JP3044735B2 - Sputtering equipment - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sputtering apparatus that continuously performs a sputtering process on an optical disk substrate when manufacturing an optical disk or the like, for example.

B. Summary of the Invention The present invention is, for example, in a sputtering apparatus used when manufacturing an optical disk or the like, using a lid having a plurality of closed surfaces provided with holding means for holding a member to be sputtered, By rotating this so as to sequentially switch the closed surface to the supply port for taking in and out the member to be sputtered, the member to be sputtered is taken in and out of the vacuum chamber instantaneously.

C. Prior Art Conventionally, an optical disk configured to record and reproduce a predetermined information signal such as an audio signal and an image signal has been proposed. The optical disk is formed by depositing a metal material such as aluminum as a reflection film on a disk substrate made of a material such as polycarbonate or acrylic and having pits and grooves formed thereon.

By the way, as a method of depositing a metal material on a disk substrate, there are a vapor deposition method, an ion plating method, a sputtering method and the like.

In the vapor deposition method and the ion plating method, a metal material (evaporation source) is heated in a vacuum chamber to evaporate the metal, and a disk substrate is placed in a metal vapor to deposit the metal material on the substrate. It is to let. In order to mass-produce optical disks by these methods, a so-called batch method is used in which a plurality of optical disks are manufactured by evaporating the metal material once using a large vacuum chamber capable of accommodating a plurality of disk substrates at once. I have to rely on it. For this reason, not only is the device configuration complicated and large, but also unevenness occurs depending on the location in the vacuum chamber.

On the other hand, the sputtering method has an advantage that processing can be completed in a short time, continuous processing can be performed, and a film can be formed on each disk substrate under the same conditions. Therefore, if this method is adopted, a uniform film without unevenness can be obtained, and it is possible to cope with mass production, multi-product production, and the like.

In the sputtering process, a discharge gas such as argon is sealed in a low pressure state in a vacuum chamber containing a disk substrate and a metal material (target) such as aluminum, and an electric field is applied to the vacuum chamber. Accordingly, the discharge gas is ionized, and atoms and molecules of the metal material are beaten out by the ionized discharge gas. That is, in the vacuum chamber, the discharge gas is ionized, collides with the metal material, and the metal material is scattered,
The metal material is applied to the disk substrate to form a thin film.

As a sputtering apparatus for performing this sputtering process, for example, as shown in FIG. 12, by rotating a disk-shaped transfer table in which a plurality of disk substrates are arranged in the circumferential direction, these disk substrates An apparatus configured to perform a sputtering process continuously has been proposed.

This sputtering apparatus is configured such that the inside thereof is maintained at a predetermined vacuum degree, and a vacuum chamber 1 in which a disk inlet / outlet 101 for taking in / out the disk substrate Da and a sputtering processing unit 102 for performing a sputtering process are formed.
It has 03. A cover 104 for maintaining the degree of vacuum in the vacuum chamber 103 is provided at the disk inlet / outlet 101 so as to be supported so as to be brought into and out of contact with the vacuum chamber 103.

On the other hand, the sputtering unit 102 has a disk processing port 105 formed in the same manner as the disk inlet / outlet 101, and a cylindrical processing unit attached to the vacuum chamber 103 so as to cover above the disk processing port 105. It has 106. The processing unit 106 includes the disk substrate D
A metal material (target) 107 for performing sputtering on a is accommodated, and argon gas or the like is sealed at a low pressure.

In the vacuum chamber 103, a disk-shaped transfer table 108 for transferring a plurality of disk substrates Da sequentially from the disk inlet / outlet 101 to the sputtering unit 102 is provided. The transfer table 108 is supported by a rotation shaft 108a provided to protrude into the vacuum chamber 103, and is rotated around the axis by a driving unit (not shown). The transfer table 108 has a circular positioning recess 108b for mounting the disk substrate Da.
A receiving tray 109 for positioning the disk substrate Da by fixing the center hole of the disk substrate Da in the recess 108b is fitted and mounted. The receiving tray 109 is formed as a disk having a diameter slightly larger than the outer dimensions of the disk substrate Da, and has a projection 109a protruding at a substantially central portion thereof to insert a center hole for chucking of the disk substrate Da. I have. Further, the positioning recess 108b of the transfer table 108
An insertion hole 108c through which push-up shafts 110 and 111 for pushing up the tray 109 are inserted is formed substantially in the center of the tray.

The push-up shafts 110 and 111 are provided in the vacuum chamber 103 facing the disk entrance / exit 101 and the sputtering unit 102, respectively.
The vacuum chamber 103 is exposed to the inside of the vacuum chamber 103 through an opening formed in the bottom surface of the vacuum chamber, and is configured to be operated in a vertical direction by a driving device (not shown). That is, the transport table
When the disk substrate Da conveyed by 108 comes to a position facing the disk entrance / exit 101 and the sputtering processing unit 102, respectively, the respective push-up shafts 110, 111
Protrudes, and presses and supports the receiving trays 109, 109 to the opening / closing edge of the disk inlet / outlet 101 and the disk processing port 105, and
03 and the outside (atmosphere) are sealed. Then, when the disk substrate Da is taken out on the disk entrance / exit 101 side and the sputtering processing is completed in the sputtering processing unit 102, the respective push-up shafts 110 and 111 are immersed in the bottom of the vacuum chamber 103.

In the sputtering apparatus configured as described above, a plurality of disk substrates Da supplied from the disk inlet / outlet 101 are sequentially transferred to the sputtering processing unit 102 by rotating the transfer table 108, where the sputtering is continuously performed. At the same time as the processing is performed, at the disk entrance / exit 101, the disk substrate Da subjected to the sputtering processing is taken out and a new disk substrate Db is supplied to the transfer table.

D. Problems to be solved by the invention By the way, the disk substrate Da subjected to the sputtering process
Take-out and transfer table 108 for new disk substrate Db
Is supplied by a sputtered member take-out mechanism for operating the lid 104 toward and away from the vacuum chamber 103.

As shown in FIG. 12, the take-out mechanism includes a rotating arm 112 which is bent at substantially right angles so that both ends are suspended.
And a driving device having a rotating shaft 113 that supports a substantially central portion of the rotating arm 112, rotates the rotating arm 112 in the horizontal direction, and moves the lid 104 up and down with respect to the disk entrance / exit 101. 114, and a pair of lids 104, 104 attached to both ends of
, And a horizontal rotation operation about the rotation shaft 113.

The removal of the sputtering-processed disk substrate Da by this removal mechanism and the supply of a new disk substrate Db to the transfer table 108 are performed as follows. First, the sputtered disk substrate Da placed on the tray 109 closing the disk entrance 101 is sucked by the suction pad 104a provided on one lid 104, and the rotating shaft 113 is raised. vacuum chamber 103 to the disk substrate D ₁ by
Take out from. Next, the rotation shaft 113 is rotated around the axis to rotate the rotation arm 112 by 180 degrees, and the other lid
The new disk substrate Db sucked by the suction pad 104a of the disk 104 is positioned on the disk inlet / outlet 101. And
By lowering the rotating shaft 113, the disc substrate Db is
Place on top of 09.

However, in the above-described mechanism, it is necessary to rotate the rotary arm 112 in the horizontal direction by 180 degrees in order to exchange the disk substrate Da after the processing with the disk substrate Db before the processing.
This rotation operation takes a considerable amount of time. For example, the time required for taking out the disk substrate Da after the sputtering process by this mechanism and setting the new disk substrate Db in the tray 109 is about 1.5 seconds. In addition, since a large rotation torque is required to rotate the lid 104,
Inevitably, the driving device 114 must be enlarged. Therefore, the apparatus becomes expensive and a problem occurs in the installation space.

Therefore, the present invention has been proposed in view of such a conventional situation, and an object of the present invention is to provide a sputtering apparatus capable of instantaneously taking a member to be processed into and out of a vacuum chamber. It is an object of the present invention to provide a small and inexpensive sputtering apparatus.

E. Means for Solving the Problems In order to achieve the above-mentioned object, a sputtering apparatus according to the present invention includes a sputter processing unit for performing sputtering on a supply port through which a member to be sputtered is taken in and out and the member to be sputtered. And a plurality of closed surfaces provided with holding means for holding the member to be sputtered, and a position at which the supply port is closed by any of the closed surfaces. And a lid that is vertically movably supported between the supply port and an ascending position that opens the supply port, and that is rotatably supported so as to be able to switch a closing surface facing the supply port, and the vacuum tank. And a transfer means for transferring the member to be sputtered between the supply port and the sputtering unit, the cover being configured to close the supply port. By being rotated when being moved between the position and the ascending position for opening the supply port, the closed surface opposed to the supply port is switched to be supplied to the vacuum chamber by switching. The replacement of the sputtering member is performed.

F. Function In the sputtering apparatus of the present invention, when the sputtering is completed, the sputtered member to be sputtered is held by the holding means provided on the closing surface of the lid closing the supply port. On the other hand, on the other closed surface of the lid (the closed surface exposed outside the vacuum chamber), a new sputtering target member is supplied while the sputtering target member is being sputtered, It is held by holding means provided on the closed surface.

In this state, when the lid is raised from the supply port and the lid is rotated to invert the closed surface, the supply port of the vacuum tank is closed and the supply port faces the inside of the vacuum tank. The closed surface that has been exposed is exposed to the outside, and the member to be sputtered that has been subjected to the sputtering process and held on the closed surface is removed from the vacuum chamber. When the lid is lowered to the supply port, the closed surface holding the new member to be sputtered closes the supply port, and the new member to be sputtered is supplied into the vacuum chamber. You.

G. Examples Hereinafter, specific examples to which the present invention is applied will be described with reference to the drawings. In this embodiment, the sputtering apparatus according to the present invention is applied to an optical disk manufacturing apparatus for manufacturing an optical disk by forming a thin film made of a metal material such as aluminum on a disk substrate formed of a synthetic resin such as polycarbonate or acrylic by sputtering. This is an example of application.

The optical disk manufacturing apparatus of the present embodiment accommodates a vacuum chamber and an exhaust system provided with a vacuum pump and the like provided below the vacuum chamber in a rectangular housing (not shown). ing.

As shown in FIGS. 1 and 2, the vacuum chamber 1 is configured such that the inside thereof is maintained at a predetermined degree of vacuum by a vacuum pump, and is connected to the vacuum pump at a substantially central portion thereof. It has a duct 1a. The vacuum chamber 1 has a disk inlet / outlet 2 through which a disk substrate serving as a member to be sputtered is put in / out, and a sputtering unit 3 for performing a sputtering process on the disk substrate.
And are arranged in parallel.

The disk inlet / outlet 2 is formed as a supply port for taking the disk substrate after the sputtering process and the disk substrate before the sputtering process into and out of the vacuum chamber 1, and corresponds to the shape of the disk substrate. The disk substrate is formed in a substantially circular shape slightly larger in diameter than the external dimensions of the disk substrate. A lid 4 is provided above the disk entrance 2 so as to open and close the disk entrance 2.

The lid 4 is formed to have a size capable of closing the disk inlet / outlet 2, and has closing surfaces 4a and 4b on both sides thereof for closing the disk inlet / outlet 2. The closing surfaces 4a and 4b are circular surfaces enough to close the disk inlet / outlet 2, and the outer peripheral edge of the closing surface 4a or the closing surface 4b abuts on the peripheral edge of the opening of the disk inlet / outlet 2. As a result, the disk entrance 2 is closed. In addition,
Close to the outer peripheral edge of each of the closing surfaces 4a and 4b of the lid 4, an O-ring or the like for keeping an airtight state in the vacuum chamber 1 by contacting the peripheral edge of the opening of the disk inlet / outlet 2. Member 5,
6 are provided.

At substantially the center of the closing surfaces 4a, 4b of the lid 4, circular step surfaces 7, 8 having a size that can reach the inside of the disk entrance 2 are formed, on which the disk substrate is mounted. A holding means including suction pads 7a and 8a for vacuum suction is provided. Note that these step surfaces 7, 8 are
The distance between a, 8a and a receiving tray 18, which will be described later, is set to be small, and the disk substrate on the receiving tray 18 is provided to surely suck the disk substrate with the suction pads 7a, 8a under vacuum.

The lid 4 configured as described above is attached to a rotating shaft 10 of a driving unit 9 composed of a motor or the like, and is turned upside down in a direction indicated by an arrow A in FIG. In other words, the rotary shaft 10 is inserted through an insertion hole (not shown) provided through the cover 4 in a diametrical direction at a substantially central portion of a thickness of the cover 4, and a tip end side thereof. , And rotates together with the rotary shaft 10. Therefore, the lid 4 is connected to the drive unit 9.
The closing surfaces 4a and 4b provided on both sides of the
It is rotated every time and turned upside down.

The lid 4 is supported so as to be vertically movable with respect to the disk entrance 2. That is, the lid 4 is supported by a drive unit (not shown) such as an air cylinder that projects upward from a lower portion of the vacuum chamber 1.
By being attached to the tip of 11 via a connecting member 12 which is attached so as to cover the vicinity of the drive section 9 of the rotary shaft 10, it can be moved up and down in the direction of arrow B in the figure. The drive unit is provided below the vacuum chamber 1 and has a support shaft.
Reference numeral 11 faces a through hole penetrating the vacuum chamber 1 provided in the vicinity of the disk inlet / outlet 2 in the thickness direction. Therefore, miniaturization of the device can be expected. In order to facilitate sliding of the support shaft 11, for example, a bearing 13 or the like is press-fitted into a through hole through which the support shaft 11 is inserted.

The lid 4 supported as described above is moved toward the vacuum chamber 1 and presses and supports the opening edge of the disk inlet / outlet 2 so that the disk inlet / outlet 2 is closed by one of the closing surfaces 4a. At the same time, the disk substrate after the sputtering process placed on the tray 18 is sucked by the suction pad 7a. Then, the disk substrate that has been separated from the vacuum chamber 1 and processed is taken out of the vacuum chamber 1 and the disk inlet / outlet 2 is opened. At this time, the lid 4 is turned upside down while the lid 4 is raised, and the disk substrate before the sputtering process, which is attracted to the other closed surface 4b side, is provided facing the disk inlet / outlet 2.

On the other hand, the sputtering unit 3 is attached to the vacuum chamber 1 so as to cover the upper side of the disk processing port 14 formed in the same manner as the disk inlet / outlet 2 and the disk processing port 14. And a processing unit 15 for keeping the airtight state. The processing section 15 is formed in a cylindrical shape whose upper end is closed, and a metal material (target) 16 used for the sputtering process and a discharge gas such as argon necessary for the sputtering process are sealed therein in a low pressure state. At the same time, a predetermined electric field is applied.

In the vacuum chamber 1, there is provided a rotating arm 17 which constitutes transfer means for transferring the disk substrate from the disk inlet / outlet 2 to the sputtering unit 3. The rotating arm 17 has a disk shape only at the free end side on which the disk substrate is mounted, and has a tapered shape at the base end side. The pivot arm 17 is bolted to the distal end of a pivot shaft 18 whose base end protrudes into the vacuum chamber 1 and is driven by a drive unit (not shown) to indicate an arrow L _{1 in} FIG.
And are made rotatable around the axis indicated by the arrow L _2. For example, the rotating arm 17 is rotated at an angle of about 90 ° indicated by an arrow θ in FIG. 2, and extends between a position below the disk entrance 2 and a position below the sputtering unit 3. The transfer operation is performed. In addition,
A through-hole (not shown) formed in the bottom of the vacuum chamber 1 for allowing the rotating shaft 18 to face the inside of the vacuum chamber 1 is used to maintain an airtight state in the vacuum chamber 1. An O-ring is provided.

A circular positioning concave portion 17a for mounting a disk substrate is formed on the upper surface portion on the distal end side which is the free end side of the rotating arm 17, and a central portion of the concave portion 17a is described later. Push-up shaft insertion holes 17b into which the push-up shafts 19, 20 are inserted. The receiving tray 18 on which the disk substrate is placed is fitted and placed in the recess 17a. The receiving tray 18 is formed as a disk having a diameter slightly larger than the outer dimension of the disk substrate, and a projection 18a for positioning the disk substrate by projecting a center hole for chucking of the disk substrate into the center thereof is provided. ing. Therefore, the disk substrate is fitted to the positioning recess 17a while being fixed to the tray 18, and is positioned and mounted on the rotating arm 17. The peripheral portion of the receiving tray 18 is arranged so that the inside of the vacuum chamber 1 is kept airtight when the peripheral portion of the receiving tray 18 is pressed against the opening peripheral portion of the disk inlet / outlet 2 from below. ,
A sealing member 18b such as an O-ring is attached.

The bottom of the vacuum chamber 1 can be moved up and down in the direction shown by arrow C in FIG. Push-up shafts 19 and 20 are provided. The push-up shafts 12 and 13 are provided through openings (not shown) formed in the bottom surface of the vacuum chamber 1 facing the disk inlet / outlet 2 and the disk processing port 14, respectively. It is facing inside. In addition, O-holes for maintaining the airtight state in the vacuum chamber 1 are provided in these openings.
A sealing member (not shown) such as a ring is provided. Also, at the tip of these push-up shafts 19 and 20,
Disc-shaped push-up members 19a and 20a for pushing up the receiving tray 18 in a stable state through a push-up shaft insertion hole 17b formed in the rotary arm 17 are attached.

These push-up shafts 19 and 20 are designed to be operated when the distal ends of the rotary arms 17 are located at positions facing the disk inlet / outlet 2 and the disk processing port 14, respectively. That is, in the disk inlet / outlet 2 and the disk processing port 14, the tray 1 placed on the rotating arm 17 through the push-up shaft insertion hole 17 b provided in the rotating arm 17.
The disk 8 is lifted by the push-up shafts 19 and 20 and is pressed against the disk inlet / outlet 2 and the peripheral edge of the disk processing port 14. At this time, since a sealing member 18b such as an O-ring is provided on the peripheral portion of the tray 18, the seal between the vacuum chamber 1 and the outside is ensured.

In the optical disk manufacturing apparatus thus configured, the disk substrate is taken in and out of the vacuum chamber 1 by the lid 4 provided with the suction pads 7a and 8a for holding the disk substrate, and Closing surfaces 4a, 4b provided on both sides of the lid 4 so as to be movable up and down with respect to the entrance 2
Is performed by a mechanism for inverting the disk substrate, the disk substrate after the sputtering process and the disk substrate before the sputtering process can be instantaneously exchanged. Also,
In particular, the apparatus of the present embodiment is configured so that the transfer operation of the disk substrate between the disk inlet / outlet 2 and the sputtering unit 3 is performed with a single swing arm 17 with a small swing angle. The size of the vacuum chamber 1 can be reduced, and the volume in the vacuum chamber 1 can be made extremely small. Therefore, it is possible to reduce the size of the vacuum pump that exhausts gas, and to shorten the exhaust time.

An optical disk is manufactured by the above-described optical disk manufacturing apparatus in the following manner.

First, as shown in FIG. 3, a push-up shaft 20 provided corresponding to the disk inlet / outlet 2 is made to protrude in a direction toward the disk inlet / outlet 2 indicated by an arrow D in FIG. The tray 18 to be placed is moved upward to
The periphery of the disk 18 is pressed against the periphery of the opening of the disk inlet / outlet 2.

Then, the disk entrance 2 is closed by the tray 18. At this time, since the sealing member 18b is provided at the peripheral edge of the receiving tray 18, the inside and the outside of the vacuum chamber 1 are sealed, and the invasion of the atmosphere into the vacuum chamber 1 is prevented.

Then, a support shaft 11 for vertically moving the lid 4 is protruded in a direction indicated by an arrow E in FIG. Face up.

Next, the suction pads provided on both sides of the lid 4
Disk substrates D ₁ and D ₂ before the sputtering process are respectively adsorbed to 7a and 8a.

Then, the support shaft 11 is indicated by an arrow F in FIG.
The lid 4 is lowered to the disk inlet / outlet 2 side by being immersed in the bottom of the disk, and the disk inlet / outlet 2 is closed by one of the closing surfaces 4 a provided on the lid 4.

As a result, the inside and the outside of the vacuum chamber 1 are sealed. Although the drawing is exaggerated so as to be sealed only by the sealing member 5 provided on the lid 4, the closing surface 4 a and the peripheral edge of the opening of the disk entrance 2 are actually exaggerated. In close contact.

In this state, one closed surface of the lid 4
The disk substrate D ₁ which is adsorbed to 4a side is placed on the receiving tray 18.

At this time, the disc substrate D ₁ is positioned by the projection 18a provided at a substantially central portion of the receiving tray 18.

Next, as shown in FIG. 5, a vacuum pump is operated in a state where the disk inlet / outlet 2 is closed by the lid 4, and the degree of vacuum damaged by the opening / closing operation of the disk inlet / outlet 2 is restored. At the same time, as shown by the arrow G in the figure, the push-up shaft 20 is immersed in the side where the vacuum pump or the like is provided, and the tray 18 is moved downward. To be placed.

At this time, in the vacuum chamber 1 of this example, the rotating arm 17
Is a single line, so that there is no obstacle in evacuation and a predetermined degree of vacuum can be instantaneously achieved. For example, the time is less than one second.

When the tray 18 is placed on the tip side of the rotating arm 17, the rotating arm 17 is rotated to the sputtering unit 3 indicated by an arrow L2 in FIG. ₂ , and as shown in FIG. To
The disk substrate D ₁ placed on the tray 18 is positioned below the disk processing port 14.

Once the tray 18 is positioned, as shown in FIG. 7, the push-up shaft 19 provided below the tray 18 is
In the figure, the tray 18 is protruded toward the disc processing port 14 indicated by an arrow H, and the peripheral edge of the tray 18 is pressed against and supported by the peripheral edge of the opening of the disc processing port 14.

As a result, the disk processing port 14 is closed by the tray 18. Then start the sputtering process on the disk substrate D ₁ in this state.

If sputtering process is completed, as shown in FIG. 8, the push-up shaft 19, as shown in the figure arrows I, immerses the side where the vacuum pump or the like is provided, the disk substrate D ₁ is the placement The placed tray 18 is placed on the rotating arm 17.

If the disc substrate D ₁ is placed on the rotating arm 17, the the pivoting arm 17 is rotated to the disk inlet and outlet 2 the direction indicated by the second arrow in the figure L _1, as shown in FIG. 9 A disk substrate D ₁ on which a thin film made of aluminum is formed
Is placed below the disk entrance 2.

If the pan 18 is positioned at a predetermined position,
As shown in FIG. 10, the push-up shaft 20 is projected toward the disc inlet / outlet 2 side as indicated by an arrow J in FIG.
The disk 18 is moved upward, and the disc inlet / outlet 2 is closed by the tray 18.

The lid 4 closing the disk entrance 2
Adsorbing the disk substrate D ₁ which is the sputtering treatment with suction pads 7a provided.

Next, a support shaft 11 for supporting the lid 4 so as to be vertically movable is protruded as shown by an arrow K in FIG. 11 to separate the cover 4 from the vacuum tank 1 and raise the support shaft 11. During this operation, the cover 4 is turned upside down as shown by the arrow L in the figure, and the closing surface 4b facing the disk entrance 2 is switched. That is, the disk substrates D ₂ prior to sputtering to face the disk inlet and outlet 2, to reverse the disk substrate D ₁ of the post-sputtering on the opposite side thereto.

Next, as described above, the support shaft 11 is immersed in the vacuum chamber 1 as shown in FIG. 4, and the disk inlet / outlet 2 is closed by the lid 4. Then, the new disk substrate D ₂
Is performed sequentially through the above-described steps.

At this time, while the new disk substrate D ₂ is being sputtered, the closing surface 4 a opposite to the disk entrance 2
It takes out the disk substrate D ₁ of the post-sputtering process being adsorbed on to adsorb a new disk substrate next to the suction pads 7a provided on the closing surface 4a.
Since this operation can be performed during the sputtering process, there is a margin in time. Therefore, it is very advantageous in automating the sputtering process.

As described above, when an optical disk is manufactured using the optical disk manufacturing apparatus of the present embodiment, the disk substrate after the sputtering process and the disk substrate before the sputtering process can be instantaneously put into and taken out of the vacuum chamber 1, resulting in significant production. The improvement of the property can be expected. For example, the time required to manufacture an optical disk with the present apparatus is about 6 seconds, and taking the disk substrate in and out of the vacuum chamber 1 is completed in only 0.5 seconds. Therefore, a significant reduction in time can be expected, and another process can be performed with a sufficient margin in the remaining 5.5 seconds.

As described above, in the optical disk manufacturing apparatus to which the present invention is applied, the lid 4 for holding the member to be sputtered is a dihedron having two closed surfaces 4a and 4b. For example, this is not limited to the dihedron but may be a trihedron. , Tetrahedron, pentahedron or more polyhedrons are also possible.

H. Effects of the Invention As is clear from the above description, in the sputtering apparatus according to the present invention, the holding that holds the target member to be sputtered on the lid that closes the supply port through which the target member to be sputtered is taken in and out. Since a plurality of closed surfaces provided with the means are provided, the members to be sputtered can be respectively held by the holding means of each closed surface.

Further, in the sputtering apparatus according to the present invention,
The lid is vertically movable with respect to the supply port, and the closing surface facing the supply port can be switched by rotating the lid, so that one of the lids At the same time that the member to be sputtered after the sputtering process is taken out of the vacuum chamber by the holding means provided on the closed surface side, the member to be sputtered before the sputtering process held on the other closed surface side is opposed to the supply port. Can be provided.

As described above, the sputtering apparatus according to the present invention is configured such that a lid having a plurality of closed surfaces provided with holding means for holding a member to be sputtered is provided at a position where the supply port of the vacuum chamber is closed and a position where the supply port is opened. When the lid is rotated, the closed surface facing the supply port is switched by rotating the lid, whereby the member to be sputtered supplied to the vacuum chamber is exchanged. Therefore, the time for replacing the member to be sputtered with the vacuum chamber can be reduced, the processing time for sputtering can be reduced, and the productivity can be improved.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a vacuum chamber of the optical disk manufacturing apparatus of the present embodiment, and FIG. 2 is a transverse sectional view of the vacuum chamber. 3 to 11 are longitudinal sectional views of a vacuum chamber sequentially showing a procedure for performing a sputtering process by the optical disk manufacturing apparatus of the present embodiment. FIG. 3 shows a state in which the disk entrance and exit are closed by a receiving tray. 4 shows a state in which the disk substrate is loaded, FIG. 5 shows a state in which the disk substrate has been loaded, FIG. 6 shows a state in which the disk substrate has been transported to the sputtering section, and FIG. FIG. 8 shows a state in which the disk substrate is being sputtered, FIG. 8 shows a state in which the sputtering process is completed, FIG. 9 shows a state in which the disk substrate has been conveyed to the disk entrance and exit, and FIG.
The figure shows a state in which the disk substrate is taken out, and FIG. 11 shows a state in which the closing surface of the lid is switched. FIG. 12 is a longitudinal sectional view showing an example of a conventional sputtering apparatus. DESCRIPTION OF SYMBOLS 1 ... Vacuum tank 2 ... Disc entrance / exit 3 ... Sputtering processing part 4 ... Lid 4a, 4b ... Closed surface 10 ... Rotating shaft 11 ... Support shaft 17 ... Rotating arm 18 ... Receiving tray 19 , 20 …… Push-up axis

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) C23C 14/00-14/58 G11B 7/26 H01L 21/31

Claims (1)

(57) [Claims] 1. A vacuum chamber having a supply port through which a member to be sputtered is put in and out, and a sputtering part for performing sputtering on the member to be sputtered, and holding means for holding the member to be sputtered. Is provided, and is vertically movably supported between a position for closing the supply port and an ascending position for opening the supply port on any one of the closed surfaces. And a lid body rotatably supported so as to be able to switch a closed surface facing the supply port, and the member to be sputtered disposed in the vacuum chamber and supplying the sputtered member with the supply port and the sputtering processing section. Transfer means for transferring between the cover and the cover when the cover is moved between a position where the supply port is closed and an ascending position where the supply port is opened. By being operated, replacement sputtering apparatus comprising performing of the sputtering members supplied to the vacuum chamber by closing surface is switched opposite to the supply port.