JP3033258B2 - Electronic parts mold press equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold press apparatus for electronic parts, and more particularly, to an apparatus for mounting an object on an upper surface and a lower surface of a mold body and performing a mold press.

[0002]

2. Description of the Related Art A mold press apparatus for forming electronic components such as ICs and LSIs is a method in which a substrate on which a chip is mounted is set between an upper mold and a lower mold, and the upper mold and the lower mold are joined and then combined. A resin is press-fitted, and a molded body for molding the chip is formed.

FIG. 4 shows a known electronic component. The electronic component P is formed by mounting a heat sink 5 for heat radiation and a substrate 6 on the upper and lower surfaces of a mold body M. C is a chip mounted on the substrate 6.

As described above, when the heat sink 5 and the substrate 6 to be mounted are mounted on the upper and lower surfaces of the mold body M, the substrate 6 can be easily set on the upper surface of the lower mold. Since there was no apparatus that could be easily set on the lower surface of the mold, when manufacturing such an electronic component P, an operator manually set the heat sink 5 on the lower surface of the upper mold.

[0005]

However, the work efficiency of the manual operation by the worker is not improved, and is also dangerous for security.

Accordingly, an object of the present invention is to provide a mold press apparatus which can easily set an object to be mounted on an upper surface and a lower surface of a mold body.

[0007]

For this purpose, the present invention provides a moving element which is conveyed to a moving means and advances between an upper mold and a lower mold, and retreats from between the upper and lower molds. In addition, while mounting the object to be mounted on the upper and lower surfaces of the mold body, on the lower surface of the upper die and the upper surface of the lower die,
This is provided with suction means for sucking the mounted object.

[0008]

In the above structure, when performing the mold press, the movable member is advanced while the upper and lower dies are opened, and the object mounted on the upper surface and the lower surface of the movable member is moved upward. Adsorb to the lower surface of the mold and the upper surface of the lower mold.

Next, after the movable element is retracted from between the upper mold and the lower mold, the upper mold and the lower mold are joined, and a synthetic resin is press-fitted to form a molded body.

[0010]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a mold press apparatus. 1 is an upper mold, 2 is a lower mold, and the moving element 3 is located between them. The outer shape of the movable element 3 is a long box shape, and a long plate-shaped jig 4 is supported on the upper surface thereof. A large number of heat sinks 5 are mounted on the jig 4. A large number of substrates 6 are located below the movable element 3.

The moving element 3 is held by an arm 67 connected to a bracket 66. This arm 67
The rotation of the ball screw 8 causes the ball screw 8 to move in the longitudinal direction, and the moving element 3 advances between the upper mold 1 and the lower mold 2 and retreats from the space. Reference numeral 60 denotes a holding frame for the arm 67, which is mounted on the guide pin 65 on which the coil spring 64 is mounted. Reference numeral 61 denotes a cylinder provided above the holding frame 60, and when the rod 62 protrudes, the holding frame 60 is pushed down by this, and the moving element 3 descends. 9 is a guide rail for guiding forward and backward, 1
0 is a slider.

FIG. 2 is a sectional view of the mold press apparatus. On the upper surface of the mover 3, a cylinder 1
1 and 12 are placed. The rod 11 a of one cylinder 11 is connected to the jig 4. Upper die 1
Is formed with a suction hole 13. Therefore, when the rod 11a projects, the jig 4 rises, and the heat sink 5 on this jig 4 is attracted to the lower surface of the upper die 1.

The substrate 6 is adsorbed on the lower end of a nozzle 14 provided inside the moving element 3. The cylinder 12
Rod 12a penetrates the moving element 3, and a plate-shaped pressing element 15 is attached to the lower end thereof. When the rod 62 of the cylinder 61 projects, the mover 3 descends,
The lower ends of the pins 6 a of the substrate 6 slightly fit into the holes 2 a of the lower mold 2. Next, when the rod 12a of the cylinder 12 projects, the presser 15 descends, presses the substrate 6 downward, forcibly drops from the nozzle 14, and lands on the upper surface of the lower die 2. A suction hole 17 is formed in the lower mold 2 to suck and fix the dropped substrate 6. Reference numeral 16 denotes a lifting guide shaft.

In FIG. 1, reference numeral 18 denotes a tablet supply unit provided on the side of the movable element 3 and has a hole 19.
The tablet which is a raw material resin of the mold body is supplied to the hole 19 by means not shown. The supply unit 18 is held by the bracket 66 and moves forward and backward between the upper die 1 and the lower die 2 together with the movable member 3.

FIG. 3 is an explanatory diagram of the entire operation. In the figure, reference numeral 21 denotes a magazine for housing a jig 30 for holding the heat sink 5. The jig 30 is stacked and stored in the magazine 21. The magazine 21 is vertically movable by a nut 22, a ball screw 23, and a motor 24.
Behind the magazine 21, a cylinder 25 is provided. By moving the magazine 21 up and down, a predetermined jig 30
Is positioned in front of the rod 25a of the cylinder 25, and when the rod 25a projects, the jig 30 is pushed out onto the conveyor 26.

Numeral 27 denotes a transfer head provided on the conveyor 26, and the jig 3 extruded onto the conveyor 26.
0 is picked up and transferred to the jig 4 on the movable member 3 which is waiting at the left end of the ball screw 8. 28 is a motor for driving the ball screw 8;
Is a nut screwed into the ball screw 8.

Reference numeral 31 denotes a magazine provided below the magazine 21 and accommodates a plate-shaped carrier 40 on which the substrate 6 is placed. This magazine 31
Is moved up and down by a nut 32, a ball screw 33, and a motor 34, and a rod 3 of a cylinder 35 provided behind the
When 5a projects, carrier 40 is pushed onto conveyor 36. Carrier 4 extruded onto conveyor 36
The substrate 6 on 0 is picked up by the transfer head 37 and transferred onto the receiving table 41. The empty carrier 40 from which the substrate 6 has been picked up is returned into the magazine 31 by means (not shown) such as a cylinder.

The receiving table 41 is provided with a rod 4 of a cylinder 42.
2a. When the rod 42a projects, the pedestal 41 rises, and the substrate 6 on this pedestal 41
(See the chain line in FIG. 3). In FIG. 3, the number of the heat sinks 5 on the jig 4 and the number of the substrates 6 on the carrier 40 are smaller than those in FIG.

In FIG. 3A, the heat sink 5 is mounted on the jig 4 on the upper surface of the movable member 3 as described above.
Further, a state is shown in which the substrate 6 is sucked by the nozzle 14 on the lower surface of the moving element 3.

Next, when the motor 28 is driven, the moving element 3
Moves forward along the ball screw 8. The tablet is inserted into the supply unit 18 by means (not shown), and the heat sink 5, the substrate 6, and the tablet are simultaneously placed in the upper die 1.
And the lower die 2 (see FIG. 3B).

Next, as described with reference to FIG. 2, the rod 11a of the cylinder 11 projects, so that the heat sink 5 on the jig 4 is attracted to the lower surface of the upper mold 1, and the rod 12a of the cylinder 12 As a result, the substrate 6 sucked by the nozzle 14 of the moving element 3 lands on the lower mold 2 (see FIG. 3C).

Next, the rods 11 of the cylinders 11 and 12
The moving element 3 escapes from between the upper mold 1 and the lower mold 2 by the a and 12a being retracted and the motor 28 rotating in the reverse direction (see FIG. 3D). Next, the upper mold 1 and the lower mold 2 are joined, and between the heat sink 5 and the substrate 6, the synthetic resin in which the tablet is melted is press-fitted to form a molded body (see FIG. 3E).
Next, the upper mold 1 and the lower mold 2 are opened, and the molded object is taken out, whereby the electronic component P shown in FIG. 4 is obtained.

[0024]

As described above, the present invention comprises an upper die and a lower die, and a movable member which is carried by the moving means, advances between the upper die and the lower die, and retreats from between the upper die and the lower die. Attachment means for attaching objects to be mounted on the upper and lower surfaces of the mold body to the upper and lower surfaces of the mover and adsorbing the objects to the lower surface of the upper die and the upper surface of the lower die. Is provided, an object to be mounted can be easily set on the lower surface of the upper die and the upper surface of the lower die, and an electronic component in which the object is mounted on the upper and lower surfaces of the mold body can be manufactured with good workability. .

[Brief description of the drawings]

FIG. 1 is a perspective view of a mold press device according to the present invention.

FIG. 2 is a sectional view of a mold press apparatus according to the present invention.

FIG. 3 is a process diagram of a mold press according to the present invention.

FIG. 4 is a sectional view of an electronic component according to the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 upper die 2 lower die 3 mover 5 mounted object 6 mounted object 8 moving means 13 suction means 17 suction means 28 moving means 29 moving means M molded body

Claims (1)

(57) [Claims] 1. An upper die and a lower die, which are conveyed to a moving means,
A mover that moves forward between the upper mold and the lower mold, and further retracts from between the upper mold and the lower mold, is mounted on the upper surface and the lower surface of the mover, with the mounted object mounted on the upper surface and the lower surface of the mold body, A mold press apparatus for an electronic component, wherein suction means for sucking the object to be mounted is provided on a lower surface of the upper die and an upper surface of the lower die.