JP3038309B2 - Resin composition for plating - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition for plating having both excellent plating characteristics and excellent electrical characteristics, and particularly to a resin composition useful for electronic parts (wiring boards, connectors, housings, insulating materials, etc.). The present invention relates to a resin composition for plating. More specifically, since it is a thermoplastic resin and has excellent plating characteristics and electrical characteristics, it can be used for a three-dimensional circuit board or an electronic component (that is, an injection molded circuit component: Molded interconnect) using an injection molding technique.
ion device <MID>, injection molded circuit board:
Molded circuit board <MCB
The present invention relates to a resin composition for plating suitable for the production of <>).

[0002]

BACKGROUND ART A thermoplastic resin composition having excellent plating characteristics (that is, a resin to be plated) can be formed three-dimensionally because of easy molding processing such as injection molding and extrusion molding. It is widely used in various electronic and electrical parts, automobile parts, mechanical parts and decorative articles.

[0003] Conventional resin compositions for plating have been able to obtain sufficient plating characteristics by improving the shape and size of the inorganic filler to be compounded or by advancing plating techniques. On the other hand, a thermoplastic resin used for an electronic component, for example, a printed wiring board, a connector, or an insulating substrate, requires strict performance not only in plating characteristics but also in electrical characteristics.

[0004] Here, the plating property refers to the quality of bonding between the plated resin composition and the plated metal, that is, the adhesion between the resin composition and the metal plating film. It is said that there is an excellent plating characteristic.
In addition, the excellent electrical characteristics refer to characteristics required for a resin insulating material, particularly, a high-frequency insulating material, that is, a low dielectric constant and a low dielectric loss tangent.

[0005] Incidentally, resins and resin compositions for plating which have already been reported or marketed have high dielectric constants and dielectric loss tangents. For example, resins to be plated reported in Japanese Patent Application Nos. 56-136841, 5-230276 and 1-98637 have excellent plating characteristics and are extremely industrially expensive. However, the electrical characteristics are poor. As a result, its use is limited, and for example, it is difficult to use electronic parts and the like used in a high frequency band because signal loss increases.

On the other hand, it is known that the adhesion strength between a resin molded product and a metal plating film largely depends on the physical properties of the resin surface, that is, the surface roughness. In particular, by forming a hole of an appropriate size (hole for anchoring—hereinafter referred to as “micropore”) uniformly on the surface of the resin molded product, the plating adhesion strength is significantly improved (anchor effect).

As a method for forming micropores on the surface of a resin molded product, a chemical etching method using an acid, an alkali, an organic solvent or the like is often used. For example, a molded article is obtained from a resin composition in which a predetermined amount of an inorganic filler soluble in an acid, an alkali or an organic solvent is blended, and the surface of the molded article is impregnated with a specific solvent (acid, alkali, organic solvent). By performing chemical etching for eluting or desorbing the inorganic filler, micropores can be easily formed on the surface of the molded article.

Conventionally, the above-mentioned specific inorganic fillers include calcium carbonate, glass, magnesium carbonate, magnesium oxide, calcium pyrophosphate, barium sulfate,
Barium carbonate, zinc oxide and many other species are used.

However, the inorganic fillers reported in the prior art have a drawback of deteriorating the electrical properties of the resin. Specific examples include an increase in the dielectric constant and the dielectric loss tangent. The increase in the dielectric constant or the dielectric loss tangent increases the signal loss when used for electronic components, particularly for electrical insulating materials, and especially for high-frequency electronic components. Here, the high-frequency signal is 1G
A specific product that uses a high-frequency signal and refers to a frequency band of not less than Hz includes a mobile phone, a PHS, a pager, a satellite terminal, a navigation system, and the like.

Heretofore, there has been no report of a resin composition having both excellent plating characteristics and excellent electric characteristics (low dielectric constant and low dielectric loss tangent). Note that, in recent years, a technique for manufacturing an electronic component by injection molding has attracted attention because it is possible to reduce the size and density of the electronic component.

[0011]

SUMMARY OF THE INVENTION In view of the above points, the present invention provides a thermoplastic resin composition suitable for injection molding, which has both excellent plating characteristics and excellent electrical characteristics. The purpose is to provide.

[0012]

SUMMARY OF THE INVENTION To achieve the above object, a resin composition for plating according to the present invention comprises a thermoplastic resin of 95 to 30 wt%.
And 5 to 70 wt% of quartz glass. At this time, the quartz glass has an aspect ratio of 1
0 or less, preferably 5 or less, and the average particle size is 0.001 to
100μm der is, silicon dioxide (SiO ₂₎ component 9
It is essential that it be at least 6% . In addition, thermoplastic resin
Is polyetherimide and polyphenylene ether
It is preferable to include one or both of the above. Further, the resin composition for plating of the present invention has a high frequency band of 100
Preferably, the dielectric constant at KHz to 300 GHz is 4.0 or less, and the dielectric loss tangent at the same frequency band is 0.01 or less.

Examples of the thermoplastic resin in the present invention include resins typified by commercially available thermoplastic resins.
Specifically, general-purpose resins such as polyethylene (PE), polypropylene (PP), polystyrene (PS), polymethyl methacrylate (PMMA), ABS resin, AS resin, polyacetate (POM), polycarbonate (P
C), polyphenylene ether (PPE), polyamide (PA: nylon), polyethylene terephthalate (P
ET), engineering plastics such as polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyether sulfone (PE)
S), polyetherimide (PEI), polyetheretherketone (PEEK), polyketone (PK), polyimide (PI), polycyclohexanedimethanol terephthalate (PCT), polyarylate (PAR), various liquid crystal polymers (LCP), etc. It is.

Each of these resins may be used alone, or two or more of the above resins may be used in combination with each other physically or chemically at a predetermined composition ratio. May be a polymer alloy or a polymer blend, or a modified product of these resins. Here, the term "modified" refers to a synthetic resin or a hybrid in which properties are changed by replacing some of the basic components with other components during the reaction or compounding of the synthetic resin.

Examples of preferable combinations of the multi-component polymer system include PPE / PS, PPE / PC,
PPE / PA, PPE / PET, PPE / PBT, PP
E / PEI, PPE / PPS, PPE / PES, PPE
/ PEEK, PPE / PCT, PPE / LCP, PEI
/ PC, PEI / PEEK, PEI / LCP, PEI /
PET, PEI / PBT, LCP / PAR, LCP / P
EEK, LCP / PET, LCP / PBT, LCP / P
C, LCP / PCT, LCP / PEEK and the like. In the three-component system, PPE / PC / PS, PPE
/ PEI / PC, PPE / PEI / PS, PEI / PP
E / LCP, PEI / PC / LCP, PEI / PEEK
/ LCP and the like. Among these multicomponent systems, P
Containing one or both of PE and PEI
Is preferred.

The above-mentioned polymer alloy or polymer blend may contain a compatibilizer or the like for the purpose of improving compatibility. Specific examples of the compatibilizer include an epoxy-modified MMA-MMA copolymer, an epoxy-modified St (styrene) -St copolymer, an epoxy-modified St-MMA copolymer, an epoxy-modified MMA-St copolymer, and a St- Maleic anhydride copolymer, St-MMA copolymer, maleic anhydride-vinyl copolymer, and the like are included. However, the term “copolymer” as used herein refers to a random copolymer, a block copolymer, an alternating copolymer, and a graft copolymer.

Further, the thermoplastic resin used in the present invention includes basic properties of the resin, for example, mechanical properties, electrical properties, heat resistance, moldability, flowability, flame retardancy, ultraviolet light resistance, Improve chemical properties, appearance of molded products, or coloring,
Various additives may be blended for the purpose of imparting gloss. As additives, plasticizers, heat stabilizers, oxidation stabilizers,
Examples include a cross-linking agent, a flame retardant, an ultraviolet absorber, a coloring agent, and a gloss-imparting agent.

The inorganic filler, ie, quartz glass, in the present invention is a non-crystalline material having a silicon dioxide (SiO ₂ ) component of 96% or more, preferably 99% or more, once fused with crystalline silica. This quartz glass is a powdery or spherical filler having a ratio of the length in the major axis direction to the length in the uniaxial direction, that is, an aspect ratio of 10 or less, preferably 5 or less, and an average particle size of 0.001 to 100 μm, Preferably it is 0.1 to 50 μm.

As the aspect ratio is closer to 1, in other words, the closer the filler shape is to a perfect circle (sphere), the better the plating characteristics are. If the aspect ratio is too high, specifically 10
If it is larger, the micropore shape becomes fibrous, and the plating adhesion strength is significantly reduced.

When the average particle size is less than 0.001 μm,
It becomes difficult to provide a catalyst for electroless plating (adsorption of the catalyst for electroless plating on the surface of the molded product), so that not only a sufficient adhesion strength but also a plating film having a uniform surface cannot be obtained. . If the average particle size is larger than 100 μm, the size of the micropores becomes larger than necessary, a sufficient anchor effect cannot be obtained, and the physical bonding strength between the plating film and the resin becomes weak.

When the total amount of the thermoplastic resin and the quartz glass is 100 parts by weight, the amount of the quartz glass is from 30 to 30 parts by weight.
5 to 70 parts by weight of quartz glass to 95 parts by weight, preferably 10 to 60 parts of quartz glass to 40 to 90 parts by weight of resin.
It is desirable to use parts by weight.

The quartz glass may be subjected to a surface treatment by a known method for the purpose of improving the dispersibility of the quartz glass and the affinity for the resin, or improving the thermal stability and the oxidation stability of the quartz glass.

As a method of the surface treatment, a coupling agent or the like may be blended. Preferred examples of the coupling agent include vinyltrichlorosilane, vinyltris (β-methoxyethoxy) silane, vinyltriethoxysilane, vinyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ) Ethyltrimethoxysilane, γ-
Glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropylmethyl Dimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, di (3-
Triethoxysilylpropyl) tetrasulfide, 3-
Mercaptopropyltrimethoxysilane, 2-mercaptoethyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-2 (aminoethyl) -3-aminopropyltrimethoxysilane, vinyltri (2-methoxyethoxy) silane, 3-meta Silane coupling agents such as acryloyloxypropyltrimethoxysilane and 3-glycidyloxypropyltrimethoxysilane; triisostearoyl isopropyl titanate, di (dioctyl phosphate) diisopropyl titanate, didodecylbenzenesulfonyl diisopropyl titanate, diisostearyl diisopropyl titanate And the like. Titanate-based coupling agents; These coupling agents can be used in an amount that does not deteriorate the electrical characteristics and the plating characteristics. Usually, 0.0001 to 1 part by weight based on 100 parts by weight of quartz glass is preferable.

Further, other inorganic fillers may be used together with the quartz glass as long as the electric characteristics and the plating characteristics are not deteriorated. Examples of inorganic fillers that can be used in combination are glass, short glass fiber, glass fiber, glass balloon, shirasu balloon, chopped strand, carbon fiber, carbon, carbon black, aramid, potassium titanate, aluminum borate, magnesium borate, Calcium carbonate, magnesium carbonate, magnesium sulfate, calcium sulfate, aluminum sulfate, pyrophosphate, silicon nitride, aluminum nitride, boron nitride, silicon carbide, alumina, alumina fiber, silica, mica, talc, diatomaceous earth, clay, volcanic ash, Limestone, bentonite, titanium oxide, magnesium oxide, calcium oxide,
Molybdenum disulfide and the like.

The resin composition of the present invention can be produced by using a general composite material production technique, but it is industrially preferable to produce the resin composition by a melt-kneading method in terms of productivity and economy. . Specific examples include production by kneading using a twin-screw extruder or a single-screw extruder, and production using a batch-type heat-melt kneader typified by Labo Plastomill.

The resin composition of the present invention is thermoplastic,
Injection molding, extrusion molding and press molding are possible.

The adhesion strength (plating adhesion strength) between the molded article made of the resin composition of the present invention and the metal plating film is the same as that of the above-mentioned molded article made of the resin composition for plating. It depends largely on the physical properties of the resin composition (ie, the surface of the resin composition), that is, the surface roughness. In particular, by forming micropores of an appropriate size uniformly on the surface of the molded product before plating, the plating adhesion strength due to the anchor effect is obtained. Can be significantly improved.

For the formation of the micropores, chemical etching is effective as in the case of a conventional molded article made of a resin composition for plating. As described above, the chemical etching is performed by impregnating the surface of the molded article with a solvent for the inorganic filler in the resin composition for plating, for example, an acid, an alkali, or an organic solvent to elute or remove the inorganic filler on the surface. This is done by separating them.

The quartz glass of the present invention is soluble in an aqueous alkaline solution. Therefore, if the surface of a molded article made of the resin composition of the present invention is chemically etched with an alkaline aqueous solution, quartz glass present on the surface of the molded article can be eluted and desorbed, and micropores effective for plating are formed. You.

As the alkaline aqueous solution, for example, an aqueous solution of sodium hydroxide, potassium hydroxide, lithium hydroxide or the like is preferable in view of the solubility and economy of quartz glass, and these are used alone or in combination. be able to. The alkali concentration of these aqueous solutions is 1 N to 15
N, preferably 3N to 12N. If the alkali concentration is low, it takes a long time to elute the quartz glass, and if the alkali concentration is high, the deterioration of the resin becomes remarkable.

In the present invention, when other inorganic fillers are used in combination, not only the above quartz glass but also these other inorganic fillers may be chemically etched together. The etching solution in this case is selected according to the properties of the inorganic filler used in combination, that is, the solubility and corrosiveness of the inorganic filler. For example, when calcium carbonate, pyrophosphate, barium sulfate, etc. are used in combination, an acid (for example, Sulfuric acid, hydrochloric acid, chromic acid, phosphoric acid, acetic acid, nitric acid, boric acid, etc., alone or in a mixture, or an aqueous solution thereof are generally used. When a glass or alumina is used in combination, an alkali (for example, water) is used. An aqueous solution of any concentration such as potassium oxide, sodium hydroxide, lithium hydroxide, or a mixed solution thereof is generally used.

Prior to the chemical etching of the quartz glass and the inorganic filler, the organic solvent is used to dissolve the resin on the surface of the molded article of the resin composition of the present invention to expose the quartz glass and the inorganic filler. That is, pre-etching), chloroform,
Dichloromethane, benzene, pyridine, hexane, tetrahydrofuran, ethyl acetate, toluene, N, N-dimethylformamide, N-methylpyrrolidone, dimethylsulfoxide, acetonitrile and the like are used.

In any of the above cases, the chemical etching temperature is preferably from room temperature (20 ° C.) to 120 ° C.
More preferably, it is 50 ° C to 100 ° C. When the etching temperature is low, it takes a long time to elute the quartz glass, and when it is high, the deterioration of the resin becomes remarkable. When performing the chemical etching, stirring, ultrasonic irradiation, air bubbling, or the like may be used in combination for the purpose of improving the dissolution rate of quartz glass.

For the purpose of removing the resin skin layer of the molded article made of the resin composition of the present invention, a general method, for example, sulfuric acid, hydrochloric acid, chromic acid, nitric acid, phosphoric acid alone or mixed acid, or organic solvent For example, it is preferable to perform pre-etching. For pre-etching, a commonly used method can be applied.

Except for the above-described chemical etching step or pre-etching step, a molded article made of the resin composition of the present invention is similar to a molded article made of a usual resin to be plated.
Electroless plating or electroplating can be performed.

The resin composition of the present invention, as described above,
It is preferable that the dielectric constant in a frequency band of 100 KHz to 300 GHz is 4.0 or less, and the dielectric loss tangent in the same frequency band is 0.01 or less. Resins having a dielectric constant of greater than 4.0 or a dielectric loss tangent of greater than 0.01 applied to the above-mentioned frequency band may be used for electronic components and electrical insulating materials (particularly 1 GH).
When used for these components and materials used in a high frequency band of z or more, signal loss increases, so that it often becomes unreasonable in circuit design and the like, and cannot be used in some cases (applications).

[0037]

EXAMPLES The resins used in the following Examples and Comparative Examples were as follows:
It is as follows. The quartz glass used in the following examples and comparative examples has a silicon dioxide (SiO ₂ ) component of 9%.
It is an amorphous material in which 9.9% of crystalline silica (quartz) is melted once.

<Resin used>-PEI: polyetherimide "Ultem 10" (trade name, manufactured by Nippon GE Plastics Co., Ltd.)
00 "PPE: modified polyphenylene ether" Zylon PXL9102 "manufactured by Asahi Kasei Corporation LCP: liquid crystal polymer Sumitomo Super E600 manufactured by Sumitomo Chemical Co., Ltd.
0 "PA: Nylon 6 Trade name" Novamid 1013C "manufactured by Mitsubishi Chemical Corporation POM: Polyacetate Trade name" Tenak 3010 "manufactured by Asahi Kasei Corporation PBT: Polybutylene terephthalate Trade name manufactured by Teijin Limited Teijin PBT resin CN-7000 "-PEEK: polyetheretherketone" Victrex 45G "manufactured by Sumitomo Chemical Co., Ltd.-PPS: polyphenylene sulfide" Righton R-4 "manufactured by Dainippon Ink Industries, Ltd. PC: Polycarbonate Brand name “NOVAREX 7022A” manufactured by Mitsubishi Chemical Corporation

Examples 1 to 33 <Production of resin composition for plating>
A predetermined thermoplastic resin and quartz glass were pre-blended.
Thereafter, a twin-screw extruder ("ZE40" manufactured by Berstroff Co., Ltd.) was supplied at a feed rate of 20 to 60 kg / hour using a fixed amount feeder.
A ″), heated and melt-kneaded at the temperature and the number of rotations shown in Table 2, cooled with water, and then cut into strands with a pelletizer to obtain pellets (material before molding).

<Molding> The above-mentioned pellets were placed in a thermostat for 1 hour.
It dried at 00-150 degreeC, and the test piece for plating property evaluation and electrical property evaluation was produced at the molding temperature shown in Table 2 using the injection molding machine ("F-85" by Crocna). The shape of this test piece was as follows.

<Shape of test piece> ・ ASTM No. 1 dumbbell; for plating evaluation ・ Disc 1: φ100 mm × 1.6 mm; 1 to 15 MHz
For evaluation of electrical characteristics ・ Disc 2: φ100 mm × 0.8 mm; 1 to 25 GHz
For electrical characteristics evaluation

<Plating> Using each of the above test pieces, the flat surface of the test piece (indicated as “molded product” in FIG. 1) under the conditions shown in Tables 3 and 8 in the manner shown in FIG. After chemical etching, electroless plating is performed according to the following procedure and conditions, and then electroplating (copper plating) (plating thickness 40)
μm). In addition, in FIG. 1, liter is "L",
Milliliters are indicated as "mL".

<Evaluation Method of Plating Characteristics> 1) Evaluation of Surface State after Chemical Etching After chemical etching treatment, a test piece (ASTM No. 1 type dumbbell) was dried, and a cellophane tape (Nichiban Co., Ltd., 18) was used.
mm width) was adhered to the treated surface and pressed (approximately 500 g) to make close contact with the surface of the test piece. The tape was peeled off at once at an angle of 90 °, and the peeling property (peeling property) of the surface layer of the treated surface was visually judged and evaluated as follows.

(Exfoliation of surface layer) ・ ・ ・: No surface layer peeling ・ ・ ・: Almost no surface layer peeling ・ ・ ・: Partially surface layer peeling ・ ・ ・: Almost adhered to tape surface and surface layer peeled

2) Evaluation of plating appearance After electroplating, the appearance of the plating surface (uniformity of plating film and presence / absence of swelling of plating film) was visually determined and evaluated as follows.

(Uniformity of plating film) ・ ・ ・: Uniform and good mirror surface ○: Uniform and almost mirror surface 鏡: Partially non-uniform ×: Non-uniform overall

(Swelling of plating film) ・ ・ ・: No swelling of plating film ・ ・ ・: Almost no swelling of plating film ・ ・ ・: Swelling of plating film partially ×: Plating film entirely Swelling

3) Measurement of plating film adhesion strength After the electroplating treatment, a 1 cm wide band-shaped cut was made with a cutter knife, the tip of the cut was turned up to an angle of 90 °, and the turned-up tip was opened with a spring. The gripping and peeling force was defined as the plating adhesion strength (kg / cm).

<Evaluation of Electric Characteristics> 1) Measurement of dielectric constant and dielectric loss tangent Measurement frequency: 1 MHz, 10 MHz, 1 GHz, 10 GHz, 20 GHz Measurement temperature: 25 ° C. Measurement method: Parallel plate electrode method (1 to 15 MHz) Triplate line Resonator method (loss separation method) (1 GHz to 25 GHz)

The results of the evaluation of the surface peelability after the chemical etching are shown in Table 3, and the results of the evaluation of the plating characteristics are shown in Table 4 as “Evaluation of plating film”, and the results of the evaluation of the electrical characteristics are shown in Table 5, respectively. It was shown to.

Comparative Examples 1 to 14 <Production of Resin Composition for Plating>
A predetermined thermoplastic resin and a predetermined inorganic filler were pre-blended. Then, use a fixed amount feeder for 40-60 kg
/ Hour feed rate twin screw extruder (Berstrof “Z
E40A ″), heated and melt-kneaded at the temperature and rotation speed shown in Table 7, cooled with water, and cut into strands by a pelletizer to obtain pellets (material before molding).

<Molding> Test pieces for evaluating plating characteristics and for evaluating electrical characteristics were prepared in the same manner as in Examples 1 to 33 except that the conditions shown in Table 7 were used.

<Plating, Evaluation of Plating Characteristics and Evaluation of Electrical Characteristics> Basically the same as in Examples 1 to 33,
The type, temperature, time, and the like of the solvent during the chemical etching were the conditions reported in the prior art (specifically, the conditions shown in Table 8).

The evaluation results of the surface layer peelability after the above chemical etching are also shown in Table 8, the evaluation results of the plating characteristics are shown in Table 9 as “Evaluation of plating film”, and the evaluation results of the electrical characteristics are shown in Table 10. Indicated.

<Evaluation and Comparison of Plating Characteristics> Examples 1 to 3
No. 3 is an example in which quartz glass having a predetermined size and shape was mixed with a commercially available resin and a prepared polymer alloy. Comparative Examples 1 to 14 are examples in which an inorganic filler reported in the prior art was blended into a resin. The plating adhesion strength varies depending on the application, but needs to be about 1 kg / cm or more from a practical viewpoint.

As is clear from Table 3, in Examples 1 to 33, in the surface layer peeling test after the alkali etching with the KOH aqueous solution, no peeling was observed in any of the test pieces, and good results were obtained. . Further, as is apparent from Table 4, in Examples 1 to 33, the adhesion strength was 1 kg / cm or more in all the test pieces.

On the other hand, as is clear from Tables 8 to 9, in Comparative Example 1 using glass fiber, the peeling of the surface layer was observed in the peeling test after chemical etching, the adhesion strength of the plating was low, and the plating surface The appearance is also bad. In contrast, as is clear from Tables 8 and 9, in Comparative Examples 2 to 14, no peeling of the surface layer after chemical etching was observed, and the plating adhesion strength was 1 k.
g / cm or more, showing sufficient performance in terms of plating characteristics.

<Evaluation / Comparison of Electrical Characteristics> As is clear from Table 5, the dielectric constants of the test pieces mixed with the quartz glass of Examples 1 to 33 were 4.0 or less in each frequency band.
The value was 3.0 or less. In addition, the dielectric loss tangent was 0.01 or less in all the test pieces, and it was found that the resin composition of the present invention containing quartz glass had excellent electric characteristics. On the other hand, as is clear from Table 10, in each of the test examples, the dielectric constant and the dielectric loss tangent were high in all the test pieces, and the electrical characteristics were remarkably poor as compared with the examples.

[0059]

[Table 1-1]

[0060]

[Table 1-2]

[0061]

[Table 1, 3]

In Examples 3 of Table 1, each of the examples marked with * 1 to * 4 is as follows. * 1: Epoxy-modified St-MMA as a resin compatibilizer
Example in which 5 wt% of a copolymer was blended * 2: Example in which 1 wt% of titanium oxide was blended as a colorant * 3: Experiment in which 0.001 wt% of γ-aminopropyltriethoxysilane was blended as a coupling agent for quartz glass Example * 4: Example in which 10 wt% of aluminum borate is blended as an inorganic filler in addition to quartz glass

[0063]

[1 of Table 2]

[0064]

[Table 2-2]

[0065]

[Table 3-1]

[0066]

[Table 3-2]

[0067]

[Table 4-1]

[0068]

[Table 4-2]

[0069]

[Table 5-1]

[0070]

[Table 5-2]

[0071]

[Table 5-3]

[0072]

[Table 6-1]

[0073]

[Table 6-2]

[0074]

[Table 7]

[0075]

[Table 8]

[0076]

[Table 9]

[0077]

[Table 10-1]

[0078]

[Table 10-2]

[0079]

As described in detail above, according to the resin composition for plating of the present invention, not only good plating characteristics but also excellent electric characteristics are obtained, and especially, electronic components used in a high frequency band. It is effective as a material for etc.

[Brief description of the drawings]

FIG. 1 is a view for explaining a point of chemical etching of a test piece in an example of the present invention.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-133982 (JP, A) JP-A-7-41664 (JP, A) JP-A-5-287176 (JP, A) JP-A-63-1988 17962 (JP, A) JP-A-51-20945 (JP, A) JP-A-63-68667 (JP, A) JP-A-63-201039 (JP, A) (58) Fields investigated (Int. ⁷ , DB name) C08L 1/00-101/16 C08K 3/00-13/08

Claims (3)

(57) [Claims] Claims: 1. A thermoplastic resin comprising 95 to 30% by weight of
Pect ratio of 10 or less, average particle size of 0.001 to 100 μm,
Quartz glass with a silicon dioxide (SiO ₂ ) component of 96% or more
A resin composition for plating, comprising 5 to 70 wt% . 2. The method according to claim 1, wherein the thermoplastic resin is polyetherimide or the like.
And / or polyphenylene ether
The resin composition for plating according to claim 1 , comprising: 3. A frequency band of 100 KHz to 300 GHz.
Dielectric constant in the same frequency band is 4.0 or less
The contact is 0.01 or less.
Is the resin composition for plating according to 2 .