JP3037964B2 - Electromagnetic wave shield plate and method of manufacturing the same - Google Patents
Electromagnetic wave shield plate and method of manufacturing the sameInfo
- Publication number
- JP3037964B2 JP3037964B2 JP2158114A JP15811490A JP3037964B2 JP 3037964 B2 JP3037964 B2 JP 3037964B2 JP 2158114 A JP2158114 A JP 2158114A JP 15811490 A JP15811490 A JP 15811490A JP 3037964 B2 JP3037964 B2 JP 3037964B2
- Authority
- JP
- Japan
- Prior art keywords
- solvent
- layer
- electroless plating
- organic polymer
- transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000007772 electroless plating Methods 0.000 claims description 44
- 239000002904 solvent Substances 0.000 claims description 40
- 239000011148 porous material Substances 0.000 claims description 27
- 150000001875 compounds Chemical class 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 25
- 238000009835 boiling Methods 0.000 claims description 23
- 229920000620 organic polymer Polymers 0.000 claims description 21
- 238000007747 plating Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 11
- 239000003054 catalyst Substances 0.000 claims description 10
- 229920000178 Acrylic resin Polymers 0.000 claims description 7
- 239000004925 Acrylic resin Substances 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 7
- 239000012046 mixed solvent Substances 0.000 claims description 6
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 claims description 2
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- -1 ITO Chemical class 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 2
- 238000007605 air drying Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N propyl acetate Chemical compound CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- FDPIMTJIUBPUKL-UHFFFAOYSA-N dimethylacetone Natural products CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Inorganic Insulating Materials (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
この発明は、電子レンジの窓、VDTの表示装置を構成
するCRTやプラズマディスプレイパネルなどの表示面前
面に配置するフィルター、計測機器の表示部などに用い
られる電磁波シールド板およびその製造方法に関するも
のであり、より詳しくは、電磁波を遮蔽する働きをし、
かつ電子レンジや計測機器などの内部、CRTやプラズマ
ディスプレイパネルなどの表示面を透視することができ
る電磁波シールド板とその製造方法に関するものであ
る。The present invention relates to a window of a microwave oven, a filter disposed on the front surface of a display surface such as a CRT or a plasma display panel constituting a display device of a VDT, an electromagnetic wave shielding plate used for a display section of a measuring instrument, and a method of manufacturing the same. Yes, more specifically, it works to block electromagnetic waves,
Also, the present invention relates to an electromagnetic wave shield plate capable of seeing through the inside of a microwave oven, a measuring instrument, or the like, or a display surface of a CRT, a plasma display panel, or the like, and a method of manufacturing the same.
従来、透視することができると共に電磁波を遮蔽する
ことができる材料には大きく分けて２種類のものがあっ
た。 まず一つは、金網、または編み上げ繊維に無電解メッ
キした導電性ネットを、ガラスまたはアクリル樹脂板で
挟み込み形成したものである。 もう一つは、金などの金属やITOなどの金属酸化物
や、蒸着やスパッタリングによって透明導電層として透
明基板上に形成したものである。Conventionally, there are roughly two types of materials that can be seen through and shield electromagnetic waves. First, a conductive net formed by electroless plating a wire net or woven fiber is sandwiched between glass or acrylic resin plates. The other is a metal such as gold, a metal oxide such as ITO, or a transparent conductive layer formed on a transparent substrate by vapor deposition or sputtering.
しかし、上記の従来材料にはそれぞれ次のような欠点
があった。 前者の場合、金網を使用する場合には金網の規格が決
まっているので線幅やピッチなどの設計に自由度がな
く、また電磁波の遮蔽を有効に行うには金属線の個々の
交点を確実に接続し導通をとることが必要であるにもか
かわらず、金属線は剛性を有しているものであるため使
用できる金網に著しく制限があった。編み上げ繊維に無
電解メッキした導電性ネットを使用する場合にも線幅や
ピッチなどについて使用者側の自由な設計が不可能で、
製造コストが高いという欠点があった。また、金網でも
導電性ネットでも内部を見やすくするためには、金網表
面や導電性ネット表面の反射を抑えることを目的として
別工程で金網や導電性ネットの表面を黒色に染めておく
必要があり、これも製造コスト高の原因になっていた。
さらに、枠付用リード部がネット状であるため、枠との
接続方法が難しく使用者側の不便を招いていた。 後者の場合、つまり透明基板上に透明導電層を形成し
たものの場合は、金の蒸着やスパッタリングでは導電性
は高いがコストが非常に高く、またITOの蒸着やスパッ
タリングでは安価であるが導電性が低いために、高効率
な電磁波シールド効果を求めることが不可能であった。However, each of the above conventional materials has the following disadvantages. In the former case, when wire mesh is used, the wire mesh standard is fixed, so there is no freedom in the design such as line width and pitch, and in order to effectively shield electromagnetic waves, the individual intersections of the metal wires must be secured. Despite the necessity of connection and electrical connection to the metal wire, the metal wire that is rigid has severely limited the wire mesh that can be used. Even when using conductive nets electrolessly plated on woven fibers, it is impossible for the user to freely design the line width and pitch, etc.
There is a disadvantage that the manufacturing cost is high. In addition, in order to make the inside of the wire net or the conductive net easier to see, it is necessary to dye the surface of the wire net or the conductive net black in a separate process in order to suppress the reflection on the wire mesh surface or the conductive net surface. This, too, has caused high manufacturing costs.
Furthermore, since the frame-attached lead portion is in a net shape, it is difficult to connect the frame to the frame, causing inconvenience to the user. In the latter case, that is, when a transparent conductive layer is formed on a transparent substrate, the conductivity is high but the cost is very high when depositing or sputtering gold, and the cost is very low when depositing or sputtering ITO, but the conductivity is low. Because of the low efficiency, it was impossible to obtain a highly efficient electromagnetic wave shielding effect.
この発明は、以上のような問題点を解決するために、
透明基板上に有機高分子化合物からなる多数の微細孔を
有する透明多孔体層が形成され、該透明多孔体層上に部
分的に無電解メッキ層が形成され、前記透明基板側から
透視した場合に前記無電解メッキ層が黒色を呈している
ように構成した。 有機高分子化合物を、該有機高分子化合物を溶解しう
る溶媒である親溶媒と該親溶媒よりも沸点が高く、上記
有機高分子化合物を溶解しない溶媒である高沸点貧溶媒
とからなる混合溶媒に溶解して透明基板上に塗布し、そ
の後加熱することによってまず前記低沸点の親溶媒（以
下、低沸点親溶媒と呼ぶ）を気化させ、次いで前記高沸
点貧溶媒を気化させることにより有機高分子化合物から
なる多数の微細孔を有する透明多孔体層を形成し、パタ
ーンに応じて透明多孔体層上にレジスト層を形成したの
ち、透明多孔体層が形成された透明基板を化学メッキ用
溶媒に接触させて微細孔中のレジスト層を形成していな
い部分のみに化学メッキ用触媒を吸着させ、その後、無
電解メッキすることによって任意の線幅およびピッチで
設計され内部を透視可能なパターンを有する無電解メッ
キ層を形成するように構成した。或いは、同様に透明多
孔体層を形成した後、透明多孔体層上全面に無電解メッ
キ層を形成し、その上に所望のパターン状にエッチング
レジストを印刷法あるいはフォトレジスト法にて形成
し、その後、不要な無電解メッキ層をエッチング除去す
ることによって任意の線幅およびピッチで設計され内部
を透視可能なパターンを有する無電解メッキ層を形成す
るように構成した。 さらに図面を用いてこの発明を詳しく説明する。 第１図はこの発明の電磁波シールド板の一実施例を示
す断面図、第２〜３図はこの発明の電磁波シールド板の
製造工程を示す断面図である。１は透明基板、２は透明
多孔体層、３は黒色部、４は無電解メッキ層、５はレジ
スト層を示している。 透明基板１としては、ガラス、アクリル系樹脂、ポリ
カーボネイト樹脂、エチレン−ビニルアルコール共重合
体、エチレン−酢酸ビニル共重合体、塩化ビニル系樹脂
のように透明なものであればよく、板状またはフィルム
状のものなどを用いることができる。 有機高分子化合物からなる透明多孔体層２は、多数の
微細孔を有していることが必要である。この微細孔の中
に化学メッキ用触媒が吸着され、無電解メッキ層４形成
の核となる。 透明基板１上に透明多孔体層２を形成するには、低沸
点親溶媒と高沸点貧溶媒からなる混合溶媒に溶解した有
機高分子化合物を透明基板１上に塗布し、加熱すること
により得られる。 この加熱は、有機高分子化合物の内部に多数の微細孔
を形成させるために、まず低沸点親溶媒が気化する温度
で加熱することによって低沸点親溶媒を気化させ、有機
高分子化合物の塗布膜を乾燥固化状態とする。次いで高
沸点貧溶媒が気化する温度で加熱することによって、有
機高分子化合物の乾燥固化膜中に一定の体積を占めて存
在している高沸点貧溶媒を気化させる。このようにする
ことによって多数の微細孔を有する透明多孔体層２を形
成する。 前記有機高分子化合物としては、たとえば、ポリカー
ボネイト、エチレン−酢酸ビニル共重合体、エチレン−
ビニルアルコール共重合体、エチレン−アクリル酸共重
合体、酢酸ビニル−ビニルアルコール共重合体、塩化ビ
ニル系樹脂およびアクリル系樹脂などが挙げられる。も
ちろん多数の微細孔を有する透明多孔体層２が形成でき
るものであれば、これらに限定されるものではない。 また、低沸点親溶媒と高沸点貧溶媒からなる混合溶媒
としては、用いる有機高分子化合物により異なるが、た
とえばアクリル樹脂であれば、メチレンエチルケトン、
酢酸メチル、酢酸エチル、イソプロピルアルコールなど
の低沸点親溶媒と、水、ｎ−ブチルアルコール、ｎ−ペ
ンタノール、γ−ブチルラクトンなどの高沸点貧溶媒と
を混合したものがある。 透明多孔体層２の層厚は、0.05〜20μｍ、好ましくは
0.5から５μｍである。これは、0.05μｍより薄いと、
所望の光学濃度を得るための無電解メッキ層４を形成す
ることができないからであり、20μｍより厚いと透明多
孔体層２の透明性に支障を来すからである。 この透明多孔体層２上に、該微細孔中に化学メッキ用
触媒を吸着させた後、これを還元し、微細孔内および透
明多孔体層２表面にメッキ核を形成せしめ、上記透明多
孔体層２を無電解メッキ液で処理して黒色部３および無
電解メッキ層４を形成させる。 透明多孔体層２上に形成された無電解メッキ層４は、
透明基板１側から透視した場合に黒色を呈しているよう
に見える（図面中の黒色部３）。このように見える理由
としては、次のように考えられる。透明多孔体層２の微
細孔中の化学メッキ用触媒をメッキ核として無電解メッ
キする際、まず、微細孔の内部よりメッキが開始され
る。しかし微細孔の内部では一様な無電解メッキ層４は
得られず数nm〜十数nm径の金属コロイドとなり析出され
る。この微細孔中の金属コロイドが無電解メッキ層４の
黒化作用を有するからと考えられる。この金属コロイド
が、微細孔の外部表面近くまで析出されるとそれ以降
は、一様な無電解メッキ層４が形成される。 黒色部３および無電解メッキ層４を特定のパターンに
形成するには、透明多孔体層２の微細孔中に化学メッキ
用触媒を吸着させる前に、パターンに応じて透明多孔体
層２上にレジスト層５を形成すればよい。レジスト層５
を形成する方法としては、印刷法あるいはフォトレジス
ト法がある。透明多孔体層２上にレジスト層５を形成し
たのち、透明多孔体層２が形成された透明基板１を、化
学メッキ用触媒に接触させる。このようにすることによ
り、レジスト層５を形成した部分の微細孔中には化学メ
ッキ用触媒が吸着されず、レジスト層５を形成していな
い部分のみに吸着される。このように部分的に化学メッ
キ用触媒を吸着させたものを用いて無電解メッキを行う
と、黒色部３および無電解メッキ層４を容易にパターン
化することができる。なお、無電解メッキ層４が形成さ
れない部分は、前記したように透明多孔体層２が透明性
に優れたものであるから、透明性に優れた部分となる。 黒色部３および無電解メッキ層４をパターン化する方
法としては、前記した方法の他、透明多孔体層２上全面
に無電解メッキ層４を形成した後、その上に所望のパタ
ーン状にエッチングレジストを印刷法あるいはフォトレ
ジスト法にて形成し、その後、不要な無電解メッキ層４
をエッチング除去する方法、あるいは透明多孔体層２を
部分的に形成しておく方法などがある。 得られる電磁波シールド板の光透過性をあげるために
は無電解メッキ層４のパターンがネット状であれば線幅
を細くし、ピッチを大きくすればよいし、電磁波シール
ド性をあげるためには無電解メッキにより形成される無
電解メッキ層４を厚くすればよい。The present invention has been developed in order to solve the above problems.
When a transparent porous layer having a large number of fine pores made of an organic polymer compound is formed on a transparent substrate, and an electroless plating layer is partially formed on the transparent porous layer, when viewed through the transparent substrate side. The electroless plating layer was configured to have a black color. A mixed solvent of an organic polymer compound and a parent solvent which is a solvent capable of dissolving the organic polymer compound and a high boiling point poor solvent which is a solvent having a higher boiling point than the parent solvent and not dissolving the organic polymer compound And then applied on a transparent substrate, followed by heating to first vaporize the low-boiling parent solvent (hereinafter referred to as the low-boiling parent solvent), and then vaporize the high-boiling poor solvent to obtain an organic solvent. After forming a transparent porous layer having a large number of micropores made of a molecular compound, forming a resist layer on the transparent porous layer according to a pattern, a transparent substrate on which the transparent porous layer is formed is subjected to a solvent for chemical plating. , The chemical plating catalyst is adsorbed only on the part of the micropores where the resist layer is not formed, and then electroless plating is performed to design the desired line width and pitch and see through the inside And configured to form an electroless plating layer having a capability pattern. Alternatively, after forming the transparent porous material layer in the same manner, an electroless plating layer is formed on the entire surface of the transparent porous material layer, and an etching resist is formed thereon in a desired pattern by a printing method or a photoresist method, Thereafter, the unnecessary electroless plating layer was removed by etching to form an electroless plating layer having a pattern designed to have an arbitrary line width and pitch and having a transparent inside. Further, the present invention will be described in detail with reference to the drawings. FIG. 1 is a cross-sectional view showing one embodiment of the electromagnetic wave shield plate of the present invention, and FIGS. 2 and 3 are cross-sectional views showing the steps of manufacturing the electromagnetic wave shield plate of the present invention. Reference numeral 1 denotes a transparent substrate, 2 denotes a transparent porous layer, 3 denotes a black portion, 4 denotes an electroless plating layer, and 5 denotes a resist layer. As the transparent substrate 1, any transparent material such as glass, acrylic resin, polycarbonate resin, ethylene-vinyl alcohol copolymer, ethylene-vinyl acetate copolymer, and vinyl chloride resin may be used. Can be used. It is necessary that the transparent porous layer 2 made of an organic polymer compound has a large number of fine pores. The catalyst for chemical plating is adsorbed in these fine holes, and serves as a nucleus for forming the electroless plating layer 4. In order to form the transparent porous layer 2 on the transparent substrate 1, an organic polymer compound dissolved in a mixed solvent comprising a low-boiling parent solvent and a high-boiling poor solvent is applied on the transparent substrate 1 and heated. Can be This heating first vaporizes the low-boiling lipophilic solvent by heating at a temperature at which the low-boiling lipophilic solvent vaporizes in order to form a large number of micropores inside the organic high-molecular compound. In a dry and solidified state. Next, by heating at a temperature at which the high-boiling poor solvent vaporizes, the high-boiling poor solvent occupying a certain volume in the dried solidified film of the organic polymer compound is vaporized. Thus, the transparent porous layer 2 having a large number of micropores is formed. Examples of the organic polymer compound include polycarbonate, ethylene-vinyl acetate copolymer, and ethylene-vinyl acetate.
Examples include a vinyl alcohol copolymer, an ethylene-acrylic acid copolymer, a vinyl acetate-vinyl alcohol copolymer, a vinyl chloride resin, and an acrylic resin. Of course, the material is not limited to these as long as the transparent porous material layer 2 having a large number of micropores can be formed. Further, the mixed solvent comprising the low-boiling parent solvent and the high-boiling poor solvent varies depending on the organic high molecular compound used. For example, in the case of an acrylic resin, methylene ethyl ketone,
There is a mixture of a low-boiling parent solvent such as methyl acetate, ethyl acetate and isopropyl alcohol, and a high-boiling poor solvent such as water, n-butyl alcohol, n-pentanol and γ-butyl lactone. The layer thickness of the transparent porous layer 2 is 0.05 to 20 μm, preferably
0.5 to 5 μm. This is because if thinner than 0.05 μm,
This is because the electroless plating layer 4 for obtaining a desired optical density cannot be formed, and if the thickness is more than 20 μm, the transparency of the transparent porous material layer 2 is hindered. After adsorbing a chemical plating catalyst in the fine pores on the transparent porous material layer 2, the catalyst is reduced to form plating nuclei in the fine pores and on the surface of the transparent porous material layer 2. The layer 2 is treated with an electroless plating solution to form a black portion 3 and an electroless plating layer 4. The electroless plating layer 4 formed on the transparent porous material layer 2
When viewed from the transparent substrate 1 side, it looks as if it is black (black portion 3 in the drawing). The reason for such an appearance is considered as follows. When performing electroless plating using the catalyst for chemical plating in the fine pores of the transparent porous material layer 2 as a plating nucleus, plating is first started from inside the fine pores. However, a uniform electroless plating layer 4 cannot be obtained inside the micropores, and a metal colloid having a diameter of several nm to several tens nm is deposited. It is considered that the metal colloid in the micropores has a blackening effect on the electroless plating layer 4. When this metal colloid is deposited near the outer surface of the micropore, a uniform electroless plating layer 4 is formed thereafter. In order to form the black portion 3 and the electroless plating layer 4 in a specific pattern, before adsorbing the chemical plating catalyst in the fine pores of the transparent porous material layer 2, the black portion 3 and the electroless plating layer 4 are formed on the transparent porous material layer 2 according to the pattern. The resist layer 5 may be formed. Resist layer 5
As a method for forming the resist, there is a printing method or a photoresist method. After forming the resist layer 5 on the transparent porous material layer 2, the transparent substrate 1 on which the transparent porous material layer 2 is formed is brought into contact with a catalyst for chemical plating. By doing so, the chemical plating catalyst is not adsorbed in the micropores in the portion where the resist layer 5 is formed, but is adsorbed only in the portion where the resist layer 5 is not formed. When the electroless plating is performed by using the partially adsorbed catalyst for chemical plating, the black portion 3 and the electroless plating layer 4 can be easily patterned. The portion where the electroless plating layer 4 is not formed is a portion having excellent transparency because the transparent porous layer 2 has excellent transparency as described above. As a method of patterning the black portion 3 and the electroless plating layer 4, in addition to the above-described method, after forming the electroless plating layer 4 on the entire surface of the transparent porous material layer 2, etching it into a desired pattern thereon. A resist is formed by a printing method or a photoresist method, and then an unnecessary electroless plating layer 4 is formed.
, Or a method in which the transparent porous material layer 2 is partially formed. In order to increase the light transmittance of the obtained electromagnetic wave shielding plate, if the pattern of the electroless plating layer 4 is net-like, the line width may be reduced and the pitch may be increased. The thickness of the electroless plating layer 4 formed by electrolytic plating may be increased.
実施例１ 3mm厚のアクリル基板（100mm角）上に、下記の組成か
らなる有機高分子化合物の溶液をスピナーにて塗布し
た。 ３％アクリル樹脂溶液 （溶媒：酢酸メチル） 200g イソプロピルアルコール 8.5g 風乾後、70℃30分間加熱乾燥して透明多孔体層を形成
した。 次に市販の無電解銅メッキシステム（OPC−700;奥野
製薬工業（株）製）により全面メッキした後、スクリー
ン印刷法でエッチングレジストを200メッシュのネット
パターンで印刷し、乾燥した。その後、塩化第二鉄溶液
でエッチングを行い、レジスト層を剥離して電磁波シー
ルド板を得た。 このようにして得られた電磁波シールド板は導電性が
高く、透明基板側から反対側が見やすいものであった。 実施例２ 2mm厚のポリカーボネイト基板（100mm角）上に、下記
の組成からなる高分子溶液をスピナーにて塗布した。 ２％アクリル樹脂溶液 （溶媒：酢酸−ｎ−プロピル） 200g γ−ブチルラクトン 2.0g 風乾後、70℃30分間加熱乾燥して透明多孔体層を形成
した。 次にスクリーン印刷法でレジスト層を200メッシュの
ネットパターンで印刷し、乾燥した後、市販の無電解ニ
ッケルメッキシステム（ITO−70;奥野製薬工業（株）
製）によりメッキした。その後、レジスト層を剥離して
電磁波シールド板を得た。 このようにして得られた電磁波シールド板は導電性が
高く、透明基板側から反対側が見やすいものであった。Example 1 A 3 mm thick acrylic substrate (100 mm square) was coated with an organic polymer compound solution having the following composition by a spinner. 3% acrylic resin solution (solvent: methyl acetate) 200 g Isopropyl alcohol 8.5 g After air-drying, it was dried by heating at 70 ° C. for 30 minutes to form a transparent porous layer. Next, after the entire surface was plated by a commercially available electroless copper plating system (OPC-700; manufactured by Okuno Pharmaceutical Co., Ltd.), an etching resist was printed in a 200-mesh net pattern by a screen printing method and dried. Thereafter, etching was performed with a ferric chloride solution, and the resist layer was peeled off to obtain an electromagnetic wave shielding plate. The thus obtained electromagnetic wave shielding plate had high conductivity, and the opposite side was easy to see from the transparent substrate side. Example 2 A polymer solution having the following composition was applied on a 2 mm-thick polycarbonate substrate (100 mm square) using a spinner. 2% acrylic resin solution (solvent: n-propyl acetate) 200 g γ-butyl lactone 2.0 g After air-drying, it was dried by heating at 70 ° C. for 30 minutes to form a transparent porous layer. Next, the resist layer is printed in a net pattern of 200 mesh by a screen printing method, and after drying, a commercially available electroless nickel plating system (ITO-70; Okuno Pharmaceutical Co., Ltd.)
Manufactured). Thereafter, the resist layer was peeled off to obtain an electromagnetic wave shield plate. The thus obtained electromagnetic wave shielding plate had high conductivity, and the opposite side was easy to see from the transparent substrate side.
この発明の電磁波シールド板は、透明基板上に有機高
分子化合物からなる多数の微細孔を有する透明多孔体層
が形成され、該透明多孔体層上に部分的に無電解メッキ
層が形成され、前記透明基板側から透視した場合に前記
無電解メッキ層が黒色を呈しているように構成した。 また、低沸点親溶媒と高沸点貧溶媒からなる混合溶媒
に溶解した有機高分子化合物を透明基板上に塗布し、そ
の後加熱することによってまず前記低沸点親溶媒を気化
させ、次いで前記高沸点貧溶媒を気化させることにより
有機高分子化合物からなる多数の微細孔を有する透明多
孔体層を形成し、該透明多孔体層上に無電解メッキによ
り部分的に無電解メッキ層を形成するように構成した。 したがって、無電解メッキにより、無電解メッキ層パ
ターンが自由なパターンで形成され、また線幅やピッチ
などの設計も自由で、さらに導電性の高い電磁波シール
ド板が安価で得られる。 また、無電解メッキの際に、透明多孔体層上に無電解
メッキ層を形成すると同時に、金属が透明多孔体層の微
細孔に形成されて黒色を呈すので、黒色に染色する工程
を別に必要としない。In the electromagnetic wave shielding plate of the present invention, a transparent porous layer having a large number of fine holes made of an organic polymer compound is formed on a transparent substrate, and an electroless plating layer is partially formed on the transparent porous layer, The electroless plating layer was configured to have a black color when viewed from the transparent substrate side. Further, an organic polymer compound dissolved in a mixed solvent comprising a low-boiling-point parent solvent and a high-boiling-point poor solvent is applied on a transparent substrate, and then heated to first vaporize the low-boiling-point parent solvent, and then the high-boiling-point poor solvent. A structure in which a solvent is vaporized to form a transparent porous layer having a large number of micropores made of an organic polymer compound, and an electroless plating layer is partially formed on the transparent porous layer by electroless plating. did. Therefore, the electroless plating layer pattern can be formed freely by electroless plating, the line width and pitch can be freely designed, and a highly conductive electromagnetic wave shield plate can be obtained at low cost. In addition, at the time of electroless plating, at the same time as forming the electroless plating layer on the transparent porous material layer, the metal is formed in the fine pores of the transparent porous material layer and exhibits a black color, so a step of dyeing black is required separately. And not.
第１図はこの発明の電磁波シールド板の一実施例を示す
断面図。第２〜３図はこの発明の電磁波シールド板の製
造工程を示す断面図。１……透明基板、２……透明多孔
体層、３……黒色部、４……無電解メッキ層、５……レ
ジスト層。FIG. 1 is a sectional view showing an embodiment of the electromagnetic wave shielding plate of the present invention. 2 and 3 are cross-sectional views showing the steps of manufacturing the electromagnetic wave shielding plate of the present invention. 1 ... Transparent substrate, 2 ... Transparent porous layer, 3 ... Black portion, 4 ... Electroless plating layer, 5 ... Resist layer.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01B 5/14 C23C 18/16 H01B 13/00 503 H05K 9/00 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 7 , DB name) H01B 5/14 C23C 18/16 H01B 13/00 503 H05K 9/00
Claims (4)
数の微細孔を有する透明多孔体層が形成され、該透明多
孔体層上に任意の線幅およびピッチで設計され内部を透
視可能なパターンに無電解メッキ層が形成され、前記透
明基板側から透視した場合に前記無電解メッキ層が黒色
を呈していることを特徴とする電磁波シールド板。1. A transparent porous layer having a large number of fine pores made of an organic polymer compound is formed on a transparent substrate, and is designed with an arbitrary line width and pitch on the transparent porous layer so that the inside can be seen through. An electromagnetic wave shielding plate, wherein an electroless plating layer is formed on a pattern, and the electroless plating layer has a black color when viewed from the transparent substrate side.
エチレン−酢酸ビニル共重合体、エチレン−ビニルアル
コール共重合体、エチレン−アクリル酸共重合体、酢酸
ビニル−ビニルアルコール共重合体、塩化ビニル系樹脂
およびアクリル系樹脂からなる群より選ばれた少なくと
も一つの化合物である請求項１に記載の電磁波シールド
板。2. The organic polymer compound is a polycarbonate,
At least one selected from the group consisting of ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, ethylene-acrylic acid copolymer, vinyl acetate-vinyl alcohol copolymer, vinyl chloride resin and acrylic resin. The electromagnetic wave shielding plate according to claim 1, which is one compound.
を溶解しうる溶媒である親溶媒と該親溶媒よりも沸点が
高く、上記有機高分子化合物を溶解しない溶媒である高
沸点貧溶媒とからなる混合溶媒に溶解して透明基板上に
塗布し、その後加熱することによってまず前記低沸点の
親溶媒を気化させ、次いで前記高沸点貧溶媒を気化させ
ることにより有機高分子化合物からなる多数の微細孔を
有する透明多孔体層を形成し、パターンに応じて透明多
孔体層上にレジスト層を形成したのち、透明多孔体層が
形成された透明基板を化学メッキ用溶媒に接触させて微
細孔中のレジスト層を形成していない部分のみに化学メ
ッキ用触媒を吸着させ、その後、無電解メッキすること
によって任意の線幅およびピッチで設計され内部を透視
可能なパターンを有する無電解メッキ層を形成すること
を特徴とする電磁波シールド板の製造方法。3. An organic polymer compound comprising: a parent solvent which is a solvent capable of dissolving the organic polymer compound; and a high boiling point poor solvent which has a higher boiling point than the parent solvent and which does not dissolve the organic polymer compound. Is dissolved in a mixed solvent consisting of and coated on a transparent substrate, and then heated to first vaporize the low-boiling parent solvent, and then vaporize the high-boiling poor solvent to form a large number of organic polymer compounds. After forming a transparent porous layer having fine pores and forming a resist layer on the transparent porous layer according to the pattern, the transparent substrate on which the transparent porous layer is formed is contacted with a solvent for chemical plating to form a fine layer. The catalyst for chemical plating is adsorbed only to the portion of the hole where the resist layer is not formed, and then the pattern is designed with an arbitrary line width and pitch by electroless plating to allow the inside to be seen through. Method of manufacturing an electromagnetic wave shielding plate, and forming an electroless plating layer.
を溶解しうる溶媒である親溶媒と該親溶媒よりも沸点が
高く、上記有機高分子化合物を溶解しない溶媒である高
沸点貧溶媒とからなる混合溶媒に溶解して透明基板上に
塗布し、その後加熱することによってまず前記低沸点の
親溶媒を気化させ、次いで前記高沸点貧溶媒を気化させ
ることにより有機高分子化合物からなる多数の微細孔を
有する透明多孔体層を形成し、透明多孔体層上全面に無
電解メッキ層を形成した後、その上に所望のパターン状
にエッチングレジストを印刷法あるいはフォトレジスト
法にて形成し、その後、不要な無電解メッキ層をエッチ
ング除去することによって任意の線幅およびピッチで設
計され内部を透視可能なパターンを有する無電解メッキ
層を形成することを特徴とする電磁波シールド板の製造
方法。4. A high boiling point poor solvent which is a solvent having a boiling point higher than that of a parent solvent which is a solvent capable of dissolving the organic polymer compound and a solvent which can dissolve the organic polymer compound. Is dissolved in a mixed solvent consisting of and coated on a transparent substrate, and then heated to first vaporize the low-boiling parent solvent, and then vaporize the high-boiling poor solvent to form a large number of organic polymer compounds. After forming a transparent porous layer having fine pores and forming an electroless plating layer on the entire surface of the transparent porous layer, an etching resist is formed thereon in a desired pattern by a printing method or a photoresist method. Then, an unnecessary electroless plating layer is removed by etching to form an electroless plating layer having a pattern designed with an arbitrary line width and pitch and having a transparent inside. Method of manufacturing an electromagnetic wave shielding plate, wherein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2158114A JP3037964B2 (en) | 1990-06-15 | 1990-06-15 | Electromagnetic wave shield plate and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2158114A JP3037964B2 (en) | 1990-06-15 | 1990-06-15 | Electromagnetic wave shield plate and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0448507A JPH0448507A (en) | 1992-02-18 |
| JP3037964B2 true JP3037964B2 (en) | 2000-05-08 |
Family
ID=15664612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2158114A Expired - Fee Related JP3037964B2 (en) | 1990-06-15 | 1990-06-15 | Electromagnetic wave shield plate and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3037964B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100720895B1 (en) * | 2005-07-05 | 2007-05-22 | 제일모직주식회사 | Conductive fine particles having a heterogeneous composite metal layer having a concentration gradient, a manufacturing method thereof, and an anisotropic conductive adhesive composition using the same |
| KR100791211B1 (en) * | 2006-11-13 | 2008-01-03 | 에스케이씨하스디스플레이필름(주) | Optical filter for display panel and manufacturing method thereof |
| KR100905970B1 (en) * | 2007-03-09 | 2009-07-06 | 주식회사 동진쎄미켐 | Black paste composition having conductivity property, filter for shielding electromagnetic interference and display device comprising the same |
| KR100852442B1 (en) * | 2007-06-25 | 2008-08-14 | (주)성우신소재 | Electromagnetic shielding gasket sheet and its manufacturing method |
| JP7240608B2 (en) * | 2019-08-29 | 2023-03-16 | トヨタ自動車株式会社 | Method for producing porous body of water-insoluble polymer |
| JP7281086B2 (en) | 2019-10-09 | 2023-05-25 | トヨタ自動車株式会社 | Method for manufacturing porous body |
-
1990
- 1990-06-15 JP JP2158114A patent/JP3037964B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0448507A (en) | 1992-02-18 |
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