JP3079605B2 - Composition for forming conductive elastomer - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electrically conductive elastomer forming <br/> composition, particularly to a conductive elastomer forming composition for forming a conductive elastomer having a durability.

[0002]

2. Description of the Related Art Conventionally, various conductors have been used for printed circuit boards,
It is used as a circuit board for a liquid crystal display element, and further as a connection element such as an integrated circuit chip. As such a conductive elastomer, there is a conductive elastomer in which conductive particles are dispersed in a polymer elastomer.
951, JP-A-51-93393, JP-A-53-1477
Various types are known from JP-A-72-72, JP-A-54-146873 and the like. As the material of the elastomer constituting the conductive elastomer, silicone rubber, urethane rubber, polybutadiene rubber, natural rubber, polyisoprene rubber, SBR, NBR, EPDM, EPM, polyester rubber, chloroprene epichlorohydrin rubber and the like are known. (See JP-A-58-152033).

[0003]

However, it is difficult to satisfactorily disperse the conductive particles in a solid state even with the above-mentioned elastomeric material. Alternatively, a method of using urethane rubber, in which conductive particles are dispersed, and then cured to change into an elastomer is suitably used. On the other hand, when the conductive elastomer is applied, for example, as a connection element of a circuit board, it is necessary to hold and fix the conductive elastomer at the position of the lead electrode of the circuit board to be connected. is there.

However, a conductive elastomer made of silicone rubber cannot be fixed sufficiently to a circuit board due to the low adhesiveness between the silicone rubber and the lead electrode. There is a problem that a static connection cannot be achieved. This has become a major problem with miniaturization of circuit boards. Further, when a urethane rubber obtained by a cross-linking reaction between an isocyanate compound and a polyol compound is used as the material of the elastomer, the isocyanate compound easily reacts with moisture in the air and foams in the process of producing the conductive elastomer. In addition, it is difficult to obtain an elastomer having low workability and uniform properties as an elastomer.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a conductive material which has good adhesiveness to an application object such as a circuit board, can achieve alignment with a lead electrode or the like with high accuracy, and has excellent durability. An object of the present invention is to provide a composition for forming a conductive elastomer capable of forming a conductive elastomer having characteristics.

[0006]

Conductive elastomer forming composition of the present invention SUMMARY OF THE INVENTION are in prepolymer having the (a) comprising a polymer diol compound is reacted with a diisocyanate compound, terminal isocyanate groups, the following formula 1 100 parts by weight of a urethane epoxy polymer obtained by reacting an epoxy compound represented by

[0007]

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(In the formula 1 , R ^{1 to} R ³ each represent a hydrogen atom or a lower alkyl group having 1 to 5 carbon atoms, and R ⁴ represents a methylene group, an alkylene group, an alkylidene group or an alkylene group having 1 to 10 carbon atoms. It represents an arylene group.) (B) A paste composition containing 0.1 to 10 parts by weight of a curing agent or a cross-linking agent, and (c) 30 to 1000 parts by weight of conductive particles , and having an electrode. Apply to applicable object
Cloth is cured and integrated with the applicable object
A conductive elastomer layer is formed.

Hereinafter, the present invention will be described in detail.
In the present invention, a prepolymer having an isocyanate group at a terminal is obtained by reacting a polymer diol compound with a diisocyanate compound, and the prepolymer is provided with an epoxy compound represented by the above formula 1 (hereinafter referred to as a “specific epoxy compound”). ) To obtain a urethane epoxy polymer (hereinafter referred to as “component (a)”). A curing agent or a cross-linking agent (hereinafter referred to as “(b)”) is added to this component (a).
Component) and conductive particles (hereinafter referred to as "component (c)") in a specific ratio, respectively, to obtain a rubber composition for forming a conductive elastomer.

Component (a) The component (a) is a urethane epoxy polymer obtained by reacting a prepolymer having isocyanate groups at terminals, preferably at both terminals, with a specific epoxy compound. The prepolymer having an isocyanate group at the terminal is obtained by subjecting a specific polymer diol compound and a diisocyanate compound to urethanization reaction.

Here, as the polymer diol compound,
It is preferably a chain, polyester diol in which the monomer unit is an ester bond, polyether diol in which the monomer unit is an ether bond, liquid polybutadiene diol in which a butadiene unit is directly bonded, silicone diol, which is a dimethylsiloxane unit, and polycaprolactam diol , Polycarbonate diol and the like.

Specific examples of the polyester diol include:
For example, ethylene glycol, polyethylene glycol,
Polyhydric alcohols such as propylene glycol, polypropylene glycol, tetramethylene glycol, polytetramethylene glycol, 1,6-hexanediol, neopentyl glycol, 1,4-cyclohexanedimethanol, and phthalic acid, isophthalic acid, terephthalic acid, and maleic Reaction formation with polybasic acids such as acid, fumaric acid, adipic acid and sebacic acid, or cyclic esters having ring-opening polymerization ability such as γ-propiolactone, β-butyrolactone, δ-valerolactone and derivatives thereof. Things can be mentioned. Specific examples of the polyether diol include, for example, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and the like.

The above-mentioned high molecular weight diol compound is preferably one having a molecular weight of 1,000 to 10,000. When the one having a molecular weight of less than 1000 is used, the obtained conductive elastomer composition may not be able to obtain an elastomer having a sufficient tensile strength even if the composition is cured.
When the viscosity exceeds 10,000, the workability is lowered due to the high viscosity of the polymer diol compound, the step of producing a prepolymer by a urethanization reaction, the step of reacting the prepolymer with a specific epoxy compound, and the obtained conductive elastomer In the step of curing the composition for use, the work may be difficult.

The above-mentioned high molecular diol compound reacts with the diisocyanate compound to form a urethane bond. The urethane bond is reacted with the diisocyanate compound in an amount of 2 mol or more per 1 mol of the high molecular diol compound to thereby form a terminal. A prepolymer having isocyanate groups can be obtained. Specific examples of the diisocyanate compound that can be used here include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate,
1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, 1,5-naphthalene diisocyanate, m-phenylene diisocyanate, p-phenylene diisocyanate, 3,3′-dimethyl-4,4′-diphenylmethane diisocyanate, 4, 4′-diphenylmethane diisocyanate, 3,3′-dimethylphenylene diisocyanate, 4,4′-biphenylene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane diisocyanate, methylene bis (4-cyclohexyl isocyanate), and the like. 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,5-naphthalene diisocyanate, 4,4'-diphenylmethane diisocyanate, isophorone diiso Such as Aneto is preferable.

The urethanization reaction is carried out after mixing the polymer diol compound and the diisocyanate compound,
It is carried out by reacting at a temperature of 1 ° C. for 1 to 10 hours. In the urethanization reaction, if necessary, for example, 0.01 to 0.1% by weight of a catalyst based on the total amount of the polymer diol compound and the diisocyanate compound can be used. As a specific example of such a catalyst, naphthenic acid is used. Examples thereof include copper, cobalt naphthenate, zinc naphthenate, dibutyltin dilaurate, and triethylamine.

After the above urethane-forming reaction, the obtained prepolymer is reacted with a specific epoxy compound represented by the above formula 1 to obtain a urethane epoxy polymer as the component (a) in the present invention. . The reaction between the prepolymer and the specific epoxy compound is carried out by mixing the prepolymer with the specific epoxy compound,
The reaction can be carried out at a temperature of 80 ° C. for 1 to 10 hours.

In the above formula (1) relating to a specific epoxy compound, R ^{1 to} R ³ represent a hydrogen atom or a C 1-5 carbon atom such as methyl, ethyl, n-pentyl, i-pentyl or neopentyl. R ⁴ represents a methylene group having 1 to 10 carbon atoms such as an ethylene group, a propylene group, a butylene group, an ethylidene group or a phenylene group; an alkylene group; an alkylidene group or an arylene group.

Specific examples of the specific epoxy compound include:
Glycidol, 1-butanol-3,4-epoxide, 1
-Pentanol-4,5-epoxide, 1-butanol-
2,3-epoxide, 1-hexanol-2,3-epoxide, 1-hexanol-3,4-epoxide, 4-hydroxystyrene oxide, 3-methyl-1-butanol-
2,3-epoxide, 3-hydroxystyrene oxide and the like, among which glycidol, 1
-Butanol-2,3-epoxide, 1-hexanol-
3,4-epoxide, 3-methyl-1-butanol-2,3
-Epoxides and the like are preferred. The specific epoxy compound is used per mole of isocyanate groups in the prepolymer.
It is preferable to use it in a range of 0.5 to 1.5 mol, particularly in a ratio of equimolar. If the amount of the specific epoxy compound used is too small, the prepolymer having an isocyanate group at the end will remain, and as a result, the resulting conductive elastomer composition is likely to foam due to reaction with moisture. It will be. On the other hand, if the amount of the specific epoxy compound used is excessive, an unreacted specific epoxy compound will remain, and the resulting conductive elastomer composition will have a tacky surface when cured. It tends to take on.

Component (b) The component (b) is used as a curing agent or a cross-linking agent for curing the urethane epoxy polymer of the component (a) into an elastomer. The component (b) is not particularly limited as long as it is a compound that reacts with an epoxy group to cure the component (a), and an amine-based, amide-based, carboxylic anhydride-based compound, or the like is preferably used. be able to. Specific examples of preferred compounds as component (b) include diethylenetriamine, triethylenetetramine,
Examples thereof include tetraethylenepentamine, dipropanediamine, diethylaminopropylamine, N-aminoethylpiperazine, mensendiamine, isophoronediamine, and piperidine.

Component (b) is used in an amount of 0.1 to 10 parts by weight, preferably 0.5 to 10 parts by weight, per 100 parts by weight of component (a).
5 parts by weight. If the amount of the component (b) is less than 0.1 part by weight, the finally obtained elastomer will not have a sufficiently high hardness, and the cured elastomer surface will have tackiness. On the other hand, when the amount of the component (b) exceeds 10 parts by weight, the obtained composition for a conductive elastomer has a high curing rate,
Since the pot life is short, workability is deteriorated, and the hardness of the formed elastomer is increased, so that a conductive elastomer having sufficient elasticity cannot be obtained.

(C) Component The conductive particles of the component (c) include, for example, nickel,
Particles of magnetic metals such as iron and cobalt, particles of alloys of these metals, particles of magnetic metals or alloys whose surfaces are plated with gold, silver, palladium, rhodium, etc., non-magnetic metal particles And inorganic particles or polymer particles such as glass beads plated with a conductive magnetic material such as nickel or cobalt. In addition, carbon black can also be used. Among these, conductive magnetic particles made of nickel, iron or an alloy thereof are preferable in relation to a manufacturing method of orienting using a parallel magnetic field, and further, conductive magnetic particles plated with gold are in contact with each other. It is preferable in terms of electrical characteristics such as low resistance.

The particle size of the conductive particles used as the component (c) is 3
To 200 μm, particularly preferably 10 to
100 μm. By using conductive particles having a particle diameter in such a range, in the finally obtained conductive elastomer, the ease of pressurized deformation of the conductive portion is ensured, and between the conductive particles in the conductive portion. Sufficient electrical contact is achieved. The amount of the conductive particles to be used is 30 to 1,000 parts by weight, preferably 50 to 750 parts by weight, per 100 parts by weight of the component (a). When the amount used is less than 30 parts by weight, the finally obtained conductive elastomer has a high electric resistance value, while when the amount used exceeds 1000 parts by weight, the obtained conductive elastomer has It becomes vulnerable.

The composition for forming a conductive elastomer of the present invention is a mixture containing the above components (a), (b) and (c) as essential components. The composition for forming a conductive elastomer is applied or spread to a state having an appropriate thickness, and is cured in this state. Preferably, a parallel magnetic field is applied, or the parallel magnetic field is kept applied or the parallel magnetic field is applied. After the magnetic field is removed, a hardening treatment is performed by, for example, performing a heat treatment at a temperature of 50 to 150 ° C. for 10 minutes to 3 hours. As a result, the conductive particles are dispersed in the elastomer having elasticity, or the alignment is performed. In this state, a sheet-like or layer-like conductive elastomer dispersed is formed.

When a parallel magnetic field is applied, the distribution of conductive particles in the cured elastomer sheet becomes uneven by using a magnetic pole plate having portions with different magnetic force intensities. Existing anisotropically conductive elastomer sheets can also be formed. here,
The conductive portion may have pressure conductivity in which a resistance value is reduced by being pressed in the thickness direction to form a conductive path.

The composition for forming a conductive elastomer of the present invention can contain a reactive diluent or a reactive plasticizer such as a monoepoxide compound, a diepoxide compound or a trialpoxide compound, if necessary. Thereby, the viscosity of the composition can be reduced, and the hardness of the finally obtained cured elastomer can be reduced. Examples of such epoxide compounds include aliphatic glycidyl ethers and glycidyl esters having a linear, branched or unsaturated bond; aromatic glycidyl ethers derived from phenols; and polyhydric alcohols such as trimethylolpropane and glycerin. Glycidyl ether and glycidyl ester. Of these, glycidyl ethers and glycidyl esters having a fluoroalkyl group are obtained because they provide a suitable sliding property to the interface between the cured elastomer and the conductive particles to smooth the movement of the conductive particles. High conductive properties can be realized for the conductive elastomer.

The composition for forming a conductive elastomer of the present invention may contain, if necessary, ordinary silica powder, colloidal silica, airgel silica, kaolin, mica, talc, wollastonite, calcium silicate, silicate An inorganic filler such as aluminum, chalk, calcium carbonate, iron oxide alumina, silicon nitride, magnesium oxide, boron nitride, and aluminum nitride can be contained. By including such an inorganic filler, the viscosity of the composition for forming a conductive elastomer can be adjusted, the dispersion stability of the conductive particles is improved, and the strength of the elastomer after curing is improved. .

The amount of the inorganic filler used is not particularly limited, but if it is used in an excessively large amount, the orientation due to the magnetic field when the conductive magnetic particles are used cannot be sufficiently achieved, and the compression set can be reduced. It is preferable that the amount is appropriate because the size may increase and the electrical characteristics may be impaired. The viscosity of the composition for forming a conductive elastomer of the present invention is 50,000 to 1,000, at a temperature of 25 ° C.
It is preferably in the range of 000 cp.

[0028]

The composition for forming a conductive elastomer according to the present invention is in the form of a paste, which is formed into a suitable film and cured as required by applying a parallel magnetic field in the thickness direction or thereafter to form a sheet. Can be formed. In addition, the composition for forming a conductive elastomer of the present invention is applied to an appropriate region of a device for electrical connection, for example, a surface of a lead electrode region of a circuit board, and the like. By causing the conductive elastomer layer to harden while acting or after that, it is possible to form a conductive elastomer layer in a state of being integrally adhered or adhered to the region.

According to the composition for forming a conductive elastomer of the present invention, in the production process of the conductive elastomer layer ,
High workability is obtained because there is no foaming due to moisture in the air, and it is possible to obtain uniform properties as an elastomer and has good adhesiveness to the application target such as a circuit board. Therefore, alignment with respect to the lead electrode and the like can be achieved with high accuracy,
A conductive elastomer layer having excellent conductive properties can be formed.

[0030]

Hereinafter, embodiments of the present invention will be described.
The present invention is not limited by these. In the following, “parts” indicates “parts by weight”. <Synthesis of (a) component> According to the following synthesis examples 1 to 7,
A urethane epoxy polymer as the component (a) was synthesized.

Synthesis Example 1 "Clapol L-2010" was placed in a 1-liter flask equipped with a thermometer, a stirrer, a reflux condenser and a dropping funnel.
(Δ-valerolactone polyester diol, molecular weight
2000: manufactured by Kuraray Co., Ltd.) 202 g and 35.2 g of tolylene diisocyanate (a mixture of 2,4-tolylene diisocyanate and 2,6-tolylene diisocyanate, the same applies hereinafter) were added, and dibutyltin dilaurate 0.1 was stirred at room temperature.
g was added dropwise. After completion of the dropwise addition, 15.0 g of “epiol” (glycidol; manufactured by NOF Corporation) was slowly added dropwise while the system was heated to 60 ° C., and the mixture was further reacted at 80 ° C. for 4 hours to obtain a urethane epoxy polymer. When the epoxy equivalent of this urethane epoxy polymer was determined by the hydrochloric acid-dimethylformamide method, it was 1300.

Synthesis Example 2 In the same flask as in Synthesis Example 1, "JSR-HTPB (K-
31) "(polybutadiene diol, molecular weight 2800: manufactured by Nippon Synthetic Rubber) 174 g and tolylene diisocyanate 21.1
g of dibutyltin dilaurate was added dropwise while stirring at room temperature. After dropping, 9.0 g of “Epiol” was slowly dropped while heating the system to 60 ° C.
For 4 hours to obtain a urethane epoxy polymer. When the epoxy equivalent of this urethane epoxy polymer was quantified by a hydrochloric acid-dimethylformamide method,
1650.

Synthesis Example 3 In the same flask as in Synthesis Example 1, 173 g of "Nipporan 982R" (polycarbonate diol, molecular weight: 1990, manufactured by Nippon Polyurethane) and 1,5-naphthalenediisocyanate
36.4 g was added, and 0.1 g of dibutyltin dilaurate was added dropwise with stirring at room temperature. After completion of the dropwise addition, 15.3 g of 1-butanol-2,3-epoxide was slowly added dropwise while the system was heated to 60 ° C, and further reacted at 80 ° C for 4 hours to obtain a urethane epoxy polymer. When the epoxy equivalent of this urethane epoxy polymer was determined by the hydrochloric acid-dimethylformamide method, it was 1290.

Synthesis Example 4 300 g of "KF-6003" (polydimethylsiloxanediol, molecular weight: 5090, manufactured by Shin-Etsu Silicone) and 20.5 g of tolylene diisocyanate were added to the same flask as in Synthesis Example 1, and dibutyltin was stirred at room temperature with stirring. Dilaurate 0.2
g was added dropwise. After dropping, 8.7 g of “Epiol” was slowly dropped while heating the system to 60 ° C.
The reaction was carried out for a time to obtain a urethane epoxy polymer. When the epoxy equivalent of this urethane epoxy polymer was determined by hydrochloric acid-dimethylformamide method, 2800
Met.

Synthesis Example 5 "Nipporan 982R" 103 was placed in the same flask as in Synthesis Example 1.
g, 103 g of "KF-6003" and 36.2 g of 4,4'-diphenylmethane diisocyanate, and 0.2 g of dibutyltin dilaurate was added dropwise with stirring at room temperature. After completion of the dropwise addition, 1-hexanol-3,4-
16.5 g of epoxide was slowly added dropwise, and the mixture was further reacted at 80 ° C. for 4 hours to obtain a urethane epoxy polymer. When the epoxy equivalent of this urethane epoxy polymer was determined by the hydrochloric acid-dimethylformamide method, it was 2100.

Synthesis Example 6 "PTG-2000" (polytetramethylene glycol, molecular weight 2000, manufactured by Hodogaya Chemical Co., Ltd.) was placed in the same flask as in Synthesis Example 1.
208 g and 46.2 g of isophorone diisocyanate were added, and while stirring at room temperature, 0.1 g of dibutyltin dilaurate was added.
g was added dropwise. After completion of the dropwise addition, heat the system to
21.2 g of -methyl-1-butanol-2,3-epoxide was slowly added dropwise, and the mixture was further reacted at 80 ° C for 4 hours to obtain a urethane epoxy polymer. The epoxy equivalent of this urethane epoxy polymer was determined to be 1310 by a hydrochloric acid-dimethylformamide method.

Synthesis Example 7 "EXCENOL-2020" was placed in the same flask as in Synthesis Example 1.
(Polypropylene glycol, molecular weight 2000: manufactured by Asahi Glass)
200 g and 42.4 g of isophorone diisocyanate were added, and while stirring at room temperature, 0.1 g of dibutyltin dilaurate was added.
g was added dropwise. After completion of the dropwise addition, heat the system to
21.6 g of -methyl-1-butanol-2,3-epoxide was slowly dropped, and further reacted at 80 ° C for 4 hours to obtain a urethane epoxy polymer. When the epoxy equivalent of this urethane epoxy polymer was quantified by the hydrochloric acid-dimethylformamide method, it was 1320.

<(B) Component (Curing Agent or Crosslinking Agent)> Isophoronediamine or Mensendiamine

<Component (c) (conductive particles)> Average particle size 40
100 parts of nickel particles having a particle size of 100 μm and two parts of gold applied by electroless plating (the amount of gold is such that the gold film thickness is 1200 mm when the nickel particles are spherical).

<Reactive diluent> 3
-(2-perfluorohexyl) ethoxy-1,2-epoxypropane

[0041]

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Examples 1 to 8 According to the formulation shown in Tables 1 to 3, component (a)
A mixture of the component (b), the component (c), the reactive diluent, and the inorganic filler is kneaded with a two-roll mill for 20 minutes, and then sufficiently defoamed under vacuum. A composition for forming a conductive elastomer was obtained .

Comparative Example 1 A comparative composition was obtained by mixing 100 parts of a commercially available elastomer for forming a conductor made of a room-temperature-curable silicone rubber with 100 parts of the same conductive particles as those used in the examples. Was.

[0044] Each of the adhesive strength obtained sample composition [Evaluation of Composition, placed in a flat mold comprising a groove depth 1.5 mm, extended into a sheet by a roll or squeegee, on the Then, a glass epoxy substrate having no metal foil portion such as a copper foil was covered and cured at 150 ° C. for 1 hour to form a conductive elastomer sheet having a thickness of about 1.5 mm on the glass substrate. The rubber layer adhered to the glass epoxy board is stripped together with the board with a band saw.
It was cut out to about 1.5 cm, and the peel strength was measured using a peel tester according to JIS standards. The results are shown in Table 1.

Fabrication of Conductor Device and Evaluation of Conductivity The above sample composition was placed on a lead electrode region of a circuit board having a total of 240 lead electrodes made of copper having a width of 0.15 mm and having an electrode pitch of 0.25 mm. Each was printed with a width of 1.0 mm, perpendicular to the longitudinal direction of the electrode, with a layer thickness of about 0.3 mm, and cured for 1 hour at 150 ° C while applying a parallel magnetic field in the thickness direction, thereby integrating with the circuit board A sheet-shaped conductive elastomer layer was formed to manufacture a circuit board device having the conductive elastomer layer.

When a predetermined strain was applied to the conductive elastomer layer formed on each of the circuit board devices obtained as described above, and the electric resistance in the thickness direction of the conductive elastomer layer was measured, it was repeated. Repeat the minimum amount of strain to obtain a stable and reproducible electrical resistance value, that is, the stabilized strain amount, and the electrical resistance value through each lead electrode in the thickness direction of the conductive elastomer layer at a strain amount of 25%. Measure,
The durability was evaluated. The results are shown in Tables 1 to 3.

[0047]

[Table 1]

[0048]

[Table 2]

[0049]

[Table 3]

[0050]

The composition for forming a conductive elastomer according to the present invention has good adhesion to various substrates such as circuit boards, high contact reliability between lead electrodes, and electrical response to deformation. It has good durability, and has excellent durability and excellent conductive properties such that its electrical properties are unlikely to change with repeated deformation.

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-61-152722 (JP, A) JP-A-59-113023 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) C08L 63/00-63/10 C08K 3/08 H01B 1/20 H01R 11/01 C08G 59/20-59/30

Claims (8)

(57) [Claims] 1. A urethane epoxy polymer 100 obtained by reacting (a) a prepolymer having an isocyanate group at a terminal obtained by reacting a polymer diol compound with a diisocyanate compound with an epoxy compound represented by the following formula 1. Parts by weight and (In the formula 1 , R ^{1 to} R ³ each represent a hydrogen atom or a lower alkyl group having 1 to 5 carbon atoms, and R ⁴ represents 1 carbon atom.
Represents a methylene group, an alkylene group, an alkylidene group or an arylene group of 10 to 10. A paste composition comprising (b) 0.1 to 10 parts by weight of a curing agent or a cross-linking agent, and (c) 30 to 1000 parts by weight of conductive particles , which is applied to an application object having electrodes. By being cured
The conductive elastomer layer is formed integrally with the applicable object
For forming a conductive elastomer, characterized in that:
object. 2. The conductive elastomer type according to claim 1.
Conductive elastomer integrally formed from composition for application
Circuit board, characterized by having a layer. 3. The conductive elastomer layer according to claim 1, wherein the conductive particles are
There is a conductive part and an insulating part that are distributed densely and densely.
The circuit board according to claim 2, comprising: 4. The conductive elastomer type according to claim 1,
Conductive elastomer integrally formed from composition for application
An integrated circuit chip having a layer. 5. The conductive elastomer layer comprises conductive particles.
There is a conductive part and an insulating part that are distributed densely and densely.
The collection according to claim 4, wherein Integrated circuit chip
H. 6. The conductive elastomer type according to claim 1,
Conductive elastomer integrally formed from composition for application
Device comprising a layer. 7. The conductive elastomer layer comprises conductive particles.
There is a conductive part and an insulating part that are distributed densely and densely.
The device of claim 6, comprising: 8. The method of claim 1, wherein (a) the polymer diol compound is
Isocyanate at the end
To a prepolymer having a tri-group.
Urethane epoxy obtained by reacting a oxy compound
With 100 parts by weight of (In the formula 1, R ^{1 to} R ³ each represent a hydrogen atom or a carbon atom number.
Represents a lower alkyl group having 1 to 5 carbon atoms , and R ⁴ has 1 carbon atom.
Up to 10 methylene, alkylene and alkylidene groups
Or an arylene group. ) (B) a curing agent or crosslinking agent 0.1 to 10 parts by weight, it contains (c) a conductive particle 30 to 1000 parts by weight
The paste-like composition is cured into a film, and the conductive particles
The conductors are densely distributed, and there are conductive and insulating parts.
Conductive elastomeric sheet characterized by having properties
G.