JP3075459B2 - How to fix circuit components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial applications]

The present invention relates to a method for fixing circuit components such as bus bars and terminals, which can be easily and reliably connected and fixed to a circuit board by the action of heating and softening a thermoplastic resin plate.

[0002]

2. Description of the Related Art FIGS.
1 shows a conventional circuit board described in Japanese Patent Publication No. 95-95. This circuit board 71 is formed by forming a small current circuit 73 for signals with a narrow copper foil on an insulating resin substrate 72 and forming a large current circuit 74 for power with a punched metal bus bar. is there. The large current circuit 74 is adhered and fixed to the surface of the resin substrate 72 with solder or an adhesive 75 as shown in FIG. 19, and is connected to a circuit on the back side of the substrate through a through hole 76.

However, the circuit board 71 has a problem that it cannot be processed into a three-dimensional shape and a problem that it takes a lot of time to connect and fix the bus bar 74 that is a large current circuit.

On the other hand, the circuit board described in Japanese Patent Application Laid-Open No. 2-94496 is formed in a three-dimensional shape as shown in FIG. This circuit board 81 is the same as that shown in FIG.
A flexible circuit pattern 83 is formed with a conductive paste on the surface of a flat resin substrate 82 as described above, and the resin substrate 82 is set on a vacuum forming die 84, heated by a heater 85, and evacuated from a hole 86 at the same time. And formed into a three-dimensional shape along the forming die 84.

[0005] The circuit pattern 83 of the conductive paste is gradually cured by the heating of the heater 85, and is formed as a small current circuit 83 'upon completion of molding. A connection land 86 is formed at the end of the circuit 83 ', and the tab 86 is connected to the land 86.
7 and the like are connected by soldering. However, in the circuit board 81, in order to obtain a large current circuit, the circuit 83 'is used.
There is a problem that the conductive plating has to be formed in a thick film on the upper side, which requires many man-hours, and a problem that much trouble is required for connection and fixing of the circuit components such as the tab terminal 87.

[0006]

SUMMARY OF THE INVENTION In view of the above points, the present invention not only allows a large current circuit to be easily formed on a circuit board, but also allows connection of circuit parts such as bus bars and terminals to the circuit board. An object of the present invention is to provide a method for fixing a circuit component, which can easily and reliably fix the circuit component.

[0007]

In order to achieve the above object, the present invention provides a method for mounting a circuit component on a mold, and
Heating and softening the resin plate, vacuum forming and pressure forming
A circuit for attaching the thermoplastic resin plate to the circuit component in a form or the like
In the method of fixing the parts,
Lock holes or horizontal protrusions
A protruding portion is provided, and the thermoplastic resin plate is vacuum-formed.
Due to the suction action at the time of forming and the pressing action at the time of pressure forming,
And the lower part of the protruding part.
(Claim 1). Circuit components are placed on the vacuum mold.
Heat and soften the thermoplastic resin plate, and vacuum
The thermoplastic resin plate is adhered to the circuit component by molding.
Busbars and terminals.
The circuit component has a locking hole
A projection protruding in the direction of the bottom, the bottom of the locking hole and the projection
An air inlet communicating with the lower space of the vacuum forming mold,
The air in the locking hole and the space below the protrusion from the suction hole
Air is sucked into the inside of the locking hole and the lower space of the protrusion.
It is also effective to let the thermoplastic resin plate enter
(Claim 2).

[0008] Further, a rising piece or a pressure contact piece of the circuit component.
It said locking hole and may be provided with the protruding portion, it is also possible to form the locking hole on the inside of the loop elements launched to the circuit components (Claim 3). Moreover, the substantially U-shaped folded portion in the rising piece on the lower side of the protruding portion formed <br/> to the inside of the folded portion, also possible that the formation of the communicating groove with respect to the intake hole There is (claim 4) .

[0009] Also, the circuit component having a pair of pressing member for pressing the wire, the air vent hole which faces the electric wire is provided, after pressing the wire to the piezoelectric contact piece, is heated and softened on the circuit component It is also possible to cover the above-mentioned thermoplastic resin plate, to suck air in the lower space of the electric wire from the air vent hole, and to make the thermoplastic resin plate enter the lower space of the electric wire (claim). Item 5) .

In addition, a circuit component is placed on a vacuum forming die,
Heats and softens the thermoplastic resin plate and vacuum forming
Circuit for attaching the thermoplastic resin plate to the circuit component.
Before fixing road components, such as busbars and terminals
Before heat-softening the rising piece formed on the circuit component
The thermoplastic resin plate is adhered and the thermoplastic resin
It is also possible to bend the rising piece while the board is flexible
(Claim 6). Further, by forming a circuit on the thermoplastic resin plate, the locking hole and the projecting portion at the same time as the entry of thermoplastic resin plate to the lower side space, the upper edge portion and the projecting portion of the engagement stop holes It is also possible to closely connect the circuit
(Claim 7) .

[0011]

According to the first aspect of the present invention, heat-softening is performed.
Thermoplastic resin plate is a circuit component by vacuum molding or pressure molding
Suction or pressure into the inside of the lock hole of the
Get in. In the invention according to claim 2,
The air in the locking hole and the air in the lower space of the protrusion are vacuum molded
Is sucked through the air intake hole. And, the cooling of the thermoplastic resin plate
The upper edge and protruding part of the locking hole are made of thermoplastic resin
Is held firmly by

According to the fourth aspect of the present invention, the projection
The air in the lower space of the part communicates with the communication groove in the U-shaped folded part.
After that, it is discharged to the suction hole of the vacuum forming die. Claim 5
In the described invention, the thermoplastic resin plate is provided in a space below the electric wire.
Is sucked into the wire, thereby fixing the electric wire.
Also, in the invention according to claim 6, the rising piece is folded.
After bending, the thermoplastic resin plate cools and solidifies to maintain the bent part.
Holding the circuit components. Claims
According to the invention as set forth in 7, the circuit formed on the thermoplastic resin plate
Is at the same time as the suction of the thermoplastic resin plate
To secure reliable electrical contact with circuit components.

[0013]

1 to 5 show a first embodiment of a method for fixing a bus bar as a circuit component according to the present invention. This method includes an insulating thermoplastic resin plate 1 as shown in FIG. 1, a heater (not shown) for heating and softening the thermoplastic resin plate 1, a bus bar 2 fixed to the thermoplastic resin plate 1, and a bus bar 2. A vacuum forming mold 3 for sucking the softened thermoplastic resin plate 1 is used to fix the rising piece 4 of the bus bar 2 with the softened thermoplastic resin plate 1 as shown in FIG. is there. 1 and 2 constitutes a part of a circuit body 39 described later.

As shown in FIG. 1, the bus bar 2 has both ends bent at a right angle to form a rising piece 4.
The locking hole 5 is formed in the thermoplastic resin plate 1. The locking hole 5 is formed in a rectangular shape from the bottom plate 2 a of the bus bar 2 to the height direction of the rising piece 4.

The vacuum forming die 3 is provided with a mounting groove 6 having a slightly shallower or the same depth with respect to the bus bar 2, and an intake hole for the locking hole 5 of the bus bar 2 is formed at the bottom of the mounting groove 6. 7
Is provided. The intake hole 7 is provided at a position communicating with the locking hole 5. An intake hole 8 facing the thermoplastic resin plate 1 is provided in a portion other than the mounting groove 6 of the vacuum forming die 3. On the back side of the thermoplastic resin plate 1, a circuit pattern 9 made of a flexible conductive paste or a thin copper foil is formed in advance.

After setting the bus bar 2 in the vacuum forming mold 3 as shown in FIG. 3, the thermoplastic resin plate 1 is heated by a heater (not shown) in a state where the thermoplastic resin plate 1 is positioned on the bus bar 2, and the softened thermoplastic resin plate 1 is heated. Suction is performed with the vacuum mold 3. As a result, the resin plate 1 softened as shown in FIGS.
It covers the upper edge 4a of the rising piece 4 while being put on the top and entering the locking hole 5 of the bus bar 2. As a result, the bus bar 2 is connected to the resin plate 1, that is, the circuit board 10 formed by vacuum forming.
Firmly fixed to Since the suction hole 7 of the vacuum forming die 3 is provided in communication with the locking hole 5 of the bus bar 2 as shown in FIG. 3, the air in the locking hole 5 is sucked simultaneously with the evacuation,
The resin plate 1 is reliably drawn into the locking hole 5.

The paste circuit 9 on the resin plate 1 is gradually bent by the heat of the heater while being bent together with the resin plate 1 at the time of molding, and is completed as a small current circuit 9 'when the molding is completed. The circuit 9 ′ is drawn into the locking hole 5 at the same time as the molding of the resin plate 1, is closely connected to the upper edge portion 4 a of the rising piece 4, and is in close contact with the bottom plate portion 2 a of the bus bar 2. Then, the circuit board 10 that has been cooled and solidified as shown in FIG. 5 is removed from the mold 3 and stored in an electric connection box (not shown), or a circuit body 39 described later is formed.

The bus bar 2 may be cut and raised not at both ends but at an intermediate portion, and the raised piece (not shown) may be provided with the locking hole 5. This configuration is effective for a long bus bar or a bus bar having a male tab terminal at an end. Also,
The bus bar 2 and the circuit 9 'may be further electrically connected by a plating bath or soldering. Further, in this example, the thermoplastic resin plate 1 is formed by vacuuming, but instead of vacuum forming, air pressure forming or blow forming in which pressure is applied from the outside of the resin plate 1 may be performed.

FIG. 6 shows a second embodiment of the bus bar fixing method. In this method, a communication groove 20 for the suction hole 17 of the vacuum forming die 13 is formed in the bus bar 12, and a horizontal protrusion 21 is positioned above the communication groove 20 so as to be opposed to the communication groove 20. The softened thermoplastic resin plate 11 is inserted into the side space (locking space) 22.

That is, a pair of substantially U-shaped folded portions 23, 23 are integrally formed on both sides in the width direction of the rising pieces 14 bent at both ends of the bus bar 12, and the folded portions 2 are formed.
3, the communication groove 20 is formed inside, and a locking space 22 is cut out from the rising piece 14 above the communication groove 20, and a pair of horizontal projections is formed on both sides of the upper end of the rising piece 14. The parts 21 and 21 are formed.

The folded portion 23 includes a bent piece 23a extending from the side end of the rising piece 14 to the back side and the bent piece 23a.
And the folded back portion 23b is formed from the bent portion 23a, and the communication groove 20 in the form of a gap in the height direction is formed between the bent portion 23a and the folded back portion 23b. The communication groove 20 communicates with the intake hole 17 in the mounting groove 16.

Then, the bus bar 12 is set in the mounting groove 16, and the same thermoplastic resin plate 11 as in the previous example is placed on the bus bar 12 while being heated by a heater. As described above, the air in the locking space 22 above the folded portion 23 is sucked from the communication groove 20, the resin plate 11 enters the locking space 22, and the resin plate 11 is held so as to wrap the projecting portion 21. Thus, the bus bar 12 is firmly fixed to the resin plate 11, that is, the circuit board cooled and solidified.

FIGS. 8 and 9 show a third embodiment of a method for fixing a bus bar. According to this method, the thermoplastic resin plate 27 is heated and softened without providing a locking hole or a locking space in the rising piece 24 of the bus bar 25 as in the previous example.
6 and the rising piece 2
4 is bent inward and horizontally, and the bent pieces (projections) 24 a are held by the resin plate 27. The bending operation of the rising pieces 24 is performed using a press machine or the like while the resin plate 27 is flexible. According to this method, the height of the rising piece 24 is reduced to about half, and the circuit body described later can be thinned.

FIG. 10 shows an example of a circuit body to which the bus bar is connected and fixed. In FIG. 10, the rising piece 4 of the bus bar 2 'protrudes from the back side of the circuit board 10, and the thermoplastic resin plate 1 is fixedly inserted into the locking hole 5 thereof.
In this fixing method, a metal bracket 30 as a circuit component for fixing the circuit board 10, an electronic component mounted on the circuit board 10, a connection terminal 32 of various accessories 31, or an electric wire 33 is fixed to the circuit board 10. Metal bracket 3
4 and so on.

The circuit board 10 is bent into a three-dimensional shape in the attaching portion 35 of the auxiliary 31, <br/> on the surface of the circuit board 10 has facilities conductive plating to the conductive paste to a copper foil small current circuit 9 'is formed. The connection between the circuit 9 'and the bus bar 2' is made by direct contact, plating or soldering as described above.

FIG. 11 is a cross-sectional view showing the connection structure of the portion D in FIG. 10, in which a disc-shaped heat-resistant resin member 36 is embedded in the hole 37 of the resin plate 1 and integrally provided. 3
6 and the circuit 9 'and the end of the bus bar 2'
To connect. A tab-shaped terminal 40 is also connected and fixed to the circuit board 10. The circuit body 39 is formed by three-dimensional molding of the circuit board 10 and the bus bar 2 ′, the auxiliary device 31 or the terminal 40.
And the connection is fixed at the same time.

FIGS. 12 to 15 show an embodiment of a method of fixing a terminal which is one of circuit components. This method
As shown in FIG. 12, a tab-shaped terminal 40 having a pair of wire pressure contact pieces 42 and a horizontal (terminal width) protrusion 44 was set in a vacuum forming die 43, and a covered wire 53 was press-connected to the pressure contact pieces 42. Thereafter, as shown in FIG. 13, the pressure contact piece 42 of the terminal 40 is formed by a thermoplastic resin plate 41 heated and softened by a heater (not shown).
And the projection 44 and the electric wire 53 are wrapped around and fixed.

As shown in FIG. 12, the terminal 40 has a male tab 49 at the distal end of the substrate 48, a pair of wire pressure contact pieces 42 formed integrally at the base end of the substrate 48, and And a pair of horizontal projecting portions 44 formed by cutting and raising the middle portion of the male tab portion 49.

A rectangular locking hole 45 is formed in the pair of wire pressing pieces 42 in the height direction from the substrate 48. The pair of protruding portions 44 are integrally bent outward from a rising piece 44a cut and raised near the center of the substrate portion 48. Further, an air vent hole 54 for vacuum forming is formed at the center of the substrate portion 48 so as to face the electric wire 45 connected to the slit 51 between the pair of electric wire pressure contact pieces 42.

As shown in FIG. 13, a mounting groove 46 is formed in the vacuum forming die 43 with respect to the substrate portion 48 of the terminal 40, and each locking hole 45 of the terminal 40 is formed at the bottom of the mounting groove 46. Intake hole 4 for protrusion 44 and central air vent hole 54
7 _{1-47 3} are formed. The locking hole 45
And air vent holes 54 communicating with the intake hole 47 _3, 47 _2,
The protrusion 44 is located opposite the inlet hole 47 _1, the lower space (locking space) 52 of the projecting portion 44 communicates with the suction hole 47 _1.

[0031] Then, by sucking the thermoplastic resin sheet 41 heated and softened to the terminal 40 in a vacuum forming mold 43, the lower space 52 of the protrusion 44 of the terminal 40 from the intake hole 47 ₁ of the front as shown in FIG. 14 Air is sucked and the protrusion 4
4 is surrounded by a resin plate 41 and a rear intake hole 47 is provided.
The air in the locking hole 45 of the wire pressing piece 42 is sucked from ₃ and the resin plate 41 enters the locking hole 45. Here suction hole 47 ₁ of the front is communicated with the lower space 52 of the protrusion 44 through the cut-out portion 55 after cutting and raising the projecting portion 44, the rear air inlets 47 ₃ directly communicating with the locking hole 45 doing.

At the same time, as shown in FIG.
7 ₂ through the terminal center of air vent holes 54 from the air in the lower space (locking space) 56 of the pressure contact electric wires 53 is drawn, the wire 53 is wrapped with a resin sheet 41 in a substantially cylindrical shape.
By cooling and solidifying the resin plate 41 in this state, the protruding portion 44, the pressure contact piece 42, and the electric wire 53 are firmly held by the resin plate 41, and the terminals 40 are firmly fixed to the solidified resin plate 41, that is, the circuit board 50. Is done.

Instead of the terminal 40, a terminal 61 having a pair of loop pieces 58 integrally formed on both sides of a substrate portion 57 as shown in FIG. 16 may be used. The heat-softened resin plate 41 enters the locking hole 59 inside the loop piece 58 and holds the loop piece 58 so as to surround it. This terminal 61
The above-described locking hole 45 is not provided in the wire pressure contact piece 60.

In the method of fixing the terminals 40 and 61, similarly to the method of fixing the bus bar 2, instead of vacuum forming, pressure forming or blow molding in which pressure is applied from the outside of the resin plate can be performed.

FIG. 17 shows a circuit body 62 using the terminal 40.
It is shown. In this circuit body 62, the male tab portion 49 of the terminal 40 projects from the terminal of the circuit board 50 and is connected to a connector (not shown). Further, the pressure contact piece 4 of the terminal 40
The electric wire 53 connected to 2 is connected to an auxiliary machine 63 arranged on the back side of the circuit board 50. A press contact terminal 64 protrudes from the back side of the auxiliary machine 63, and the press contact piece 42 'of the press contact terminal 64 is formed with a locking hole 45' similar to the previous example.
Auxiliary machine 63 is fixed with thermoplastic resin plate 41 entering therein. Two electric wires 53 are branched and connected to a desired press contact terminal 64 ₁ . The press contact terminals 64, the press contact portions of the terminals 40, and the electric wires 53 are fixed by the resin plate 41, and at the same time, protection such as insulation and waterproof and dustproof is performed.

[0036]

As described above, according to the present invention, the bus bar
Inside the locking holes of circuit components such as
When the softened thermoplastic resin plate enters the side space
Thus, the circuit components are easily and firmly fixed. At the same time
In addition, the circuit on the thermoplastic resin plate is
Enters into the space and makes close contact with the upper edge and protrusion of the locking hole
Therefore, the circuit and the circuit component are easily and reliably connected.

Then, the thermoplastic resin plate is softened by heating.
Forming into a three-dimensional circuit board and simultaneously
Fixing and connecting circuit parts such as busbars and terminals
And insulation of circuit parts by thermoplastic resin plate
And waterproof and dustproof, making it easy to manufacture three-dimensional circuits.
It is simple and quick.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a first embodiment of a method of fixing a bus bar as a circuit component according to the present invention.

FIG. 2 is a perspective view showing a fixed state.

FIG. 3 is a longitudinal sectional view showing a state before the bus bar is fixed to the circuit board.

FIG. 4 is a sectional view taken along the line AA of FIG. 2 showing the same fixed state.

FIG. 5 is a longitudinal sectional view showing a state where the circuit board is removed from a molding die.

FIG. 6 is an exploded perspective view showing a second embodiment of a method of fixing a bus bar.

FIG. 7 is a sectional view taken along the line BB of FIG. 6 showing the fixed state.

FIG. 8 is a perspective view showing a third embodiment of a method of fixing a bus bar.

FIG. 9 is a sectional view taken along the line CC in FIG. 8;

FIG. 10 is a perspective view showing a three-dimensional circuit body on which circuit components are mounted.

FIG. 11 is a sectional view taken along line DD of FIG. 10;

FIG. 12 is an exploded perspective view showing one embodiment of a method for fixing a terminal as a circuit component according to the present invention.

FIG. 13 is an exploded perspective view showing the fixed state.

FIG. 14 is a view corresponding to a section taken along line EE of FIG. 13;

15 is a view corresponding to a section taken along line FF of FIG. 13;

FIG. 16 is a perspective view showing another embodiment of the terminal.

FIG. 17 is a perspective view showing a circuit body using terminals.

FIG. 18 is a plan view showing a conventional circuit board.

FIG. 19 is a longitudinal sectional view of the same.

FIG. 20 is a perspective view showing another circuit board.

FIG. 21 is a vertical sectional view showing the molding method.

[Explanation of symbols]

1,41 thermoplastic resin plate 2,2 ', 12 bus bar 3,13,43 vacuum forming mold 4,14,44a rising piece 4a upper edge 5,45,59 locking hole 7,17,47 _{1 to} 47 ₃ intake hole 9 circuit 20 communication groove 21,44 projecting part 22,52,56 lower space 23 folded part 40,61,64 terminal 42 pressure contact piece 54 air vent hole 58 loop piece

──────────────────────────────────────────────────の Continued on front page (51) Int.Cl. ⁷ Identification code FI H05K 7/06 H01R 9/09 A

Claims (7)

(57) [Claims] 1. A circuit component is placed on a mold, and the
Heating and softening the resin plate, vacuum forming and pressure forming
A circuit for attaching the thermoplastic resin plate to the circuit component in a form or the like
In the method of fixing components, the circuit components such as busbars and terminals are horizontally penetrated.
Providing a locking hole and a protrusion protruding in the horizontal direction
Suction action and pressure forming at the time of vacuum forming of thermoplastic resin plate
The pressing action at the time causes the inside of the locking hole and the lower
A method for fixing a circuit component, wherein the circuit component is inserted. 2. A circuit component is placed on a vacuum forming die,
Heat and soften the plastic resin plate, and use vacuum forming
Circuit part for attaching the thermoplastic resin plate to the circuit component
In the method of fixing components, the circuit components such as bus bars and terminals
A locking hole and a protrusion that protrudes in the horizontal direction.
The intake hole communicating with the bottom of the stop hole and the space below the protrusion is located in front.
It is provided in the vacuum forming die, and air or air in the locking hole from the suction hole.
The air in the lower space of the protrusion is sucked and
And the thermoplastic resin plate enters the space below the protrusion
A method for fixing a circuit component, comprising: 3. The method according to claim 1, further comprising :
It is possible to provide a locking hole or the protrusion, or
Forming the locking hole inside the raised loop piece.
The method according to claim 2, wherein the circuit component is fixed. 4. A form a substantially U-shaped folded portion in the rising piece on the lower side of the projecting portion, the inside of the folded portion, characterized in that makes forming a communicating groove with respect to the intake hole The method for fixing a circuit component according to claim 3 . 5. Before having a pair of press-contact pieces for pressing an electric wire.
A serial circuit components, the air vent hole which faces the electric wire is provided, after pressing the wire to the piezoelectric contact piece, covered the thermoplastic resin plate is heated and softened on the circuit component, said from the bleeding hole by sucking air in the lower space of the electric wire, and characterized in that penetrate the thermoplastic resin sheet in the lower space of the electric wire 請
The method for fixing a circuit component according to claim 2 or 3 . 6. A heat-dissipating device in which circuit components are placed on a vacuum forming die.
Heat and soften the plastic resin plate, and use vacuum forming
Circuit part for attaching the thermoplastic resin plate to the circuit component
In the method of fixing products, the start-up formed on the circuit components such as busbars and terminals
The heat-softened thermoplastic resin plate is adhered to the bristles.
And while the thermoplastic resin plate is flexible,
A method for fixing a circuit component, comprising bending a piece . 7. A circuit is formed on the thermoplastic resin plate,
Said locking hole and said projection at the same time as the entry of thermoplastic resin plate to the lower side space of, claims, characterized in that for adhering connecting the circuit to the upper flange and the projecting portion of the engagement stop holes 1-5
The method for fixing a circuit component according to any one of the above.