JP3077520B2 - Electrode formation method for electronic device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming electrodes of an electronic device, for example, a piezoelectric resonator, an inductance device, a capacitor device, an IC device and the like.

[0002]

2. Description of the Related Art In an electronic element having a complicated outer shape having concaves and convexes such as grooves, for example, a tuning fork type piezoelectric resonator 31 shown in FIG.
4 may be formed. In this case, the vibration electrodes 32 and 33 provided on the front surface of the resonator 31 and the vibration electrode 3 provided on the back surface
4, the edges of the vibrating electrodes 32 to 34 have to be retracted at least a certain distance from the end face of the resonator 31 so that the end faces of the resonator 31 are not electrically connected via the end face of the resonator 31. For this reason, it is necessary to form the vibrating electrodes 32 to 34 at a predetermined position of the resonator 31 with high accuracy, and the productivity is low.

The masks 38, 39 used for forming the vibrating electrodes 32-34 must have holes 38a, 38b, 39a machined according to the shapes of the vibrating electrodes 32-34. Masks used to manufacture electronic devices of complex shapes have been expensive. Therefore,
An object of the present invention is to provide a method for forming an electrode of an electronic device having excellent productivity.

[0004]

In order to solve the above-mentioned problems, a method for forming an electrode of an electronic device according to the present invention comprises:
(A) a step of providing a masking material on the surface of a block-shaped work provided with an uneven portion; and (b) a plate-like shape obtained by cutting the block-shaped work, having the uneven portion, and providing the masking material on an end surface. A step of cutting out the work; (c) providing electrodes on the front and back surfaces of the plate-like work; and (d) removing the masking material from an end surface of the plate-like work.

According to the above-described method, since the masking material covers the end face of the plate-like work, when the electrodes are provided on the front and back surfaces of the plate-like work, a part of the electrode material may wrap around the end face of the plate-like work. In some cases, the electrode material adheres to the masking material surface. Then, after forming the electrode, the masking material is removed from the end face of the plate-shaped work, thereby removing extra electrode material attached to the surface of the masking material, so that the electrodes provided on the front and back surfaces of the work are electrically connected via the work end face. No more worrying about connecting to

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for forming an electrode of an electronic device according to the present invention will be described below with reference to the accompanying drawings. In this embodiment, a piezoelectric resonator used as a filter or an oscillator will be described as an example. As shown in FIG. 1, grooves 2, 2 are arranged at predetermined intervals in a width direction of a long piezoelectric block 1 as a work.
3 are alternately formed. The groove 2 has a U-shaped cross section, and the groove 3 has a rectangular cross section. As a material of the piezoelectric block 1, ceramics such as PZT, quartz, L
iTaO ₃ or the like is used.

Next, masking films 4 and 5 are provided on the upper surface and the lower surface of the piezoelectric block 1, respectively. The masking films 4 and 5 are formed by means such as spraying, dipping, and potting. As a material of the masking films 4 and 5,
Examples of the resin that can be removed in a later process include 3044 (trade name) manufactured by 3M Co., which can be physically peeled off, and an aluminum foil with an adhesive. Alternatively, there is a resin which is cured by UV irradiation to reduce the adhesive strength, and a resin which is heated to expand and foam the gas therein to reduce the adhesive strength. A specific example of the latter is River Alpha (trade name) manufactured by Nitto Denko. Further, a material that dissolves or decomposes by a solvent or water, a material that burns off by heat, or the like may be used. Specific examples thereof include commonly used inks and paints, and alkali-removable resist inks.

Next, the piezoelectric block 1 is cut along the dashed line C1 to cut out a mother board 10 having a predetermined thickness. As shown in FIG. 2, a mask 14 is applied to the surface of the motherboard 10, which is a plate-like work. It is not necessary to apply a mask to the back surface. The mask 14 has a large rectangular hole 14
A mask provided with a and provided with holes matching the shape of the vibrating electrode as in the related art is unnecessary. Therefore, an inexpensive mask is sufficient. The alignment between the mask 14 and the motherboard 10 may have relatively coarse precision, and the productivity is good.

[0009] Thereafter, processing such as sputtering, vapor deposition, plating, or printing and drying of Au, Ag, Cu, Ni, Pd and alloys thereof is performed, and vibrating electrodes 11 and 12 are provided on the front and back surfaces of the motherboard 10. At this time, even if a part of the sputtered metal, the vapor deposited metal, the plated metal, or the like may reach the end face of the motherboard 10, the metal adheres to the surface of the masking films 4 and 5 and the end face of the motherboard 10. Does not adhere directly to Vibrating electrode 11,
The edge of 12 reaches the end face of the motherboard 10. Thereafter, the motherboard 10 is cut along the dashed line C2, and the piezoelectric resonator 15 is cut out.

As shown in FIG. 3, in the cut-out piezoelectric resonator 15, the masking films 4, 5 are removed from the end face of the piezoelectric resonator 15, and at the same time, the excess The electrode material is also removed. The removal of the masking films 4 and 5 is performed by flipping and peeling off a physically removable resin or an aluminum foil with an adhesive. When the masking films 4 and 5 are made of a material whose adhesive strength is reduced by UV irradiation, the masking films 4 and 5 are irradiated with UV.
After weakening the adhesive strength of No. 5, peel off and peel off. When the masking films 4 and 5 are made of a material whose adhesive strength is reduced by heat, the masking films 4 and 5 are peeled off after being heated to weaken the adhesive strength.

The thus-obtained piezoelectric resonator 15 has the groove 2, the surface of which is provided with L-shaped vibration electrodes 11a and 11b obtained by dividing the vibration electrode 11, and the common electrode 12 is provided on the entire back surface. The edges of the vibrating electrodes 11 a, 11 b, 12 reach the end face of the piezoelectric resonator 15. Since no extra vibrating electrode material is attached to the end face of the piezoelectric resonator 15, the electrode 1
There is no possibility that the electrodes 1a and 11b and the electrode 12 are electrically connected via the end face of the piezoelectric resonator 15. This piezoelectric resonator 15
Is a tuning fork type three-terminal element, and its vibration mode is a thickness vibration mode. Then, the vibrating electrodes 11a, 11b, 12
Has reached the end face of the piezoelectric resonator 15, there is no fear that the mutual positional relationship between the vibrating electrodes 11a to 12 is shifted between the front and back of the piezoelectric resonator 15, and a stable resonance characteristic can be obtained.

The method for forming an electrode of an electronic device according to the present invention is not limited to the above embodiment, but can be variously modified within the scope of the invention. The masking material does not need to be in the form of a film, but may be filled in, for example, grooves of a block-shaped work. In the above embodiment, the case of a piezoelectric resonator has been described, but a resistance element, an inductance element,
It may be a capacitor element, an IC element, or the like.

[0013]

As is apparent from the above description, according to the present invention, after forming electrodes on the front and back surfaces of a plate-like work provided with a masking material on the end face, the masking material is removed from the end face of the plate-like work. By removing excess electrode material adhering to the masking material, there is no need to worry about the electrodes formed on the front and back surfaces of the plate-like work being electrically connected through the work end surface, and to manufacture electronic elements with good productivity. Can be. In addition, even for an electronic device having a complicated shape having an uneven portion such as a groove, a simple mask can be used without using an expensive mask having a hole corresponding to the shape of the electrode, so that the manufacturing cost is reduced. You. Furthermore, since the edge of the electrode reaches the end face of the electronic element, there is no fear that the mutual positional relationship between the electrodes is shifted between the front and back of the electronic element, and an electronic element with stable electric characteristics can be obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of a method for forming electrodes of an electronic device according to the present invention.

FIG. 2 is a perspective view showing a method of forming an electrode following FIG. 1;

FIG. 3 is a perspective view showing a method of forming an electrode following FIG. 2;

FIG. 4 is a perspective view showing a conventional electronic element.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Piezoelectric block (block-like work) 2, 3 ... Groove (irregular part) 4 ... Masking film 10 ... Motherboard (plate-like work) 11, 12 ... Vibration electrode 15 ... Piezoelectric resonator

Claims (1)

(57) [Claims] 1. A step of providing a masking material on a surface of a block-shaped work provided with an uneven portion, and cutting the block-shaped work to have the uneven portion and providing the masking material on an end surface. An electrode on the front and back surfaces of the plate-like work; and a step of removing the masking material from an end surface of the plate-like work.