JP3048461B2 - Method for producing grinding wheel for electrolytic dressing containing submicron abrasive grains - Google Patents
Method for producing grinding wheel for electrolytic dressing containing submicron abrasive grainsInfo
- Publication number
- JP3048461B2 JP3048461B2 JP4045673A JP4567392A JP3048461B2 JP 3048461 B2 JP3048461 B2 JP 3048461B2 JP 4045673 A JP4045673 A JP 4045673A JP 4567392 A JP4567392 A JP 4567392A JP 3048461 B2 JP3048461 B2 JP 3048461B2
- Authority
- JP
- Japan
- Prior art keywords
- grindstone
- grinding
- grinding wheel
- powder
- abrasive grains
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Polishing Bodies And Polishing Tools (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、研削・研磨加工に用い
られる砥石に係わり、特に、電解効果によりドレッシン
グする導電性砥石の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grindstone used for grinding and polishing, and more particularly to a method for producing a conductive grindstone which is dressed by an electrolytic effect.
【0002】[0002]
【従来の技術】鋳鉄ファイバボンドダイヤモンド砥石等
の導電性砥石を用い、この砥石に電圧を印加し、砥石を
電解によりドレッシングする導電性砥石の電解ドレッシ
ング方法及び装置が、本願と同一の出願人による特開平
1-188266号( 特願昭63-12305号) に開示され、電子材料
であるシリコン等の半導体材料を鏡面研削することに成
功している。更に、この方法及び装置を発展させた電解
インプロセスドレッシング研削法(Electrolytic Inproc
ess Dressing: 以下 Elid 研削法という) と呼ばれる方
法及び装置が本願出願人により開発され、発表されてい
る( 理研シンボジウム「鏡面研削の最新技術動向」、平
成3年3月5日開催)。2. Description of the Related Art An electrolytic dressing method and apparatus for a conductive grindstone, which uses a conductive grindstone such as a cast iron fiber bond diamond grindstone, applies a voltage to the grindstone and dresses the grindstone by electrolysis, has been disclosed by the same applicant as the present applicant. JP
It is disclosed in Japanese Patent Application No. 1-188266 (Japanese Patent Application No. 63-12305) and succeeded in mirror-polishing semiconductor materials such as silicon as electronic materials. Further, an electrolysis in-process dressing grinding method (Electrolytic Inproc
A method and apparatus referred to as “ess dressing: Elid grinding method” have been developed and published by the applicant of the present invention (RIKEN Cymbodium, “Latest Technology Trend of Mirror Surface Grinding”, held on March 5, 1991).
【0003】この Elid 研削法は、ワークとの接触面を
有する砥石と、接触面に対向する電極と、砥石と電極と
の間に導電性液を流すノズルと、砥石と電極との間に電
圧を印加する電源及び給電体とからなる装置であり、砥
石と電極との間に導電性液を流しながら、砥石と電極と
の間に電圧を印加し、砥石を電解によりドレッシングす
るものである。[0003] The Elid grinding method comprises a grindstone having a contact surface with a workpiece, an electrode facing the contact surface, a nozzle for flowing a conductive liquid between the grindstone and the electrode, and a voltage between the grindstone and the electrode. Is a device comprising a power source and a power supply for applying the voltage, applying a voltage between the grindstone and the electrode while flowing a conductive liquid between the grindstone and the electrode, and dressing the grindstone by electrolysis.
【0004】この Elid 研削法によるドレッシングの機
構を図6に示す。砥石の目立て開始時(A)には、砥石
と電極との間の電気抵抗が少なく比較的大きい電流(5
〜10A)が流れる。これにより、電解効果により砥石
表面の金属部(ボンド)が溶解し、非導電性のダイヤモ
ンド砥粒が突出する。更に、通電を続けると、酸化鉄(F
e2O3)を主とした絶縁被膜が砥石表面に形成され、砥石
の電気抵抗が大きくなる。これにより、電流が低下し、
ボンドの溶解が減り、砥粒の突出(砥石の目立て)が実
質的に終了する(B)。この状態で研削を開始する
(C)と、被膜が研削屑を遊離しつつ、ワークの研削に
つれてダイヤモンド砥粒が摩耗していく。更に研削を続
けると(D)、砥石表面の絶縁被膜が摩耗により除去さ
れ、砥石の電気抵抗が低下し、砥石と電極間の電流が増
大し、ボンドの溶解が増し、砥粒の突出(砥石の目立
て)が再開される。従って、 Elid 研削法による研削中
には、(B)〜(D)のように被膜の形成・除去により
ボンドの過溶出が抑えられ、砥粒の突出(砥石の目立
て)が自動的に調整される。(B)〜(D)に示す上述
したサイクルを以下 Elid サイクルと呼ぶ。FIG. 6 shows a dressing mechanism by the Elid grinding method. At the beginning of sharpening of the grinding wheel (A), the electric resistance between the grinding wheel and the electrode is small and a relatively large current (5
-10A) flows. As a result, the metal part (bond) on the surface of the grindstone is dissolved by the electrolytic effect, and the non-conductive diamond abrasive grains protrude. In addition, when energization is continued, iron oxide (F
An insulating film mainly composed of e 2 O 3 ) is formed on the grindstone surface, and the electric resistance of the grindstone increases. This reduces the current,
Dissolution of the bond is reduced, and the protrusion of the abrasive grains (sharpening of the grinding stone) is substantially completed (B). When the grinding is started in this state (C), the diamond abrasive grains are worn as the workpiece is ground while the coating releases grinding dust. When grinding is further continued (D), the insulating coating on the grindstone surface is removed by abrasion, the electric resistance of the grindstone decreases, the current between the grindstone and the electrode increases, the dissolution of the bond increases, and the protrusion of the abrasive grains (grindstone) ) Is resumed. Therefore, during the grinding by the Elid grinding method, the overelution of the bond is suppressed by forming and removing the coating as shown in (B) to (D), and the protrusion of the abrasive grains (grinding of the grindstone) is automatically adjusted. You. The above-described cycle shown in (B) to (D) is hereinafter referred to as an Elid cycle.
【0005】[0005]
【発明が解決しようとする課題】上述した Elid 研削に
よる加工面は、砥石に含まれる砥粒が細かいほど、良好
な仕上がり面が得られることがわかった。 Elid 研削で
は砥粒を細かくしても上述した Elid サイクルにより砥
石の目詰まりがないので、鏡面のような極めて優れた加
工面を研削により得るために、砥粒はできるだけ細かい
方が望ましい。It has been found that the finer the abrasive grains contained in the grinding wheel, the better the finished surface obtained by the above-mentioned Elid grinding can be obtained. In Elid grinding, the grinding wheel is not clogged by the above-mentioned Elid cycle even if the abrasive grains are made fine. Therefore, in order to obtain a very excellent processed surface such as a mirror surface by grinding, it is desirable that the abrasive grains be as fine as possible.
【0006】しかし、砥粒の平均粒径がサブミクロン、
例えば約50Åにもなると、砥粒を砥石の中に分散させ
ることが極めて難しかった。従って、従来、サブミクロ
ン砥粒を含む電解ドレッシング用砥石の製造は、試みさ
えも行われなかった。更に、かかる砥石の研削面は、被
加工物の大きさに応じて、ある程度の面積を必要とす
る。特に、近年需要の増大している半導体等を研削する
ためには、少なくとも直径200mm程度の砥石が必要
になるが、かかる大面積のサブミクロン砥粒を含む電解
ドレッシング用砥石の製造は、到底不可能であると考え
られていた。However, the average grain size of the abrasive grains is submicron,
For example, at about 50 °, it was extremely difficult to disperse the abrasive grains in the grindstone. Therefore, no attempt has been made to manufacture a grinding wheel for electrolytic dressing containing submicron abrasive grains. Further, the grinding surface of such a grindstone requires a certain area according to the size of the workpiece. In particular, in order to grind a semiconductor or the like, which has been increasing in demand in recent years, a grindstone having a diameter of at least about 200 mm is required. However, the production of a grindstone for electrolytic dressing containing such large-area submicron abrasive grains is almost impossible. It was thought possible.
【0007】従って、本発明は、かかる問題を解決し、
サブミクロン砥粒を含み、かつ大面積の電解ドレッシン
グ用砥石の製造方法を提供することにある。Therefore, the present invention solves such a problem,
An object of the present invention is to provide a method for producing a grinding wheel for electrolytic dressing having a large area and containing submicron abrasive grains.
【0008】[0008]
【課題を解決するための手段】本発明によれば、粒径数
μmのコバルト金属粉末と粒径1μm以下のダイヤモン
ド粉末とを混練して混合粉末を作り、前記混合粉末を所
定の雌型内で圧縮成形して成形体を作り、前記成形体を
焼結して砥石セグメントを作り、前記砥石セグメントを
台板上に導電性接着剤により接着する、各工程からなる
ことを特徴とする電解ドレッシング用砥石の製造方法が
提供される。According to the present invention, a mixed powder is prepared by kneading a cobalt metal powder having a particle size of several μm and a diamond powder having a particle size of 1 μm or less, and mixing the mixed powder in a predetermined female mold. Forming a molded body by compression molding, sintering the molded body to form a whetstone segment, and bonding the whetstone segment to a base plate with a conductive adhesive, the electrolytic dressing comprising: There is provided a method of manufacturing a grinding wheel for use in a vehicle.
【0009】本発明の実施例によれば、前記混練工程
は、所定量の金属粉末に押し棒を周期的に押付けなが
ら、所定量のダイヤモンド粉末を少量ずつ追加すること
からなる、ことが好ましい。また、前記ダイヤモンド粉
末は平均粒径が約50Å以下である、ことが好ましい。According to an embodiment of the present invention, the kneading step preferably comprises adding a predetermined amount of diamond powder little by little while periodically pressing a push rod against a predetermined amount of metal powder. Preferably, the diamond powder has an average particle size of about 50 ° or less.
【0010】更に、前記圧縮成形工程は、面圧6〜8t
/cm2で行われ、前記焼結工程は、1000℃以上の温度で行
われる、ことが好ましい。[0010] Further, the compression molding step includes a contact pressure of 6 to 8 t.
/ cm 2 , and the sintering step is preferably performed at a temperature of 1000 ° C. or higher.
【0011】[0011]
【作用】上述した本発明による砥石の製造方法によれ
ば、従来ボンドを形成していた鋳鉄を比較的柔らかいコ
バルトに変更し、このコバルト金属粉末と粒径1μm以
下のダイヤモンド粉末とを予め混練するので、微細なダ
イヤモンド粉末が比較的大きいコバルト金属粉末の表面
に捕獲され、比較的均一に分散させることができる。と
くに、粒径数μmの金属粉末に押し棒を周期的に押付け
ながら、平均粒径が約50Å以下のダイヤモンド粉末を
少量ずつ追加する場合には、この効果が大きい。According to the above-described method for manufacturing a grinding wheel according to the present invention, cast iron, which has conventionally formed a bond, is changed to relatively soft cobalt, and this cobalt metal powder and diamond powder having a particle size of 1 μm or less are kneaded in advance. Therefore, the fine diamond powder can be captured on the surface of the relatively large cobalt metal powder and dispersed relatively uniformly. This effect is particularly great when diamond powder having an average particle size of about 50 ° or less is added little by little while periodically pressing a push rod against metal powder having a particle size of several μm.
【0012】また、成形体を焼結して砥石セグメントを
作り、台板上に導電性接着剤により接着する、工程によ
り、小さいセグメントから大きい砥石を製造することが
できる。従って、本発明により、サブミクロン砥粒を含
み、かつ大面積の電解ドレッシング用砥石の製造方法を
提供することができる。Further, a large grinding wheel can be manufactured from a small segment by a step of sintering the formed body to form a grinding wheel segment and bonding the grinding wheel segment to a base plate with a conductive adhesive. Therefore, according to the present invention, it is possible to provide a method for producing a large-area electrolytic dressing grindstone containing submicron abrasive grains.
【0013】[0013]
【実施例】以下、本発明の好適な実施例を図面を参照し
て説明する。図1は、本発明により製造した砥石を用い
る Elid ラップ研削を模式的に示す図である。この図に
おいて、10は、垂直な軸線を有するほぼ円板状の導電
性砥石であり、図示しない駆動装置により加工面12を
上にして軸線のまわりに回転可能に取付けられている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram schematically showing Elid lap grinding using a grindstone manufactured according to the present invention. In this figure, reference numeral 10 denotes a substantially disk-shaped conductive grindstone having a vertical axis, which is rotatably mounted around the axis with a processing surface 12 facing upward by a driving device (not shown).
【0014】砥石10の上方には、加工機の回転可能な
駆動軸14が図示しない加工装置の上部ヘッドに設けら
れている。駆動軸14は、水平方向及び/又は垂直方向
に移動できるようになっている。駆動軸14の下面に
は、通常周知の仕方で被加工物すなわちワーク16が固
定される。砥石10の上面すなわちワーク16との接触
面12は、水平な切削面であり、回転する接触面12が
ワーク16と接触することにより、ワーク16を切削す
る。Above the grindstone 10, a rotatable drive shaft 14 of a processing machine is provided on an upper head of a processing apparatus (not shown). The drive shaft 14 is adapted to move in a horizontal direction and / or a vertical direction. A workpiece, that is, a work 16 is fixed to the lower surface of the drive shaft 14 in a generally known manner. The upper surface of the grindstone 10, that is, the contact surface 12 with the work 16 is a horizontal cutting surface, and the rotating contact surface 12 comes into contact with the work 16 to cut the work 16.
【0015】砥石10のワーク16と接触しない部分の
上方には、電極20が砥石10の接触面12に対向して
隙間を隔てて設けられている。砥石10の周囲には複数
のノズル30が設けられ、供給パイプ32を介して砥石
10と電極20との間に弱導電性である研削液すなわち
クーラントを流すようになっている。ノズル30は、砥
石10とワーク16との間にもクーラントを流すように
設けるのが好ましい。An electrode 20 is provided above a portion of the grindstone 10 that does not contact the work 16 with a gap facing the contact surface 12 of the grindstone 10. A plurality of nozzles 30 are provided around the grindstone 10, and a weakly conductive grinding fluid, that is, a coolant, flows between the grindstone 10 and the electrode 20 via a supply pipe 32. It is preferable that the nozzle 30 be provided so that the coolant flows between the grindstone 10 and the work 16.
【0016】更に、この装置には電源40が設けられ、
砥石10の下面に接触するようになった給電体42を介
して砥石10に+の電圧を印加し、一方電極20に−の
電圧を印加できるようになっている。この電源40は、
パルス電源或いはパルスと直流を混在させた電源が好ま
しい。使用において、上述した Elid 研削法により、砥
石の突出(A)、被膜生成(B)、研削(C)、砥粒の
摩耗(D)のサイクルにより、ワーク16の研削が行わ
れる。Further, the apparatus is provided with a power supply 40,
A positive voltage can be applied to the grindstone 10 and a negative voltage can be applied to the electrode 20 via the power supply 42 that comes into contact with the lower surface of the grindstone 10. This power supply 40
A pulse power supply or a power supply in which pulse and DC are mixed is preferable. In use, the workpiece 16 is ground by the cycle of protrusion (A) of the grinding wheel, formation of the film (B), grinding (C), and wear of the abrasive grains (D) by the above-described Elid grinding method.
【0017】砥石10を製造するには、まず、粒径数μ
mのコバルト金属粉末と粒径1μm以下のダイヤモンド
粉末とを混練して混合粉末を作る。この混練は、金属粉
末に押し棒を周期的に押付けながら、ダイヤモンド粉末
を少量ずつ追加するのがよい。この場合に、ダイヤモン
ド粉末の量は、集中度25(約1.1カラット/cm3)程
度が良い。またダイヤモンド粉末は平均粒径が約50Å
以下であるのが良い。この工程により、微細なダイヤモ
ンド粉末が比較的大きいコバルト金属粉末の表面に捕獲
され、比較的均一に分散させることができる。In order to manufacture the grindstone 10, first, a particle size of several μm is used.
m of cobalt metal powder and diamond powder having a particle size of 1 μm or less are kneaded to form a mixed powder. In this kneading, it is preferable to add the diamond powder little by little while periodically pressing the push rod against the metal powder. In this case, the amount of diamond powder is preferably about 25 (about 1.1 carat / cm 3 ). The diamond powder has an average particle size of about 50Å.
The following should be good. By this step, the fine diamond powder can be captured on the surface of the relatively large cobalt metal powder and dispersed relatively uniformly.
【0018】次いで、得られた混合粉末を所定の雌型内
で圧縮成形して成形体を作る。この圧縮成形工程は、面
圧6〜8t/cm2で行うのが良い。雌型の凹部形状は、矩
形、円形、扇形、楕円等のいずれでも良い。大面積を均
一な面圧で加圧するのは、一般に困難であり、また、大
面積を一度で加圧するには非常に大きな出力のプレス装
置を必要とするので、雌型の寸法は、砥石10の接触面
12を小さい面積に分割した形状にするのが良い。Next, the obtained mixed powder is compression-molded in a predetermined female mold to produce a molded body. This compression molding step is preferably performed at a surface pressure of 6 to 8 t / cm 2 . The female concave shape may be any of a rectangle, a circle, a sector, an ellipse, and the like. It is generally difficult to pressurize a large area with a uniform surface pressure. In addition, since pressing a large area at one time requires a pressing device with a very large output, the size of the female mold is limited to the whetstone 10. It is preferable that the contact surface 12 is divided into small areas.
【0019】次いで、得られた成形体を焼結して砥石セ
グメントを作る。この焼結は、1000℃以上の温度、好ま
しくは1100〜1200℃で行われる。次いで、砥石セグメン
トを台板上に導電性接着剤により接着し、所望の砥石1
0を得る。この製造方法により、小さいセグメントから
大きい砥石を製造することができる。 実施例1 図2に示す砥石(直径215mm) を以下の手順で製作し
た。Next, the obtained compact is sintered to form a grinding wheel segment. This sintering is performed at a temperature of 1000 ° C. or more, preferably 1100 to 1200 ° C. Next, the grindstone segments are bonded to the base plate with a conductive adhesive, and the desired grindstone 1 is formed.
Get 0. With this manufacturing method, a large grinding wheel can be manufactured from a small segment. Example 1 A grindstone (diameter: 215 mm) shown in FIG. 2 was manufactured in the following procedure.
【0020】まず、粒径数μmのコバルト金属粉末に押
し棒を周期的に押付けながら、#300万の微粒(平均
粒径約50Å)のダイヤモンド粉末を少量ずつ追加して
混合粉末を作った。ダイヤモンド粉末の量は、集中度2
5(約1.1カラット/cm3)程度であった。次いで、得
られた混合粉末を所定の雌型内で圧縮成形して成形体を
作った。この圧縮は、出力60tのプレスを用いた。雌
型の凹部形状は、ほぼ正方形であり、面積は約25mm2
であった。次いで、得られた成形体を1100〜1200℃で焼
結して砥石セグメントを作った。得られた砥石セグメン
トの厚さは約5mmであった。First, while a pressing rod was periodically pressed against cobalt metal powder having a particle size of several μm, diamond powder of # 3 million fine particles (average particle size: about 50 °) was added little by little to prepare a mixed powder. The amount of diamond powder is 2
5 (approximately 1.1 carats / cm 3 ). Next, the obtained mixed powder was compression-molded in a predetermined female mold to form a molded body. For this compression, a press having an output of 60 t was used. The concave shape of the female mold is almost square and the area is about 25 mm 2
Met. Next, the obtained molded body was sintered at 1100 to 1200 ° C. to form a grinding wheel segment. The thickness of the obtained whetstone segment was about 5 mm.
【0021】同様にして、#8000の微粒のダイヤモ
ンド粉末を用いて、同一寸法の砥石セグメントを作っ
た。更に、半分の面積に#300万の微粒を用い、残り
の半分の部分に#8000の微粒を用いた同一寸法の砥
石セグメントを作った。次に、砥石の内面及び外面に接
する砥石セグメントを、予めワイヤカットにより切断
し、各砥石セグメントを台板上に導電性接着剤により接
着して、図2に示す砥石を得た。各セグメント間の隙間
はできるだけ小さい方が好ましく、本試作では1mm以内
であった。導電性接着剤には銀粉末を含む接着剤を使用
した。In the same manner, grinding stone segments having the same dimensions were prepared using # 8000 fine diamond powder. Further, a grinding wheel segment of the same size was prepared using # 3 million fine particles in half the area and # 8000 fine particles in the other half. Next, the grindstone segments in contact with the inner and outer surfaces of the grindstone were cut in advance by wire cutting, and the respective grindstone segments were adhered to the base plate with a conductive adhesive to obtain the grindstone shown in FIG. It is preferable that the gap between the segments is as small as possible, and in this prototype, it was 1 mm or less. An adhesive containing silver powder was used as the conductive adhesive.
【0022】得られた砥石の表面は、#300万の微粒
部分に光沢がなかった。次いで、上述の工程で得られた
砥石を用い、表1に示す研削機械、電源及び被削材等を
使用して Elid 研削を実施した。その結果を図3〜5に
示す。The surface of the obtained grindstone had no gloss in the # 3 million fine particle portion. Next, using the grinding wheel obtained in the above-described process, Elid grinding was performed using a grinding machine, a power source, a work material, and the like shown in Table 1. The results are shown in FIGS.
【0023】[0023]
【表1】 [Table 1]
【0024】(1)ドレッシング特性 従来の装置と同様に、通電時間とともに実電流の低減が
あるが、コバルトボンドの活発な電解により、比較的高
い電解電流を確認した(図3、●印)。砥石面には電解
に伴い表面ザラツキの増加、被覆の生成が確認された。 (2)鏡面研削特性 加工負荷変化の様子を図4に示す。スパークアウトによ
る負荷低減は少なく、切り込み後は定圧に保ち易かっ
た。 (3)加工面粗さ 超硬合金仕上面の粗さパターンを図5に示す。特に、加
工熱と振動に敏感だが、Rmax 110Åの優れた鏡面が
得られた。 実施例2 実施例1の製作工程と同様に実施例2では、ダイヤモン
ド粉末の集中度を約15に代えて製作した砥石を超硬合
金と光学ガラスに実施した。その結果を図7〜13に示
す。ここで、研削機械、 Elid 電源、研削液、ツルアは
表1と同じである。鏡面加工面粗さの評価に用いる測定
器としては、超硬合金の場合は実施例1と同じ研削抵抗
計測システム(コスモデザイン (株) 製) を用い、光学
ガラスの場合には一般にレーザ光あらさ計と呼ばれるW
YKO:TOPO−3D(松貿機器 (株) 、輸入・取
扱)を用いた。 (1)ドレッシング特性 図7に示す電解ドレッシング特性は、実施例1の図3と
同様に、電流の低下はあるが比較的高い電流で安定し
た。電解印加後の砥石面は、集中度を25から15に下
げたため、初期状態では実施例1に比べ空孔が少なく銀
白色を呈し、その後、被覆が形成されると赤味がかった
黒色を呈した。(1) Dressing characteristics As with the conventional apparatus, there was a decrease in the actual current with the energization time, but a relatively high electrolysis current was confirmed by vigorous electrolysis of the cobalt bond (FIG. 3, mark ●). It was confirmed that the roughness of the surface increased and the coating was formed on the grindstone surface due to the electrolysis. (2) Mirror surface grinding characteristics Fig. 4 shows how the processing load changes. There was little load reduction due to spark-out, and it was easy to maintain a constant pressure after cutting. (3) Roughness of machined surface Fig. 5 shows the roughness pattern of the cemented carbide finished surface. In particular, an excellent mirror surface having an Rmax of 110 ° was obtained although it was sensitive to the processing heat and vibration. Example 2 In Example 2, similarly to the manufacturing process of Example 1, a grindstone manufactured by changing the concentration of diamond powder to about 15 was applied to cemented carbide and optical glass. The results are shown in FIGS. Here, the grinding machine, Elid power supply, grinding fluid and truer are the same as in Table 1. As a measuring instrument used for evaluating the mirror-finished surface roughness, the same grinding resistance measurement system (manufactured by Cosmo Design Co., Ltd.) as in Example 1 was used for cemented carbide, and laser light roughness was generally used for optical glass. W called total
YKO: TOPO-3D (Shosho Kiki Co., Ltd., imported and handled) was used. (1) Dressing Characteristics The electrolytic dressing characteristics shown in FIG. 7 were stable at a relatively high current, although the current decreased, as in FIG. 3 of Example 1. Since the concentration of the grindstone after the electrolysis was reduced from 25 to 15 in the initial state, the grindstone exhibited silver white in the initial state with less pores than in Example 1, and then exhibited a reddish black when the coating was formed. did.
【0025】図8は本ラップ研削における被覆厚さの変
化を示す。初期の被覆厚さは約86μmで、#1200
による前研削条痕を取り去っても砥石は元の寸法に戻っ
ていない。 (2)鏡面研削特性 図9および図10には、超硬合金および光学ガラスの加
工負荷変化の様子を示す。超硬合金では、約19kgf ま
で強制切り込みの後スパークアウトしたところ、負荷が
やや低下し、約40分で加工が終了した。ガラスは低負
荷( Elid :3〜4A)で加工できた。FIG. 8 shows a change in coating thickness in the main lap grinding. The initial coating thickness is about 86 μm, # 1200
The grinding wheel does not return to its original size even after removing the pre-grinding traces. (2) Mirror Surface Grinding Characteristics FIGS. 9 and 10 show how the machining load of the cemented carbide and the optical glass changes. In the case of cemented carbide, when a spark was cut out after forcible cutting to about 19 kgf, the load decreased slightly, and processing was completed in about 40 minutes. The glass could be processed with low load (Elid: 3-4A).
【0026】図11には生成された被覆の元素分析をX
線マイクロアナライザで測定した結果を示す。ボンド材
のCo が主に検出され、次いで電極などからのCu 、研
削液からのMo 、そして研削機械の一部から溶出するF
e が検出された。 (3)加工面粗さ 超硬合金の仕上面粗さパターンを図12に、また光学ガ
ラスの仕上面粗さを図13に示す。6回計測した結果、
超硬合金で平均約70ÅRmax(54〜108Å)が実現
された。また、光学ガラスの場合には、約20分で、約
84Rmax(68〜100Å)が得られた。FIG. 11 shows an elemental analysis of the coating produced by X
2 shows the results measured with a line microanalyzer. Co in the bonding material is mainly detected, and then Cu from the electrodes and the like, Mo from the grinding fluid, and F eluted from a part of the grinding machine.
e has been detected. (3) Finished Surface Roughness FIG. 12 shows the finished surface roughness pattern of the cemented carbide, and FIG. 13 shows the finished surface roughness of the optical glass. As a result of six measurements,
An average of about 70 ° Rmax (54-108 °) was achieved with cemented carbide. In the case of optical glass, about 84 Rmax (68-100 °) was obtained in about 20 minutes.
【0027】以上から、#1200による前加工面と#
300万による鏡面加工面とを比較すると前者はむしれ
面が残留するが後者には見当たらなかった。From the above, the pre-processed surface by # 1200 and #
Compared with the mirror-finished surface of 3 million, the former had a peeling surface but the latter did not.
【0028】[0028]
【発明の効果】上述した本発明による砥石の製造方法に
よれば、従来ボンドを形成していた鋳鉄を比較的柔らか
いコバルトに変更し、このコバルト金属粉末と粒径1μ
m以下のダイヤモンド粉末とを予め混練するので、微細
なダイヤモンド粉末が比較的大きいコバルト金属粉末の
表面に捕獲され、比較的均一に分散させることができ
る。とくに、粒径数μmの金属粉末に押し棒を周期的に
押付けながら、平均粒径が約50Å以下のダイヤモンド
粉末を少量ずつ追加する場合には、この効果が大きい。According to the above-described method for manufacturing a grindstone according to the present invention, cast iron, which has conventionally formed a bond, is changed to relatively soft cobalt, and this cobalt metal powder is mixed with a 1 μm particle size.
m or less in advance, the fine diamond powder is captured on the surface of the relatively large cobalt metal powder and can be dispersed relatively uniformly. This effect is particularly great when diamond powder having an average particle size of about 50 ° or less is added little by little while periodically pressing a push rod against metal powder having a particle size of several μm.
【0029】また、成形体を焼結して砥石セグメントを
作り、台板上に導電性接着剤により接着する、工程によ
り、小さいセグメントから大きい砥石を製造することが
できる。従って、本発明により、サブミクロン砥粒を含
み、かつ大面積の電解ドレッシング用砥粒の製造方法を
提供することができる。Further, a large grinding wheel can be manufactured from a small segment by a step of sintering the formed body to form a grinding wheel segment and bonding the grinding wheel segment on a base plate with a conductive adhesive. Therefore, according to the present invention, it is possible to provide a method for producing abrasives for electrolytic dressing having a large area and containing submicron abrasives.
【図1】本発明により製造した砥石を用いた電解ドレッ
シング加工を模式的に示す図である。FIG. 1 is a view schematically showing an electrolytic dressing process using a grindstone manufactured according to the present invention.
【図2】試作砥石の寸法を示す図である。FIG. 2 is a diagram showing dimensions of a prototype grinding wheel.
【図3】試作砥石による電解ドレッシング特性を示す図
である。FIG. 3 is a view showing electrolytic dressing characteristics of a prototype grinding wheel.
【図4】試作砥石による加工負荷変化を示す図である。FIG. 4 is a diagram showing a change in processing load by a prototype grinding wheel.
【図5】Elid 研削後の面粗さを示す図である。FIG. 5 is a diagram showing surface roughness after Elid grinding.
【図6】Elid 研削法における Elid サイクルを示す説
明図である。FIG. 6 is an explanatory view showing an Elid cycle in the Elid grinding method.
【図7】第2の試作砥石による電解ドレッシング特性を
示す図である。FIG. 7 is a diagram showing electrolytic dressing characteristics of a second prototype grinding wheel.
【図8】第2の試作砥石による本ラップ研削における被
覆厚さの変化を示す図である。FIG. 8 is a diagram showing a change in coating thickness in main lap grinding using a second prototype grinding wheel.
【図9】第2の試作砥石による超硬合金の加工負荷変化
を示す図である。FIG. 9 is a view showing a change in processing load of a cemented carbide by a second prototype grinding wheel.
【図10】第2の試作砥石による光学ガラスの加工負荷
変化を示す図である。FIG. 10 is a diagram showing a change in processing load of optical glass by a second prototype grinding wheel.
【図11】生成された被覆の元素分析をX線マイクロア
ナライザで測定した結果を示す図である。FIG. 11 is a diagram showing the results of elemental analysis of the generated coating measured by an X-ray microanalyzer.
【図12】超硬合金の仕上面粗さパターンを示す図であ
る。FIG. 12 is a view showing a finished surface roughness pattern of a cemented carbide.
【図13】光学ガラスの仕上面粗さパターンを示す図で
ある。FIG. 13 is a view showing a finished surface roughness pattern of the optical glass.
10 砥石 12 接触面 14 駆動軸 16 ワーク 20 電極 30 ノズル 40 電源 42 給電体 DESCRIPTION OF SYMBOLS 10 Whetstone 12 Contact surface 14 Drive shaft 16 Work 20 Electrode 30 Nozzle 40 Power supply 42 Power supply
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI B24D 5/06 B24D 5/06 (58)調査した分野(Int.Cl.7,DB名) B24D 3/34 B24D 3/00 320 B24D 3/00 330 B24D 3/00 340 B24D 3/06 B24D 5/06 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 identification code FI B24D 5/06 B24D 5/06 (58) Field surveyed (Int.Cl. 7 , DB name) B24D 3/34 B24D 3/00 320 B24D 3/00 330 B24D 3/00 340 B24D 3/06 B24D 5/06
Claims (4)
μm以下のダイヤモンド粉末とを混練して混合粉末を作
り、 前記混合粉末を所定の雌型内で圧縮成形して成形体を作
り、 前記成形体を焼結して砥石セグメントを作り、 前記砥石セグメントを台板上に導電性接着剤により接着
する、各工程からなることを特徴とする電解ドレッシン
グ用砥石の製造方法。1. Cobalt metal powder having a particle size of several μm and a particle size of 1.
μm or less of diamond powder is kneaded to form a mixed powder, the mixed powder is compression-molded in a predetermined female mold to form a compact, and the compact is sintered to form a grindstone segment. And a method of manufacturing a grindstone for electrolytic dressing, comprising the steps of: adhering to a base plate with a conductive adhesive.
し棒を周期的に押付けながら、所定量のダイヤモンド粉
末を少量ずつ追加することからなる、ことを特徴とする
請求項1に記載の製造方法。2. The method according to claim 1, wherein the kneading step comprises adding a predetermined amount of diamond powder little by little while periodically pressing a push rod against a predetermined amount of metal powder. Production method.
0Å以下である、ことを特徴とする請求項2に記載の製
造方法。3. The diamond powder has an average particle size of about 5
The method according to claim 2, wherein the angle is 0 ° or less.
で行われ、前記焼結工程は、1000℃以上の温度で行われ
る、ことを特徴とする請求項3に記載の製造方法。4. The compression molding step includes a contact pressure of 6 to 8 t / cm 2.
The method according to claim 3, wherein the sintering step is performed at a temperature of 1000 ° C. or higher.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4045673A JP3048461B2 (en) | 1992-03-03 | 1992-03-03 | Method for producing grinding wheel for electrolytic dressing containing submicron abrasive grains |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4045673A JP3048461B2 (en) | 1992-03-03 | 1992-03-03 | Method for producing grinding wheel for electrolytic dressing containing submicron abrasive grains |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05245763A JPH05245763A (en) | 1993-09-24 |
| JP3048461B2 true JP3048461B2 (en) | 2000-06-05 |
Family
ID=12725912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4045673A Expired - Lifetime JP3048461B2 (en) | 1992-03-03 | 1992-03-03 | Method for producing grinding wheel for electrolytic dressing containing submicron abrasive grains |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3048461B2 (en) |
-
1992
- 1992-03-03 JP JP4045673A patent/JP3048461B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05245763A (en) | 1993-09-24 |
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