JP3015255B2 - Substrate processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a glass substrate for liquid crystal,
The present invention relates to a substrate processing apparatus that supplies a fluid of a predetermined processing agent to a surface of a substrate such as a color filter substrate and performs various processes such as application, development, etching, peeling, and cleaning of a resist on the substrate.

[0002]

2. Description of the Related Art As a conventional substrate processing apparatus, there is, for example, a resist coating apparatus disclosed in Japanese Patent Application Laid-Open No. 58-170565. FIG. 4 is a diagram illustrating the structure of this device. While rotating the circular substrate 6 at a low speed, a nozzle 4 having a slit 4a formed on the surface of the substrate 6
The resist solution 5 is dropped in a strip shape. Next, after the dropping of the resist solution 5 is completed, the substrate 6 is rotated at a high speed to form a thin film of the resist solution 5 on the surface of the substrate 6.

[0003]

However, in such an apparatus, since only one type of resist solution 5 can be dropped on the substrate 6, for example, different types of resist solution 5 are applied to a plurality of substrates 6, respectively. When applying the resist in parallel, two resist coating apparatuses are required, which increases the apparatus cost and the installation space of the apparatus.

[0004] On the other hand, although not shown, in a conventional developing apparatus for developing a resist thin film formed on a substrate surface after exposure, a developing solution is first supplied to the substrate surface to start a developing process, and then a predetermined process is performed. After the elapse of the development time, a cleaning liquid is supplied to the substrate surface, and the developer is washed off the substrate and removed from the substrate surface. For this reason, since it is necessary to supply the developing solution and the cleaning solution to the substrate separately, separate nozzles are separately arranged in the apparatus for the developing solution and for the cleaning solution, and are selectively operated. .

However, such an apparatus requires a separate mechanism for selectively positioning each nozzle on the surface of the substrate, which complicates the structure of the apparatus.

Accordingly, the present invention is a surface treatment apparatus for treating a substrate surface by supplying a processing fluid such as a resist solution to the substrate, and has a simple structure which does not increase the apparatus cost and installation space. SUMMARY OF THE INVENTION It is an object of the present invention to provide a substrate processing apparatus capable of supplying various processing fluids to a substrate individually to enable various processing of the substrate surface.

[0007]

According to a first aspect of the present invention, there is provided a substrate processing apparatus for sequentially supplying a processing fluid to a surface of a substrate and performing a predetermined processing on the surface of the substrate. A substrate supporting means for supporting the substrate, a plurality of fluid supply means each having a slit-shaped fluid discharge port for supplying a fluid toward the surface of the substrate supported by the substrate support means, and each fluid discharge port supporting the substrate. A single guiding means for guiding each fluid supply means so as to move in parallel with the surface of the substrate supported by the means.

[0008] The apparatus according to claim 2 is characterized in that it comprises a driving means for selectively moving a plurality of fluid supply means.

The apparatus according to a third aspect of the present invention is further characterized in that the apparatus further comprises substrate rotating means for rotating the substrate supported by the substrate supporting means.

In the apparatus according to a fourth aspect of the present invention, the substrate supported by the substrate supporting means is a square substrate, and each of the fluid discharge ports of the plurality of fluid supply means is supported by the substrate supporting means. So that they move along the two sides facing each other,
The guide means guides each fluid supply means.

[0011]

In the apparatus according to the first aspect of the present invention, a single guide means for guiding each fluid supply means such that each fluid discharge port moves in parallel with the surface of the substrate is provided, and the guide means is shared. There is no need to provide guide means for each fluid supply means. Therefore, the substrate processing apparatus can have a simple configuration without increasing the apparatus cost and installation space.

Further, the substrate processing apparatus according to the second aspect of the present invention includes a driving means for selectively moving the plurality of fluid supply means, so that the processing fluid from each of the fluid supply means is individually supplied to the substrate and the surface of the substrate is processed. Can be variously processed.

Further, the substrate processing apparatus according to the third aspect further includes substrate rotating means for rotating the substrate supported by the substrate supporting means, so that a processing fluid can be uniformly supplied to the substrate when processing the substrate. it can.

According to a fourth aspect of the present invention, the guide means guides each fluid supply means so that each fluid discharge port of the plurality of fluid supply means can move along two sides of the rectangular substrate facing each other. Therefore, the processing fluid can be directly supplied to a region approximating the shape of the rectangular substrate, and more uniform processing can be achieved over the entire rectangular substrate.

[0015]

FIG. 1 is a plan view of a surface treatment apparatus according to a first embodiment. As shown, a rectangular glass substrate 16 for liquid crystal is used.
Is reciprocated up and down by a lifting mechanism 35b via a support member 35a. The glass substrate 16 in the spin cup 32 has a pair of slit nozzles 14a and 14b serving as fluid supply means.
From a plurality of types of resist liquids A, which are different types of processing fluids,
B (for example, a positive resist solution and a negative resist solution) are supplied. Each slit nozzle 14a, 14b
Are horizontally supported by movable supports 39a and 39b, respectively. The supports 39a and 39b are supported by a pair of guide rails 37 arranged in parallel with the spin cup 32 interposed therebetween.
b can independently reciprocate on the guide rail 37 along the guide rail 37 in the left-right direction of the drawing. In the drawings, one guide rail 37 is shown.
Only the other guide rails are hidden by the cover 47 and not shown. As described above, a single guide means is constituted by the two guide rails 37, and the support members 39a, 39b are guided by the guide means.
Is driven as described below, so that the support 39
a, nozzles 14a, 14b fixed to 39b
Can be selectively moved in parallel with the surface of the substrate 16 on the spin chuck 24. That is, a pair of wires 59a, 59b connected to the pair of motors 49a, 49b are accommodated in the cover 47 by being laid. The motor 49a is connected via a wire 59a to
The supporting body 39a is formed by a pair of long sides 1 of the glass substrate 16 facing each other.
Move horizontally along 6a. The motor 49b horizontally moves the support 39b along the long side 16a via the wire 59b. Note that the pair of motors 49a, 49b and the pair of wires 59a, 59b form a pair of corresponding supports 39a, 39b, that is, a pair of slit nozzles 14a,
It is a driving means for selectively moving 14b.

As shown in the side view of FIG.
Numeral 6 is fixed on a spin chuck 24 as a substrate supporting means by vacuum suction. The spin chuck 24
Under the control of the chuck driving mechanism 26, which is a substrate rotating means, it moves together with the glass substrate 16 to a desired position in the vertical direction in the drawing, and rotates with the glass substrate 16 at a desired rotational speed around a vertical axis passing through the center thereof. The pair of slit nozzles 14a and 14b have slits 14d and 14e, respectively, which are discharge ports for resist liquid. Each of the slits 14d and 14e extends in a direction perpendicular to the paper surface (that is, in a horizontal direction of the apparatus). These slits 1
From 4d and 14e, resist liquids A and B are respectively discharged and supplied onto the glass substrate 16.

In supplying and applying the resist liquids A and B, one of the slit nozzles 14a and 14b is horizontally moved above the short side 16b of the glass substrate 16, and the glass substrate 16 is raised together with the spin chuck 24. ,
The surface of the glass substrate 16 is brought directly under one of the slits 14d and 14e. Then, one of the slit nozzles 14a, 14b close to the surface of the glass substrate 16
The slit nozzles 14a and 14b are moved while discharging the resist liquids A and B from.

When the resist liquids A and B are spread over the entire surface of the substrate, the glass substrate 16 is lowered with the lowering of the spin chuck 24, and is simultaneously fixed to the upper rotary plate 42a which has been lowered together with the lid member 33. Is housed in a substantially closed space formed by the lower rotating plate 42b. Then, in this closed space, the glass substrate 16 on the spin chuck 24 rotates at a high speed together with the upper rotary plate 42a and the lower rotary plate 42b.

The operation of the first embodiment shown in FIGS. 1 and 2 will be described below. First, the lid member 33 is moved upward together with the upper rotating plate 42a by the elevating mechanism 35b, and the spin cup 32 is opened. Next, the spin chuck 24 is raised, and the glass substrate 16 is transferred to the spin chuck 24 by a transfer robot (not shown) so that the surface of the glass substrate 16 can be coated with a resist liquid. Next, one of the slit nozzles 14a and 14b (corresponding to the resist solution A) is moved above the short side 16b on the drawing side of the glass substrate 16 to raise the glass substrate 16 together with the spin chuck 24. The upper surface of the glass substrate 16 on the short side 16b on the left side in FIG. 2 is brought close to the slit 14d at the lower end of the slit nozzle 14a. Next, while discharging the resist liquid A from the slit 14d, the slit nozzle 14a is moved at a constant speed in the horizontal direction to the right in FIG. As a result, the resist solution A is thinly applied to the portion of the surface of the glass substrate 16 except for the periphery. Next, the spin chuck 24
At the same time, after lowering the glass substrate 16, the lid member 33 is lowered to fix the upper rotating plate 42 a and the lower rotating plate 42 b to each other, and rotate them at high speed together with the glass substrate 16 on the spin chuck 24. As a result, the resist solution A on the glass substrate 16 spreads uniformly, and the glass substrate 1
6, a thin film of the resist solution A is formed. Next, the glass substrate 16 is raised together with the lid member 33, and the glass substrate 16 is taken out of the spin cup 32.

The above operation is repeated by exchanging the glass substrate 16. At this time, the type of the resist solution can be changed. When applying the resist solution B on the glass substrate 16, first, another glass substrate 1 is placed on the spin chuck 24.
6 is set so that a resist solution can be applied on the glass substrate 16. Next, the slit nozzle 14b is moved above the short side 16b on the right side of FIG. 2 of the glass substrate 16 to raise the glass substrate 16 together with the spin chuck 24, and the slit 14 at the lower end of the slit nozzle 14b
The upper surface of the glass substrate 16 on the short side 16b on the right side of the drawing is brought close to e. Next, while discharging the resist liquid B from the slit 14e, the slit nozzle 14b is moved at a constant speed in the horizontal direction on the left side of the drawing while maintaining its posture. As a result, the resist solution B is thinly applied to the portion of the surface of the glass substrate 16 except for the periphery. Thereafter, a thin film of the resist solution B is formed on the glass substrate 16 by high-speed rotation.

As described above, in the substrate processing apparatus of the first embodiment, the common guide rail 37 for guiding the pair of slit nozzles 14a and 14b so as to be movable in parallel to the surface of the glass substrate 16, respectively, Slit nozzle 14
a and a pair of motors 49a for selectively moving 14b,
Since the pair of slit nozzles 49b and the pair of wires 59a and 59b are provided, there is no need to provide a dedicated guide rail 37 for each pair of slit nozzles 14a and 14b. Therefore,
The resist liquids A and B to be applied on the glass substrate 16 can be individually supplied while being appropriately changed, so that various processing of the glass substrate 16 can be performed, and a simple configuration that does not increase the cost and space of the apparatus can be realized. it can. In addition, the guide rail 37 connects the pair of slit nozzles 14a and 14b,
This guides the glass substrate 16 so as to be able to move along the two long sides 16a facing each other, so that the resist liquid can be directly supplied to a square region approximating the shape of the square glass substrate 16, and More uniform processing can be achieved over the entire glass substrate 16 and waste of the resist solution can be eliminated.

FIG. 3 is a side view showing the structure of the surface treatment apparatus of the second embodiment. Since the apparatus of the second embodiment is basically a two-cup type apparatus having a structure in which the surface treatment apparatuses of the first embodiment are arranged side by side, the same parts as those of the first embodiment are denoted by the same reference numerals. And the description is omitted. As shown, the apparatus of the second embodiment includes two spin cups 32 having the same structure. Each glass substrate 16 accommodated in these spin cups 32 receives supply of resist liquid from three slit nozzles 14a, 14b, and 14c that discharge different resist liquids A and B. These three slit nozzles 14
a, 14b, and 14c are independently guided on the same guide rail 37, and reciprocate horizontally in the left and right directions in the drawing. The slit nozzles 14a and 14c
Is discharged onto each glass substrate 16 in both spin cups 32, and slit nozzle 14 b discharges resist solution B onto each glass substrate 16 in both spin cups 32.

In the substrate processing apparatus of the second embodiment, three slit nozzles 14a, 14b,
The same guide rail 37 for movably guiding in parallel to the surface of each slit nozzle 14a, 14b, 14c
Is selectively moved to perform the discharging operation, so that it is not necessary to provide the guide rail 37 for each slit nozzle 14a, 14b, 14c. Therefore, the resist liquids A and B to be coated on the glass substrate 16 can be individually supplied while being appropriately changed, and the substrate processing apparatus can have a simple configuration that does not increase the cost and space. Further, since the resist liquid B can be supplied to each of the glass substrates 16 in both the spin cups 32 by the single slit nozzle 14b at the center, one slit nozzle can be omitted as a result.

Although the present invention has been described with reference to the embodiment, the present invention is not limited to the above embodiment. For example, the step of rotating the glass substrate 16 after applying the resist liquid to diffuse the resist liquid is not always essential.

As the different types of resist liquid supplied to the slit nozzles 14a and 14b, a combination of positive resists and negative resists, or a combination of resists having different viscosities can be used. Further, when the diluted resist solution is supplied in advance to the substrate surface to prevent the repelling of the resist solution on the substrate surface and prevent the occurrence of pinholes, a different type of resist solution is provided to each slit nozzle 14a, 14b. A combination of a diluted resist solution and a final finished resist solution can be used.

The processing fluid supplied to the slit nozzles 14a and 14b is not limited to the resist liquid, and the following processing fluid can be used. For example, when the present invention is applied to a development processing apparatus, it is possible to configure such that developing solutions having different concentrations can be supplied to the slit nozzles 14a and 14b, respectively, and to use different developing solutions for each substrate. Further, a developing solution and a cleaning (rinsing) solution may be supplied to the slit nozzles 14a and 14b, respectively, so that the slit nozzles 14a and 14b can be selectively used for developing one substrate and rinsing the developing solution.

Further, when the present invention is applied to an etching apparatus, it is possible to supply an etching solution having a different concentration to each of the slit nozzles 14a and 14b, and to use an etching solution having a different concentration for each substrate. . In addition, etching solution and cleaning (rinse)
A liquid may be supplied to each of the slit nozzles 14a and 14b, and the slit nozzles 14a and 14b may be selectively used for etching one substrate and washing away the etchant.

Further, when the present invention is applied to a stripping apparatus, stripping solutions having different concentrations are applied to each of the slit nozzles 14a, 1d.
4b, the stripping solutions having different concentrations can be used for each substrate. Further, a stripping solution and a cleaning (rinsing) solution are applied to each slit nozzle 14.
The slit nozzles 14a and 14b can be selectively used for peeling one substrate and washing away the peeling liquid.

Further, when the present invention is applied to a cleaning apparatus, a cleaning liquid and a nitrogen gas (or dry air) are supplied to each of the slit nozzles 14a and 14b, and a slit is formed by cleaning one substrate and then drying. Nozzles 14a, 14
b can be used properly. That is, the slit nozzle can be selectively used for the cleaning liquid (liquid) and the nitrogen gas (gas) for drying.

The present invention is further applicable to the case where two types of gases are selectively used, and the shape of the discharge port for discharging the liquid or gas is not limited to the slit as in the above embodiment, but may be a large number of fine holes. It is also possible to use a nozzle having discharge ports arranged in a slit shape, or to use a nozzle having a discharge port in which a large number of fine needle-shaped nozzles are arranged in a slit shape.

[0031]

According to the first aspect of the present invention, a single guide means for guiding each fluid supply means so that each fluid discharge port moves in parallel with the surface of the substrate is provided. There is no need to provide guide means. Therefore,
The substrate processing apparatus can have a simple configuration without increasing the apparatus cost and installation space.

Further, the substrate processing apparatus according to the second aspect of the present invention is provided with a driving means for selectively moving the plurality of fluid supply means. Can be variously processed.

Further, the substrate processing apparatus according to claim 3 further includes a substrate rotating means for rotating the substrate supported by the substrate supporting means, so that a processing fluid can be uniformly supplied to the substrate when processing the substrate. it can.

According to a fourth aspect of the present invention, the guide means guides each fluid supply means so that each fluid discharge port of the plurality of fluid supply means can move along two opposing sides of the rectangular substrate. Therefore, the processing fluid can be directly supplied to a region approximating the shape of the rectangular substrate, and more uniform processing can be achieved over the entire rectangular substrate.

[Brief description of the drawings]

FIG. 1 is a view showing a surface treatment apparatus of a first embodiment.

2 is a side view of the device of FIG. 1;

FIG. 3 is a view showing a surface treatment apparatus of a second embodiment.

FIG. 4 is a diagram showing a configuration of a conventional surface treatment apparatus.

[Explanation of symbols]

 14 Slit nozzle 14a, 14b, 14c Slit 16 Glass substrate 26 Chuck drive mechanism 37 Guide rail

────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ identification code FI G03F 7/30 501 G03F 7/30 501 502 502 (56) References JP-A-1-218664 (JP, A) JP-A-59 JP-A-215726 (JP, A) JP-A-3-22428 (JP, A) JP-A-2-132444 (JP, A) JP-A-5-267148 (JP, A) JP-A-63-18627 (JP, A) JP-A-3-25919 (JP, A) JP-A-4-124812 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/027 B05C 11/08

Claims (4)

(57) [Claims] 1. A substrate processing apparatus for sequentially supplying a processing fluid to a surface of a substrate and performing a predetermined process on the surface of the substrate, comprising: a substrate supporting means for supporting the substrate; A plurality of fluid supply means each having a slit-shaped fluid discharge port for supplying a fluid toward the surface, and each of the fluid supply ports is moved so that each fluid discharge port moves in parallel to the surface of the substrate supported by the substrate support means. A single guiding means for guiding the fluid supply means. 2. The substrate processing apparatus according to claim 1, further comprising a driving unit that selectively moves the plurality of fluid supply units. 3. The substrate processing apparatus according to claim 1, further comprising substrate rotating means for rotating a substrate supported by said substrate supporting means. 4. A substrate supported by the substrate supporting means,
A rectangular substrate, wherein each of the fluid supply ports of the plurality of fluid supply units is movable along two opposing sides of the rectangular substrate supported by the substrate support unit. The substrate processing apparatus according to any one of claims 1 to 3, wherein the substrate processing apparatus is guided.