JP3068331B2 - Exhaust gas treatment system for solder plating equipment for electronic components - Google Patents
Exhaust gas treatment system for solder plating equipment for electronic componentsInfo
- Publication number
- JP3068331B2 JP3068331B2 JP4145490A JP14549092A JP3068331B2 JP 3068331 B2 JP3068331 B2 JP 3068331B2 JP 4145490 A JP4145490 A JP 4145490A JP 14549092 A JP14549092 A JP 14549092A JP 3068331 B2 JP3068331 B2 JP 3068331B2
- Authority
- JP
- Japan
- Prior art keywords
- exhaust gas
- exhaust
- section
- treatment system
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007747 plating Methods 0.000 title claims description 47
- 229910000679 solder Inorganic materials 0.000 title claims description 20
- 238000012545 processing Methods 0.000 claims description 27
- 238000001816 cooling Methods 0.000 claims description 16
- 238000012805 post-processing Methods 0.000 claims description 7
- 238000007781 pre-processing Methods 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims 7
- 238000005406 washing Methods 0.000 description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000000428 dust Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 5
- 238000005238 degreasing Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003472 neutralizing effect Effects 0.000 description 3
- 238000011045 prefiltration Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
Landscapes
- Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Coating With Molten Metal (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品の半田めっき
装置における排ガス処理システムに関し、各処理槽で発
生する排ガスを処理する排ガス処理システムに適用して
有効な技術に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exhaust gas treatment system for a solder plating apparatus for electronic parts, and more particularly to a technology effective when applied to an exhaust gas treatment system for treating exhaust gas generated in each treatment tank.
【０００２】[0002]
【従来の技術】電子部品の半田めっき装置においては、
各処理槽で発生するガスには有機ガスや悪臭ガスが含ま
れ、衛生上、作業環境上好ましくないので、これを排除
し、換気する必要がある。2. Description of the Related Art In a solder plating apparatus for electronic parts,
The gas generated in each processing tank contains an organic gas and an odorous gas, which is not preferable in terms of sanitation and working environment.
【０００３】そこで、排ガス処理システムを設け、この
排ガス処理システムは工場外の集塵装置、排風機に接続
される排気ダクトを建屋を貫通させて工場内に配設し、
電子部品の半田めっき装置まで延在させ、その排気フー
ドを各処理槽の上部に臨ませる構造となっている。[0003] Therefore, an exhaust gas treatment system is provided. In this exhaust gas treatment system, an exhaust duct connected to a dust collector and an exhaust fan outside the factory is provided in the factory through a building.
The structure extends to the solder plating apparatus for electronic components, and the exhaust hood faces the upper part of each processing tank.
【０００４】[0004]
【発明が解決しようとする課題】しかし、前記した排ガ
ス処理システムでは、工場外の集塵装置、排風機に接続
される排気ダクトを建屋を貫通させて工場内に配設し、
電子部品の半田めっき装置まで延在させ、その排気フー
ドを各処理槽の上部に臨ませる構造となっているので、
工場外に集塵装置、排風機を設置し、工場内外に排気ダ
クトを配設する工事は既設設備との関係から容易でな
く、コストが高くつくという問題があった。However, in the above-described exhaust gas treatment system, an exhaust duct connected to a dust collector and an exhaust fan outside the factory is provided in the factory through a building.
Since it is structured to extend to the solder plating equipment for electronic components and the exhaust hood faces the upper part of each processing tank,
There is a problem that the installation of a dust collector and an exhaust fan outside the factory and the installation of an exhaust duct inside and outside the factory are not easy due to the existing equipment, and the cost is high.
【０００５】本発明の目的は、工場外の集塵装置、排風
機の設置および工場内外の排気ダクトの配設を不要にす
ることのできる電子部品の半田めっき装置における排ガ
ス処理システムを提供することにある。An object of the present invention is to provide an exhaust gas treatment system in a solder plating apparatus for electronic components, which can eliminate the need for installation of a dust collector and an exhaust fan outside the factory and installation of an exhaust duct inside and outside the factory. It is in.
【０００６】本発明の他の目的は、排気ダクトレス化お
よびコストの低廉化を図ることのできる電子部品の半田
めっき装置における排ガス処理システムを提供すること
にある。Another object of the present invention is to provide an exhaust gas treatment system in a solder plating apparatus for electronic components, which can reduce the exhaust duct and reduce the cost.
【０００７】また、本発明のさらに他の目的は、ケーシ
ング内のクリーン化を図ることのできる電子部品の半田
めっき装置における排ガス処理システムを提供すること
にある。It is still another object of the present invention to provide an exhaust gas treatment system in a solder plating apparatus for electronic parts, which can clean the inside of a casing.
【０００８】本発明の前記ならびにその他の目的と新規
な特徴は、本明細書の記述および添付図面から明らかに
なるであろう。The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.
【０００９】[0009]
【課題を解決するための手段】本願において開示される
発明のうち、代表的なものの概要を簡単に説明すれば、
以下のとおりである。SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.
【００１０】すなわち、本発明による電子部品の半田め
っき装置における排ガス処理システムは、ケーシング内
の前処理部、めっき部、後処理部に設けられ、清浄空気
を供給する給気ノズルおよび排気フードを備え、前記ケ
ーシングに、前記排気フードからの排ガスを冷却するガ
ス冷却部と、冷却された排ガスを清浄化空気に処理する
ガス処理部と、前記排ガスを排気フードに吸引するブロ
アとを搭載した構造としたものである。That is, an exhaust gas treatment system in a solder plating apparatus for electronic parts according to the present invention includes an air supply nozzle for supplying clean air and an exhaust hood, which are provided in a pre-processing section, a plating section, and a post-processing section in a casing. A structure in which a gas cooling unit that cools exhaust gas from the exhaust hood, a gas processing unit that processes the cooled exhaust gas into purified air, and a blower that sucks the exhaust gas into the exhaust hood are provided on the casing. It was done.
【００１１】この場合、前記前処理部、めっき部、後処
理部における各処理槽の開口部の一側に給気ノズルを、
他側に排気フードをそれぞれ設け、各処理槽の開口部に
エアカーテンを形成した構造とすることができる。In this case, an air supply nozzle is provided on one side of the opening of each processing tank in the pre-processing section, the plating section, and the post-processing section.
An exhaust hood may be provided on the other side, and an air curtain may be formed at the opening of each processing tank.
【００１２】[0012]
【作用】本発明による電子部品の半田めっき装置におけ
る排ガス処理システムによれば、ケーシング内の前処理
部、めっき部、後処理部に設けられる給気ノズルおよび
排気フードを備え、前記ケーシングに、排気フードから
の排ガスを冷却するガス冷却部と、排ガスを排気フード
に吸引するブロアとを搭載した構造としたので、工場外
の集塵装置、排風機の設置および工場内の排気ダクトの
配設を不要にすることができる。According to the exhaust gas treatment system of the solder plating apparatus for electronic parts according to the present invention, an air supply nozzle and an exhaust hood provided in a pre-processing section, a plating section, and a post-processing section in a casing are provided. A gas cooling unit that cools the exhaust gas from the hood and a blower that sucks the exhaust gas into the exhaust hood are installed.Therefore, it is necessary to install a dust collector and air blower outside the factory and install an exhaust duct inside the factory. It can be unnecessary.
【００１３】したがって、排気ダクトレス化およびコス
トの低廉化を図ることができる。Therefore, it is possible to reduce exhaust ducts and reduce costs.
【００１４】この場合、前記前処理部、めっき部、後処
理部における各処理槽の開口部の一側に給気ノズルを、
他側に排気フードをそれぞれ設け、各処理槽の開口部に
エアカーテンを形成した構造としたので、各処理槽での
電子部品の搬入出の際にも、各処理槽内から発生した排
ガスの拡散を防止し、ケーシング内のクリーン化を図る
ことができる。In this case, an air supply nozzle is provided on one side of the opening of each processing tank in the pre-processing section, the plating section, and the post-processing section.
Exhaust hoods are provided on the other side, and air curtains are formed at the openings of each processing tank, so when loading and unloading electronic components in each processing tank, the exhaust gas generated from each processing tank can be removed. Diffusion can be prevented and the inside of the casing can be cleaned.
【００１５】本発明の前記ならびにその他の目的と新規
な特徴は、本明細書の記述および添付図面から明らかに
なるであろう。The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.
【００１６】[0016]
【実施例】図１は本発明の一実施例である電子部品の半
田めっき装置における排ガス処理システムを示す断面
図、図２は図１のII−II線断面図である。1 is a sectional view showing an exhaust gas treatment system in a solder plating apparatus for electronic parts according to one embodiment of the present invention, and FIG. 2 is a sectional view taken along line II-II of FIG.
【００１７】本実施例における電子部品の半田めっき装
置における排ガス処理システムはＩＣ用リードフレーム
の高速半田めっき装置に適用したものである。このＩＣ
用リードフレームの半田めっき装置は、ケーシング１を
備え、このケーシング１内には、左側から、供給部２、
脱脂部３ａ，３ｂ、液切り部４ａ、水洗部５ａ，５ｂ、
化学研磨部６、液切り部４ｂ、水洗部５ｃ，５ｄ、めっ
き槽７よりなるめっき部８ａ〜８ｃが順次配置されてい
る。The exhaust gas treatment system in the solder plating apparatus for electronic parts according to the present embodiment is applied to a high-speed solder plating apparatus for an IC lead frame. This IC
The solder plating apparatus for a lead frame for use includes a casing 1, in which a supply unit 2,
Degreasing sections 3a, 3b, draining section 4a, washing sections 5a, 5b,
Plating sections 8a to 8c each including a chemical polishing section 6, a liquid drain section 4b, washing sections 5c and 5d, and a plating tank 7 are sequentially arranged.
【００１８】また、このめっき部８ａ〜８ｃに続いて、
液切り部４ｃ、水洗部５ｅ、中和部９、液切り部４ｄ、
湯洗部１０ａ〜１０ｃ、液切り部４ｅ、乾燥部１１、収
納部１２が順次配置されている。Further, following these plated portions 8a to 8c,
Draining section 4c, washing section 5e, neutralizing section 9, draining section 4d,
The hot water washing units 10a to 10c, the liquid draining unit 4e, the drying unit 11, and the storage unit 12 are sequentially arranged.
【００１９】本実施例における排ガス処理システムは、
脱脂部３ａ，３ｂおよび液切り部４ａと、化学研磨部６
および液切り部４ｂと、めっき部８ａ〜８ｃおよび液切
り部４ｃと、中和部９と、液切り部４ｄおよび湯洗部１
０ａ〜１０ｃとには、一側にそれぞれ排気フード１３を
設け、他側にそれぞれ給気ノズル１４を設けた構造とな
っている。The exhaust gas treatment system in this embodiment is
A degreasing section 3a, 3b and a liquid removing section 4a;
And the draining section 4b, the plating sections 8a to 8c and the draining section 4c, the neutralizing section 9, the draining section 4d and the hot water washing section 1.
Each of 0a to 10c has an exhaust hood 13 on one side and an air supply nozzle 14 on the other side.
【００２０】詳しくは、たとえば、めっき部８ａ〜８ｃ
および液切り部４ｃでは、給気ノズル１４と排気フード
１３とは互いに対向し、給気ノズル１４から清浄空気を
給気し、めっき槽７の開口部にエアカーテンを形成する
構造となっている。More specifically, for example, the plating portions 8a to 8c
In the liquid draining section 4c, the air supply nozzle 14 and the exhaust hood 13 face each other, supply clean air from the air supply nozzle 14, and form an air curtain at the opening of the plating tank 7. .
【００２１】各排気フード１３は共通フード１５を介し
てガス冷却部１６に接続されている。このガス冷却部１
６は排気フード１３からの排ガスを冷媒との熱交換によ
り冷却するもので、ケーシング１に搭載されている。Each exhaust hood 13 is connected to a gas cooling unit 16 via a common hood 15. This gas cooling unit 1
Numeral 6 is for cooling the exhaust gas from the exhaust hood 13 by heat exchange with a refrigerant, and is mounted on the casing 1.
【００２２】この搭載されたガス冷却部１６にガス処理
部１７が接続され、このガス処理部１７は冷却された排
ガスを清浄化空気に処理するものである。A gas processing unit 17 is connected to the mounted gas cooling unit 16, and the gas processing unit 17 processes the cooled exhaust gas into purified air.
【００２３】すなわち、ガス処理部１７内には、フィル
タケースが積層され、このフィルタケース内に排ガス中
の有害成分のうち、粗成分を濾過する多孔性ポリビニル
ホルマールからなるプレフィルタが収納されている。That is, a filter case is laminated in the gas treatment section 17, and a pre-filter made of porous polyvinyl formal for filtering a coarse component among harmful components in the exhaust gas is accommodated in the filter case. .
【００２４】このようなフィルタケースの最下層に連な
って活性炭吸着ケースが形成され、この活性炭吸着ケー
ス内には、排ガス中の有害成分のうち、微成分を吸着す
る活性炭が充填されている。An activated carbon adsorption case is formed so as to be continuous with the lowermost layer of such a filter case, and the activated carbon adsorption case is filled with activated carbon that adsorbs fine components among harmful components in exhaust gas.
【００２５】このようなガス処理部１７にブロア１８が
接続され、このブロア１８は負圧を生成し、この負圧に
よりめっき槽７上に発生した排ガスを排気フード１３か
ら吸い込み、ガス冷却部１６を経てガス処理部１７内の
プレフィルタおよび活性炭を通過させ、供給管１９を介
して給気ノズル１４とケーシング１内に清浄化空気とし
て循環供給する構造となっている。A blower 18 is connected to the gas processing section 17, and the blower 18 generates a negative pressure, and the exhaust gas generated on the plating tank 7 is sucked from the exhaust hood 13 by the negative pressure, and the gas cooling section 16 is formed. Through the pre-filter and the activated carbon in the gas processing unit 17, and circulate and supply as clean air to the air supply nozzle 14 and the casing 1 via the supply pipe 19.
【００２６】次に、本実施例の作用について説明する。Next, the operation of this embodiment will be described.
【００２７】半田めっき装置の各処理槽で発生する排ガ
スの処理を行う場合、ブロア１８を駆動させると、たと
えばめっき槽７上では、給気ノズル１４から清浄空気が
シート状に噴射し、対向する排気フード１３に向かって
流動し、排気フード１３に負圧により吸引される。When the exhaust gas generated in each processing tank of the solder plating apparatus is processed, when the blower 18 is driven, for example, on the plating tank 7, clean air is jetted from the air supply nozzle 14 in a sheet shape and opposed. It flows toward the exhaust hood 13 and is sucked into the exhaust hood 13 by negative pressure.
【００２８】このため、めっき槽７の開口部にエアカー
テンが形成され、このエアカーテンによりめっき槽７の
開口部が覆われる。For this reason, an air curtain is formed at the opening of the plating tank 7, and the air curtain covers the opening of the plating tank 7.
【００２９】その結果、めっき槽７内から発生した排ガ
スはエアカーテンに沿って排気フード１３に吸引され、
共通フード１５を経てガス冷却部１６内に吸い込まれ
る。As a result, the exhaust gas generated from the plating tank 7 is sucked into the exhaust hood 13 along the air curtain,
The gas is sucked into the gas cooling unit 16 via the common hood 15.
【００３０】ガス冷却部１６では、冷媒との熱交換によ
り排ガスは冷却され、ガス処理部１７に送られる。排ガ
スを冷却することにより、水蒸気等の気化されたガスを
液化し、ガス冷却部１６で液体として回収する。このよ
うに、水分がガス冷却部１６で回収されるので、ガス処
理部１７への水分持ち込みが防止できる。なお、回収さ
れた水分は排水系路に流れ込むようになっている。In the gas cooling section 16, the exhaust gas is cooled by heat exchange with the refrigerant and sent to the gas processing section 17. By cooling the exhaust gas, vaporized gas such as water vapor is liquefied and collected as a liquid by the gas cooling unit 16. As described above, since the water is collected by the gas cooling unit 16, it is possible to prevent water from being brought into the gas processing unit 17. The collected water flows into a drainage channel.
【００３１】ガス処理部１７では、まず、多孔性ポリビ
ニルホルマールからなるプレフィルタによって粗いフィ
ルトレーションが行われる。その後、図示しない活性炭
吸着ケース内を排ガスが通過する際、活性炭によって、
有害成分中の微成分が吸着除去される。In the gas processing section 17, first, coarse filtration is performed by a pre-filter made of porous polyvinyl formal. Then, when the exhaust gas passes through the activated carbon adsorption case (not shown),
Fine components in harmful components are adsorbed and removed.
【００３２】そして、排ガス中の有害成分がすべて除去
されて排ガスは清浄化空気としてブロア１８を経て給気
ノズル１４とケーシング１内に循環供給される。Then, all harmful components in the exhaust gas are removed, and the exhaust gas is circulated and supplied to the air supply nozzle 14 and the casing 1 through the blower 18 as purified air.
【００３３】このように、ケーシング１にガス冷却部１
６と、ガス処理部１７と、ブロア１８とを搭載した構造
としたので、工場外の集塵装置、排風機の設置および工
場内の排気ダクトの配設を不要にすることができる。As described above, the gas cooling unit 1 is provided on the casing 1.
6, the gas processing unit 17 and the blower 18 are mounted, so that it is not necessary to install a dust collecting device and an exhaust fan outside the factory and to dispose an exhaust duct inside the factory.
【００３４】したがって、排気ダクトレス化およびコス
トの低廉化を図ることができる。Therefore, it is possible to reduce exhaust ducts and reduce costs.
【００３５】この場合、前記めっき部８ａ〜８ｃにおけ
るめっき槽７の開口部の一側に給気ノズル１４を、他側
に排気フード１３をそれぞれ設け、めっき槽７の開口部
にエアカーテンを形成した構造としたので、めっき槽７
でのＩＣ用リードフレームの搬入出の際にも、めっき槽
７内から発生した排ガスの拡散を防止し、ケーシング１
内のクリーン化を図ることができる。In this case, an air supply nozzle 14 is provided on one side of the opening of the plating tank 7 in the plating sections 8a to 8c, and an exhaust hood 13 is provided on the other side, and an air curtain is formed on the opening of the plating tank 7. The plating tank 7
When the lead frame for IC is carried in and out, the diffusion of the exhaust gas generated from the plating tank 7 is prevented, and the casing 1
The inside can be cleaned.
【００３６】以上、本発明者によってなされた発明を実
施例に基づき具体的に説明したが、本発明は前記実施例
に限定されるものでなく、その要旨を逸脱しない範囲で
種々変更可能であることはいうまでもない。As described above, the invention made by the inventor has been specifically described based on the embodiments. However, the present invention is not limited to the above-described embodiments, and can be variously modified without departing from the gist thereof. Needless to say.
【００３７】以上の説明では、主として本発明者によっ
てなされた発明をその利用分野である、ＩＣ用リードフ
レームの半田めっき装置における排ガス処理システムで
説明したが、ＩＣ用リードフレーム以外のリードフレー
ム状の電子部品の半田めっき装置における排ガス処理シ
ステムにも適用することができる。In the above description, the invention made mainly by the present inventor has been described in the field of application, that is, the exhaust gas treatment system in the solder plating apparatus for an IC lead frame. The present invention can also be applied to an exhaust gas treatment system in a solder plating apparatus for electronic components.
【００３８】[0038]
【発明の効果】本願において開示される発明のうち、代
表的なものによって得られる効果を簡単に説明すれば、
以下のとおりである。Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.
【００３９】(1).ケーシング内の前処理部、めっき部、
後処理部に設けられ、清浄空気を供給する給気ノズルお
よび排気フードを備え、前記ケーシングに、前記排気フ
ードからの排ガスを冷却するガス冷却部と、冷却された
排ガスを清浄化空気に処理するガス処理部と、前記排ガ
スを排気フードに吸引するブロアとを搭載した構造とし
たので、工場外の集塵装置、排風機の設置および工場内
の排気ダクトの配設を不要にすることができる。(1) Pretreatment section, plating section in casing,
An air supply nozzle and an exhaust hood are provided in the post-processing unit and supply clean air. The casing has a gas cooling unit that cools exhaust gas from the exhaust hood, and processes the cooled exhaust gas into purified air. Since the gas processing unit and the blower that sucks the exhaust gas into the exhaust hood are mounted, it is not necessary to install a dust collector outside the factory, install a blower, and dispose an exhaust duct inside the factory. .
【００４０】(2).前記(1) の効果により、排気ダクトレ
ス化およびコストの低廉化を図ることができる。(2) By the effect of the above (1), it is possible to reduce the exhaust duct and reduce the cost.
【００４１】(3).前記(1) の場合、各処理部における各
処理槽の開口部の一側に給気ノズルを、他側に排気フー
ドをそれぞれ設け、各処理槽の開口部にエアカーテンを
形成した構造としたので、各処理槽での電子部品の搬入
出の際にも、めっき槽内から発生した排ガスの拡散を防
止し、ケーシング内のクリーン化を図ることができる。(3) In the case of the above (1), an air supply nozzle is provided on one side of the opening of each processing tank in each processing section, and an exhaust hood is provided on the other side. Since the curtain is formed, the diffusion of the exhaust gas generated from the plating tank can be prevented even when the electronic components are carried in and out of each processing tank, and the inside of the casing can be cleaned.
【００４２】[0042]
【図１】本発明の一実施例である電子部品の半田めっき
装置における排ガス処理システムを示す断面図である。FIG. 1 is a sectional view showing an exhaust gas treatment system in a solder plating apparatus for electronic components according to one embodiment of the present invention.
【図２】図１のII−II線断面図である。FIG. 2 is a sectional view taken along line II-II of FIG.
１ ケーシング ２ 供給部 ３ａ 脱脂部 ３ｂ 脱脂部 ４ａ 液切り部 ４ｂ 液切り部 ４ｃ 液切り部 ４ｄ 液切り部 ４ｅ 液切り部 ５ａ 水洗部 ５ｂ 水洗部 ５ｃ 水洗部 ５ｄ 水洗部 ５ｅ 水洗部 ６ 化学研磨部 ７ めっき槽 ８ａ めっき部 ８ｂ めっき部 ８ｃ めっき部 ９ 中和部 １０ａ 湯洗部 １０ｂ 湯洗部 １０ｃ 湯洗部 １１ 乾燥部 １２ 収納部 １３ 排気フード １４ 給気ノズル １５ 共通フード １６ ガス冷却部 １７ ガス処理部 １８ ブロア １９ 供給管 Reference Signs List 1 casing 2 supply section 3a degreasing section 3b degreasing section 4a draining section 4b draining section 4c draining section 4d draining section 4e draining section 5a washing section 5b washing section 5c washing section 5d washing section 5e washing section 6 chemical polishing section 7 Plating tank 8a Plating section 8b Plating section 8c Plating section 9 Neutralizing section 10a Hot water washing section 10b Hot water washing section 10c Hot water washing section 11 Drying section 12 Storage section 13 Exhaust hood 14 Air supply nozzle 15 Common hood 16 Gas cooling section 17 Gas Processing unit 18 Blower 19 Supply pipe
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｃ２５Ｄ 7/12 Ｃ２５Ｄ 7/12 Ｆ２７Ｄ 17/00 １０４ Ｆ２７Ｄ 17/00 １０４Ｄ Ｈ０１Ｌ 23/50 Ｈ０１Ｌ 23/50 Ｄ (58)調査した分野(Int.Cl.7，ＤＢ名) C25D 21/04 B23K 1/20 C23C 2/08 - 2/10 C25D 3/34 C25D 7/12 F27D 17/00 H01L 23/50 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI C25D 7/12 C25D 7/12 F27D 17/00 104 F27D 17/00 104D H01L 23/50 H01L 23/50 D (58) Field (Int.Cl. 7 , DB name) C25D 21/04 B23K 1/20 C23C 2/08-2/10 C25D 3/34 C25D 7/12 F27D 17/00 H01L 23/50
Claims (2)
処理部に設けられ、清浄空気を供給する給気ノズルおよ
び排気フードを備え、前記ケーシングに、前記排気フー
ドからの排ガスを冷却するガス冷却部と、冷却された排
ガスを清浄化空気に処理するガス処理部と、排ガスを前
記排気フードに吸引するブロアとを搭載したことを特徴
とする電子部品の半田めっき装置における排ガス処理シ
ステム。Pre-processing unit of claim 1 in the casing, the plating unit, provided in the post-processing unit includes a supply air nozzle and the exhaust hood you supplying clean air to said casing, to cool the exhaust gas from the exhaust hood a gas cooling unit, a gas processing unit for the cooled exhaust gas treating the clean air, the exhaust gases before
Exhaust gas treatment system in the solder plating apparatus for an electronic component, characterized in that mounted a blower for sucking the serial exhaust hood.
理部における各処理槽の開口部の一側に前記給気ノズル
を、他側に前記排気フードをそれぞれ設け、前記各処理
槽の開口部にエアカーテンを形成したことを特徴とする
請求項１記載の電子部品の半田めっき装置における排ガ
ス処理システム。Wherein said pre-processing unit, the plating unit, said air supply nozzle to one side of the opening of each processing tank in the post-processing unit, respectively said exhaust hood to the other side, the processing tanks 2. An exhaust gas treatment system for an electronic component solder plating apparatus according to claim 1, wherein an air curtain is formed in the opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4145490A JP3068331B2 (en) | 1992-06-05 | 1992-06-05 | Exhaust gas treatment system for solder plating equipment for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4145490A JP3068331B2 (en) | 1992-06-05 | 1992-06-05 | Exhaust gas treatment system for solder plating equipment for electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05339799A JPH05339799A (en) | 1993-12-21 |
| JP3068331B2 true JP3068331B2 (en) | 2000-07-24 |
Family
ID=15386473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4145490A Expired - Fee Related JP3068331B2 (en) | 1992-06-05 | 1992-06-05 | Exhaust gas treatment system for solder plating equipment for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3068331B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100759477B1 (en) * | 2007-03-15 | 2007-09-27 | 주식회사 제이텍 | Hood device for plating equipment |
| KR100868428B1 (en) * | 2007-05-11 | 2008-11-11 | 주식회사 포스코 | Fume Drop Prevention Device |
| KR100892995B1 (en) * | 2008-10-20 | 2009-04-10 | 손치호 | Metal anodizing method and system |
| KR100958368B1 (en) * | 2009-12-16 | 2010-05-17 | 주식회사 삼원알텍 | Apparatus for anodizing treatment of metal having grease removing apparatus |
| JP5805055B2 (en) * | 2012-11-24 | 2015-11-04 | 丸仲工業株式会社 | Horizontal conveyance type electroplating equipment |
| KR102154861B1 (en) * | 2020-06-01 | 2020-09-11 | 지원석 | Method and apparatus for continuous plating process based on hood device control |
| CN112962045B (en) * | 2021-02-03 | 2022-08-30 | 徐州瑞马智能技术有限公司 | Dust collector is used in hot-galvanize production |
-
1992
- 1992-06-05 JP JP4145490A patent/JP3068331B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05339799A (en) | 1993-12-21 |
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