invention.
【図２】従来例を示す説明図である。FIG. 2 is an explanatory diagram showing a conventional example.
１ 基材 ２ 下処理層 ３ 電解メッキ層 ４ 無電解メッキ層 ５ 第一皮膜部 ６ 第二皮膜部 DESCRIPTION OF SYMBOLS 1 Base material 2 Pretreatment layer 3 Electroplating layer 4 Electroless plating layer 5 First coating part 6 Second coating part
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平２−254179（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) C23C 28/02 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-254179 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) C23C 28/02
Claims (1)
上に積層された第一皮膜部と、該第一皮膜部上に積層さ
れた第二皮膜部とを備え、 上記第一皮膜部は、導電性を有する電解メッキ層と、該
電解メッキ層上に形成された無電解ニッケルメッキ層と
からなり、 上記第二皮膜部は、前記無電解ニッケルメッキ層と密着
するクロムメッキ層と、前記クロムメッキ層上に形成さ
れ、導電性を有する電解メッキ層と、前記電解メッキ層
上に形成された無電解メッキ層とからなる ことを特徴と
するマグネシウム合金基材。 1. A substrate comprising a magnesium alloy, and the substrate
A first coating portion laminated on the first coating portion;
A second coating portion, wherein the first coating portion has a conductive electrolytic plating layer,
An electroless nickel plating layer formed on the electrolytic plating layer and
And the second coating portion is in close contact with the electroless nickel plating layer.
A chromium plating layer to be formed and
A conductive electrolytic plating layer, and the electrolytic plating layer
It is characterized by comprising an electroless plating layer formed on
Magnesium alloy substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3016354A JP2994473B2 (en) | 1991-02-07 | 1991-02-07 | Magnesium alloy plating film structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3016354A JP2994473B2 (en) | 1991-02-07 | 1991-02-07 | Magnesium alloy plating film structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04254591A JPH04254591A (en) | 1992-09-09 |
| JP2994473B2 true JP2994473B2 (en) | 1999-12-27 |
Family
ID=11914018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3016354A Expired - Fee Related JP2994473B2 (en) | 1991-02-07 | 1991-02-07 | Magnesium alloy plating film structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2994473B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005256170A (en) * | 2004-02-12 | 2005-09-22 | National Institute Of Advanced Industrial & Technology | Electroless nickel plating method and plated product |
| JP2007068017A (en) * | 2005-09-01 | 2007-03-15 | Pioneer Electronic Corp | Structural component for speaker device and speaker device |
| CN100430520C (en) * | 2005-12-30 | 2008-11-05 | 东北大学 | A kind of method for electroless copper plating on the surface of magnesium and magnesium alloy |
| ITCO20120015A1 (en) | 2012-04-12 | 2013-10-13 | Nuovo Pignone Srl | METHOD FOR THE PREVENTION OF CORROSION AND COMPONENT OBTAINED THROUGH THIS METHOD |
-
1991
- 1991-02-07 JP JP3016354A patent/JP2994473B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04254591A (en) | 1992-09-09 |
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