JP3046148B2 - Electronic component storage package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a package for accommodating electronic components such as semiconductor elements and quartz oscillators.

[0002]

2. Description of the Related Art Conventionally, a package for accommodating an electronic component, for example, a piezoelectric vibrator for obtaining a predetermined vibration frequency, is generally made of an electrically insulating material such as alumina ceramics as shown in FIG. A rectangular insulating base 21 having a metallized wiring layer 22 made of a refractory metal powder such as tungsten, molybdenum, manganese or the like derived from the top surface to the bottom surface, and attached to a part of the metallized wiring layer 22 via a conductive adhesive. And a holder 23 for holding the piezoelectric vibrator 25 and connecting the electrodes of the piezoelectric vibrator 25 to an external electric circuit, and a bowl-shaped lid also made of an electrically insulating material.
24, and a piezoelectric vibrator 25 on a holding bracket 23.
Is bonded and held via a conductive adhesive such as polyimide, and each electrode of the piezoelectric vibrator 25 is electrically connected to the holding fitting 23.After that, the lid 24 is attached to the upper surface of the insulating base 21 by soldering or the like. The piezoelectric vibrator 25 is joined as a sealing material 26 made of a brazing material, and the piezoelectric vibrator 25 is hermetically sealed in a container including the insulating base 21 and the lid 24, thereby forming a piezoelectric vibrating element as a final product.

In the electronic component housing package, rectangular annular metallized metal layers 27 and 28 made of a refractory metal powder such as tungsten or molybdenum are previously provided on the outer peripheral portion of the upper surface of the insulating base 21 and the outer peripheral portion of the lower surface of the lid 24. Each of the metallized metal layers 27 and 28 is adhered to each other and joined by a sealing material 26 made of a brazing material such as solder to form a lid 24 on an insulating base.
21 will be joined.

In order to improve the workability of the lid 24, the brazing material such as solder as a sealing material 26 is applied to a metallized metal layer 28 attached to the lid 24 in order to improve the workability. The cover 24 is placed in advance on the metallized metal layer 27 of the insulating base 21 with the sealing member 26 interposed therebetween, and then the cover 24 is fixed to the insulating base 21 side. This is performed by applying pressure to the sealing material 26 and applying a temperature of about 300 to 350 ° C. to heat and melt the sealing material 26.

[0005]

However, in this conventional package for housing electronic components, the alumina ceramics constituting the insulating base 21 and the lid 24 has poor wettability with respect to a brazing material such as solder. Also, since the line width of the metallized metal layers 27 and 28 applied to the lid 24 is substantially the same over the entire circumference, etc., the piezoelectric vibrator 25 is hermetically sealed inside the container composed of the insulating base 21 and the lid 24. When stopping, the lid 24
When the brazing material as the sealing material 26 is heated and melted while pressing the insulating material 21 against the insulating base 21, the molten sealing material 26 is pushed to the corners of the insulating base 21 and the lid 24 by the pressing force of the lid 24, and a large amount of And a part thereof protrudes to the outside to form a spherical projection 29 as shown in FIG. 4, which falls on the external electric circuit board when the piezoelectric vibrating element is mounted on the external electric circuit board. This has the disadvantage that the wiring conductors of the external electric circuit board are short-circuited.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks, and has as its object that a solder or other brazing material as a sealing material protrudes out of the insulating base and the lid as spherical projections. Effectively, the protrusions fall on the external electric circuit board,
An object of the present invention is to provide an electronic component housing package that can eliminate short circuit of a wiring conductor of an external electric circuit board.

[0007]

According to the present invention, there is provided a rectangular insulating substrate having a rectangular annular metal layer adhered to an outer peripheral portion of an upper surface, and a rectangular insulating substrate having a rectangular annular metallic layer adhered to an outer peripheral portion of a lower surface. An electronic component housing package comprising a lid, wherein the metal layers of the insulating substrate and the lid are joined via a sealing material made of a brazing material so that the electronic components are hermetically accommodated inside. Wherein the line width of the corners of the rectangular annular metal layer attached to at least one of the insulating substrate and the lid is set to 50.0 to 95.0% with respect to the line width of the straight part toward the outside of the corners. Is what you do.

[0008]

According to the electronic component storage package of the present invention,
The line width at the corners of the rectangular annular metal layer attached to at least one of the rectangular insulating base and the lid is 50.0% of the line width of the linear portion.
When the lid is joined to the insulating base, a large amount of brazing material such as solder as a sealing material does not collect at the corners of the insulating base and the lid, and as a result, the sealing material Does not protrude from the corners of the insulating base and the lid, and does not protrude as a spherical projection.

[0009]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIGS. 1 and 2 show an embodiment in which the electronic component housing package of the present invention is applied to a package housing a piezoelectric vibrator, wherein 1 is an insulating base and 2 is a lid. The insulating base 1 and the lid 2 constitute a container 4 for housing the piezoelectric vibrator 3.

The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, and for example, an aluminum oxide sintered body. If it is composed of alumina (Al ₂
O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia
A raw material powder such as (MgO) is mixed with a suitable binder and an organic solvent to form a slurry, which is then formed into a ceramic green sheet (ceramic green sheet) using a conventionally known doctor blade method, calender roll method, or the like. It is manufactured by subjecting it to suitable punching, laminating a plurality of layers, and firing at a high temperature (about 1600 ° C.).

A metallized wiring layer 6 extending from the upper surface to the lower surface through a through hole 5 is formed on the insulating substrate 1.
1 A holding member 7 for holding the piezoelectric vibrator 3 is attached to the upper surface via a conductive adhesive, and the lower surface of the insulating base 1 is attached to an external electric circuit board via a conductive adhesive such as solder. Connected.

The metallized wiring layer 6 is made of a high melting point metal powder such as tungsten, molybdenum, manganese, etc., and insulates a metal paste obtained by adding a suitable binder and an organic solvent to the high melting point metal powder such as tungsten. The ceramic green sheet serving as the base 1 is coated and applied in advance by a well-known screen printing method so as to be led out from the upper surface of the insulating base 1 to the lower surface through the through hole 5.

The metallized wiring layer 6 may be formed by plating a metal having good conductivity and excellent corrosion resistance, such as nickel or gold, to a thickness of 1.0 to 20.0 μm by plating. 6 can be effectively prevented from being oxidized and corroded. Accordingly, it is preferable that nickel, gold, or the like be applied to the surface of the metallized wiring layer 6 to a thickness of 1.0 to 20.0 μm in order to prevent the metallized wiring layer 6 from being oxidized and corroded.

A holding member 7 is attached to the metallized wiring layer 6 on the upper surface of the insulating base 1 via a conductive adhesive such as a conductive polyimide. The piezoelectric vibrator 3 is bonded and held through a conductive adhesive such as the above so that its electrode is electrically connected to the holding member 7.

The holding member 7 functions to hold the piezoelectric vibrator 3 and to electrically connect the electrodes of the piezoelectric vibrator 3 to the metallized wiring layer 6, and for example, nickel silver (Cu-Zn-Ni alloy) or Kovar metal (Fe-Ni-Co alloy), 42 alloy (Fe-Ni
(Alloy).

The holding member 7 is manufactured in a predetermined shape by using a conventionally known metal working method such as punching and bending a plate material such as nickel-white.

A rectangular annular metallized metal layer 8 is adhered to the outer peripheral portion of the upper surface of the insulating base 1, and a bowl-shaped lid 2 is formed on the metallized metal layer 8 by sealing a brazing material such as solder. It is joined through a stopper 10, thereby forming the insulating base 1.
A piezoelectric vibrator 3 is hermetically sealed inside a container 4 composed of a cover 4 and a cover 2.

The metallized metal layer 8 attached to the outer peripheral portion of the upper surface of the insulating base 1 is made of a high melting point metal powder such as tungsten, molybdenum, manganese, etc. Is added to a ceramic green sheet serving as the insulating substrate 1 in advance by a thick film method such as a conventionally known screen printing method.
1 is attached to the outer periphery of the upper surface in a square ring shape.

The rectangular metallized metal layer 8 is thinner than the line width of the straight part so that the line width at the corner becomes narrower toward the outside of the corner. Therefore when joining the lid 2 on the insulating substrate 1, an insulating brazing material such as solder is I transfer the metallized metal layer 8 as the sealing material 10 substrate 1 and the lid 2
Of the sealing material 10
Protrudes from the corners of the insulating substrate 1 and the lid 2 and does not project as spherical projections. Since the outer periphery of the metallized metal layer 8 has the same square shape as that of the related art, the insulating substrate 1 and the lid 2 can be hermetically and firmly joined to each other. can do.

When the metallized metal layer 8 has a line width of less than 50.0% with respect to the line width of the linear portion, when the cover 2 is joined to the insulating base 1, the insulating base 1 and the cover 2 The sealing material 10 does not sufficiently penetrate into the corners of the container 4, which greatly reduces the reliability of hermetic sealing of the container 4,
When the cover 2 is over, when the lid 2 is joined to the insulating base 1, a sealing material
10 connects the metallized metal layer 8 to the insulating base 1 and the lid 2
And a large amount of protrusions protrude from the corners of the insulating base 1 and the lid 2 and form spherical projections. Accordingly, the metallized wiring layer 8 is specified to have a corner line width of 50.0 to 95.0% of the line width of the straight line portion.

When the metallized metal layer 8 is coated with a brazing material such as nickel or gold and a metal having good wettability to a thickness of 1.0 to 20.0 μm by plating, the cover 2 is attached to the insulating base 1. When the container 4 is joined via the sealing material 10 to hermetically seal the container 4, the joining between the metallized metal layer 8 adhered to the insulating base 1 and the sealing material 10 becomes strong and the container 4 is air-tightly sealed. The reliability of stopping is greatly improved. Therefore, it is preferable that a metal having good wettability with a brazing material such as nickel or gold is applied to the surface of the metallized metal layer 8 by plating to a thickness of 1.0 to 20.0 μm.

Further, on the metallized metal layer 8 attached to the outer peripheral portion of the upper surface of the insulating base 1, a bowl-shaped lid 2 is provided with a sealing material 10.
Through which the container 4 composed of the insulating base 1 and the lid 2 is hermetically sealed.

The lid 2 is made of an aluminum oxide sintered body,
It is made of an electrical insulating material such as a mullite-based sintered body, an aluminum nitride-based sintered body, and a silicon carbide-based sintered body. For example, in the case of an aluminum oxide-based sintered body, alumina, silica,
A material obtained by adding an appropriate binder and an organic solvent to raw material powders such as calcia and magnesia is filled into a press mold having a predetermined shape and molded by applying a constant pressure. It is manufactured by firing at a temperature of ° C.

On the outer peripheral portion of the lower surface of the lid 2, a rectangular annular metallized metal layer 9 is adhered. The metallized metal layer 9 is attached to the metallized metal layer 8 on the upper surface of the insulating substrate 1 by a sealing material 10. The lid 2 is joined to the upper surface of the insulating base 1 by joining them together.

The metallized metal layer 9 attached to the lid 2 is made of a metal such as silver-palladium. A metal paste obtained by adding a glass frit, a binder, and an organic solvent to silver and palladium powders is used. The lower peripheral part of the lid 2 is printed and applied by a conventionally known thick film method such as a screen printing method, and is baked at a temperature of about 1000 ° C. to be adhered in a square annular shape on the lower peripheral part of the lid 2. .

Further, on the surface of the metallized metal layer 9, a sealing material 10 made of a brazing material such as solder is previously adhered and joined in order to improve workability in joining the lid 2 to the insulating base 1. The sealing material 10 made of the brazing material is printed and coated with a solder paste obtained by adding and mixing a suitable binder and an organic solvent to the solder powder on the metallized metal layer 9 by a conventionally known screen printing method. By heating and melting at a temperature of about 350 ° C., it is adhered and bonded to the surface of the metallized metal layer 9.

Thus, according to the electronic component housing package of the present invention, the piezoelectric vibrator 3 is adhered and fixed to the holding member 7 attached to the insulating base 1 with a conductive adhesive, and is adhered to the upper surface of the insulating base 1. Metallized metal layer 8 with lid 2
A metallized metal layer 9 adhered to the lower surface of the substrate 2 is joined via a sealing material 10 made of a brazing material such as solder previously adhered to the lid 2 to form an insulating base 1 and a lid 2. By sealing the piezoelectric vibrator 3 inside the container 4 in an airtight manner, a piezoelectric vibrating element as a product is obtained.

It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. In the metallized metal layer 8 adhered to the outer peripheral portion of the upper surface, the line width of the corner was narrower than the line width of the linear portion, but the line width of the corner of the metallized metal layer 9 adhered to the lid 2 was changed to the linear portion. The line width at the corners of the metallized metal layers 8, 9 attached to each of the insulating base 1 and the lid 2 may be smaller than the line width of the linear portion.

In the above-described embodiment, the electronic component housing package for housing the piezoelectric vibrator is used. However, an electronic component housing package for housing an integrated circuit element or a surface acoustic wave filter may be used.

[0030]

According to the electronic component housing package of the present invention, the line width of the corner of the rectangular annular metal layer attached to at least one of the rectangular insulating substrate and the lid is straightened toward the outside of the corner. When the lid is joined to the insulating substrate, a brazing material such as solder is used to seal the rectangular annular metal layer adhered to the insulating substrate or the lid when the lid is joined to the insulating substrate. As a result, it does not gather in large amounts at the corners of the insulating substrate and the lid,
As a result, the sealing material does not protrude from the corners of the insulating substrate and the lid, and does not protrude as a spherical projection. Therefore, in this electronic component storage package, when the piezoelectric vibrating element is mounted on the external electric circuit board, the projection made of the spherical sealing material falls on the external electric circuit board and short-circuits between the wiring conductors. Is gone. In addition, the insulating substrate and the lid can be hermetically and firmly joined to each other by the rectangular annular metal layer having a rectangular outer periphery, and a highly reliable hermetically sealed electronic component housing package can be obtained.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment in which the present invention is applied to an electronic component housing package for housing a piezoelectric vibrator.

FIG. 2 is a sectional view of the package shown in FIG. 1;

FIG. 3 is an exploded perspective view of a conventional electronic component storage package.

FIG. 4 is a perspective view of an electronic component using a conventional electronic component storage package.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Insulating base 2 ... Lid 3 ... Piezoelectric vibrator 4 ... Container 8 ... Square annular metallized metal layer 9 attached to the insulating base 9 ...・ Square annular metallized metal layer attached to lid 10 ・ ・ Sealant

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 23 / 02,23 / 12

Claims (1)

(57) [Claims] 1. An insulating substrate comprising: a rectangular insulating substrate having a rectangular annular metal layer adhered to an outer peripheral portion of an upper surface; and a rectangular lid having a rectangular annular metallic layer adhered to an outer peripheral portion of a lower surface. An electronic component storage package in which electronic components are hermetically stored therein by joining respective metal layers of a substrate and a lid via a sealing material made of a brazing material, wherein the insulating substrate or the lid is provided. The rectangular annular metal layer attached to at least one of the
Te, electronic component storing package, characterized in that the line width of the corner portion of said shaped annular metal layer was 50.0 to 95.0% with respect to the line width of the straight line portion.