JP3046437B2 - Circuit board - Google Patents
Circuit boardInfo
- Publication number
- JP3046437B2 JP3046437B2 JP3357061A JP35706191A JP3046437B2 JP 3046437 B2 JP3046437 B2 JP 3046437B2 JP 3357061 A JP3357061 A JP 3357061A JP 35706191 A JP35706191 A JP 35706191A JP 3046437 B2 JP3046437 B2 JP 3046437B2
- Authority
- JP
- Japan
- Prior art keywords
- foil
- aluminum alloy
- copper
- aluminum
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000838 Al alloy Inorganic materials 0.000 claims description 72
- 239000011888 foil Substances 0.000 claims description 62
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 50
- 229910052802 copper Inorganic materials 0.000 claims description 37
- 239000010949 copper Substances 0.000 claims description 37
- 239000002131 composite material Substances 0.000 claims description 25
- 239000011889 copper foil Substances 0.000 claims description 17
- 229910045601 alloy Inorganic materials 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 14
- 238000010030 laminating Methods 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 24
- 238000005530 etching Methods 0.000 description 15
- 239000000758 substrate Substances 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 238000004458 analytical method Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910000881 Cu alloy Inorganic materials 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000003513 alkali Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000002952 polymeric resin Substances 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 229910001295 No alloy Inorganic materials 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、アルミニウム合金箔、
銅箔及びアルミニウム合金箔を順に積層した圧延複合箔
を積層してなる回路基板に関し、特にエッチング性が良
好である電気機器、通信機、自動車等に用いられる回路
用基板に関する。The present invention relates to an aluminum alloy foil,
The present invention relates to a circuit board formed by laminating a rolled composite foil in which a copper foil and an aluminum alloy foil are sequentially laminated, and more particularly to a circuit board used for an electric device, a communication device, an automobile and the like, which has good etching properties.
【０００２】[0002]
【従来の技術】従来、回路基板に用いられているアルミ
ニウムワイヤーボンディング可能なアルミニウム合金と
銅の複合箔としては、アルミニウム合金箔に銅をメッキ
したもの（特開昭５６−１４６８６６号）、銅箔にアル
ミニウム蒸着メッキしたもの（特開昭５１−２８６６２
号）、圧延法によりアルミニウムと銅を圧着したもの及
びアルミニウム箔に銅メッキを行った箔にアルミニウム
箔を順に積層したもの（特開昭６４−２５５５４号）な
どがある。ここで言うアルミニウム合金とはＪＩＳ規格
アルミニウム合金展伸材であるアルミニウム及びアルミ
ニウム合金を言う。2. Description of the Related Art Conventionally, as a composite foil of an aluminum alloy and copper capable of being subjected to aluminum wire bonding and used for a circuit board, an aluminum alloy foil plated with copper (Japanese Patent Application Laid-Open No. 56-146866), a copper foil Coated with aluminum by evaporation (Japanese Patent Laid-Open No. 51-28662)
No.), one obtained by pressing aluminum and copper by a rolling method, and one obtained by sequentially laminating an aluminum foil on a foil obtained by plating an aluminum foil with copper (Japanese Patent Application Laid-Open No. 64-25554). The aluminum alloy mentioned here refers to aluminum and aluminum alloy which are wrought JIS standard aluminum alloy.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上述し
た従来の複合箔はそれぞれ以下のような問題点を有して
いた。すなわち、メッキ法によるアルミニウム合金−
銅クラッド箔は、メッキされる金属の厚さが厚くなると
厚さの均一性が悪くなり、メッキされる金属厚さが制限
され、かつコストが高くなる。However, each of the above-mentioned conventional composite foils has the following problems. That is, aluminum alloy by plating method
As the thickness of the metal to be plated increases, the uniformity of the thickness of the copper clad foil deteriorates, the thickness of the metal to be plated is limited, and the cost increases.
【０００４】また、圧延法によるアルミニウム合金箔
と銅箔の複合箔は、すべて図２に示すようにアルミニウ
ム合金箔３と銅箔４の界面に、機械的な結合によるアル
ミニウム合金と銅からなる合金層５が存在し、導電回路
を形成する際のエッチング性を阻害する大きな要因とな
っていた。そして、合金層５が介在しない複合箔は従来
得られなかった。As shown in FIG. 2, the composite foil of the aluminum alloy foil and the copper foil formed by the rolling method is provided at the interface between the aluminum alloy foil 3 and the copper foil 4 at the interface between the aluminum alloy and the copper by mechanical bonding. The presence of the layer 5 was a major factor that hindered the etching properties when forming a conductive circuit. And the composite foil which does not intervene the alloy layer 5 was not obtained conventionally.
【０００５】さらに、この複合箔は銅面を絶縁層上に
積層する場合、接着力を良好にするために銅面にクロム
メッキ、銅メッキ及びニッケルメッキ等を施さなければ
ならずコストが高くなる。Further, when a copper surface is laminated on an insulating layer, this composite foil must be plated with chromium, copper, nickel, etc. on the copper surface in order to improve the adhesive strength, which increases the cost. .
【０００６】また、この複合箔のアルミニウム合金面
を絶縁層上に積層した場合は、接着力は良好であるが、
銅箔部を銅エッチングして除去して形成されるアルミワ
イヤ−ボンディングが行われるアルミニウム合金面は、
アルミニウム合金と銅との界面に上述した合金層５が存
在するため、エッチング時間がかかること及び合金層を
溶解除去した後、アルミニウム合金面の表面が平滑でな
く表面粗さが大きくなり、ワイヤ−ボンディング強度が
低下してしまう。When the aluminum alloy surface of the composite foil is laminated on the insulating layer, the adhesive strength is good,
The aluminum alloy surface on which the aluminum wire formed by removing the copper foil portion by copper etching and bonding is performed,
Since the above-mentioned alloy layer 5 is present at the interface between the aluminum alloy and copper, it takes a long time to etch, and after dissolving and removing the alloy layer, the surface of the aluminum alloy surface is not smooth and the surface roughness becomes large, so that the wire- The bonding strength is reduced.
【０００７】本発明はかかる問題点に鑑みてなされたも
のであって、アルミニウム合金箔と銅箔の間にアルミニ
ウム合金と銅の合金層を介在しない、アルミニウム合金
箔、銅箔及びアルミニウム合金箔の順で構成された構造
の圧延複合箔を用いることによって、前記問題点を解決
することができることを見出し、本発明を完成するに至
った。すなわち、本発明の目的はエッチング性が良好で
あり、エッチングにより形成された回路の、ワイヤ−ボ
ンディングがおこなわれるアルミニウム合金面が平滑で
あり、従ってアルミニウムボンディング強度を低下させ
ることなく、かつ各箔の肉厚を均一にすることができ、
絶縁層と複合箔の接着強度が良好な回路基板を提供する
ことにある。The present invention has been made in view of the above-mentioned problems, and has been made in consideration of an aluminum alloy foil, a copper foil, and an aluminum alloy foil without an aluminum alloy-copper alloy layer between the aluminum alloy foil and the copper foil. It has been found that the above problem can be solved by using a rolled composite foil having a structure constituted in this order, and the present invention has been completed. That is, the object of the present invention is that the etching property is good, the aluminum alloy surface of the circuit formed by etching, on which the wire-bonding is performed, is smooth, so that the aluminum bonding strength is not reduced, and The wall thickness can be made uniform,
An object of the present invention is to provide a circuit board having good adhesive strength between an insulating layer and a composite foil.
【０００８】[0008]
【課題を解決する手段】本発明の回路基板はアルミニウ
ム合金箔と銅箔との界面にアルミニウム合金と銅からな
る合金層が介在しないで、アルミニウム合金箔、銅箔及
びアルミニウム合金箔の順で形成された圧延複合箔を金
属基板上に絶縁層を介して積層してなることを特徴とす
るものである。The circuit board of the present invention is formed in the order of an aluminum alloy foil, a copper foil and an aluminum alloy foil without an intervening alloy layer made of an aluminum alloy and copper at the interface between the aluminum alloy foil and the copper foil. The rolled composite foil thus obtained is laminated on a metal substrate via an insulating layer.
【０００９】以下、図面により本発明を詳細に説明す
る。本発明の回路基板は図１に示すように、金属基板１
の上に絶縁層２を積層し、絶縁層２の面にアルミニウム
合金箔３がくるようにアルミニウム合金箔３と銅箔４と
アルミニウム合金箔３を積層した複合箔６を積層したも
のである。そして、この複合箔はアルミニウム合金箔３
と銅合金箔４の界面にアルミニウム合金と銅からなる合
金層が介在していないことを特徴とするものである。Hereinafter, the present invention will be described in detail with reference to the drawings. As shown in FIG. 1, a circuit board according to the present invention
And a composite foil 6 in which an aluminum alloy foil 3, a copper foil 4, and an aluminum alloy foil 3 are stacked such that the aluminum alloy foil 3 is on the surface of the insulating layer 2. And this composite foil is aluminum alloy foil 3
And an alloy layer composed of an aluminum alloy and copper is not interposed at the interface between the aluminum alloy and the copper alloy foil 4.
【００１０】ここでいうアルミニウム合金と銅の合金層
が介在しないということは、ＸＭＡ分析によりアルミニ
ウム合金と銅の合金層が認められないことを意味する。
アルミニウム合金と銅の合金層とはアルミニウムと銅を
主成分とし、上述したＪＩＳ規格のアルミニウム合金中
に含まれる金属を含有する場合もある。このような合金
層が介在しない複合圧延箔は圧延ロールの温度と圧力を
調整することによってつくられる。本発明に用いる金属
基板１としては、良熱伝導性をもつ一般に肉厚が０．５
〜３．０ｍｍであるアルミニウム及びアルミニウム合
金、銅、鉄、鉄ーニッケル合金、銅ーインバー合金等が
用いられる。The absence of the aluminum alloy / copper alloy layer means that no aluminum alloy / copper alloy layer is recognized by XMA analysis.
The aluminum alloy and copper alloy layer contains aluminum and copper as main components, and may contain a metal contained in the above-mentioned JIS standard aluminum alloy. Such a composite rolled foil in which no alloy layer is interposed is produced by adjusting the temperature and pressure of the roll. The metal substrate 1 used in the present invention generally has a good thermal conductivity and a thickness of 0.5.
Aluminum and aluminum alloys, copper, iron, iron-nickel alloys, copper-invar alloys and the like having a thickness of up to 3.0 mm are used.
【００１１】また、絶縁層２としては、各種セラミッ
ク、無機粉体を含有する高分子樹脂絶縁層、ガラス繊維
を含有する高分子樹脂層及び耐熱性高分子樹脂絶縁層を
用い、その肉厚は絶縁層不良を生じない程度であれば、
特に制限はなく、２０μｍ以上が一般に使用されてい
る。絶縁層２に用いられる粉体としては、アルミナ、ベ
リリア、ボロンナイトライド、マグネシア及びシリカ等
が好ましく、高分子樹脂としてはエポキシ樹脂、フェノ
ール樹脂及びポリイミド樹脂が好ましい。As the insulating layer 2, a polymer resin insulating layer containing various ceramics and inorganic powders, a polymer resin layer containing glass fiber, and a heat-resistant polymer resin insulating layer are used. If it does not cause insulation layer failure,
There is no particular limitation, and a thickness of 20 μm or more is generally used. The powder used for the insulating layer 2 is preferably alumina, beryllia, boron nitride, magnesia, silica, or the like, and the polymer resin is preferably an epoxy resin, a phenol resin, or a polyimide resin.
【００１２】さらに本発明に用いる圧延法によるアルミ
ニウム合金−銅−アルミニウム合金複合箔６は、エッチ
ングにより回路配線パターンを形成するが、該複合箔６
は、アルミニウム合金と銅の界面にアルミニウム合金と
銅からなる合金層が介在すると、エッチング性を非常に
低下させるため、アルミニウム合金と銅からなる合金層
を有していてはいけない。該複合箔の界面にアルミニウ
ム合金と銅からなる合金を含有しているかどうかはその
断面をＸＭＡ分析により元素分析を行うことにより、確
認することができる。The aluminum alloy-copper-aluminum alloy composite foil 6 formed by the rolling method used in the present invention forms a circuit wiring pattern by etching.
When an alloy layer made of an aluminum alloy and copper is interposed at the interface between an aluminum alloy and copper, the etching property is greatly reduced. Therefore, an alloy layer made of an aluminum alloy and copper must not be provided. Whether or not the interface of the composite foil contains an alloy composed of an aluminum alloy and copper can be confirmed by performing elemental analysis on the cross section by XMA analysis.
【００１３】そして、複合箔６の各箔部の厚さは、例え
ば、微細回路用途では、導電回路を形成するエッチング
時にサイドエッチによる回路パターン寸法精度が低下し
ないように、銅箔は１から１０μｍ、アルミニウム合金
箔は１から１０μｍが好ましい。又、大電流用途では銅
箔は１０μｍ以上であれば、上限については制限がない
が、通常の回路基板においては１５００μｍが限度であ
る。また、同様にアルミニウム合金箔厚さは１０μｍ以
上であれば上限については制限がないが、通常の回路基
板においてはコスト的には１００μｍ程度であり、それ
以上の厚さではコスト的に不利である。The thickness of each foil portion of the composite foil 6 is, for example, 1 to 10 μm for a fine circuit so that the copper foil has a thickness of 1 to 10 μm so that the dimensional accuracy of the circuit pattern due to side etching does not decrease during etching for forming a conductive circuit. The thickness of the aluminum alloy foil is preferably 1 to 10 μm. For large current applications, the upper limit is not limited as long as the thickness of the copper foil is 10 μm or more, but is 1500 μm in a normal circuit board. Similarly, the upper limit is not limited as long as the thickness of the aluminum alloy foil is 10 μm or more, but the cost is about 100 μm in a normal circuit board, and the thickness more than that is disadvantageous in cost. .
【００１４】また、前記複合箔のアルミニウム合金とし
ては、Ｓｉを０．０５〜１５％、Ｍｇを０．０１〜５．
０％、Ｍｎを０．０１〜２．０％、Ｚｎを０．０２〜
８．０％の範囲を含有するものが好ましいが、その他の
成分を含んだものでもよく、ＪＩＳ規格アルミニウム合
金展伸材のアルミニウム及びアルミニウム合金はすべて
使用可能である。Further, as the aluminum alloy of the composite foil, 0.05 to 15% of Si and 0.01 to 5% of Mg are used.
0%, Mn 0.01 to 2.0%, Zn 0.02 to
The one containing 8.0% is preferable, but the one containing other components may be used, and all aluminum and aluminum alloy of JIS standard aluminum alloy wrought material can be used.
【００１５】[0015]
【実施例】以下、実施例について具体的に説明する。EXAMPLES Examples will be specifically described below.
【００１６】（実施例１）３．０ｍｍ厚さのアルミニウ
ム板上に、アルミニウム合金と銅の界面にＸＭＡ分析に
より、アルミニウム合金と銅からなる合金層が認められ
ないアルミニウム合金（５μｍ）−銅（１０μｍ）−ア
ルミニウム合金（５μｍ）からなる圧延複合箔を無機物
を充填したエポキシ樹脂により接着して基板を作成し
た。この基板の箔面と絶縁材の接合面の箔引き剥がし強
度をＪＩＳ規格Ｃ６４８６で測定した結果、２．２Ｋｇ
／ｃｍであった。(Example 1) On an aluminum plate having a thickness of 3.0 mm, an aluminum alloy (5 μm) -copper (with no alloy layer composed of aluminum alloy and copper observed at the interface between the aluminum alloy and copper by XMA analysis) A substrate was prepared by bonding a rolled composite foil made of 10 μm) -aluminum alloy (5 μm) with an epoxy resin filled with an inorganic substance. As a result of measuring the peeling strength of the foil between the foil surface of the substrate and the bonding surface of the insulating material in accordance with JIS standard C6486, 2.2 kg was obtained.
/ Cm.
【００１７】ついで、この基板上に所定の回路を得るた
め感光性レジストを塗布した後、アルカリエッチングに
よりアルミニウム回路パタ−ンを形成した。さらに、硫
酸系エッチング液により選択的に銅回路パターンを形成
し、その後でアルカリエッチングによりアルミニウム回
路パターンを形成した。この時の回路パターン幅は２０
０μｍであり、設計値どうりの回路パターンを得た。
又、ワイヤ−ボンディングが行われるアルミニウム合金
面の平滑度は良好でワイヤ−ボンディング強度も良好で
あった。Then, a photosensitive resist was applied on the substrate to obtain a predetermined circuit, and an aluminum circuit pattern was formed by alkali etching. Further, a copper circuit pattern was selectively formed using a sulfuric acid-based etchant, and then an aluminum circuit pattern was formed by alkali etching. The circuit pattern width at this time is 20
0 μm, and a circuit pattern having a design value was obtained.
Further, the smoothness of the aluminum alloy surface on which the wire bonding was performed was good, and the wire bonding strength was also good.
【００１８】（実施例２）３．０ｍｍ厚さのアルミニウ
ム板に、アルミニウム合金箔と銅箔の界面にＸＭＡ分析
により、アルミニウム合金と銅からなる合金層が認めら
れないアルミニウムと銅からなるアルミニウム合金（４
０μｍ）−銅（８５μｍ）−アルミニウム合金（４０μ
ｍ）からなる圧延複合箔を、無機物を充填したエポキシ
樹脂により接着した基板を作成した。ついで、感光性レ
ジストを印刷して乾燥した後、アルカリエッチングによ
りアルミニウム回路パターンを形成した。硫酸系エッチ
ング液により選択的に銅回路パターンを形成し、その後
アルカリエッチングによりアルミニウム回路パターンを
形成した。この時の回路パターン幅は８００μｍであ
り、設計値どうりの回路パターンを得た。又、ワイヤ−
ボンディングが行われるアルミニウム合金面の平滑度は
良好で、ワイヤ−ボンディング強度も良好であった。Example 2 An aluminum plate having a thickness of 3.0 mm and an aluminum alloy made of aluminum and copper in which no alloy layer made of aluminum alloy and copper was observed at the interface between the aluminum alloy foil and the copper foil by XMA analysis (4
0 μm) -copper (85 μm) -aluminum alloy (40 μm)
A substrate was prepared by bonding the rolled composite foil of m) with an epoxy resin filled with an inorganic substance. Then, after printing and drying the photosensitive resist, an aluminum circuit pattern was formed by alkali etching. A copper circuit pattern was selectively formed using a sulfuric acid-based etchant, and then an aluminum circuit pattern was formed by alkali etching. The circuit pattern width at this time was 800 μm, and a circuit pattern having a design value was obtained. Also, wire
The smoothness of the aluminum alloy surface to be bonded was good, and the wire-bonding strength was also good.
【００１９】（比較例１）実施例２の基板にかえて、圧
延箔の界面にＸＭＡ分析により、アルミニウムと銅から
なる厚さ0.１μm の合金層が認められる従来のアルミニ
ウム合金（４０μｍ）−銅（８５μｍ）−アルミニウム
合金（４０μｍ）からなる圧延複合箔を、無機物を充填
したエポキシ樹脂により接着した基板を作成した。実施
例２と同様の操作により回路パターンを形成したが、ア
ルミニウム回路形成におけるアルカリエッチング時間が
実施例１に比べて約２．５倍の時間を要した。回路パタ
−ンが設計値８００μm に対し約１００μm 細くなっ
た。(Comparative Example 1) Instead of the substrate of Example 2, a conventional aluminum alloy (40 μm) in which an alloy layer made of aluminum and copper having a thickness of 0.1 μm was recognized at the interface of the rolled foil by XMA analysis. A substrate was prepared by bonding a rolled composite foil made of copper (85 μm) -aluminum alloy (40 μm) with an epoxy resin filled with an inorganic substance. A circuit pattern was formed in the same manner as in Example 2. However, an alkali etching time for forming an aluminum circuit was about 2.5 times as long as that in Example 1. The circuit pattern became thinner by about 100 μm than the designed value of 800 μm.
【００２０】（比較例２）箔と無機物を充填したエポキ
シ樹脂からなる絶縁層の接着強度を比較するために以下
に示す基板を作成してその強度をＪＩＳＣ６４８６規格
に従って測定し比較した。すなわち、３．０ｍｍ厚さの
アルミニウム板に、アルミニウム合金と銅の界面にＸＭ
Ａ分析により、アルミニウムと銅からなる合金層の認め
られない、アルミニウム合金（２０μｍ）−銅（８５μ
ｍ）−アルミニウム合金（２０μｍ）からなる圧延複合
箔を無機物を充填したエポキシ樹脂により接着した基板
と、３．０ｍｍ厚さのアルミニウム板に、従来のアルミ
ニウム合金（４０μｍ）−銅（８５μｍ）からなる圧延
複合箔の銅面側を、無機物を充填したエポキシ樹脂によ
り接合した基板の箔引き剥し強度をＪＩＳ規格Ｃ６４８
６で測定した結果、前者は２．２kg/cm、後者は１．２k
g/cmであり、従来の箔を用い銅面と絶縁層を接着面とし
た基板の箔引き剥がし強度は低いことが判明した。(Comparative Example 2) In order to compare the adhesive strength between the foil and the insulating layer made of an epoxy resin filled with an inorganic substance, the following substrate was prepared, and the strength was measured and compared in accordance with JIS C 6486 standards. That is, an XM is formed on an aluminum plate having a thickness of 3.0 mm at an interface between an aluminum alloy and copper.
According to A analysis, no aluminum alloy (20 μm) -copper (85 μm) alloy layer consisting of aluminum and copper was observed.
m) -a conventional aluminum alloy (40 μm) -copper (85 μm) on a substrate in which a rolled composite foil made of an aluminum alloy (20 μm) is bonded with an epoxy resin filled with an inorganic material and an aluminum plate having a thickness of 3.0 mm. The foil peeling strength of a substrate in which the copper surface side of a rolled composite foil was joined with an epoxy resin filled with an inorganic substance was measured according to JIS standard C648.
As a result of the measurement at 6, the former was 2.2 kg / cm, and the latter was 1.2 k / cm.
g / cm, and the foil peeling strength of a substrate using a conventional foil and having a copper surface and an insulating layer as an adhesive surface was found to be low.
【００２１】[0021]
【発明の効果】以上のように、本発明の、アルミニウム
合金と銅からなる合金を含有しない、アルミニウム合金
箔、銅箔及びアルミニウム合金箔を順に積層した圧延複
合箔は導電回路を形成する際のエッチング性が良好で、
ワイヤーボンディングが行われるアルミニウム合金面が
平滑で、ワイヤーボンディング強度の高い回路基板が得
られ、電気機器、通信機、自動車等に用いられる回路基
板として有用である。As described above, the rolled composite foil of the present invention, which does not contain an alloy composed of an aluminum alloy and copper, and in which an aluminum alloy foil, a copper foil, and an aluminum alloy foil are laminated in order, is used for forming a conductive circuit. Good etching properties,
A circuit board having a smooth aluminum alloy surface on which wire bonding is performed and having high wire bonding strength can be obtained, and is useful as a circuit board for use in electric devices, communication devices, automobiles, and the like.
【図１】 本願発明の一例を示す回路基板の断面図であ
る。FIG. 1 is a sectional view of a circuit board showing an example of the present invention.
【図２】 従来の回路基板の断面図を示す。FIG. 2 shows a cross-sectional view of a conventional circuit board.
１．金属基板 ２．絶縁層 ３．アルミニウム合金箔 ４．銅箔 ５．アルミニウム合金と銅からなる合金層 ６．アルミニウム合金−銅−アルミニウム合金圧延複合
箔1. Metal substrate 2. 2. Insulating layer Aluminum alloy foil 4. Copper foil 5. 5. Alloy layer made of aluminum alloy and copper Aluminum alloy-copper-aluminum alloy rolled composite foil
フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 1/05 H05K 1/09 Continuation of the front page (58) Field surveyed (Int.Cl. 7 , DB name) H05K 1/05 H05K 1/09
Claims (1)
ルミニウム合金と銅からなる合金層が介在しないで、ア
ルミニウム合金箔、銅箔及びアルミニウム合金箔の順で
形成された圧延複合箔を金属基板上に絶縁層を介して積
層してなることを特徴とする回路基板。1. A rolled composite foil formed of an aluminum alloy foil, a copper foil and an aluminum alloy foil in this order without interposing an alloy layer made of an aluminum alloy and copper at an interface between the aluminum alloy foil and the copper foil. A circuit board formed by laminating an insulating layer on the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3357061A JP3046437B2 (en) | 1991-12-25 | 1991-12-25 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3357061A JP3046437B2 (en) | 1991-12-25 | 1991-12-25 | Circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05175626A JPH05175626A (en) | 1993-07-13 |
| JP3046437B2 true JP3046437B2 (en) | 2000-05-29 |
Family
ID=18452187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3357061A Expired - Lifetime JP3046437B2 (en) | 1991-12-25 | 1991-12-25 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3046437B2 (en) |
-
1991
- 1991-12-25 JP JP3357061A patent/JP3046437B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05175626A (en) | 1993-07-13 |
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