JP3076742B2 - Photosensitive resin composition for thick film conductive circuit and method for forming thick film conductive circuit using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to the field of electronic components or circuit components, which are becoming increasingly smaller and more multifunctional, in the field of ultra-small and high-performance small motor coils or compact discs. Thick film conductivity suitable for manufacturing components such as optical pickups that are reading components, circuit boards that include finely laid out parts of LSIs, and manufacturing circuit components for connections such as display devices that are becoming increasingly finer. The present invention relates to a photosensitive resin composition for a circuit and a method for forming a thick-film conductive circuit using the same. In particular, the present invention relates to a high-density and low-resistance different-pitch connection wiring component including a portion having a minimum wiring pitch of less than 100 μm.

[0002]

2. Description of the Related Art As the performance of LSIs (Large Scale Integrated Circuits), etc., has become higher and higher, the number of pins has increased with the demand for higher performance, and the pitch of the pins has become narrower. For example, as seen in liquid crystal displays,
As the demand for higher definition has increased, the number of display scanning lines has increased, and at the same time, the wiring interval has become extremely narrow, making it difficult to mount an IC for controlling display.

Under such technical trends, high-density and low-density components for connecting components having greatly different circuit wiring intervals, for example, ICs and LSIs having pins with narrow pitches to a motherboard (which has a large circuit wiring interval). The demand for resistance different pitch connection wiring components is increasing. Although there is a document that defines such a part as “interposer”, (Nikkei Electronics 1995.16 (No. 62)
6) Pages 79 to 86) In the present invention, this is called a different pitch connection wiring component.

[0004] The required performance of different pitch connection wiring parts is as follows.
For example, as described in the sixth Microelectronics Symposium, pages 43 to 46, it has been reported that when a CPU is operated at a high-speed operation clock frequency, signal pulses are attenuated with an increase in wiring resistance. Further, it is said that when the wiring resistance of the connection between the control IC of the high-definition liquid crystal display element and the liquid crystal substrate increases, the S / N ratio decreases and the image becomes unstable. As a result, different pitch connection wiring components are required to have a low resistance circuit wiring and a small wiring pitch. Therefore, the circuit wiring is required to have a large sectional area, that is, a high conductor height.

Conventionally, as seen in a printed circuit board or the like, there are the following three methods for forming a conductive circuit. That is, a subtractive method of forming a desired circuit by etching or the like using a cured resin image of a photosensitive resin composition formed on a conductive substrate (hereinafter, referred to as a resin image in the present invention) as a protective film ( Also called an etching method), an additive method in which a resin image is formed on an insulating substrate and electroless copper plating is performed to form a conductive circuit, and a semi-additive method which is an intermediate method between the two. Is mentioned.

As another method of forming a high-density and low-resistance circuit wiring, for example, JP-A-52-137666 and JP-A-57-162489 disclose a method of filling a resist pattern with a thick film paste material. JP-A-55-4172
No. 9 mixes a thick film paste and a positive resist,
A method of exposing and developing is disclosed. JP-A-59-1
Japanese Patent No. 98792 discloses a method of manufacturing a thick-film pattern conductor by repeating resist lamination and exposure on a conductive substrate, followed by development and electroplating. JP-A-56-94690, JP-A-60-161605
The publication discloses a method of forming a fine pattern circuit by anisotropic electrolytic plating by combining a conductive substrate and photolithography.

[0007]

However, circuit wiring conductors obtained by a method combining copper-clad substrates, photolithography and etching are extremely difficult to suppress the side-etch phenomenon during etching of copper foil. This prevents high density and low resistance. Further, as the conductor height increases, this phenomenon becomes remarkable. Therefore, the thickness of the copper foil of the copper-clad board which is usually used is about 18 to 35 μm, but the wiring density is about 10 wires / mm, that is, If the wiring pitch is less than about 100 μm, the resistance cannot be made sufficiently low. Technically, the wiring pitch is about 50 μm.

In a thick-film pattern conductor obtained by a method of forming a high-density and low-resistance circuit wiring, pores are generated in the conductor when the paste is fired, and as a result, circuit characteristics are deteriorated due to an increase in conductor resistance. In JP-A-59-198792, it is expected that a resist pattern having a relatively high aspect ratio can be obtained.
There are many problems such as the introduction of defects due to positional deviation at the time of exposure, the occurrence of a defective resist shape, and the resulting short circuit.
Further, JP-A-56-94690 and JP-A-60-1
In the method disclosed in Japanese Patent No. 61605, the conductor design is controlled by the plating start width, and since the conductor shape is spherical, the thickness cannot be increased with respect to the width of the conductor, and high-density, low-resistance circuit wiring Can not be obtained.

In any of the above methods, a circuit wiring conductor having a conductor wiring density of 20 wires / mm or more, that is, a wiring pitch of 50 μm or less, and a conductor aspect ratio of 1.0 or more has not been practically obtained.

[0010]

Means for Solving the Problems The present inventors have conducted intensive studies based on these technical trends, and as a result, have found that a polyester prepolymer having an ethylenically unsaturated bond and a monomer having an ethylenically unsaturated bond In the liquid photosensitive resin composition containing as essential components, the molecular weight of the polyester prepolymer is 1200 to 25000 , and the monomer component has 3 to 4 acryloyl groups or methacryloyl groups in one molecule, and At least one compound that has at most 15 atoms bonded between the carbon atoms to which the acryloyl or methacryloyl group is bonded is liquid
A photosensitive resin composition for a thick-film conductive circuit, characterized in that the photosensitive resin contains 3 to 15% by weight .

Further, the photosensitive resin composition for a thick-film conductive circuit is coated on a conductive substrate to a thickness of 20 to 400 μm, and a portion where an image is to be formed is exposed to high energy rays, and then the photosensitive resin is exposed. After forming the desired resin image on the conductive substrate by dissolving or dispersing the unexposed portion of the conductive resin composition with a developing liquid, a conductor is formed by a plating method,
A method for forming a desired thick-film conductive circuit by removing the conductive substrate has been found.

[0012] In the present invention, the oligomer or prepolymer having an ethylenically unsaturated bond may be an alkyl diol or a diol having 5 or less ether bonds in a molecule, or an alcohol comprising a mixture thereof. Component and an acid component comprising a dicarboxylic acid having an ethylenically unsaturated bond alone or a mixture of a dicarboxylic acid having no ethylenically unsaturated bond and a dicarboxylic acid having an ethylenically unsaturated bond. Particularly preferred images are obtained when the polyester is a saturated polyester.

When the molecular weight is less than 500, the sensitivity as a photosensitive resin composition is too low to withstand use, and when the molecular weight exceeds 50,000, the developability after irradiation with high energy rays is remarkably reduced. No resolution can be obtained. As a composition for a conductive circuit, from the viewpoint of sensitivity and resolution, 120
A molecular weight of 0 to 25000 is a preferred range. As the oligomer or prepolymer used as the photosensitive resin composition of the present invention, unsaturated polyester, unsaturated polyurethane, oligoester acrylates or oligoester methacrylates, unsaturated polyamides, unsaturated polyimides, unsaturated polyethers, Examples thereof include unsaturated polyacrylates or unsaturated polymethacrylates, various modified products thereof, mixtures thereof, and compounds having a carbon-carbon double bond. Of these, unsaturated polyesters or unsaturated polyurethanes are preferable examples of obtaining an image having a large image-to-width ratio (hereinafter, referred to as an aspect ratio).

As unsaturated polyesters, for example, unsaturated dibasic acids such as maleic acid, fumaric acid and itaconic acid or anhydrides thereof and ethylene glycol, propylene glycol, diethylene glycol, triethylene glycol, glycerin, trimethylolpropane, Polyesters reacted with polyhydric alcohols such as pentaerythritol, 1,4-polybutadiene having a terminal hydroxyl group, hydrogenated or non-hydrogenated 1,2-polybutadiene, butadiene-styrene copolymer, butadiene-acrylonitrile copolymer And polyesters in which a part of the acid component is replaced with a saturated polybasic acid, or polyesters modified with a drying oil or semi-dry oil.

Examples of the unsaturated polyurethanes include the above-mentioned polyhydric alcohols and polyester polyols,
Polyols such as polyether polyols, 1,4-polybutadiene having a terminal hydroxyl group, hydrogenated or non-hydrogenated 1,2-polybutadiene, butadiene-styrene copolymer, butadiene-acrylonitrile copolymer and the like, and tolylene diisocyanate , Diphenylmethane, 4, 4 '
-Compounds in which unsaturated groups are introduced by utilizing the reactivity of terminal isocyanate groups or hydroxyl groups of polyurethanes derived from polyisocyanates such as diisocyanate and hexamethylene diisocyanate. That is, an unsaturated group is introduced by reacting a compound having active hydrogen such as a hydroxyl group, a carboxyl group, or an amino group with an isocyanate, or an unsaturated group is introduced by a reaction between a carboxyl group and a hydroxyl group, or Compounds obtained by linking unsaturated polyesters with polyisocyanates.

Particularly preferred examples include an alcohol component comprising a mixture of an alkyl diol and a diol having 5 or less ether bonds in a molecule, a dicarboxylic acid having an ethylenically unsaturated bond alone or an ethylenically unsaturated bond. Having a molecular weight of from 500 to 5,000, obtained by polycondensation of an acid component comprising a mixture of a dicarboxylic acid having no carboxylic acid and a dicarboxylic acid having an ethylenically unsaturated bond.
0 unsaturated polyesters.

In the present invention, the monomer component has at least three acryloyl groups or methacryloyl groups in one molecule, and 15 or less carbon atoms to which the acryloyl group or methacryloyl group is bonded. Monomers having atoms and bonded to each other have a high density of 20 / mm or more, that is, a pitch of 50 μm or less, and have a high density of 20 μm.
It is an essential component for forming a photosensitive resin image having a thickness of at least m. That is, the cross-sectional shape of the photosensitive resin image has a large ratio of the dimension in the height direction to the width direction (aspect ratio), and the cross-linking density after photopolymerization is increased to prevent the image from falling down or tilting, thereby maintaining the image strength. Is necessary.

On the other hand, the photosensitive resin composition must be completely removed by a developing liquid in order to perform plating on the unexposed portions on the conductive substrate, and light spills due to scattering and reflection of the exposure system. The polymer should not be polymerized or crosslinked so that the photosensitive resin composition cannot be removed by the developing liquid. That is, since it is necessary to increase the difference in the crosslinking density between the image portion and the unexposed portion, at least one of the monomer components is a polymerizable monomer having at least three acryloyl or methacryloyl groups in one molecule. Mers are required. When only the polymerizable monomer having two or less acryloyl groups or methacryloyl groups is used, or the carbon atom to which the acryloyl group or methacryloyl group of the polymerizable monomer having three or more acryloyl groups or methacryloyl groups is bonded. Even when a monomer having 16 or more atoms therebetween is used, a cross-linking density of a resin image sufficient to carry out the present invention cannot be obtained, and the image is softened and falls down, or the image of the adjacent A desired resin image cannot be obtained due to the sticking and sticking.

From the above viewpoint, at least 3
Monomer having an acryloyl group or a methacryloyl group, and having at most 15 atoms between the carbon atoms to which the acryloyl group or the methacryloyl group is bonded are essential in the present invention. Component. The number of acryloyl groups or methacryloyl groups contained in this monomer is at least three in one molecule, but even if the number is more than necessary, the number of reactive groups involved in the photoreaction is limited and contributes to the curing reaction. Is less, and instead remains as scum (semi-cured resin component residue) on the unexposed part substrate surface,
In the subsequent plating process, a large problem such as poor plating adhesion is caused. The preferred range of the number of acryloyl groups or methacryloyl groups contained in this monomer is 3 to 10.

The monomer component can be detected by liquid chromatography or gas chromatography. The meaning of having 15 or less atoms between the carbon atoms to which the acryloyl group or the methacryloyl group is bonded is described below. First, a carbon atom to which an acryloyl group or a methacryloyl group is bonded is a carbon atom on the hydroxyl group side immediately after the ester bond with acrylic acid or methacrylic acid. The term "carbon atom on the hydroxyl group side" means a carbon atom bonded to a hydroxyl group generated when an ester is hydrolyzed. In other words, it means that not more than 15 atoms are bonded between the carbon atoms and not including the carbon atom counted at the shortest. When this number is 0, the carbon atoms are bonded to each other, and the case where the carbon atoms are the same is not included. In addition, how to count the number of atoms between the carbon atoms is determined by calculating the number of atoms between the carbon atoms among the remaining two or more carbon atoms for any one of the three or more carbon atoms. The smallest number is selected, and the number of atoms is used as the number of atoms between the carbon atoms.

Specific examples for the purpose of explanation will be described below. Trimethylolpropane trimethacrylate is exemplified when the number of atoms between the carbon atoms is 1, tri [acryloyl-di (oxyethyl)] trimethylolpropane is exemplified as 13
Examples of 0 include glycerol triacrylate (0 or 1 depending on the counting method, but 0 according to the above definition), and examples of 1 include dipentaerythritol hexaacrylate (1 or 5 but also 1). )
Becomes

One molecule has three or more acryloyl or methacryloyl groups, and 15 carbon atoms are bonded to the acryloyl or methacryloyl group.
Monomers having no more than 3 atoms bonded thereto include trimethylolpropane triacrylate or methacrylate, triacryloyl or trimethacryloylethyl trimethylolpropane, di (ethyleneoxy) trimethylolpropane triacrylate or methacrylate, Erythritol triacrylate or methacrylate, pentaerythritol tetraacrylate or methacrylate, dipentaerythritol tetra / penta / hexaacrylate or methacrylate, glycerol triacrylate or methacrylate, or mono or poly (oxyethyl) next to the acrylate or methacrylate ester group of these compounds Having a structure in which a group or mono- or poly (oxypropyl) group is inserted Compounds of alkyl polyols such as polyhydric alcohols and vinyl alcohol oligomers obtained by condensing a compound having three or more hydroxyl groups, a compound in which an acryloyl group or a methacryloyl group is introduced into three or more and up to ten hydroxyl groups, etc. Can be mentioned as a specific example. These monomers may be used alone or in combination of two or more components. If the content of these monomers is too small, the resin image strength is low and the effect of the present invention cannot be exerted. If the content is too large, disadvantages such as generation of cracks in the resin image occur. In the present invention, the preferred content of these monomers is 10% of the photosensitive resin composition.
1 to 30 parts by weight of 0 parts by weight, more preferably 3 to 30 parts by weight
It is preferable to use it in the range of 15 parts by weight.

Various components can be added to the photosensitive resin composition of the present invention, if necessary, for the purpose of obtaining better images or for the convenience of handling. For example, a monomer having two or less polymerizable functional groups in one molecule to adjust the viscosity of the photosensitive resin composition, or a polymer having a phosphoric acid group to improve adhesion to a conductive substrate. For the purpose of improving the storage stability of the photosensitive monomer and the photosensitive resin composition, the composition may contain a thermal polymerization inhibitor or the like as a component.

In the present invention, a photopolymerization initiator or a photosensitizer can be added for the purpose of shortening the reaction time and curing time of the photosensitive resin composition, or improving sensitivity and resolution. As the photopolymerization initiator or photosensitizer that can be used in the present invention, for example, benzoin, benzoin alkyl ethers, polynuclear quinones such as anthraquinone, benzophenone, chlorobenzophenone, Michler's ketone,
Freonone, thioxanthone, dialkylthioxanthones, halogenated thioxanthones, naphthalenesulfonyl chloride, and the like.

The addition amount of these photopolymerization initiators depends on the amount of the resin component 1 comprising an oligomer or a prepolymer and a monomer.
The range of 0.001 to 10 parts by weight relative to 00 parts is suitable. High-energy radiation as referred to in the present invention means ultraviolet light, far ultraviolet light, laser light or the like that can efficiently cure the photosensitive resin composition. It is effective for curing the composition.

Next, a method for forming a thick-film conductor circuit using the photosensitive resin composition will be described. That is, on a conductive substrate, in a liquid photosensitive resin composition having a prepolymer or oligomer having an ethylenically unsaturated bond and an ethylenically unsaturated compound monomer as essential components, the molecular weight of the prepolymer or oligomer is 500 to 50,000,
The monomer has three or more acryloyl or methacryloyl groups in one molecule, and one between carbon atoms to which the acryloyl or methacryloyl group is bonded.
A photosensitive resin composition for a thick film circuit, which is a monomer having 5 or less atoms, is applied to a thickness of 20 to 400 μm, subjected to image forming exposure with high energy rays, After dissolving or dispersing and removing the unexposed portion of the photosensitive resin composition with a developing liquid to form a desired image on a conductive substrate, a conductor is formed by a plating method, and then the conductive substrate is removed. Is achieved by doing

As a method of removing the conductive substrate, for example, a method of etching with an aqueous solution of an acid, an alkali, or a salt;
A method such as a method of polishing and shaving, a method of mechanical peeling, or a combination thereof can be used. Further, before or after removing the conductive substrate to improve the strength of the thick-film conductive circuit, a method such as bonding an insulating material to the surface of the thick-film conductive circuit opposite to the conductive substrate may be used. Good.

If necessary, the resin image portion may be removed before transferring the thick film conductor pattern to the insulating substrate or after transferring and removing the conductive substrate. The coating thickness of the photosensitive resin composition is not particularly limited, and is determined in the range of 20 to 400 μm depending on the required conductor thickness of electronic components and precision circuit boards. Also, there is no particular limitation on the conductive substrate,
Substrates such as aluminum and copper are preferably used. If necessary, the conductive substrate may be subjected to a physical or chemical surface treatment, for example, in order to improve the adhesion between the conductive substrate and the photosensitive resin composition or the plating film.

[0029]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail with reference to examples. The present invention is not limited by the embodiments.

[0030]

Example 1 Reaction time of diethylene glycol, propylene glycol, adipic acid, fumaric acid, and isophthalic acid in a nitrogen atmosphere at a molar ratio of 0.38 / 0.12 / 0.24 / 0.14 / 0.12 in a nitrogen atmosphere The polycondensation was performed under reduced pressure for 4 hours to produce an unsaturated polyester prepolymer having a number average molecular weight of 1600.

To 100 parts by weight of the prepolymer, 12 parts of tetraethylene glycol dimethacrylate, 5 parts of diethylene glycol dimethacrylate, 8 parts of 2-hydroxyethyl methacrylate, 12 parts of pentaerythritol trimethacrylate, 3 parts of pentaerythritol tetramethacrylate, and monophosphate ( (Methacryloyloxyethyl) 5 parts, 2,2-dimethoxy-2-phenylacetophenone 2 parts, 4-tert-butyl-butylcatechol
05 parts, Kayaset Red A-2G manufactured by Nippon Kayaku Co., Ltd.
0.15 parts was added and mixed well with stirring to obtain a photosensitive resin composition.

Next, this photosensitive resin composition is applied to an aluminum plate to a thickness of 100 μm, and the ultraviolet light of a mercury short arc lamp is passed through a photomask corresponding to a wiring pattern having a density of 20 lines / mm (wiring pitch 50 μm). And the unexposed portions were removed with a 1% aqueous sodium borate solution to form a resin image. Next, the aluminum plate on which the resin image was formed was subjected to electrolytic copper plating, and the aluminum plate was etched and removed with 10% hydrochloric acid to obtain a wiring density of 20 wires / mm and a conductor thickness of 1
A thick film conductor wiring board of 00 μm was obtained.

[0033]

Example 2 Diethylene glycol, fumaric acid, isophthalic acid and itaconic acid were mixed in a molar ratio of 0.5 / 0.13 / 0.
Polycondensation was carried out at a ratio of 24 / 0.13 under the same conditions as in Example 1 to produce an unsaturated polyester prepolymer having a number average molecular weight of 1200. To 100 parts by weight of the prepolymer, 15 parts of tetraethylene glycol dimethacrylate,
5 parts of diethylene glycol dimethacrylate, 5 parts of 2-hydroxyethyl methacrylate, 3 parts of diacetone acrylamide, 12 parts of trimethylolpropane trimethacrylate, mono (methacryloyloxyethyl) phosphate
5 parts, 4 parts of benzoin isobutyl ether, 0.05 parts of 4-tert-butylcatechol, and 0.1 part of Kayaset Red A-BR manufactured by Nippon Kayaku Co., Ltd. are added and stirred well.
The mixture was mixed to obtain a photosensitive resin composition.

Next, this photosensitive resin composition was applied on an aluminum plate to a thickness of 380 μm, and irradiated with ultraviolet rays from a mercury short arc lamp through a photomask corresponding to a wiring pattern having a pitch of 95 μm. The portion was removed with a 1% aqueous sodium borate solution to form a resin image. Next, the aluminum plate on which the resin image was formed was subjected to electrolytic copper plating, and the aluminum plate was removed by etching with 10% hydrochloric acid to obtain a thick-film conductor wiring board having a wiring pitch of 95 μm and a conductor thickness of 380 μm.

[0035]

Comparative Example A photosensitive resin composition was prepared in the same manner as in Example 2 except that propylene glycol dimethacrylate was used instead of trimethylolpropane trimethacrylate. This photosensitive resin composition was applied to an aluminum plate to a thickness of 380 μm, and irradiated with ultraviolet rays from a mercury short arc lamp through a photomask corresponding to a wiring pattern having a pitch of 95 μm.
% Sodium borate aqueous solution to form a resin image. This resin image is softer than the resin image of Example 2, falls down, or sticks next to the pattern, and the conductor after plating is intermittent, so it must be used as a thick-film conductor wiring board at all. Could not be done.

When the resin image was formed by doubling the ultraviolet irradiation time in order to increase the strength of the resin image, the unexposed portion of the resin was cured, and the conductor could not be formed by plating. .

[0037]

Example 3 Toyo Aluminum Co., Ltd., thickness 100 μm
m aluminum substrate was subjected to surface treatment at 30 ° C. for 80 seconds using AZ401 zincate treatment solution manufactured by Uemura Kogyo Co., Ltd. Next, diethylene glycol, propylene glycol, and adipic acid, itaconic acid, and fumaric acid were used in a molar ratio of 0.45 / 0.05 / 0.20 / 0.15 /
In a nitrogen atmosphere at a rate of 0.15, a reaction temperature of 195 ° C., a reaction time of 5 hours, and polycondensation under reduced pressure, 100 parts of an unsaturated polyester resin having a number average molecular weight of 1700, 15 parts of pentaerythritol trimethacrylate, 3 parts of diethylene glycol dimethacrylate, 7.5 parts of tetraethylene glycol dimethacrylate, 4 parts of 2-hydroxyethyl methacrylate, 3.6 parts of mono (methacryloyloxyethyl) phosphate, 2 parts of 2,2-dimethoxy-2-phenylacetophenone, 0.04 parts of 4-tert-butylcatechol and 0.2 parts of Oil Yellow 3G manufactured by Orient Chemical Co., Ltd. were added and sufficiently stirred and mixed to obtain a liquid photosensitive resist. The prepared photosensitive resist was placed on the aluminum substrate treated as described above, and the product was manufactured by Asahi Kasei Corporation.
The coating was performed using an RB apparatus. Minimum wiring pitch 26μm
Exposure and development (1% sodium borate solution, 40 ° C., discharge pressure 0.1 k) using a parallel light type light source manufactured by Oak Co. through a glass mask corresponding to a wiring pattern including
g / cm ² ) to form a resin pattern having a width of 5 to 10 μm and a height of 32 μm on the treated aluminum substrate.

The aluminum substrate on which the resin pattern was formed was coated with a copper pyrophosphate plating solution manufactured by Harsha Murata Co., Ltd. under the conditions of a cathode current density of 3 A / dm ² and a thickness of 30 μm.
Then, a plated copper film having a film thickness of 1 mm was deposited to form a patterned conductor. After removing the resin pattern using methylene chloride, a thermocompression bonding is performed on a 25 μm-thick polyimide sheet manufactured by DuPont using an adhesive sheet, and the aluminum substrate is reduced to 10%.
The film was removed by etching with hydrochloric acid to obtain a thick-film conductive circuit including a portion having a minimum wiring pitch of 26 μm. This circuit could be used as a low resistance different pitch connection component.

[0039]

The photosensitive resin composition for a thick-film conductive circuit of the present invention can increase the difference in cross-link density between exposed and unexposed portions, and can provide a ratio of the dimension in the height direction to the width direction. High resolution can be formed because of high resin image, and there are very few plating defects because there is very little resin residue in unexposed areas.
High wiring density, low resistance and thickness of 20 to 400 μm
A highly reliable thick film conductive circuit can be formed. Further, by using the photosensitive resin composition of the present invention, a high-density thick-film conductor circuit can be formed relatively inexpensively and relatively easily.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-3-205417 (JP, A) JP-A-6-138659 (JP, A) JP-A-60-225149 (JP, A) 283830 (JP, A) JP-A-6-282069 (JP, A) JP-A-6-230571 (JP, A) JP-A-4-294354 (JP, A) JP-A-3-172301 (JP, A) JP-A-3-250012 (JP, A) JP-A-61-148444 (JP, A) JP-A-63-157143 (JP, A) JP-A-6-184270 (JP, A) JP-A-6-258830 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) G03F 7/027 H05K 3/06 H05K 3/20

Claims (2)

(57) [Claims] 1. Polyester having an ethylenically unsaturated bond
In a liquid photosensitive resin composition comprising a terprepolymer and a monomer having an ethylenically unsaturated bond as essential components, the molecular weight of the polyester prepolymer is from 1200 to 2
5,000 , and the monomer component has 3 to 4 acryloyl groups or methacryloyl groups in one molecule, and has 15 or less atoms between carbon atoms to which the acryloyl group or methacryloyl group is bonded. At least one of the compounds bonded to the liquid photosensitive resin by 3 to 15 times
% Of a photosensitive resin composition for a thick film conductive circuit. 2. The photosensitive resin composition according to claim 1, which is applied to a conductive substrate to a thickness of 20 to 400 μm, and exposed to a high energy ray on a portion where an image is to be formed. Dissolving or dispersing and removing the unexposed portion of the resin composition with a developing liquid to form a desired image on the conductive substrate, forming a conductor by plating, and removing the conductive substrate. A method for forming a thick film conductive circuit.