JP3045665B2 - Spin cleaning equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spin cleaning apparatus for performing cleaning by spraying a cleaning liquid onto a work rotated at a high speed.

[0002]

2. Description of the Related Art For example, in the manufacturing process of a semiconductor device or a liquid crystal display device, a film forming process or a photo process for forming a circuit pattern on a semiconductor wafer or a rectangular glass substrate as a work. There is. In these processes, the above-described work processing and cleaning are repeatedly performed.

In order to clean the work, the work is
It has been practiced to hold a worktable on a rotating table and wash the worktable by spraying a cleaning liquid onto the workpiece while rotating the rotary table at a high speed.

The above-mentioned work is contaminated not only on the upper surface but also on the rear surface. If the back surface of the work is in a contaminated state, when the washed work is stacked and stored in a stocker or the like, dirt such as dust adhering to the back surface may be transferred to another work. is there. For this reason, the work held on the rotating table is not only cleaned on the upper surface but also on the rear surface at the same time.

FIGS. 6A and 6B show a conventional spin cleaning apparatus used for simultaneously cleaning the upper and lower surfaces of a work w. That is, the spin cleaning apparatus shown in FIG. 6A has a rotation axis a. The rotating shaft a is rotatably supported by a bearing b. A rotating table c is attached to the upper end of the rotating shaft a, and a driven pulley d is attached to the lower end.

A drive motor f having a drive shaft e parallel to the rotation shaft a is disposed near the driven pulley d, and a drive pulley g fitted on the drive shaft e and the drive motor f. Driven pulley d
And a belt h is stretched between them. Therefore, when the drive motor f operates, the rotary shaft a is driven to rotate, so that the rotary table c provided at the upper end thereof is also rotated.

The rotary table c is formed in a substantially cross shape having four convex portions p as shown in FIG. 6 (b), and a holding member i stands on the upper surface of the tip of each convex portion p. Has been established. A support pin j for supporting the peripheral portion of the back surface of the work w and a holding pin k for holding the outer peripheral surface of the work w are protruded from the upper end surface of the holding member i.

An upper nozzle 1 is disposed above the rotary table c, and a lower nozzle m is disposed below the rotary table c. The cleaning liquid L is spouted from the nozzles l and m toward the upper and lower surfaces of the work w which is rotated at high speed together with the rotary table c, thereby cleaning the upper and lower surfaces of the work w. It is supposed to be.

The upper nozzle l is provided on the upper surface of the work w.
The cleaning liquid can be reliably supplied from. However, the cleaning liquid L sprayed from the lower nozzle m passes through the portion between the convex portions p of the rotary table c and reaches the back surface of the work w. Therefore, when the rotary table c is rotating at a high speed, the cleaning liquid L that has hit the convex portion p is difficult to reach the back surface of the work w, so that the cleaning effect may not only be reduced. Since the cleaning liquid L that has hit the projections p scatters around, the surroundings may be contaminated, or the cleaning liquid L may easily enter the bearing b, causing early damage to the bearing b. Particularly, a chemical solution having a high acidity may be used as the cleaning liquid L, and in such a case, it is not preferable to scatter the cleaning liquid L around.

[0010]

As described above, the rotating tape is
When the cleaning liquid is sprayed on the back surface of the work held by the cleaning table, the nozzle for spraying the cleaning liquid on the work is arranged on the lower surface side of the rotating table, and thus the nozzle is sprayed from the nozzle. The cleaning liquid passes through a rotating table rotating at a high speed and reaches the work. For this reason, most of the cleaning liquid collides with the rotating table and scatters around, so that the cleaning effect is reduced, contamination by the scattered cleaning liquid, and early damage to the bearing portion are sometimes caused.

The present invention has been made based on the above circumstances, and an object of the present invention is to provide a spin cleaning apparatus capable of cleaning the back surface of a work without scattering a cleaning liquid by a rotating table rotated at a high speed. An object of the present invention is to provide a cleaning apparatus.

[0012]

According to the first aspect of the present invention, there is provided a spin cleaning apparatus for cleaning a rotating work by spraying a cleaning liquid on the work, and a fixed shaft and an internal portion of the fixed shaft. A rotating shaft provided rotatably with respect to the fixed shaft, a driving means for rotating the rotating shaft, and a rotating table provided above the rotating shaft;
Provided on this rotary table so as to be rotatable at predetermined intervals in the circumferential direction
And a plurality of holding members provided on an upper end surface of the holding member.
And a support pin for supporting the periphery of the lower surface of the work
Taller than the support pin of the eccentricity and eccentric from the rotation center of the holding member
And a lock pin provided in the rotation on the outside of the rotary shaft
Being provided and urged in a predetermined direction by a spring
Then, rotate the holding member so that the lower surface is
The lock pin is brought into contact with the outer peripheral surface of the
Lock cylinder, and this lock cylinder is biased by the spring.
Lock the work with the lock pin by turning it against
A release means for releasing the state, and a nozzle body having a nozzle hole provided on the fixed shaft and spraying a cleaning liquid toward a lower surface of the work held by the holding means are provided.

According to a second aspect of the present invention, in the first aspect of the invention, the nozzle body is provided at an upper end of the fixed shaft and is set to have a size to cover a gap between the fixed shaft and the rotating shaft. It is characterized by the following.

According to a third aspect of the present invention, in the first aspect of the present invention, the fixed shaft has a gap between the fixed shaft and the rotating shaft.
A supply means for supplying an inert gas for making the gap a positive pressure is provided.

According to the first aspect of the present invention, a fixed shaft is provided at the center of the lower surface of the rotary table.
Since the nozzle body having the nozzle hole for spraying the cleaning liquid is provided on the back surface of the work held by the rotary table, the cleaning liquid sprayed from the nozzle hole rotates at a high speed.
The back surface of the work is cleaned without being blocked by the bull.

According to the second aspect of the present invention, the nozzle body having the nozzle hole can prevent the cleaning liquid having washed the back surface of the work from entering the gap between the fixed shaft and the rotating shaft. According to the third aspect of the present invention, the gap between the fixed shaft and the rotating shaft is maintained at a positive pressure by the inert gas, thereby preventing the cleaning liquid from entering the gap.

[0017]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.
This will be described with reference to FIGS. The spin cleaning apparatus of the present invention shown in FIG. The main body base 1 is provided with a cylindrical support 2 penetrating vertically. The support 2 has a cylindrical rotating body 3
Is provided such that the middle part is rotatably supported by a pair of upper and lower bearings 4.

A lower end of the rotary shaft 3 projects from the support 2, and a driven pulley 5 is fitted to the lower end. A step motor 6 is provided near the driven pulley 5. A drive pulley 7 is fitted on the rotating shaft 6a of the step motor 6, and a belt 8 is stretched between the drive pulley 7 and the driven pulley 5. Therefore, if the step motor 6 operates, the rotation shaft 3
Are driven to rotate.

As shown in FIG . 1, a rotating table 9 is detachably attached to the upper end of the rotating shaft 3 by screws 9a. On the rotary table 9, four holding members 11 are rotatably mounted via bushes 12 at intervals of 90 degrees in the circumferential direction. The holding member 11 is a cylindrical portion 13
Having. The cylindrical part 13 has an upper end closed and an open lower end. A support shaft 14 is vertically suspended from the cylindrical portion 13 with its lower end protruding. The support shaft 14 is rotatably supported by the bush 12.

A support pin 16 is provided on the upper surface of the cylindrical portion 13.
And an inverted tapered lock pin 17 that is taller than the support pin 16. The support pin 16 has the shaft center substantially aligned with the support shaft 14, and the lock pin 1
7 is provided eccentrically with respect to the axis.

As shown in FIGS. 1 to 3, a semiconductor wafer 21 as a work is held by the four holding members 11 having the above-described structure. That is, the semiconductor wafer 21 is provided with the peripheral portion of the back surface supported by the support pins 16. While the semiconductor wafer 21 is supported by the support pins 16, the holding member 11 is urged in the rotational direction by a spring 54 described later.

As a result, the lock pin 17 provided on the holding member 11 is eccentrically rotated from the position shown by the dashed line in FIG. 3 to the position shown by the solid line to abut on the outer peripheral surface of the semiconductor wafer 21. Is held without shifting in the radial direction.

[0023] The rotating tape - in the center portion of the table 9 hole 25 as shown in FIG. 1 is formed. A conical lower nozzle body 26 is provided in the through hole 25. The lower nozzle body 26 includes a central portion 26a that is inserted into the through hole 25 in a non-contact state, and an umbrella portion 26b that is screwed to the outer peripheral surface of the central portion 26a and that has a larger diameter than the through hole 25. Become.

An annular first seal wall 20a protrudes from the periphery of the through hole 25 of the rotary table 9, and the first seal wall 20a is formed on the lower surface of the umbrella portion 26b. An annular second seal wall 20b is vertically provided on the outer peripheral surface of the second seal wall 20a.

Since the umbrella portion 26b of the lower nozzle body 26 covers the upper end surface of the rotary shaft 3, the cleaning liquid for cleaning the semiconductor wafer 21 is prevented from entering the rotary shaft 3.

The umbrella portion 26b of the lower nozzle body 26 covers the upper surface of the rotary table 9, and the umbrella portion 26b is detachably screwed to the center portion 26a. Therefore, by removing the umbrella portion 26b from the center portion 26a, the screw 9a for attaching the rotating table 9 to the upper end of the rotating shaft 3 can be exposed. Thus, the screw 9a can be loosened to remove the rotary table 9 from the rotary shaft 3.

Steps are respectively formed on the outer peripheral surface of the central portion 26a and the inner peripheral surface of the umbrella portion 26b, and liquid tightness between the central portion 26a and the umbrella portion 26b is ensured between these steps. Packing 26c is provided. In addition, a nozzle hole 27 opened to the upper surface thereof is formed in the center portion 26a of the lower nozzle body 26 so as to penetrate vertically.

A bracket 31 is fitted to the lower end of the central portion 26a of the lower nozzle body 26. The bracket 31 is rotatably supported by an upper part of the rotary shaft 3 by a bearing 29.

The bracket 3 inside the rotating shaft 3
1 and the other bearing 32 shown in FIG.
Thus, a housing 33 whose upper and lower ends are rotatably supported is inserted. The housing 33 and the bracket 31 are integrally combined to form a fixed shaft. A lower end of the housing 33 protrudes from the rotation shaft 3 and is attached to a lower surface of the base body 1.
It is fixed to.

The housing 33 has a first through hole 34 through which the support shaft 28 is inserted, and a second through hole 36 through which a supply tube 35 having one end connected to the nozzle hole 27 is inserted. Has been drilled. The upper end of the support shaft 28 inserted into the first through hole 34 is connected and fixed to the center 26 a of the lower nozzle body 26, and the lower end is the housing 3.
It is fixed to 3. Thereby, the lower nozzle body 26 is integrated with the housing 33. That is,
Even when the rotary table 9 is driven to rotate together with the rotary shaft 3, the lower nozzle body 26 and the housing 33 do not rotate.

The other end of the supply tube 35 communicates with a cleaning liquid supply unit (not shown). Therefore, the cleaning liquid from the supply tube 35 can be sprayed from the nozzle hole 27 toward the center of the lower surface of the semiconductor wafer 21 held by the holding member 11. That is, the back surface of the semiconductor wafer 21 can be cleaned.

An upper nozzle body 38 is arranged on the upper surface side of the semiconductor wafer 21. The cleaning liquid is sprayed from the upper nozzle body 38 toward the center of the upper surface of the semiconductor wafer 21. Thereby, the semiconductor wafer 2
1 is to be cleaned.

On the lower surface side of the rotary table 9, a cylindrical lock cylinder 41 is rotatably provided by a pair of upper and lower bearings 40 on the upper outer peripheral surface of the rotary shaft 3. As shown in FIGS. 1 and 3, a flange 42 is provided at the upper end of the lock cylinder 41, and four arms 39 are provided on the flange 42 at radially outward intervals of 90 degrees in the circumferential direction. Each arm 39 has a slide groove 36 formed in the distal end portion along the radial direction. In each slide groove 36, a top 37 having a fitting hole 37a formed therein is slidably provided.

A locking pin 43 is removably fitted in the fitting hole 37a of the top 37. The locking pin 43 protrudes from one end of the lever 44. The other end of the lever 44 is connected and fixed to a lower end of the support shaft 14 of the holding member 11 protruding from the lower surface of the rotary table 9.

Therefore, if the lock cylinder 41 is rotated clockwise as indicated by the arrow in FIG. 3 and the lever 44 is rotated through the top 37 and the locking pin 43, the lock cylinder 41 is connected to the lever 44. The holding member 11 can be rotated via the support shaft 14 thus set.

As a result, the lock pins 17 rotate eccentrically, and the semiconductor wafer 21 supported by the support pins 16 is rotated.
The lock pins 17 are brought into contact with the outer peripheral surface of the semiconductor wafer 21 to lock the support state of the semiconductor wafer 21. That is, the lock pins 17 prevent the semiconductor wafer 21 supported by the support pins 16 from moving in the radial direction.

The locked state of the semiconductor wafer 21 by the lock pins 17 can be released by rotating the lock cylinder 41 counterclockwise. The lock pin 17 locks and releases the semiconductor wafer 21, that is, the rotation of the lock cylinder 41 is performed by the release mechanism 51. As shown in FIGS. 4 and 5, the release mechanism 51 includes a first locking piece 52 provided on the outer peripheral surface of the rotary shaft 3 and a second locking piece 52 provided on the outer peripheral surface of the lock cylinder 41.
And a locking piece 53.

A spring 54 is stretched between the first locking piece 52 and the second locking piece 53. The spring 54 urges the lock cylinder 41 toward the first locking piece 52 via the second locking piece 53. That is, the lock cylinder 41
It is urged in the counterclockwise direction indicated by the arrow in FIG. Therefore, since the spring 54 rotates the lock cylinder 41,
Rotating table 9 via locking pin 43 and lever 44
Is rotated, and the lock pin 17 is brought into a locked state in which the lock pin 17 comes into contact with the outer peripheral surface of the semiconductor wafer 21.

The locking state of the semiconductor wafer 21 by the lock pin 17 is released by the first cylinder 61 constituting the releasing mechanism 51 disposed near the step motor 6 as shown in FIGS. , And the second cylinder 62.

That is, as shown in FIG. 4, the first cylinder 61 is provided on the main body base 1 with the first substrate 60 interposed therebetween. The first substrate 60 includes a first cylinder 61.
A first movable body 64 is slidably supported by a first linear guide 63 on the side of the first movable body 64. The first movable body 64 is connected to the rod 61a of the first cylinder 61. Thereby, the first movable body 64 is driven to reciprocate along the first linear guide 63 by the operation of the first cylinder 61.

A pair of clamping rollers 65 are provided at a predetermined interval at the top end of the upper surface of the first movable body 64. When the first movable body 64 is driven in the forward direction, the holding rollers 65 hold the first locking pieces 52 of the rotating shaft 3 stopped at a predetermined rotation angle as shown by a chain line in FIG. I do. Thereby, the first movable body 64 prevents the rotation shaft 3 from rotating.

The second cylinder 62 is mounted on the main body base 1 via a second substrate 66. Second
A second movable body 68 is slidably provided on the substrate 66 by a second linear guide 67 on the side of the second cylinder 62. A pressing roller 69 is rotatably provided at the top end of the second movable body 68. Therefore, the pressing roller 69 is driven forward and backward by the second cylinder 62.

The rotation shaft 3 stops at a predetermined rotation angle,
When the second cylinder 62 is operated and the second movable body 68 is driven in the forward direction in a state where the first locking piece 52 is held by the pair of holding rollers 65, FIG. 5
A pressing roller 69 provided at the tip of the second locking piece 5 provided on the lock cylinder 41 as shown by a chain line in FIG.
Press 3.

As a result, the lock cylinder 41 is rotated against the urging force of the spring 54, so that the locking pin 4
The holding member 11 is rotated via the lever 3 and the lever 44 in a direction opposite to that in the locked state. Therefore, the lock pin 1
7 rotates eccentrically to release the locked state of the semiconductor wafer 21.

As shown in FIG. 2, a dog 71 is provided on the outer peripheral surface of the lower end of the rotating shaft 3, and the dog 71 is detected by a microphoto sensor 72. The rotation angle of the rotary shaft 3 by the step motor 6 is controlled by the detection signal of the micro photo sensor 72. That is, when the locked state of the semiconductor wafer 21 is released, the first and second cylinders 61 and 62 of the release mechanism 51
The rotation angle of the rotating shaft 3 is controlled such that the locking piece 52 and the second locking piece 53 are at predetermined positions.

A through hole 75a into which the upper part of the rotary shaft 3 is loosely inserted is formed on the upper surface side of the main body base 1, and a lower cup 75 in which the rotary shaft 3 is housed, and the holding member 11
Covering the peripheral portion on the upper surface side of the semiconductor wafer 21 held at
An upper cup 76 having an opening 76a on the upper surface is provided. The upper cup 76 is provided so as to be vertically movable, and is connected to a rod 77 of a vertical driving cylinder (not shown).
By operating this cylinder, the upper cup 76 is driven up and down.

[0047] When lowering the on cup 76 to position the upper portion of the holding member 11 from its upper opening projects. Therefore, an unprocessed semiconductor wafer 21 can be supplied to the holding member 11 by a robot (not shown), and the semiconductor wafer 21 that has been dried can be taken out. Further, the lower cup 75 has a discharge pipe 7.
8 are connected. The discharge pipe 78 discharges the cleaning liquid and the atmosphere inside the lower cup 75.

As shown in FIG. 1, a ring-shaped facing member 81 is provided around the lower hole 75a of the lower cup 75 so as to face the lower surface of the rotary table 9. As shown in FIG. An inner peripheral wall 82a is provided around the upper surface of the facing member 81.
And an outer peripheral wall 82b shorter than the inner peripheral wall 82a form an annular groove 83. A liquid L supply pipe 84 is connected to the bottom of the annular groove 83 so as to supply the liquid L to the annular groove 83. Since the outer peripheral wall 82b forming the annular groove 83 is shorter than the inner peripheral wall 82a, the liquid L supplied to the annular groove 83 overflows outward.

At the periphery of the lower surface of the rotary table 9, a seal wall 85 which enters the annular groove 83 is provided all around. By inserting the seal wall 85 into the annular groove 83 containing the liquid L, the lower surface side and the outer peripheral side of the rotary table 9 are airtightly shut off.

As a result, outside air containing dust is prevented from flowing into the lower cup 75 from the through hole 75a of the lower cup 75, and the cleaning liquid scattered in the upper and lower cups 75, 76 is removed by the lower cup 75. It is prevented from flowing out to the outside from the through holes 75a of the 75.

When the cleaning liquid is a liquid having a high acidity, the cups 75 and 76 and the rotary table 9 are made of a material having acid resistance, such as a fluorine resin, so that they are not corroded. When the cleaning liquid flows out of the lower cup 75 and adheres to other parts made of metal,
The parts may be corroded, and if the parts enter a movable part such as a bearing part, the movable part may be damaged early. However, the above-described seal structure prevents the cleaning liquid from flowing out of the lower cup 75 to the outside, so that such inconvenience does not occur.

The housing 3 provided in the rotating shaft 3
3 is provided with a supply pipe 91 for an inert gas such as nitrogen. The supply pipe 91 communicates with a first space 92a between the upper surface of the bracket 31 and the lower surface of the lower nozzle body 26. A communication hole 93 communicating with the second space portion 92b between the outer peripheral surface and the inner peripheral surface of the rotating shaft 3 is formed in the peripheral wall of the bracket 31.

Therefore, the first pipe from the supply pipe 91
The inert gas supplied to the space 92a of the communication hole 9a
3 to the second space 92b, and the second space 9
2b flows out along the lower surface side of the lower nozzle body 26.
In other words, since the second space 92b is made to have a positive pressure by the inert gas, the pressure prevents the cleaning liquid from flowing into the second space 92b.

As shown in FIG. 2 , a first suction hole 95a connected to a suction pump (not shown) is formed in a peripheral wall of the support 2 rotatably supporting the rotating shaft 3. A second suction hole 95b is formed in a portion of the peripheral wall of the rotating shaft 3 facing the first suction hole 95a. further,
A third suction hole 95c is formed in a portion of the peripheral wall of the rotating shaft 3 facing the lock cylinder 41.

Therefore, by the suction force of the suction pump connected to the first suction hole 95 a, the bearing 4, which rotatably supports the rotating shaft 3 on the support 2, and the rotating shaft 3 is rotated by the housing 33. Freely supported bearings 29, 32
And the dust generated by the bearing 40 that rotatably supports the lock cylinder 41 on the rotary shaft 3 is discharged, so that the dust generated by each bearing is prevented from scattering around. Has become.

Next, a case where the semiconductor wafer 21 is cleaned by the spin cleaning apparatus having the above configuration will be described.
First, the semiconductor wafer 21 is held by four holding members 11 erected on the upper surface of the rotating table 9. That is,
The peripheral portion of the lower surface of the semiconductor wafer 21 is supported by the support pins 16 and the lock pins 17 are brought into contact with the outer peripheral surface, thereby holding the semiconductor wafer 21 on the rotating table 9. Since the lock pin 17 has an inverted tape shape, the lock pin 17 not only holds the semiconductor wafer 21 so as not to be displaced in the radial direction, but also prevents the semiconductor wafer 21 from floating from the support pin 16.

When the semiconductor wafer 21 is held on the rotating table 9, the step motor 6 is operated to rotate the rotating table 9 together with the rotating shaft 3 at a high speed. At the same time, the cleaning liquid is supplied from the upper nozzle body 38 to the semiconductor wafer 2.
1 and the lower nozzle body 2
The cleaning liquid is sprayed from the nozzle hole 27 of No. 6 toward the lower surface of the semiconductor wafer 21. The cleaning liquid is supplied to the central portion between the upper surface and the lower surface of the semiconductor wafer 21 rotated at a high speed,
The upper and lower surfaces of the semiconductor wafer 21 are cleaned.

A cleaning liquid is supplied to the lower surface of the semiconductor wafer 21 from a nozzle hole 27 formed in the lower nozzle body 26. The lower nozzle body 26 is attached to a bracket 31 forming a fixed shaft, and is connected to an upper end side of the rotating shaft 3.
That is, it is provided so as to protrude from the upper surface of the rotary table 9.

Therefore, the cleaning liquid sprayed from the nozzle holes 27 of the lower nozzle body 26 toward the lower surface of the semiconductor wafer 21 cleans the lower surface of the semiconductor wafer 21 without being interrupted by the rotating table 9 rotating at a high speed. Therefore, not only can the lower surface of the semiconductor wafer 21 be efficiently and reliably cleaned, but also the cleaning liquid does not collide with the rotary table 9 and scatter.

The lower nozzle body 26 is divided into a central portion 26a and an umbrella portion 26b, and the umbrella portion 26b covers the upper end surface of the rotating shaft 3. Therefore, the cleaning liquid sprayed and dropped on the lower surface of the semiconductor wafer 21 is provided in the second space between the rotating shaft 3 by the umbrella portion 26b and the bracket 31 rotatably supported in the upper end of the rotating shaft 3. 92b.

Further, a first seal wall 20a protrudes from the periphery of the through hole 25 of the rotary table 9, and the first seal wall 20a is formed on the lower surface of the umbrella portion 26b. Since the second seal wall 20b opposing the second seal portion 20b is provided vertically, the sealing liquid also prevents the cleaning liquid from entering the second space 92b.

The inert gas supplied to the first space 92a from the supply pipe 91 provided in the housing 33 flows into the second space 92b through the communication hole 93 formed in the bracket 31, It flows out from the open end of its upper end. For this reason, since the second space 92b becomes positive pressure by the inert gas, the pressure prevents the cleaning liquid from flowing into the second space 92b.

As described above, if the cleaning liquid is prevented from flowing into the second space 92b, the bearing 29 that rotatably supports the rotating shaft 3 may be corroded early by the cleaning liquid. Disappears. Particularly, when the acidity of the cleaning solution is high, it is very effective to prevent premature corrosion.

On the other hand, when the size of the semiconductor wafer 21 held by the holding member 11 of the rotating table 9 changes,
The rotary table 9 is replaced with a rotary table 9 provided with the holding member 11 at an interval capable of supporting the semiconductor wafer 21 to be changed.

When replacing the rotary table 9, first, the umbrella portion 26b of the lower nozzle body 26 is removed from the central portion 26a. The central portion 26a is set to have a smaller diameter than the through hole 40 formed in the central portion of the rotary table 9. Therefore, even if the umbrella portion 26b of the lower nozzle body 26 covers the screw 9a that fixes the rotary table 9 to the rotary shaft 3,
By removing the umbrella portion 26b from the center portion 26a, the screw 9a can be exposed. Thereby,
The rotary table 9 can be removed from the rotary shaft 3 by loosening the screw 9a.

When the rotary table 9 has been removed, a new rotary table 9 according to the size change may be attached to the rotary shaft 3 in the reverse order of the removal procedure. Even if the rotary table 9 is replaced with one of a different size, the distance A from the center of the rotating shaft 3 shown in FIG. 3 to the locking pin 43 provided at one end of the lever 44 and this locking pin 43 The length of the lever 44 is set such that the ratio of the lever 44 to the rotation center of the holding member 11 is constant.

Thus, the angle at which the holding member 11 is rotated in the lock direction by the spring 54 via the lock cylinder 41 and the angle at which the holding member 11 is rotated in the release direction by the release mechanism 51 can be made constant.

A seal wall 85 is provided around the lower surface of the rotary table 9, and the seal wall 85 is stored in the annular groove 83 in which the liquid L is stored. Is hermetically sealed around the lower surface.

As a result, outside air containing dust is prevented from flowing into the lower cup 75 from the through hole 75a formed in the lower cup 75, so that the cleaned semiconductor wafer 21 is not contaminated. Conversely, it is possible to prevent the cleaning liquid scattered in the lower cup 75 from flowing out from the lower surface side of the rotary table 9 to the outside through the through hole 75a. Therefore, the cleaning liquid is a chemical having a high acidity. It is effective in the case.

In the spin cleaning apparatus, the cleaning liquid adhered to the semiconductor wafer 21 can be dried by rotating the cleaned semiconductor wafer 21 at a high speed. During the drying process, the peripheral portion of the lower surface of the rotary table 9 is sealed as described above, so that the outside air is prevented from flowing into the lower cup 75 even during the drying.
Therefore, it is possible to prevent dust contained in the outside air from adhering to the semiconductor wafer 21 even during the drying process.

[0071]

As described above, according to the first aspect of the present invention, the fixed shaft is housed inside the rotary shaft for driving the rotary table to rotate, and the fixed shaft is held on the rotary table. A nozzle body having a nozzle hole for spraying a cleaning liquid was provided on the back surface of the work.

Therefore, the cleaning liquid sprayed from the nozzle holes reaches the back surface of the work without being interrupted by the rotating table rotating at a high speed, so that the back surface of the work is efficiently and reliably cleaned. be able to. Moreover, since the cleaning liquid does not collide with the rotating table, it is possible to prevent the cleaning liquid from scattering around.

According to a second aspect of the present invention, a nozzle body for covering a gap between the fixed shaft and the rotating shaft is provided at the upper end of the fixed shaft, and the nozzle body has a nozzle hole for spraying a cleaning liquid toward the lower surface of the work. Formed.

As a result, the cleaning liquid sprayed from the nozzle hole and reflected on the back surface of the work can be prevented from entering the gap between the fixed shaft and the rotary shaft by the nozzle body, and the rotary shaft is rotated by the cleaning liquid. The freely supported bearing is prevented from being damaged early, and the rotating shaft and the fixed shaft are prevented from being corroded early.

According to a third aspect of the present invention, an inert gas is supplied to a gap between the fixed shaft and the rotating shaft, and the gap is maintained at a positive pressure. Therefore, it is possible to prevent the cleaning liquid from entering the gap between the fixed shaft and the rotating shaft due to the pressure of the inert gas.

[Brief description of the drawings]

FIG. 1 is an enlarged sectional view of a main part showing one embodiment of the present invention.

FIG. 2 is an overall configuration diagram of the spin cleaning apparatus.

FIG. 3 is an explanatory view of a work holding structure.

FIG. 4 is a side view of the release mechanism.

FIG. 5 is a plan view of the release mechanism.

FIGS. 6A and 6B are explanatory views of a conventional spin cleaning apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 3 ... Rotating shaft, 6 ... Step motor (drive means) 9 ... Rotary table 11 ... Holding member (holding means) 21 ... Semiconductor wafer (work) 26 ... Nozzle body 27 ... Nozzle hole 31 ... Bracket (fixed) 33) Housing (fixed shaft) 91 ... Supply pipe (supply means)

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21 / 304,21 / 68 B08B 3/02

Claims (3)

(57) [Claims] 1. A spin cleaning apparatus for cleaning a rotating work by injecting a cleaning liquid into the work. A fixed shaft, a fixed shaft accommodated therein, and rotation with respect to the fixed shaft. A rotating shaft freely provided; a driving means for driving the rotating shaft to rotate; a rotating table provided on the upper portion of the rotating shaft; and a rotatably provided on the rotating table at predetermined intervals in a circumferential direction.
And a plurality of holding members provided on an upper end surface of the holding member and around a lower surface of the work.
Support pin for supporting the part and taller than this support pin
Lock pin provided eccentrically from the rotation center of the holding member
And a spring rotatably provided outside the rotation shaft.
The holding member is rotated by being urged in the
The upper surface of the work whose lower surface is supported by the support pin
A lock cylinder for contacting the lock pin, and rotating the lock cylinder against the urging force of the spring.
Release the lock state of the work by the lock pin.
And removing means, word held in said holding means provided on the stationary shaft - spin cleaning apparatus characterized by comprising a nozzle body having a nozzle hole for injecting a cleaning liquid toward the lower surface of the click. 2. The spin according to claim 1, wherein the nozzle body is provided at an upper end of the fixed shaft and is set to have a size to cover a gap between the fixed shaft and the rotating shaft. Cleaning equipment. 3. The fixed shaft is provided with a supply means for supplying an inert gas for making the gap a positive pressure in a gap between the fixed shaft and the rotating shaft. Item 6. A spin cleaning apparatus according to Item 1.