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JP3080164B2 - Electroluminescent element sealing method - Google Patents
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JP3080164B2 - Electroluminescent element sealing method - Google Patents

Electroluminescent element sealing method

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Publication number
JP3080164B2
JP3080164B2 JP10307323A JP30732398A JP3080164B2 JP 3080164 B2 JP3080164 B2 JP 3080164B2 JP 10307323 A JP10307323 A JP 10307323A JP 30732398 A JP30732398 A JP 30732398A JP 3080164 B2 JP3080164 B2 JP 3080164B2
Authority
JP
Japan
Prior art keywords
sealant
cover plate
transparent substrate
suction
large amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP10307323A
Other languages
Japanese (ja)
Other versions
JP2000133445A (en
Inventor
一朗 石坂
憲治 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Engineering Co Ltd
Original Assignee
Shin Etsu Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Engineering Co Ltd filed Critical Shin Etsu Engineering Co Ltd
Priority to JP10307323A priority Critical patent/JP3080164B2/en
Publication of JP2000133445A publication Critical patent/JP2000133445A/en
Application granted granted Critical
Publication of JP3080164B2 publication Critical patent/JP3080164B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、エレクトロルミネ
センス(electroluminescence;以下「EL」という)を
発光素子として用いるフラットパネル・ディスプレイ、
即ちELディスプレイの組立工程において、上記EL素
子を封止する方法に関する。詳しくは、矩形のエレクト
ロルミネセンス素子層が形成された透明基板とカバー板
との間に、液状の密封剤を塗布し、これら透明基板とカ
バー板のどちらか一方が吸着保持される定盤に対し、他
方が吸着保持される吸着部材を昇降手段により上下動さ
せることにより、上記密封剤が押し広げられてエレクト
ロルミネセンス素子層を封止する方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat panel display using electroluminescence (hereinafter referred to as "EL") as a light emitting element.
That is, the present invention relates to a method for sealing the EL element in an EL display assembling process. Specifically, a liquid sealant is applied between the transparent substrate on which the rectangular electroluminescent element layer is formed and the cover plate, and one of the transparent substrate and the cover plate is adsorbed and held on a surface plate. On the other hand, the present invention relates to a method of sealing an electroluminescent element layer by vertically moving an adsorbing member, the other of which is adsorbed and held by an elevating means, so that the sealant is spread out.

【0002】[0002]

【従来の技術】従来、この種のEL素子の封止方法とし
ては、例えば図8(a)の実線に示す如く下定盤Aに対
し吸着部材Bを昇降手段Cにより上下動するように構成
し、この下定盤Aの上に矩形の透明基板2を吸着保持し
て、この透明基板2の上面中央部には、図8(b)の実
線に示す如く密封剤4がEL素子層1の上に集中して塗
布され、このEL素子層1の周囲には、密封剤4のはみ
出し防止とギャップ厚を確保するための樹脂製枠10が
形成されるものがある。そして、図8(a)の二点鎖線
に示す如く昇降手段Cの作動で、吸着部材B及びそれに
吸着保持されたカバー板3が水平状態のままゆっくり下
降して、該カバー板3を密封剤4の上端部に接触させる
ことにより、図8(b)の二点鎖線に示す如く中央部の
密封剤4が押し潰されて放射状に広がり、それ以降の下
降でカバー板3が上記枠10に突き当った後は、カバー
板3と透明基板2との間に発生する毛細管現象により密
封剤4が全体に広がってEL素子層1を密封していた。
2. Description of the Related Art Conventionally, as a method of sealing an EL element of this kind, for example, as shown by a solid line in FIG. A rectangular transparent substrate 2 is sucked and held on the lower platen A, and a sealant 4 is provided at the center of the upper surface of the transparent substrate 2 as shown by a solid line in FIG. The EL element layer 1 is applied in a concentrated manner, and a resin frame 10 is formed around the EL element layer 1 to prevent the sealant 4 from protruding and secure a gap thickness. Then, as shown by a two-dot chain line in FIG. 8A, the suction member B and the cover plate 3 held by suction are slowly lowered in a horizontal state by the operation of the lifting / lowering means C, and the cover plate 3 is sealed with the sealant. 8, the sealant 4 at the center is crushed and spread radially as shown by the two-dot chain line in FIG. After the collision, the sealant 4 spreads over the entire surface due to a capillary phenomenon generated between the cover plate 3 and the transparent substrate 2 to seal the EL element layer 1.

【0003】[0003]

【発明が解決しようとする課題】しかし乍ら、このよう
な従来のEL素子封止方法では、透明基板の中央部から
密封剤を放射状に押し広げて毛細管現象により周縁部ま
で広げるため、この周縁部の隅々まで密封剤が到達完了
するまでに多大の時間を要し、その結果、装置のタクト
タイムが長くなるという問題がある。これを解決するた
めには、装置の台数を増やしたり、密封剤の広がりが完
了するまで待機させるためにバッファ等の設置が必要と
なって、大幅なコストアップになるという問題がある。
更に、透明基板の中央部に密封剤が集中して塗布される
ため、この中央部から放射方向の距離が外周四隅部より
短い各辺中間部の領域では、密封剤のはみ出しが発生し
易く、これを解決するためには、EL素子層の周囲に、
密封剤のはみ出し防止用の枠を設ける必要があり、製品
のコストアップになるという問題がある。また、透明基
板の中央部に塗布された液状密封剤は、粘性が極端に高
くない限り上端部が略平らな面状となり、この平らな上
端面に対して水平状態のまま下降したカバー板が面接触
するため、この面接触する瞬間に空気が混入し易く、し
かも接触した瞬間に密封剤は一気に押し潰れるが、カバ
ー板は吸着部材にて上下移動不能に保持されているため
に、上記密封剤の急激な形状変化に追従できず、これら
カバー板と密封剤の上端部との間に空気が混入し易かっ
た。その結果、密封剤中に気泡が発生し、この気泡がカ
バー板とEL素子との間に残って、EL素子を劣化させ
たり、ELディスプレイパネルとしての品質を低下させ
るという問題がある。上記気泡の発生を防ぐには、カバ
ー板が密封剤の上端面に接触する瞬間の下降速度を極端
に低速にすることが考えられるものの、この接触時の高
さ位置は、透明基板やカバー板の厚さ寸法や塗布後の密
封剤形状などの変化要因によって位置検出が困難である
ため、吸着部材及びそれに吸着保持されたカバー板の下
降全工程を低速化する必要があり、その結果、装置のタ
クトタイムが長くなるという問題がある。また更に、E
L素子層を密封するために必要な密封剤の充填量は、枠
によって囲まれた面積と枠の高さとで形成された容積と
完全に一致させる必要があるが、特に枠の高さ寸法にバ
ラツキが多いため、枠が設定高さより低い場合には、密
封剤がはみ出し、これと逆に高い場合には、密封剤が不
足して透明基板とカバー板との間に気泡が発生し、EL
素子を劣化させたり、ELディスプレイパネルとしての
品質を低下させるという問題がある。これを解決するに
は、枠の高さ精度を向上させるために高額な装置を導入
する必要があり、ELディスプレイパネルのコストを低
減できないという問題がある。枠の高さ精度を向上でき
たとしても、上述した理由でカバー板が枠の上面接触す
る位置の検出は困難であるため、カバー板を下降させ過
ぎて該枠を損傷させるという問題がある。
However, in such a conventional EL element sealing method, the sealing agent is radially pushed out from the central portion of the transparent substrate and spreads to the peripheral portion by a capillary phenomenon. It takes a long time for the sealant to reach the corners of the part and completes it. As a result, there is a problem that the tact time of the device becomes long. In order to solve this problem, it is necessary to increase the number of devices or to install a buffer or the like in order to wait until the spreading of the sealant is completed.
Furthermore, since the sealant is applied in a concentrated manner to the central portion of the transparent substrate, the radial distance from this central portion is shorter than the outer four corners, in the region of each side intermediate portion, the sealant is likely to protrude, To solve this, around the EL element layer,
It is necessary to provide a frame for preventing the sealant from protruding, and there is a problem that the cost of the product increases. In addition, the liquid sealant applied to the center of the transparent substrate has a substantially flat upper end unless the viscosity is extremely high. The surface contact makes it easy for air to enter at the moment of the surface contact, and the sealant is crushed at once at the moment of contact, but the cover plate is held by the suction member so as not to be able to move up and down. A rapid change in the shape of the sealant could not be followed, and air was easily mixed between these cover plates and the upper end of the sealant. As a result, air bubbles are generated in the sealant, and the air bubbles remain between the cover plate and the EL element, causing a problem that the EL element is deteriorated or the quality of the EL display panel is deteriorated. In order to prevent the generation of the air bubbles, it is conceivable that the descent speed at the moment when the cover plate contacts the upper end surface of the sealant is extremely low, but the height position at the time of this contact is determined by the transparent substrate or the cover plate. It is difficult to detect the position due to factors such as the thickness dimension of the sealant and the shape of the sealant after application, so it is necessary to reduce the speed of the entire lowering process of the suction member and the cover plate sucked and held by the suction member. There is a problem that the tact time becomes longer. Furthermore, E
The filling amount of the sealant necessary for sealing the L element layer needs to completely match the volume formed by the area surrounded by the frame and the height of the frame. Due to the large variation, when the frame is lower than the set height, the sealant protrudes. On the contrary, when the frame is high, the sealant is insufficient and bubbles are generated between the transparent substrate and the cover plate, and EL is generated.
There is a problem that the element is deteriorated and the quality of the EL display panel is deteriorated. In order to solve this, it is necessary to introduce an expensive device in order to improve the height accuracy of the frame, and there is a problem that the cost of the EL display panel cannot be reduced. Even if the height accuracy of the frame can be improved, it is difficult to detect the position where the cover plate comes into contact with the upper surface of the frame for the above-described reason. Therefore, there is a problem that the cover plate is lowered too much and the frame is damaged.

【0004】本発明のうち請求項1記載の発明は、密封
剤を短時間で空気の混入やはみ出しを防ぎながら全域に
広げることを目的としたものである。
An object of the present invention in claim 1 is to spread the sealant over the entire area while preventing air from entering or protruding in a short time.

【0005】[0005]

【課題を解決するための手段】前述した目的を達成する
ために、本発明のうち請求項1記載の発明は、定盤に吸
着保持される透明基板又はカバー板のどちらか一方の中
央部及び外周部に、多量の密封剤を適宜間隔毎に分散し
て塗布し、吸着部材に吸着保持されるカバー板又は透明
基板の他方には、上記多量密封剤と相対する位置に、少
量の密封剤を夫々塗布するステップと、上記多量密封剤
の上端部と、逆山形状に垂れ下がった密封剤とを、昇降
手段により接近させて接触させるステップと、からなる
ことを特徴とする方法である。
In order to achieve the above-mentioned object, the present invention according to claim 1 of the present invention is directed to a transparent substrate or a cover plate which is attracted and held on a surface plate. A large amount of sealant is dispersed and applied to the outer peripheral portion at appropriate intervals, and a small amount of sealant is placed on the other of the cover plate or the transparent substrate that is sucked and held by the suction member at a position opposed to the large amount of sealant. Respectively, and a step of bringing the upper end of the large amount of sealant and the sealant hanging down in an inverted mountain shape into close contact with each other by an elevating / lowering means.

【0006】[0006]

【作用】請求項1の発明は、昇降手段の作動で透明基板
及びカバー板を接近させることにより、多量密封剤の略
平らな上端部と、逆山形に垂れ下がった少量密封剤とが
夫々一点で接触を開始して略均一な量で広がり、その
後、これら総ての密封剤が合流して、カバー板又は透明
基板の周縁部まで到達する方法である。
According to the first aspect of the present invention, the substantially flat upper end portion of the large amount of the sealant and the small amount of the sealant hanging down in an inverted mountain shape are respectively formed at one point by bringing the transparent substrate and the cover plate closer by the operation of the lifting / lowering means. This is a method in which contact is started, spreads in a substantially uniform amount, and then all of these sealants merge to reach the periphery of the cover plate or the transparent substrate.

【0007】[0007]

【発明の実施の形態】以下、本発明の実施例を図面に基
づいて説明する。この実施例は、図1〜図5に示す如く
矩形のエレクトロルミネセンス素子層板1が形成された
矩形状の透明基板2の上方に、それより小さな矩形状の
カバー板3を相互に対向させて配置し、定盤Aとして下
定盤の上面に上記透明基板2を吸着保持すると共に、吸
着部材Bとして上定盤の下面に上記カバー板3を吸着保
持し、この下定盤Aに対し上定盤Bを従来周知構造の昇
降手段Cにより上下動させることにより、透明基板2と
カバー板3の間に所定厚さ寸法のギャップGを形成した
場合を示したものである。
Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, a rectangular cover plate 3 smaller than the rectangular transparent substrate 2 on which a rectangular electroluminescent element layer plate 1 is formed as shown in FIGS. The transparent substrate 2 is suction-held on the upper surface of the lower surface plate as the surface plate A, and the cover plate 3 is suction-held on the lower surface of the upper surface plate as the suction member B. This shows a case in which a gap G having a predetermined thickness is formed between the transparent substrate 2 and the cover plate 3 by moving the board B up and down by a lifting means C having a conventionally well-known structure.

【0008】上記透明基板2は、ガラスにより形成さ
れ、その片面には、矩形のEL素子層1が、アノードと
カソードの両電極パターン(図示せず)に挟まれて薄膜
状に形成されている。更に、透明基板2の中央部及び外
周部には、前記下定盤Aに吸着保持した後か或いは下定
盤Aに吸着保持する前の時点で、多量の密封剤4を適宜
間隔毎に分散して塗布する。詳しくは、透明基板2の中
央部には、上記EL素子層1を封止するのに必要な密封
剤4の6〜9割程度を、ディスペンサー(図示せず)に
より塗布し、外周部には、残りの密封剤4の大部分を等
量ずつに分割して適宜間隔毎にディスペンサーにより塗
布し、この塗布後の状態では、これら多量密封剤4a…
の上端部が夫々略平らになる。
The transparent substrate 2 is made of glass, and on one surface thereof, a rectangular EL element layer 1 is formed in a thin film between both anode and cathode electrode patterns (not shown). . Further, a large amount of the sealant 4 is dispersed at appropriate intervals on the central portion and the outer peripheral portion of the transparent substrate 2 after the suction and holding on the lower platen A or before the suction and holding on the lower platen A. Apply. Specifically, about 60 to 90% of the sealant 4 necessary for sealing the EL element layer 1 is applied to a central portion of the transparent substrate 2 by a dispenser (not shown), and Most of the remaining sealant 4 is divided into equal amounts and applied by a dispenser at appropriate intervals. In the state after the application, the large amount of sealant 4a is used.
Are approximately flat at the top.

【0009】上記多量密封剤4…の塗布位置は、EL素
子層1及び透明基板2の平面形状に応じて変化する。例
えば図2(a)に示すようなEL素子層1及び透明基板
2が正方形である場合には、透明基板2の対角線2a,
2aが交差する中央部に、大きな多量密封剤4a1を1
つ配置し、これら対角線2a,2a上で交点から等距離
の外周四隅部には、上記多量密封剤4a1より小さな多
量密封剤4a2を4つ配置している。また図3(a)に
示すようなEL素子層1及び透明基板2が縦横比の小さ
い長方形である場合には、透明基板2の長辺と平行な中
心線2bに沿って大きな2つの多量密封剤4a3,4a3
を、中心点2cから等距離の中心部に配置し、これら対
角線2d,2d上で交点2cから等距離の外周四隅部に
は、上記多量密封剤4a3より小さな多量密封剤4a4を
4つ配置している。更に図4(a)に示すようなEL素
子層1及び透明基板2が縦横比の大きい長方形である場
合には、透明基板2の中心点2fに大きな1つの多量密
封剤4a5を配置すると共に、長辺と平行な中心線2e
に沿って中心点2fから等距離の中心部に上記多量密封
剤4a5よりやや小さい2つの多量密封剤4a6,4a6
を配置し、これら対角線2g,2g上で交点2fから等
距離の外周四隅部には、上記多量密封剤4a6より小さ
な多量密封剤4a7を4つ配置している。
The application position of the large amount of the sealant 4 changes according to the planar shape of the EL element layer 1 and the transparent substrate 2. For example, when the EL element layer 1 and the transparent substrate 2 are square as shown in FIG.
In the center where 2a intersects, apply a large amount of sealant 4a1
Four large-capacity sealants 4a2 smaller than the large-capacity sealant 4a1 are disposed at the four outer peripheral corners equidistant from the intersection on the diagonal lines 2a, 2a. In the case where the EL element layer 1 and the transparent substrate 2 are rectangles having a small aspect ratio as shown in FIG. 3A, two large mass sealings are made along a center line 2b parallel to the long side of the transparent substrate 2. Agents 4a3, 4a3
Are disposed at the center part equidistant from the center point 2c, and four large-capacity sealants 4a4 smaller than the large-capacity sealant 4a3 are disposed at the four outer peripheral corners equidistant from the intersection 2c on these diagonals 2d, 2d. ing. Further, when the EL element layer 1 and the transparent substrate 2 are rectangles having a large aspect ratio as shown in FIG. 4 (a), one large sealing agent 4a5 is arranged at the center point 2f of the transparent substrate 2 and Center line 2e parallel to the long side
The two large sealants 4a6 and 4a6, which are slightly smaller than the large sealant 4a5,
And four large-capacity sealants 4a7 smaller than the large-capacity sealant 4a6 are disposed at the four outer peripheral corners equidistant from the intersection 2f on these diagonal lines 2g, 2g.

【0010】上記カバー板3は、例えば透明ガラスによ
り形成され、その中央部及び外周部には、前記吸着部材
Bとして上定盤の下面に吸着保持する前の時点で、上記
下定盤Aの多量密封剤4a…と相対する位置に、少量の
密封剤4b…を夫々点状にディスペンサーで塗布する。
これら少量密封剤4b…の塗布量は、この塗布された面
を上記透明基板2と対向するように下方へ向けても落下
しない量であり、この塗布面を下方へ向けた状態では、
図1に示す如く夫々の中心部が逆山形状に垂れ下がる。
The cover plate 3 is made of, for example, transparent glass, and has a large amount of the lower platen A at the center and the outer peripheral portion thereof before being sucked and held on the lower surface of the upper platen as the suction member B. A small amount of the sealant 4b is applied to the position opposed to the sealant 4a by a dispenser.
The amount of the small amount of sealant 4b to be applied is such that the coated surface does not fall even if the coated surface is directed downward so as to face the transparent substrate 2. When the coated surface is directed downward,
As shown in FIG. 1, each central portion hangs in an inverted mountain shape.

【0011】更に、上記少量密封剤4b…の塗布位置も
上述した多量密封剤4の塗布位置と同様に、図2(a)
〜図4(a)に示す如くEL素子層1及び透明基板2の
平面形状に応じて変化する。即ち、図2(a)に示すよ
うなEL素子層1及び透明基板2が正方形である場合に
は、透明基板2の中央部に配置した大きな多量密封剤4
a1と、外周四隅部に配置した小さな多量密封剤4a2…
と夫々相対するように、少量密封剤4b1,4b2…をカ
バー板3に配置している。また図3(a)に示すような
EL素子層1及び透明基板2が縦横比の小さい長方形で
ある場合には、透明基板2の中央部に配置した大きな多
量密封剤4a3,4a3と、外周四隅部に配置した小さな
多量密封剤4a4…と夫々相対するように、少量密封剤
4b3,4b3,4b4…をカバー板3に配置している。更
に図4(a)に示すようなEL素子層1及び透明基板2
が縦横比の大きい長方形である場合には、透明基板2の
中央部に配置した大きな多量密封剤4a5及びそれより
やや小さい多量密封剤4a6,4a6と、外周四隅部に配
置した小さな多量密封剤4a7…と夫々相対するよう
に、少量密封剤4b5,4b6,4b6,4b7…をカバー
板3に配置している。
Further, the application position of the small amount of the sealant 4b is the same as the application position of the large amount of the sealant 4 as shown in FIG.
As shown in FIG. 4A, it changes according to the planar shape of the EL element layer 1 and the transparent substrate 2. That is, when the EL element layer 1 and the transparent substrate 2 are square as shown in FIG.
a1 and a small amount of sealant 4a2 arranged at four corners of the outer periphery.
Are disposed on the cover plate 3 so as to face each other. When the EL element layer 1 and the transparent substrate 2 are rectangles having a small aspect ratio as shown in FIG. 3A, a large amount of sealants 4a3 and 4a3 disposed at the center of the transparent substrate 2 and four outer peripheral corners are provided. The small sealants 4b3, 4b3, 4b4... Are arranged on the cover plate 3 so as to be opposed to the small large sealants 4a4. Further, an EL element layer 1 and a transparent substrate 2 as shown in FIG.
Is a rectangle having a large aspect ratio, a large amount of sealant 4a5 and a small amount of sealants 4a6 and 4a6 arranged at the center of the transparent substrate 2 and a small amount of sealant 4a7 arranged at four corners of the outer periphery. A small amount of sealant 4b5, 4b6, 4b6, 4b7,... Is arranged on the cover plate 3 so as to face each other.

【0012】前記下定盤Aは、その上面が水平となるよ
うにベースD上に固定され、その上面は平坦で真空吸着
用の多数の孔や溝などの吸引口A1が形成される。
The lower surface plate A is fixed on a base D so that the upper surface thereof is horizontal, and the upper surface thereof is flat and has a plurality of suction ports A1 such as a large number of holes and grooves for vacuum suction.

【0013】前記上定盤Bは、従来周知構造の昇降手段
Cによって下定盤Aに対し、その下面が下定盤Aの上面
と平行となるように保持したまま上下動するように構成
される。本実施例の場合には、上記昇降手段Cが、上記
ベースD上に立設した複数の案内ガイドC1と、上定盤
Bに固着した上記案内ガイドC1に沿って上下方向へ往
復動自在な複数の摺動部C2と、例えばモーターなどの
駆動源C3に連結して摺動部C2に螺合したボールネジ
C4とから構成され、上記駆動源C3の作動でボールネ
ジC4を回転させることにより、摺動部C2及び上定盤
Bが案内ガイドC1に沿って上下動するようになってい
る。そして、上記駆動源C3は、コントローラー(図示
せず)により作動制御され、その初期状態で摺動部C2
を上限位置に待機させ、第1の動作信号を入力すること
により、摺動部C2を下降させて上定盤Bが設定高さ位
置まで下降した時点で下降を停止し、第2の動作信号を
入力することにより、摺動部C2を上昇させて初期状態
に戻す。
The upper stool B is configured to move up and down with respect to the lower stool A by a raising / lowering means C having a conventionally well-known structure, with its lower surface being held parallel to the upper surface of the lower stool A. In the case of this embodiment, the elevating means C is vertically reciprocable along a plurality of guides C1 erected on the base D and the guides C1 fixed to the upper stool B. A plurality of sliding portions C2 and a ball screw C4 connected to a driving source C3 such as a motor and screwed to the sliding portion C2, and the ball screw C4 is rotated by the operation of the driving source C3. The moving portion C2 and the upper stool B move up and down along the guide C1. The operation of the driving source C3 is controlled by a controller (not shown).
Is stopped at the upper limit position, and the first operation signal is input, thereby lowering the sliding portion C2 and stopping the lowering when the upper stool B is lowered to the set height position. , The sliding portion C2 is raised to return to the initial state.

【0014】また、前記密封剤4は、紫外線硬化性樹脂
からなる液状接着剤か又は熱硬化性樹脂からなる液状接
着剤であり、その充填量は、前記透明基板2とカバー板
3の間に形成されたギャップGの容積と一致し、詳しく
は該ギャップGの厚さ寸法に、カバー板3の面積を乗算
することにより求められる。そして、前記昇降手段Cに
より密封剤4が十分に広がった後の適宜タイミングで、
紫外線硬化型接着剤の場合には紫外線を照射することに
より固化して透明基板2とカバー板3が接着され、また
熱硬化型接着剤の場合には、加熱することにより固化し
て透明基板2とカバー板3が接着される。
The sealant 4 is a liquid adhesive made of an ultraviolet curable resin or a liquid adhesive made of a thermosetting resin, and the filling amount is between the transparent substrate 2 and the cover plate 3. It corresponds to the volume of the formed gap G, and more specifically, is obtained by multiplying the thickness dimension of the gap G by the area of the cover plate 3. Then, at an appropriate timing after the sealant 4 is sufficiently spread by the elevating means C,
In the case of an ultraviolet curable adhesive, the transparent substrate 2 and the cover plate 3 are solidified by irradiating ultraviolet rays, and in the case of a thermosetting adhesive, the transparent substrate 2 is solidified by heating. And the cover plate 3 are bonded.

【0015】次に、斯かるEL素子の封止方法を、上述
した装置を使用して説明する。先ず、初期状態では、図
1の実線に示す如く上定盤Bが上昇しており、この状態
で下定盤Aの上面の定位置には、透明基板2を載置して
吸引口A1からの吸引を開始させることにより吸着保持
され、この吸着保持した後に多量密封剤4a…が塗布さ
れるか、或いは予め多量密封剤4a…が塗布される透明
基板2を吸着保持する。これにより、多量密封剤4a…
は、夫々の上端部が略平らになる。
Next, a method for sealing such an EL element will be described using the above-described apparatus. First, in the initial state, the upper stool B rises as shown by the solid line in FIG. 1, and in this state, the transparent substrate 2 is placed at the fixed position on the upper surface of the lower stool A and the After the suction is started, the transparent substrate 2 is sucked and held, and after this sucking and holding, the transparent substrate 2 to which the large amount of the sealant 4a is applied or the large amount of the sealant 4a is previously applied is sucked and held. Thereby, a large amount of sealant 4a ...
Has a substantially flat upper end.

【0016】また、上定盤Bの下面の定位置には、予め
少量密封剤4b…が塗布されたカバー板3を配置して吸
引口B1からの吸引を開始させることにより吸着保持さ
せるか、或いはカバー板3を吸着保持させた後に少量密
封剤4b…が塗布される。これにより、各少量密封剤4
b…は夫々の中心部が逆山形状に垂れ下がって、上記多
量密封剤4a…の略平らな上端部と夫々相対する。
At a fixed position on the lower surface of the upper stool B, a cover plate 3 coated with a small amount of a sealing agent 4b in advance is arranged to start suction from the suction port B1 for suction and holding. Alternatively, a small amount of the sealant 4b is applied after the cover plate 3 is sucked and held. Thereby, each small amount sealant 4
b ... each has a central portion that hangs in an inverted mountain shape, and is opposed to the substantially flat upper end of the large amount of sealant 4a.

【0017】この状態から、昇降手段Cの駆動源C3が
作動して、上定盤Bの下降を開始すると、図1の二点鎖
線に示す如く各少量密封剤4b…の逆山形状に垂れ下が
った中心部が、上端部が略平らな多量密封剤4a…に夫
々一点で接触を開始する。それにより、合流時に空気が
混入せず、密封剤4中には気泡が発生しない。
In this state, when the drive source C3 of the lifting / lowering means C is activated and the lowering of the upper stool B is started, the small amount of sealant 4b hangs down in an inverted mountain shape as shown by a two-dot chain line in FIG. The central part starts to contact the mass sealant 4a... As a result, no air is mixed at the time of merging, and no air bubbles are generated in the sealant 4.

【0018】上記中央部及び外周部に配置した少量密封
剤4b…と多量密封剤4a…が夫々一点で接触して合流
した後は、上定盤Bの下降に伴って夫々略均一な量で放
射状に広がり、ある程度まで広がると総ての密封剤4が
合流する。この頃には、図5の実線に示す如く上定盤B
の下降が完了して、図2(b)〜図4(b)に示す如く
カバー板3の外周四隅部3a…及び各辺中間部3b…を
覆い、その最も外側部分が周縁部3c…に到達した時点
では、密封剤4が未到達な領域は非常に少ない。その
後、密封剤4がはみ出すことなく周縁部3c…の全域ま
で到達してEL素子層1は完全に密封される。
After the small amount of sealant 4b and the large amount of sealant 4a arranged at the central portion and the outer peripheral portion come into contact at one point, respectively, and converge, the lower amount of the upper surface plate B lowers, and the amount of the substantially uniform amount respectively. It spreads radially, and when it spreads to some extent, all the sealants 4 merge. At this time, as shown by the solid line in FIG.
Is completed, and as shown in FIGS. 2 (b) to 4 (b), the outer peripheral four corners 3a of the cover plate 3 and the middle parts 3b of each side are covered, and the outermost parts of the outer peripheral parts become the peripheral parts 3c. At this point, the area where the sealant 4 has not reached is very small. After that, the sealant 4 reaches the entire periphery 3c without protruding, and the EL element layer 1 is completely sealed.

【0019】従って、密封剤4の広がりは多点で略同時
に広がり始めるから、図2(b)〜図4(b)に示され
る状態までに要する時間は極めて短い。更に、密封剤4
の押し広げを開始する時点で、既に多量密封剤4aが略
全域に分散配置されるので、従来のような中央部と外周
四隅部に密封剤4の量が不均一になることから発生する
透明基板2とカバー板3とのギャップの違いにより歪が
発生し、その結果、製品としてELディスプレイパネル
の表示が悪くなるという致命的な欠点を防止できる。
Accordingly, since the spread of the sealant 4 starts to spread almost simultaneously at multiple points, the time required until the state shown in FIGS. 2 (b) to 4 (b) is extremely short. Furthermore, sealant 4
When the spread of the sealant is started, a large amount of the sealant 4a is already dispersed and distributed over substantially the entire area. Distortion occurs due to a difference in gap between the substrate 2 and the cover plate 3, and as a result, a fatal drawback that the display of the EL display panel is deteriorated as a product can be prevented.

【0020】その後は、前記上定盤Bの吸引口B1から
の吸引を解除してカバー板3の吸着が開放され、これに
続いて前記昇降手段Cの駆動源C3が作動し、上定盤B
の上昇を開始して図5の二点鎖線に示す如く初期状態に
戻り、その後は、下定盤Aの吸引口A1からの吸引を解
除して透明基板2の吸着が開放され、密封剤4が充填さ
れた透明基板2及びカバー板3を次の工程へ送る。この
際、下定盤A上において透明基板2とカバー板3の間に
充填された密封剤4に対し、紫外線が照射されるか或い
は加熱されて、密封剤4の一部又は全部を固化して透明
基板2とカバー板3を貼り合わせた後に次の工程へ送る
か、或いは次の工程へ送った後に、紫外線が照射される
か或いは加熱されて、密封剤4を固化して透明基板2と
カバー板3を貼り合わせ。それ以降は、上述した動作が
繰り返される。
Thereafter, the suction from the suction port B1 of the upper platen B is released to release the suction of the cover plate 3. Subsequently, the drive source C3 of the lifting / lowering means C is operated, and the upper platen is operated. B
5 and returns to the initial state as shown by the two-dot chain line in FIG. 5, thereafter, the suction from the suction port A1 of the lower platen A is released to release the suction of the transparent substrate 2, and the sealant 4 is removed. The filled transparent substrate 2 and cover plate 3 are sent to the next step. At this time, the sealant 4 filled between the transparent substrate 2 and the cover plate 3 on the lower platen A is irradiated with ultraviolet rays or heated to solidify part or all of the sealant 4. After the transparent substrate 2 and the cover plate 3 are bonded together, they are sent to the next step, or after they are sent to the next step, they are irradiated or heated with ultraviolet light to solidify the sealant 4 and The cover plate 3 is attached. Thereafter, the above operation is repeated.

【0021】一方、図6及び図7に示すものは、本発明
の他の実施例であり、このものは、前記吸着部材Bとし
て上定盤を昇降手段Cに対し上下動自在に支持し、この
上定盤B及びそれに吸着保持されたカバー板3を、定盤
Aとして下定盤の上面に吸着保持された透明基板2に向
けて弾性的に押圧するための伸縮自在な弾性部材6を配
設した構成が、前記図1〜図5に示した実施例とは異な
り、それ以外の構成は図1〜図5に示した実施例と同じ
ものである。
6 and 7 show another embodiment of the present invention. In this embodiment, an upper platen is supported as the suction member B so as to be vertically movable with respect to a lifting / lowering means C. A stretchable elastic member 6 for elastically pressing the upper surface plate B and the cover plate 3 sucked and held thereon toward the transparent substrate 2 sucked and held on the upper surface of the lower surface plate as a surface plate A is arranged. The configuration provided is different from the embodiment shown in FIGS. 1 to 5, and the other configuration is the same as the embodiment shown in FIGS. 1 to 5.

【0022】本実施例では、上記昇降手段Cの複数の摺
動部C2に亙って保持プレート5aを固着し、この保持
プレート5aには、複数又は単数のボールブッシュ5b
とスプラインシャフト5cからなる摺動機構が上下方向
へ往復動自在に配設され、これらボールブッシュ5bか
ら下方へ突出したスプラインシャフト5cの下端には、
上定盤Bをその吸引口B1が前記下定盤Aの上面と平行
に対向するように連設している。更に、上記ボールブッ
シュ5bから上方へ突出したスプラインシャフト5cの
上端と、保持プレート5aの上面の間には、前記弾性部
材6として例えばコイルスプリングを配設し、このコイ
ルスプリング6によって上定盤Bは、僅かな力が作用し
ただけでも上下動するようになっている。
In this embodiment, a holding plate 5a is fixed over a plurality of sliding portions C2 of the elevating means C, and a plurality of or a single ball bush 5b is fixed to the holding plate 5a.
A sliding mechanism comprising a spline shaft 5c and a spline shaft 5c is disposed so as to be able to reciprocate up and down, and at the lower end of the spline shaft 5c protruding downward from the ball bush 5b,
The upper surface plate B is continuously provided such that the suction port B1 faces the upper surface of the lower surface plate A in parallel. Further, for example, a coil spring is disposed as the elastic member 6 between the upper end of the spline shaft 5c projecting upward from the ball bush 5b and the upper surface of the holding plate 5a. Can move up and down even when a slight force is applied.

【0023】次に、斯かる図6及び図7に示すEL素子
の封止方法を、上述した装置を使用して説明する。前記
図1〜図5に示した実施例と異なる動作のみを記載すれ
ば、先ず、上定盤Bの下面にカバー板3を吸着保持させ
た初期状態では、図6の実線に示す如くカバー板3の重
量分だけ弾性部材6が短縮して上定盤Bが僅かに下降し
て釣り合う。その後、昇降手段Cの駆動源C3の作動に
より上定盤Bの下降を開始して、図6の二点鎖線に示す
如く少量密封剤4b…と多量密封剤4a…とが接触した
瞬間は、これら少量密封剤4b…と多量密封剤4a…同
士が引き合ってカバー板3を引き下げようとする。この
下方への引っ張り力により弾性部材6を短縮させて、カ
バー板3が昇降手段Cによる下降速度よりも速く引き下
げられる。それにより、少量密封剤4b…と多量密封剤
4a…同士の引き合いに追従してカバー板3が下動する
から、少量密封剤4b…と多量密封剤4a…と間に隙間
ができず、両者間への空気の混入を完全に防止して、密
封剤4中には気泡が発生しない。その後の上記密封剤4
の広がるのに従ってカバー板3が下方へ僅かに引っ張ら
れて弾性部材6が更に短縮し、これにより、キャップG
が調整されて毛細管現象による密封剤4の広がりが促進
される。それにより、密封剤4の広がりは更に加速され
てスムーズに行われる。更に、昇降手段Cの駆動源C3
によって図7の実線に示す如く上定盤Bを下降させ過ぎ
たとしても、広がった密封剤4により弾性部材6が伸長
してカバー板3を上方向へ押し戻す。それにより、カバ
ー板3の重量と密封剤4のから受ける反力とが釣り合っ
て、カバー板3と透明基板2とが所定のギャップG厚
(例えば20〜50μm)に保たれる。その結果、カバ
ー板3により密封剤4が必要以上に押し潰されてはみ出
ない。
Next, a method for sealing the EL element shown in FIGS. 6 and 7 will be described using the above-described apparatus. Only operations different from those of the embodiment shown in FIGS. 1 to 5 will be described. First, in the initial state in which the cover plate 3 is sucked and held on the lower surface of the upper surface plate B, as shown by the solid line in FIG. The elastic member 6 is shortened by the weight of 3, and the upper stool B is slightly lowered and balanced. Then, the lowering of the upper surface plate B is started by the operation of the driving source C3 of the lifting / lowering means C, and as shown by the two-dot chain line in FIG. The small amount of sealant 4b and the large amount of sealant 4a are attracted to each other so that the cover plate 3 is lowered. The elastic member 6 is shortened by this downward pulling force, and the cover plate 3 is pulled down faster than the descending speed by the elevating means C. As a result, the cover plate 3 moves downward following the attraction between the small amount of sealant 4b and the large amount of sealant 4a, so that no gap is formed between the small amount of sealant 4b and the large amount of sealant 4a. Air is completely prevented from entering the space, and no air bubbles are generated in the sealant 4. Subsequent sealant 4
As the cover spreads, the cover plate 3 is slightly pulled downward, and the elastic member 6 is further shortened.
Is adjusted to promote the spread of the sealant 4 due to the capillary phenomenon. Thereby, the spread of the sealant 4 is further accelerated and is performed smoothly. Further, the driving source C3 of the lifting / lowering means C
Even if the upper platen B is lowered too much as shown by the solid line in FIG. 7, the elastic member 6 is extended by the spread sealant 4 and pushes the cover plate 3 upward. Thereby, the weight of the cover plate 3 and the reaction force received from the sealant 4 are balanced, and the cover plate 3 and the transparent substrate 2 are maintained at a predetermined gap G thickness (for example, 20 to 50 μm). As a result, the sealant 4 is crushed more than necessary by the cover plate 3 and does not protrude.

【0024】従って、図6及び図7に示すものは、前記
図1〜図5に示した実施例よりも塗布後の密封剤形状や
透明基板及びカバー板の厚み誤差と関係なく吸着部材を
定量下降させるだけで空気の混入やはみ出しを起こさず
に封止作業を完了できるという利点はある。
6 and 7, the amount of the adsorbing member is determined more irrespective of the shape of the sealant after application and the thickness error of the transparent substrate and the cover plate than in the embodiment shown in FIGS. There is an advantage that the sealing operation can be completed without lowering the air and without protruding just by lowering.

【0025】なお、図6及び図7に示した実施例におい
てカバー板3の大きさが小さいものである場合には、上
定盤Bに代えて複数又は単数の吸着パットを上下動自在
に支持しても同様な作用効果が得られる。
In the embodiment shown in FIGS. 6 and 7, when the size of the cover plate 3 is small, a plurality or a single suction pad is supported so as to be vertically movable instead of the upper surface plate B. The same operation and effect can be obtained.

【0026】また、図6及び図7に示した実施例では、
前記図1〜図5に示した実施例で説明した透明基板2の
中央部及び外周部に分散して塗布された多量密封剤4a
…と、カバー板3の中央部及び外周部に塗布された少量
密封剤4b…とを夫々一点で接触させる方法を図示して
いるが、図8に示すように透明基板の中央部に集中して
塗布された密封剤4をカバー板3により押し広げるよう
にしても良い。この場合には、カバー板3が密封剤4の
平らな上端面に接触した瞬間に、密封剤4が一気に押し
潰れても、これに引っ張られてカバー板3が吸着部材で
ある上定盤Bと関係なく下動するから、この急激な密封
剤4の形状変化に追従して両者間に隙間が発生しないと
共に、カバー板3により密封剤4が必要以上に押し潰さ
れてはみ出ることもない。その結果、図8に示したもの
よりも、下降したカバー板3が塗布後の密封剤形状や透
明基板及びカバー板の厚み誤差と関係なく吸着部材を定
量下降させるだけで空気の混入やはみ出しを起こさずに
封止作業を完了するできるという利点がある。
In the embodiment shown in FIGS. 6 and 7,
A large amount of sealant 4a dispersedly applied to the central portion and the outer peripheral portion of the transparent substrate 2 described in the embodiment shown in FIGS.
And a small amount of sealant 4b applied to the central portion and the outer peripheral portion of the cover plate 3 at a single point, respectively. However, as shown in FIG. The sealant 4 applied by pressing may be spread by the cover plate 3. In this case, at the moment when the cover plate 3 comes into contact with the flat upper end surface of the sealant 4, even if the sealant 4 is suddenly crushed, the seal plate 4 is pulled by the cover plate 3 and the cover plate 3 is an upper surface plate B which is an adsorption member. Therefore, no gap is generated between the two following the sudden change in the shape of the sealant 4, and the sealant 4 is not crushed more than necessary by the cover plate 3 and does not protrude. As a result, as compared with the case shown in FIG. 8, the lower cover plate 3 reduces the adsorbing member by a fixed amount, regardless of the sealant shape after application and the thickness error of the transparent substrate and the cover plate. There is an advantage that the sealing operation can be completed without causing the occurrence.

【0027】尚、前示両実施例では、透明基板2の上方
にカバー板3を相互に対向させて配置したが、これに限
定されず、これと上下逆にしてカバー板3の上方に対向
させて透明基板2を配置して、カバー板3の中央部及び
外周部に多量密封剤4a…分散して塗布すると共に、透
明基板2の中央部及び外周部に少量密封剤4b…を塗布
しても良い。更に、昇降手段Cも前述したものに限定さ
れず、同様の作用をすれば他の構成であっても良い。ま
た、前示両実施例で真空中においても特性の変化がない
密封剤4を使用するのであれば、密封剤4を押し広げる
空間を2000Pa以下の真空にすることで、気泡防止
に対しては更に良い結果が得られる。
In the above-described embodiments, the cover plates 3 are disposed above the transparent substrate 2 so as to face each other. However, the present invention is not limited to this. Then, the transparent substrate 2 is arranged, and a large amount of the sealant 4a is dispersed and applied to the central portion and the outer peripheral portion of the cover plate 3, and a small amount of the sealant 4b is applied to the central portion and the outer peripheral portion of the transparent substrate 2. May be. Further, the lifting / lowering means C is not limited to the one described above, and may have another configuration as long as the same operation is performed. In addition, if the sealant 4 which does not change its properties even in a vacuum is used in both of the above-described embodiments, the space for expanding the sealant 4 is set to a vacuum of 2000 Pa or less. Even better results are obtained.

【0028】[0028]

【発明の効果】以上説明したように、本発明のうち請求
項1記載の発明は、昇降手段の作動で透明基板及びカバ
ー板を接近させることにより、多量密封剤の略平らな上
端部と、逆山形に垂れ下がった少量密封剤とが夫々一点
で接触を開始して略均一な量で広がり、その後、これら
総ての密封剤が合流して、カバー板又は透明基板の周縁
部まで到達するので、密封剤を短時間で空気の混入やは
み出しを防ぎながら全域に広げられる。従って、透明基
板の中央部から密封剤を放射状に押し広げて毛細管現象
により周縁部まで広げる従来の方法に比べ、周縁部の隅
々まで密封剤が僅かな時間で到達し、その結果、装置の
タクトタイムを短縮化でき、それにより、装置の台数を
増やしたり、密封剤の広がりが完了するまで待機させる
バッファなどの設置が必要とならない。更に、放射方向
の距離が外周四隅部より短い各辺中間部の領域では密封
剤のはみ出しが発生し易い従来の方法に比べ、密封剤が
略均一な量で広がるから密封剤のはみ出しが発生せず、
それにより、EL素子層の周囲に密封剤のはみ出し防止
用の枠を設ける必要がなく、製品のコストを低減できる
ばかりでなく、高品質のELディスプレイパネルを提供
できる。また、透明基板上に塗布された密封剤の平らな
上端面に対し水平状態のまま下降したカバー板が面接触
する従来の方法に比べ、密封剤の平らな上端面にカバー
板が面接触しないから、カバー板とEL素子との間に気
泡が発生するのを防止でき、それにより、EL素子を劣
化させたり、ELディスプレイパネルとしての品質を下
げることがない。
As described above, according to the first aspect of the present invention, the transparent substrate and the cover plate are brought close to each other by the operation of the lifting / lowering means, whereby the substantially flat upper end of the large amount of sealant is provided. A small amount of sealant hanging in an inverted chevron starts contact at each point and spreads in a substantially uniform amount, and then all of these sealants merge to reach the peripheral edge of the cover plate or the transparent substrate. In addition, the sealant can be spread over the entire area in a short time while preventing the intrusion and protrusion of air. Therefore, compared with the conventional method in which the sealant is radially spread out from the center of the transparent substrate and spread to the peripheral edge by capillary action, the sealant reaches all corners of the peripheral edge in a short time, as a result, the The takt time can be shortened, so that it is not necessary to increase the number of devices or install a buffer or the like which waits until the spreading of the sealant is completed. Furthermore, the sealant spreads in a substantially uniform amount in the middle area of each side where the radial distance is shorter than the outer four corners, as compared with the conventional method in which the sealant is likely to protrude. Without
Accordingly, there is no need to provide a frame for preventing the sealant from protruding around the EL element layer, so that the cost of the product can be reduced and a high-quality EL display panel can be provided. In addition, the cover plate does not make surface contact with the flat upper end surface of the sealant, as compared with the conventional method in which the cover plate that has descended while being horizontal remains in contact with the flat upper end surface of the sealant applied on the transparent substrate. Therefore, it is possible to prevent bubbles from being generated between the cover plate and the EL element, thereby preventing the EL element from deteriorating and the quality of the EL display panel from deteriorating.

【0029】[0029]

【0030】[0030]

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明の一実施例を示すEL素子封止方法の
一部切欠正面図で、吸着部材の下降前を実線で示してい
る。
FIG. 1 is a partially cutaway front view of an EL element sealing method according to an embodiment of the present invention, and shows a solid line before a suction member descends.

【図2】 図1の(2)−(2)線に沿える部分的な横
断平面図であり、(a)は密封剤の流入前を示し、
(b)は密封剤の合流後を示している。
FIG. 2 is a partial cross-sectional plan view taken along the line (2)-(2) of FIG. 1, wherein (a) shows a state before the inflow of a sealant;
(B) shows the state after the sealant has joined.

【図3】 密封剤の分散位置の変形例を示す部分的な横
断平面図であり、(a)は密封剤の流入前を示し、
(b)は密封剤の合流後を示している。
FIG. 3 is a partial cross-sectional plan view showing a variation of a dispersion position of a sealant, (a) showing a state before the sealant flows,
(B) shows the state after the sealant has joined.

【図4】 密封剤の分散位置の変形例を示す部分的な
横断平面図であり、(a)は密封剤の流入前を示し、
(b)は密封剤の合流後を示している。
FIG. 4 is a partial cross-sectional plan view showing a modification of the dispersion position of the sealant, (a) showing before the inflow of the sealant,
(B) shows the state after the sealant has joined.

【図5】 吸着部材の下降完了時を実線で示す一部切欠
正面図である。
FIG. 5 is a partially cutaway front view showing the completion of the lowering of the suction member by a solid line.

【図6】 本発明の他の実施例を示すEL素子封止装置
の一部切欠正面図であり、吸着部材が下降する前の初期
状態を実線で示している。
FIG. 6 is a partially cutaway front view of an EL element sealing device according to another embodiment of the present invention, in which an initial state before a suction member descends is indicated by a solid line.

【図7】 吸着部材の下降完了時を示す一部切欠正面図
である。
FIG. 7 is a partially cutaway front view showing the completion of the lowering of the suction member.

【図8】 従来のEL素子封止方法の一例で、(a)は
吸着部材の下降前を実線で示し一部切欠正面図であり、
(b)は同状態の部分的な拡大横断平面図である。
FIG. 8 is an example of a conventional EL element sealing method, in which (a) is a partially cutaway front view showing a state before the suction member descends by a solid line,
(B) is a partial enlarged cross-sectional plan view of the same state.

【符号の説明】[Explanation of symbols]

A 定盤(下定盤) B 吸着部材
(上定盤) C 昇降手段 1 EL素子層 2 透明基板 3 カバー板 4 密封剤 4a 多量密封
剤 4b 少量密封剤 6 弾性部材
A surface plate (lower surface plate) B adsorption member (upper surface plate) C lifting / lowering means 1 EL element layer 2 transparent substrate 3 cover plate 4 sealant 4a large sealant 4b small sealant 6 elastic member

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平11−283739(JP,A) 特開 平10−335061(JP,A) 特開 昭62−22393(JP,A) 特開 平7−320865(JP,A) (58)調査した分野(Int.Cl.7,DB名) H05B 33/00 - 33/28 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-11-283739 (JP, A) JP-A-10-3355061 (JP, A) JP-A-62-22393 (JP, A) JP-A-7-27 320865 (JP, A) (58) Field surveyed (Int. Cl. 7 , DB name) H05B 33/00-33/28

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 矩形のエレクトロルミネセンス素子層
(1)が形成された透明基板(2)とカバー板(3)と
の間に、液状の密封剤(4)を塗布し、これら透明基板
(2)とカバー板(3)のどちらか一方が吸着保持され
る定盤(A)に対し、他方が吸着保持される吸着部材
(B)を昇降手段(C)により上下動させることによ
り、上記密封剤(4)が押し広げられてエレクトロルミ
ネセンス素子層(2)を封止する方法において、 前記定盤(A)に吸着保持される透明基板(2)又はカ
バー板(3)のどちらか一方の中央部及び外周部に、多
量の密封剤(4)を適宜間隔毎に分散して塗布し、吸着
部材(B)に吸着保持されるカバー板(3)又は透明基
板(2)の他方には、上記多量密封剤(4a)と相対す
る位置に、少量の密封剤(4b)を夫々塗布するステッ
プと、 上記多量密封剤(4a)の上端部と、逆山形状に垂れ下
がった密封剤(4b)とを、昇降手段(C)により接近
させて接触させるステップと、 からなることを特徴とするエレクトロルミネセンス素子
封止方法。
A liquid sealant (4) is applied between a transparent substrate (2) on which a rectangular electroluminescent element layer (1) is formed and a cover plate (3), and the transparent substrate ( By moving the suction member (B), which holds one of the cover plate (3) by suction and holding, with respect to the surface plate (A) on which one of the cover plate (3) and the cover plate (3) is held by the lifting means (C), In the method of sealing the electroluminescent element layer (2) by expanding the sealant (4), either the transparent substrate (2) or the cover plate (3) sucked and held on the surface plate (A). A large amount of a sealant (4) is dispersed and applied at appropriate intervals to one central portion and the outer peripheral portion, and the other of the cover plate (3) or the transparent substrate (2) which is adsorbed and held by the adsorbing member (B). In a position opposite to the large amount of sealant (4a), a small amount of sealant (4b And a step of bringing the upper end portion of the large amount of sealant (4a) into close contact with the sealant (4b) hanging down in an inverted mountain shape by means of a lifting / lowering means (C). A method of sealing an electroluminescent element.
JP10307323A 1998-10-28 1998-10-28 Electroluminescent element sealing method Expired - Fee Related JP3080164B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10307323A JP3080164B2 (en) 1998-10-28 1998-10-28 Electroluminescent element sealing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10307323A JP3080164B2 (en) 1998-10-28 1998-10-28 Electroluminescent element sealing method

Publications (2)

Publication Number Publication Date
JP2000133445A JP2000133445A (en) 2000-05-12
JP3080164B2 true JP3080164B2 (en) 2000-08-21

Family

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Country Link
JP (1) JP3080164B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3621369B2 (en) 2001-10-30 2005-02-16 松下電器産業株式会社 Manufacturing method of semiconductor device
JP4712298B2 (en) * 2002-12-13 2011-06-29 株式会社半導体エネルギー研究所 Method for manufacturing light emitting device
KR101032337B1 (en) * 2002-12-13 2011-05-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Light emitting device and manufacturing method thereof
CN100356611C (en) * 2004-07-01 2007-12-19 友达光电股份有限公司 Organic electro-laser light-emitting diode panel module with buffer layer
KR101321238B1 (en) * 2006-05-11 2013-10-25 엘지디스플레이 주식회사 encapsulation appratus and method for fabricating electroluminescence display device
KR100793368B1 (en) * 2006-08-21 2008-01-11 삼성에스디아이 주식회사 Vertical encapsulation device and manufacturing method of organic light emitting display device using same
JP6479517B2 (en) * 2015-03-17 2019-03-06 株式会社ディスコ Method for forming protective member
WO2019021370A1 (en) * 2017-07-25 2019-01-31 シャープ株式会社 Coating device, el device manufacturing apparatus, and el device

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