JP3036249B2 - Chip mounting structure and test method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a bare chip formed such that a bare chip fixed to a substrate can be removed as required.

When an electronic device is formed by mounting a semiconductor element on a substrate, a unit test is usually performed by a burn-in test for holding the semiconductor element at a high temperature state and a function test for performing a function check by inputting and outputting test signals. Is performed, and the semiconductor element determined to be non-defective by the unit test is mounted on a predetermined substrate.

On the other hand, in mounting such a semiconductor element, a bare chip has recently been directly mounted on a substrate due to high-density mounting. Therefore, in a configuration in which such a bare chip is directly mounted on a substrate, it is necessary to easily perform a unit test of the bare chip.

[0004]

2. Description of the Related Art Conventionally, the configuration is as shown in the conventional explanatory diagram of FIG. FIGS. 4A and 4B are side views.

As shown in FIG. 4A, a bump 10 is fixed to an electrode 5 of a bare chip 4 and a bare chip is
4 If you want to install
The welding was performed by welding the bumps 10.

In the socket 14, contact pins 13 are arranged on one surface 12A of the insulating member 12 made of a ceramic material.
The pads 3 are arranged on the other surface 12B, the pattern 11 is connected between the contact pins 13 and the pads 3, and the predetermined contact pins 13 are formed so as to have electrical conduction with the predetermined pads 3.

Therefore, when performing a unit test of the bare chip 4, the bare chip 4 is attached to the socket 14, and for example,
The contact pins 13 connected to the connector of a given test apparatus, a single test by inputting and outputting test signals S through the contact pin 13 has been performed.

Therefore, when the bare chip 4 is removed from the socket 14 after the unit test, the bump 10 is melted by heating as shown in FIG. 4B, and the bare chip 4 is removed as shown by an arrow A. It is necessary to peel it off.

[0009]

However, in a configuration in which the bare chip 4 is mounted on the socket 14 by welding the bump 10 to the pad 3, when the bare chip 4 is removed from the socket 14, the state shown in FIG. As shown, bare chip 4
An external force is applied so as to peel off the pad 3 and the electrode 5 of the bare chip 4.
10 will adhere.

Therefore, when the bare chip 4 is removed from the socket 14 after the unit test, there is a problem that the bare chip 4 is damaged by applying an external force and removing the attached bumps 10.

Accordingly, an object of the present invention is to facilitate removal of a bare chip.

[0012]

Figure 1 [Means for Solving the Problems] In principle illustration of the present invention, as shown in the side view of FIG. 1 (a) (b), the electrode
5 and the electrodes 5 via bumps 7.
A substrate 8 having pads 3 electrically connected to
Hardens at a temperature of above and softens at a temperature higher than the predetermined temperature.
An edge layer 6 between the electrode 5 and the bump 7 or
Either the pump 7 or the pad 3 is in a non-fixed state.
Configure to be connected .

The above-mentioned configuration solves the above-mentioned problem.

[0014]

In other words, an insulating layer 6 made of a thermoplastic synthetic resin material is formed between the substrate 8 and the bare chip 4, and at the time of the unit test, the bare chip 4 is fixed by the insulating layer 6; heated to a predetermined temperature, when the allow is removed Ri taken easily bare chip 4 by softening the insulating layer 6 together, which was so as to secure the bump 7 to be close contact with the electrodes 5 of the bare chip 4 to pad is there.

[0015] Thus, by fixing the bare chip 4 by an insulating layer 6, the bumps 7 by mounting the bare chip 4 to the socket 8 can be closely electrode 5 of the bare chip 4, out to field takes bare chip 4 from the socket 8 In this case, the removal can be performed with the bump 7 fixed to the socket 8 side.

[0016] Therefore, Te <br/> Saishi removal as described above, to join a large external force to the bare chip 4, and,
It is not necessary to remove the bumps attached to the electrodes 5, and it is possible to avoid damaging the bare chip 4, and furthermore, it is possible to easily perform attachment and detachment, and to reduce the number of test steps in a unit test.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to FIGS. FIG. 2 is an explanatory diagram of an embodiment according to the present invention.
(a) is a side view, (b1) to (b5) are views for attaching and removing a bare chip, FIG. 3 is an explanatory view of another embodiment of the present invention, (a) is a plan view, and (b) is a plan view. It is a side view. Throughout the drawings, the same reference numerals indicate the same objects.

As shown in FIG. 2A, the drawing pattern 9
An insulating layer made of a thermoplastic synthetic resin material is formed on a substrate 8 formed by arranging the pads 3 connected to the
6, the bare chip 5 is mounted, the electrodes 5 of the bare chip 5 are formed so as to be connected to the pads 3 via the bumps 7, and the connection pads 2 formed on one of the lead-out patterns 9 are formed. Are formed by connecting the contact pins 2A.

The bumps 7 are formed of a thermosetting palladium-based conductive resin material, are fixed to the pads 3, and are formed so as to be in close contact with the electrodes 5 of the bare chip 4. In mounting such a bare chip 4, as shown in FIG. 2 (b1), a thermosetting palladium-based conductive resin material is applied to the pads 3 arranged on the insulating member 1 by masking and heated. Thus, the palladium-based conductive resin material is cured to form the bumps 7, and then, as shown in FIG. 2 (b2), the predetermined surface 1A, on which the pads 3 are arranged, becomes a gel at room temperature. An arrow B is formed by placing the plastic synthetic resin material 6-1 and positioning the electrode 5 of the bare chip 4 on the bump 7.
The bare chip 4 is pressed against the insulating member 1 as described above.

By pressing the bare chip 4 in this manner, heating at a predetermined temperature T1, for example, heating at a temperature of 110 to 150 ° C., is performed, and as shown in FIG.
1 is cured to form an insulating layer 6, and the bare chip 4 is fixed to the predetermined surface 1A of the insulating member 1, and at the same time, the bump 7 is
The bare chip 4 can be mounted on the insulating member 1 so as to be in close contact with.

Therefore, a predetermined test signal S is input to and output from the contact pin 2A, and after the unit test is completed, the bare chip 4 is removed from the insulating member 1. In this case, heating at a temperature T2 higher than the above-mentioned heating temperature T1, for example, at a temperature of 150 to
Heat again at 200 ° C, and as shown in Fig. 2 (b4),
6 is softened, and as shown in FIG.
Can be removed by peeling off as shown by arrow A.

[0022] In this case, since the bump 7 is secured to the Pas head 3, the bump 7, between the electrodes 5 are separated. Therefore, the bare chip 4 can be easily removed without the molten bump 10 adhering to the electrode 5 of the bare chip 4 which has been removed as in the related art, and without applying a large external force to the bare chip 4 at the time of removal.

Furthermore, conventionally, bare chips 4 to be tested
However, it was necessary to form the bumps 10 on the bare chip 4, but the labor for forming the bumps 10 on the bare chip 4 became unnecessary, and the obtained bare chip 4 could be tested immediately. The man-hour can be reduced.

In the case shown in FIGS. 3A and 3B, the pad 3 is provided on the predetermined surface 1A of the insulating member 1, and the lead pattern is provided on the pad 3.
9 and the connection pad 2 connected via
The bare chip 4 is fixed to the predetermined surface 1A of the substrate 8 via the insulating layer 6, and the electrodes 5 of the bare chip 4 are
The bare chip 4 is mounted by being connected to the pad 3 through the connection pad, and the test by inputting and outputting the test signal S is performed by the connection pad 2.

Also in this case, as described above, the insulating layer 6
The bump 7 is formed so as to be hardened by heating at T1 and softened by heating at temperature T2, and the bump 7 is fixed to the pad 3.

Therefore, after the bare chip 4 is mounted on the substrate 8 and the predetermined unit test is completed, the bare chip 4 is removed from the substrate 8.
4 can be easily removed.

[0027]

As described above, according to the present invention,
The bare chip is fixed by forming an insulating layer made of a thermoplastic synthetic resin material between the substrate and the bare chip, and when the bare chip is removed from the substrate, it can be easily removed by softening the insulating layer. Further, the bump can be fixed to the substrate side, and the bare chip can be mounted without forming the bump on the bare chip.

Accordingly, as compared with the conventional case, the mounting and detaching of the bare chip becomes easier, the number of testing steps can be reduced, and the damage to the bare chip can be avoided, so that the practical effect is large.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating the principle of the present invention.

FIG. 2 is an explanatory view of an embodiment according to the present invention.

FIG. 3 is an explanatory view of another embodiment of the present invention.

FIG. 4 is a conventional explanatory view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulation member 2 Connection pad 3 Pad 4 Bare chip 5 Electrode 6 Insulating layer 7 Bump 8 Substrate 1A surface

Claims (2)

(57) [Claims] 1. A chip having electrodes, a substrate having pads electrically connected to the electrodes via bumps, and an insulating layer which is hardened at a predetermined temperature and softened at a temperature higher than the predetermined temperature. A chip mounting structure, wherein one of the electrode and the bump or the bump and the pad is connected in a non-fixed state. 2. A test method for performing an electrical test by connecting an electrode of a chip to a pad of a substrate, the method comprising: forming a bump electrically connecting the pad and the electrode; Applying an insulating layer that cures at a predetermined temperature, and heating the chip to the predetermined temperature so that the chip is in a non-fixed state between the electrode and the bump or between the bump and the pad with respect to the substrate. a step of mounting Te, after electrical test of the chip, the predetermined temperature and heated to a temperature higher than said softening the insulating layer, a chip testing method comprising the step of removing the chip from the substrate.