JP3020764B2 - Phenolic resin molding material for injection molding - Google Patents
Phenolic resin molding material for injection moldingInfo
- Publication number
- JP3020764B2 JP3020764B2 JP5118549A JP11854993A JP3020764B2 JP 3020764 B2 JP3020764 B2 JP 3020764B2 JP 5118549 A JP5118549 A JP 5118549A JP 11854993 A JP11854993 A JP 11854993A JP 3020764 B2 JP3020764 B2 JP 3020764B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- weight
- molding material
- molding
- phenolic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012778 molding material Substances 0.000 title claims description 30
- 239000005011 phenolic resin Substances 0.000 title claims description 28
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title claims description 16
- 229920001568 phenolic resin Polymers 0.000 title claims description 16
- 238000001746 injection moulding Methods 0.000 title claims description 14
- 239000011256 inorganic filler Substances 0.000 claims description 20
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 20
- 239000002245 particle Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 238000000465 moulding Methods 0.000 description 13
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 3
- 239000004312 hexamethylene tetramine Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000002023 wood Substances 0.000 description 3
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000007730 finishing process Methods 0.000 description 2
- 235000013312 flour Nutrition 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はフェノール樹脂の成形方
法として最も普及している射出成形において、成形時に
発生するバリが少なく且つ薄いためにバリ取りが容易で
あり、射出成形工程とバリ仕上げ工程とを連続自動化し
た場合、バリ残りがなく無人自動仕上げが効率良く、安
定して得られるフェノール樹脂成形材料に関する。BACKGROUND OF THE INVENTION The present invention relates to injection molding, which is most widely used as a method for molding a phenolic resin . In the injection molding, since burrs generated during molding are small and thin, deburring is easy. The present invention relates to a phenolic resin molding material which can be efficiently and stably obtained by performing unattended automatic finishing without burrs when と is continuously automated.
【０００２】[0002]
【従来の技術】従来から、熱硬化性樹脂成形材料の代表
的なものであるフェノール樹脂成形材料は、良好な耐熱
性、電気特性、機械強度等の諸性能が、その良好な成形
性と相まって安価に得られることから種々の用途分野に
おいて用いられている。しかしながら、フェノール樹脂
成形材料は成形時においてバリが発生するため成形後バ
リ仕上げを行なうことが一般的である。従来速硬化性フ
ェノール樹脂成形材料の実用化により成形工程での生産
性向上と自動成形化が促進されたが、射出成形の高速自
動化を最大限に発揮するためにはバリの発生がネックと
なりフェノール樹脂成形品の一層の生産性向上が困難に
なっている。2. Description of the Related Art Conventionally, a phenol resin molding material, which is a typical thermosetting resin molding material, has various properties such as good heat resistance, electric properties, and mechanical strength, combined with its good moldability. Since it can be obtained at low cost, it is used in various application fields. However, phenolic resin
Since a molding material generates burrs at the time of molding, it is general to perform burr finishing after molding. Conventionally, the practical use of fast-curing phenolic resin molding materials has promoted the improvement of productivity and automatic molding in the molding process.However, in order to maximize the high-speed automation of injection molding, the generation of burrs is a bottleneck It has become difficult to further improve the productivity of resin molded products.
【０００３】しかし近年、射出成形工程とバリ仕上げ工
程とを連続して自動化することにより成形サイクルと同
等の短時間でバリ仕上げを行うバリ取り自動仕上げ機の
進歩に伴いバリ仕上げの容易なフェノール樹脂成形材料
が要求されている。従来は、流動性の小さい成形材料と
間隙の少ない高精度の金型の組合せにおいてバリの少な
い射出成形方法を検討している場合もある。しかし、流
動性の小さい成形材料は、大型成形品を射出成形すると
成形性が不安定であるため、このような成形用途には不
適である。高精度金型の適用にも経済的の面から限界が
あり一般的ではない。However, in recent years, with the advance of automatic deburring machines that perform deburring in a short time equivalent to a molding cycle by continuously automating the injection molding process and the burr finishing process, a phenol resin that can be easily burr-finished has been developed. Molding materials are required. Conventionally, an injection molding method with less burrs has been considered for a combination of a molding material having a low fluidity and a high-precision mold having a small gap. However, a molding material having a low fluidity is not suitable for such a molding application because the molding property is unstable when a large molded product is injection-molded. The application of high-precision molds is not common since there is a limit in terms of economy.
【０００４】[0004]
【発明が解決しようとする課題】従来流動性の少ない成
形材料と高精度の金型とを用いた比較的小型の成形品の
射出成形方法でしかバリの少ない射出成形が行なわれな
かったが、本発明は、あらゆる形状、大きさの成形品の
成形においてバリの少ない成形材料を得えんとして検討
し完成されたもので、その目的とするところは、射出成
形において著しくバリが少ないフェノール樹脂成形材料
を提供することにある。Conventionally, injection molding with little burr has been performed only by a relatively small injection molding method using a molding material having low fluidity and a high-precision mold. The present invention has been completed by examining and obtaining a molding material with less burrs in the molding of molded articles of all shapes and sizes. The purpose of the invention is to achieve a phenol resin molding material with significantly less burrs in injection molding. Is to provide.
【０００５】[0005]
【課題を解決するための手段】本発明は、フェノール樹
脂１００重量部に対し粒子径が１５０〜５００μｍと３
〜５０μｍの無機充填材をそれぞれ１０〜５０重量部、
５〜３０重量部配合し、加熱混練して製造されることを
特徴とする射出成形用フェノール樹脂成形材料に関する
ものである。The present invention relates to a phenolic tree.
Particle size of 150 to 500 μm and 100 parts by weight of fat
Each of 10 to 50 parts by weight of an inorganic filler of
The present invention relates to a phenolic resin molding material for injection molding, which is produced by blending 5 to 30 parts by weight and kneading with heat.
【０００６】本発明を用いて、フェノール樹脂としてノ
ボラック型フェノール樹脂、レゾール型フェノール樹脂
等であり、他の樹脂又は化合物で変性してもよい。本発
明においては、各種成形品用途に応じ、上記フェノール
樹脂及び上記粒径の充填材を種々組合せることにより、
射出成形においてバリの少ないことを特長とする速硬化
性樹脂成形材料、高耐熱性成形材料、耐電食性成形材料
あるいは耐衝撃性成形材料等を提供することができる。[0006] Using the present invention, a novolak type phenol resin as phenol resin, resol type phenolic resin
And may be modified with another resin or compound. In the present invention, the above-mentioned phenol
By various combinations of resin and filler of the above particle size,
It is possible to provide a fast-curing resin molding material, a high heat-resistant molding material, an electrolytic corrosion-resistant molding material, an impact-resistant molding material, and the like, which are characterized by low burrs in injection molding.
【０００７】ここでいう無機充填材はアルミナ、水酸化
アルミニウム、タルク、クレー、マイカ、硫酸バリウ
ム、炭酸カルシウム、ガラス粉、シリカ等であり、粒径
１００〜５００μｍと３〜３０μｍの無機充填材をフェ
ノール樹脂１００重量部に対してそれぞれ１０〜５０重
量部、５〜３０重量部組み合わせることにより使用する
ことができる。無機充填材の粒径が３〜３０μｍのみの
場合あるいは１００〜５００μｍのみの場合では成形時
に金型パーティング面でのバリ発生防止には効果が少な
い。同様に、フェノール樹脂１００重量部に対して、粒
径１００〜５００μｍ、３〜３０μｍの無機充填材がそ
れぞれ１０重量部未満、５重量部未満では金型パーティ
ング面でのバリ発生防止には効果が小さい。また、それ
ぞれ５０重量部超、３０重量部超では、他方が所定量で
あっても、バリ発生防止効果が小さいか、成形品強度が
低下する傾向がある。例えば、フェノール樹脂１００重
量部に対して粒径１００〜５００μｍの無機充填材が１
０重量部程度で、３〜３０μｍの無機充填材が３０重量
部を越える場合、あるいは、粒径１００〜５００μｍの
無機充填材が５０重量部を越え、３〜３０μｍの無機充
填材が５重量部程度の場合、バリ発生防止には効果が小
さく、所定量を大きく越えると成形品強度も低下するよ
うになる。一方、フェノール樹脂１００重量部に対して
粒径１００〜５００μｍの無機充填材が５０重量部程度
で、３〜３０μｍの無機充填材が３０重量部を越える場
合、あるいは、粒径１００〜５００μｍの無機充填材が
５０重量部を越え、３〜３０μｍの無機充填材が３０重
量部程度の場合、バリ防止効果はよいが、成形品強度が
低下するようになる。無機充填材として上記粒径として
外のもを含有してもよいことは当然である。The inorganic filler referred to here is alumina, aluminum hydroxide, talc, clay, mica, barium sulfate, calcium carbonate, glass powder, silica or the like. The inorganic filler having a particle size of 100 to 500 μm and 3 to 30 μm is used. It can be used by combining 10 to 50 parts by weight and 5 to 30 parts by weight with respect to 100 parts by weight of the phenol resin. Less effective in the burr prevention of the mold parting surface during molding when the particle size of the inorganic filler in the case or 100~500μm only only 3 to 30 .mu.m. Similarly, with respect to 100 parts by weight of phenolic resin, the particle size 100 to 500 [mu] m, the inorganic filler is less than each of 10 parts by weight of 3 to 30 .mu.m, the effect is the burr prevention in the mold parting plane less than 5 parts by weight Is small. Further, each of 50 parts by weight, greater than the super 30 parts by weight, the other is at a predetermined amount
Even so, the effect of preventing burr generation is small, or the strength of the molded article tends to decrease. For example, phenolic resin 100
1 to 100 parts by weight of inorganic filler
About 0 parts by weight, 30 parts by weight of 3 to 30 μm inorganic filler
Part or when the particle size is 100 to 500 μm.
Inorganic filler exceeding 50 parts by weight, inorganic filler of 3 to 30 μm
When the filler is about 5 parts by weight, the effect is small in preventing burr
If the amount exceeds a certain amount, the strength of the molded product will decrease.
Swell. On the other hand, based on 100 parts by weight of the phenol resin
About 50 parts by weight of inorganic filler having a particle size of 100 to 500 μm
When the inorganic filler of 3 to 30 μm exceeds 30 parts by weight
Or an inorganic filler having a particle size of 100 to 500 μm
Exceeding 50 parts by weight, 30 layers of 3 to 30 μm inorganic filler
In the case of about parts, the burr prevention effect is good, but the strength of the molded product is low.
Will begin to fall. It is a matter of course that the above-mentioned particle diameter may contain a foreign substance as the inorganic filler.
【０００８】このようなフェノール樹脂成形材料は、フ
ェノール樹脂、硬化剤、有機系充填材、無機系充填材に
離型剤、着色剤等の添加剤を配合し、ロール、ヘンシェ
ルミキサー、押出機、２軸押出機等を用いて均一に混練
を行ない冷却粉砕することにより安定して製造すること
ができる。[0008] Such phenolic resin molding materials, off
Add additives such as release agent and colorant to phenolic resin , hardener, organic filler and inorganic filler, and uniformly knead them using roll, Henschel mixer, extruder, twin screw extruder, etc. It can be manufactured stably by performing cooling pulverization.
【０００９】[0009]
【作用】本発明の配合組成に従うと、種々の形状大きさ
の成形品の成形において、従来の市販フェノール樹脂成
形材料に比べて、金型のエアベントからのバリ発生が１
／４以下に少なくなり、パーティング面に過剰なバリの
流出がないので、デフラッシャー仕上げ機でのバリ取り
時間が１／２以下で効率良くバリ取り仕上げが出来、仕
上げ工程の大幅な短縮による生産性向上が図れる。ま
た、成形時に発生するバリが少ないので金型にバリが残
ることが原因で起こる充填不良品の発生及び金型トラブ
ルがなくなる。なお、無機充填材の粒径が３〜３０μｍ
のみの場合あるいは１００〜５００μｍのみの場合には
バリ防止効果が小さく、これらを組み合わせた場合には
バリ発生が減少する理由は、金型パーティング面近くで
１００〜５００μｍの粒径の無機充填材の隙間に３〜３
０μｍの粒径の無機充填材が入り込み、その結果、これ
らの充填材により樹脂の流れが遮断され、樹脂が金型パ
ーティング面から流出するのを防止するためと考えられ
る。According to the composition of the present invention, when molding molded articles of various shapes and sizes, burrs are generated from the air vent of the mold in comparison with a conventional commercially available phenolic resin molding material.
/ 4 or less, and there is no excessive flash of burrs on the parting surface, so that deburring time with a deflasher finisher is less than 1/2 and efficient deburring can be performed, greatly reducing the finishing process. Productivity can be improved. Further, since there is little burr generated during molding, the occurrence of defective filling and the trouble of the mold caused by the burr remaining in the mold are eliminated. In addition, the particle size of the inorganic filler is 3 to 30 μm.
In the case of only 100 μm or only 100 to 500 μm, the effect of preventing burr is small, and in the case of combining them, the reason for reducing the burr generation is that the inorganic filler having a particle size of 100 to 500 μm near the mold parting surface. Between 3 and 3
Inorganic filler having a particle diameter of 0μm is narrowing enters, as a result, this
These fillers block the flow of resin and allow the resin to
It is thought that it is to prevent it from flowing out of the printing surface .
【００１０】[0010]
【実施例】以下、実施例及び比較例により本発明を説明
する。 ＜実施例＞ 蓚酸触媒のノボラック型フェノール樹脂１００重量部に
対してヘキサメチレンテトラミン１８重量部、粒径が２
００〜２５０μｍの炭酸カルシウム２０重量部、粒径が
５〜５０μｍのシリカ１０重量部、木粉５５重量部及び
離型剤、着色剤等の添加剤１４重量部を混合し、ロール
で混練しフェノール樹脂成形材料を得た。この成形材料
を図１に示すような金型１を用いて射出成形し、成形品
２を得た。パーティング面３を中心に成形品２に発生し
たバリの総面積は １.５ｃｍ２であった。The present invention will be described below with reference to examples and comparative examples. <Example> 18 parts by weight of hexamethylenetetramine and 100 parts by weight of a novolak type phenol resin of an oxalic acid catalyst having a particle diameter of 2 parts
20 parts by weight of calcium carbonate having a particle size of 00 to 250 μm, 10 parts by weight of silica having a particle size of 5 to 50 μm, 55 parts by weight of wood powder, and 14 parts by weight of additives such as a release agent and a colorant are mixed and kneaded with a roll, and phenol is mixed. A resin molding material was obtained. This molding material was injection-molded using a mold 1 as shown in FIG. The total area of burrs generated on the molded product 2 around the parting surface 3 was 1.5 cm 2.
【００１１】＜比較例１＞ 蓚酸触媒のノボラック型フェノール樹脂１００重量部に
対してヘキサメチレンテトラミン１８重量部、粒径が５
〜５０μｍのシリカ３０重量部、木粉５５重量部及び離
型剤、着色剤等の添加剤１４重量部を混合し、ロールで
混練しフェノール樹脂成形材料を得た。この成形材料を
実施例と同様に射出成形した。成形品に発生したバリの
総面積は １１.０ｃｍ2 であった。Comparative Example 1 18 parts by weight of hexamethylenetetramine and 100 parts by weight of oxalic acid-catalyzed novolak-type phenol resin having a particle size of 5 parts
30 parts by weight of silica of 50 to 50 μm, 55 parts by weight of wood flour, and 14 parts by weight of additives such as a release agent and a colorant were mixed and kneaded with a roll to obtain a phenol resin molding material. This molding material was injection molded in the same manner as in the example. The total area of burrs generated on the molded product was 11.0 cm 2 .
【００１２】＜比較例２＞ 蓚酸触媒のノボラック型フェノール樹脂１００重量部に
対してヘキサメチレンテトラミン１８重量部、粒径が２
００〜２５０μｍの炭酸カルシウム３０重量部、木粉５
５重量部及び離型剤、着色剤等の添加剤１４重量部を混
合し、ロールで混練しフェノール樹脂成形材料を得た。
この成形材料を実施例と同様に射出成形した。成形品に
発生したバリの総面積は １０.０ｃｍ2 であった。Comparative Example 2 18 parts by weight of hexamethylenetetramine and 100 parts by weight of oxalic acid-catalyzed novolak-type phenol resin had a particle diameter of 2 parts.
30 parts by weight of calcium carbonate of 00 to 250 μm, wood flour 5
5 parts by weight and 14 parts by weight of additives such as a release agent and a colorant were mixed and kneaded with a roll to obtain a phenol resin molding material.
This molding material was injection molded in the same manner as in the example. The total area of burrs generated on the molded product was 10.0 cm 2 .
【００１３】[0013]
【発明の効果】以上の効果から明らかなように、本発明
のフェノール樹脂成形材料は、これを用いて射出成形し
た場合、バリ発生の極めて小さい成形品を得ることがで
きる。従って、射出成形とバリ仕上げとの工程を接続し
て省力化をはかった射出成形による成形品生産方式にお
いて、バリの無い成形品が安定して効率良く得られ、生
産性向上に対して大きく寄与するものである。As is apparent from the above effects, when the phenolic resin molding material of the present invention is injection-molded using the phenolic resin molding material, it is possible to obtain a molded article having extremely small burrs. Therefore, in a molded product production system by injection molding that connects the processes of injection molding and burr finishing to save labor, molded products without burrs can be obtained stably and efficiently, greatly contributing to improved productivity. Is what you do.
【図１】 フェノール樹脂成形材料を射出成形した状態
を示す金型断面図。FIG. 1 is a mold sectional view showing a state in which a phenolic resin molding material is injection-molded.
１ 金型 ２ 成形品 ３ パーティング面 1 Mold 2 Molded product 3 Parting surface
Claims (1)
形材料において、フェノール樹脂１００重量部に対して
粒径１５０〜５００μｍの無機充填材及び粒径３〜５０
μｍの無機充填材をそれぞれ１０〜５０重量部、５〜３
０重量部含有することを特徴とする射出成形用フェノー
ル樹脂成形材料。1. A phenolic resin molding material containing an inorganic filler, wherein an inorganic filler having a particle size of 150 to 500 μm and a particle size of 3 to 50 are added to 100 parts by weight of the phenolic resin.
10 to 50 parts by weight, 5 to 3 parts by weight
Phenol for injection molding characterized by containing 0 parts by weight
Resin molding material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5118549A JP3020764B2 (en) | 1993-05-20 | 1993-05-20 | Phenolic resin molding material for injection molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5118549A JP3020764B2 (en) | 1993-05-20 | 1993-05-20 | Phenolic resin molding material for injection molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06329920A JPH06329920A (en) | 1994-11-29 |
| JP3020764B2 true JP3020764B2 (en) | 2000-03-15 |
Family
ID=14739339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5118549A Expired - Fee Related JP3020764B2 (en) | 1993-05-20 | 1993-05-20 | Phenolic resin molding material for injection molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3020764B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2292685B1 (en) | 2009-09-07 | 2012-06-27 | The Procter & Gamble Company | Bottle cap made from a material comprising polypropylene, particulate calcium carbonate and additives |
-
1993
- 1993-05-20 JP JP5118549A patent/JP3020764B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06329920A (en) | 1994-11-29 |
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