JP3039118B2 - Resin bond whetstone - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin bond whetstone using a resin bond as a binder for a whetstone.

[0002]

2. Description of the Related Art Conventionally, there has been a resin bond grindstone using a resin (resin) as a binder such as diamond or c-BN abrasive grains.

[0003] This resin-bonded grindstone is most often used for precision grinding of cemented carbide, and is also used for finish grinding of glass, ceramics and the like. This resin-bonded grindstone is the one most frequently used as a c-BN grindstone.

This resin bonded diamond, c
-BN grinding stone has the advantages of high processing efficiency and good surface quality of the workpiece such as roughness of finished surface and chipping.

[0005] As a resin as a binder of the above-mentioned grindstone, an organic bond mainly composed of a thermosetting phenol formalin resin is mainly used. Further, in recent years, those using polyimide resins having higher heat resistance than phenol resins have been increasing.

[0006]

Problems common to resin-bonded grindstones include the fact that the abrasive grain holding force is weak and the abrasive grain layer is greatly worn. For this reason, there has been a problem that the discharge amount of the abrasive grain layer becomes extremely large, and the clogging of the grindstone easily occurs.

[0007]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and the structure thereof will be described below.

[0008] In the resin-bonded grinding wheel of the present invention , Ag, C , which is a soft metal having a high thermal conductivity , is contained in the resin binder phase.
It is characterized by uniformly dispersing a hollow filler coated with u or Cu-Sn metal.

Here, as the hollow filler,
A hollow body made of glass, plastic, or the like is desirable.

The addition amount of the hollow filler is 3 to 40.
vol% is preferred. If the addition amount is less than 3%, the effect of adding the hollow filler cannot be expected much, and if it exceeds 40%, the decrease in the strength of the binder phase cannot be ignored, and the abrasive phase tends to lose its shape. Since commercially available hollow spheres have irregular particle diameters, it is preferable to classify and use them according to the purpose. For forming the chip pocket, it is preferable that the diameter is equal to or larger than the abrasive particle diameter by 20 to 30%.

Further, as the coating metal, A
g, Cu, or Cu-Sn is employed. In particular, A
Since g is the specific gravity is large, not easily fit the apparent specific gravity and bonds other ingredients. In addition, these metals have high thermal conductivity and have good thermal conductivity as a grinding wheel binder, so that bond deterioration can be prevented. And these metals are soft
So, the filler coated with such metal becomes the abrasive layer
Easily deformed even when exposed to the surface of the workpiece and in contact with the workpiece
Wear, which may adversely affect the grinding action.
Not even. Then, to set the apparent specific gravity of the hollow filler to a value equivalent to that of the bond other components,
For example, the thickness of the metal layer formed by the metal coating may be appropriately adjusted.

The resin binder phase may be of any type, such as a conventionally used phenol-based or polyimide-based resin, regardless of thermosetting or thermoplasticity. The particle size and concentration of the abrasive particles are also determined according to the purpose of use.

[0013] According to the above construction, a chip pocket is easily generated by the breakage of a part of the filler during the grinding process, and the abrasive layer, the discharge of the cuttings, and the retention of the grinding fluid are greatly improved. Clogging is prevented. In addition, a soft metal with high thermal conductivity is formed on the surface of the hollow filler.
That, Ag, Cu, or by forming a metal coating of Cu-Sn, abrasive, bond, at the time of mixing of the filler, the dispersion of the hollow filler is improved, it is caused evenly insert pocket during grinding As a result, the above-mentioned effects can be obtained more reliably, and the thermal conductivity as a grinding wheel binder is improved by the high thermal conductivity of these metals, so that the heat generated at the time of grinding is quickly radiated. And bond deterioration can be prevented. In addition, since these metals are soft, they do not deteriorate the grinding action.

[0014]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a resin-bonded grindstone of the present invention. FIG. 1 is an enlarged sectional view showing an abrasive layer of a resin-bonded grindstone according to one embodiment of the present invention. In this abrasive layer, a hollow spherical filler 2 having a metal coating layer 3 made of Ag , Cu, or Cu-Sn and a superabrasive 4 are dispersed between resin bonding phases indicated by reference numeral 1. Have been. Here, the coating layer 3
Is formed such that the apparent specific gravity of the hollow spherical filler 2 becomes equal to the specific gravity of the bond and other components.

In order to manufacture the resin-bonded grindstone having the above structure, first, since the dispersion of the hollow filler 2 is poor, the hollow sphere filler 2 is coated with an Ag layer, a Cu layer or a Cu-Sn layer by plating or the like. After the specific gravity is changed from 0.22 g / cc to 1.5 to 5.0 g / cc, the hollow spherical filler 2 on which the predetermined superabrasive grains 4, the resin binder phase 1, and the coating layer 3 such as Ag are formed is uniformly mixed. The mixture is mixed and molded together with the base metal, and then subjected to pressure and heat molding and baking to be solidified.

In the resin bond grindstone thus manufactured, the coating layer 3 is formed on the filler 2 so that its apparent specific gravity is equal to that of the bond and other components. it is possible to disperse uniformly bonded phase 1 the filler 2, this
Ag, Cu, or C forming the coating layer 3 of
The u-Sn metal has a high thermal conductivity, and
Filler 2 having a coating layer 3 made of a metal
By uniformly dispersing in the binder phase 1, the metal coating layer 3 improves the thermal conductivity as a grinding wheel binder, so that the heat generated during the grinding process is quickly dissipated.
Thus, bond deterioration due to such grinding heat can be prevented. Also, because these metals are soft,
The filler 2 on which the metal coating layer 3 is formed is ground
Exposed on the surface of the grain layer and easily deformed even when in contact with the workpiece
Adversely affect grinding action due to wear and tear
Can be prevented. And since the said filler 2 is a hollow body, as shown in FIG.
Partial breakage of the filler 2 easily and uniformly forms chip pockets in the abrasive layer, greatly improving the abrasive layer, chip discharge and grinding fluid retention, and preventing grindstone clogging. An excellent effect of being obtained is obtained.

Further, since the filler 2 having a spherical outer shape is dispersed in the binder phase 1, there is no acute angle portion in any part of the binder phase 1 in contact with the filler 2. For this reason, unlike a case where a normal amorphous filler is dispersed, a minute repetitive load due to stress concentration or the like in the binder phase 1 in contact with the filler is reduced. For this reason, there is also an effect that the strength of the entire binder phase 1 hardly decreases even when the filler 2 is added.

[0018]

In resin bonded grinding wheel of the present invention as has been described above, the resin binder phase, a portion of the filler is destroyed during so to disperse the hollow filler is metal coating, Grinding process This easily creates a chip pocket. Therefore, according to the resin-bonded grindstone of the present invention, the ability to discharge the abrasive layer , the chips, and the retention of the grinding fluid are greatly improved, and the clogging of the grindstone can be prevented.

The hollow filler is coated with a coating.
Is a soft metal having a high thermal conductivity.
g, Cu or a Cu-Sn,, abrasive, bond, at the time of mixing of the filler, the dispersion of hollow filler as well, uniformly dispersing the filler in the abrasive layer
Accordingly, the chip pocket can be uniformly generated during grinding, it is possible to obtain more reliably a clogging preventing effect of the grinding wheel described above by this, it is possible to improve the thermal conductivity of the grindstone bonding material can, the heat generated during grinding by diverge rapidly from the abrasive grain layer Ri Do is possible to prevent the bond degradation effectively, moreover,
Be contacted coated filler such metal is exposed on the surface of the abrasive layer to the workpiece, since these cormorants want to or easily deformed or worn, there is no risk adversely affect the grinding action .

[Brief description of the drawings]

FIG. 1 is an enlarged sectional view showing one embodiment of a resin-bonded grindstone of the present invention.

FIG. 2 is an enlarged cross-sectional view of the grinding wheel during cutting.

[Explanation of symbols]

 Reference Signs List 1 resin binder phase 2 hollow sphere filler 3 metal coating layer 4 superabrasive

────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shigeru Maekawa 246-1 Egoshi Kurosuno Izumi-cho, Iwaki-shi, Fukushima Prefecture Mitsubishi Materials Corporation Iwaki Seisakusho (56) References JP-A-5-277956 (JP, A) JP-A-61-219574 (JP, A) JP-A-57-21270 (JP, A) JP-A-54-13090 (JP, A) JP-A-62-251077 (JP, A) JP-A-61-8277 JP-A-58-90466 (JP, A) JP-A-63-256364 (JP, A) JP-A-63-200969 (JP, A) JP-A-63-256365 (JP, A) 1979-149145 (JP, A) JP-B 57-49603 (JP, B2) (58) Fields investigated (Int. Cl. ⁷ , DB name) B24D 3/02 B24D 3/28

Claims (1)

(57) [Claims] 1. A resin bonded grindstone having an abrasive layer formed by dispersing superabrasive grains in a resin binder phase, wherein the resin binder phase contains a soft metal having high thermal conductivity, Ag, C
A resin-bonded grindstone characterized by uniformly dispersing a hollow filler coated with u or Cu-Sn metal.