JP3088314B2 - Terminal for metal substrate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a metal substrate terminal and a method for fixing the same.

[0002]

2. Description of the Related Art Conventionally, this type of metal substrate terminal fixing method is different from a glass epoxy substrate and a ceramic substrate in that a clip terminal cannot be used because the substrate itself is a conductor.
A method of mounting on a surface of a metal substrate has been used, and a positioning protrusion of a terminal is inserted into a positioning hole of the metal substrate to be positioned, fixed, and used.

FIG. 4 is a diagram showing an example of a conventional method for fixing a terminal for a metal substrate. The terminal 41 is formed by integrally molding a plurality of pins 43 with a resin 42 having positioning protrusions 45 and 46. The positioning protrusions 45 and 46 are inserted into the holes 22 and 23 of the metal substrate 21 to be positioned. Root 44
Is fixed on the terminal pads 24 of the metal substrate 21 on which the solder paste 25 is printed in advance. In this state, when passing through a reflow furnace, the pin root portion 44 and the terminal pad 24 are soldered with the solder paste 25 and connected.

[0004]

The first problem is that it is necessary to make a terminal mold for each product, and in recent years, since many kinds of small-quantity production are common, the cost of the terminal mold is large. The terminals become expensive.

The reason is that the pins of the terminals and the positioning protrusions are integrally formed by a resin mold.

[0006] The second problem is that if common use of terminals is considered during product development, the design can be restricted, which makes flexible product development difficult.

[0007] The reason is that if the number of terminals is designed differently for each product, it is necessary to make a terminal mold for each product. Because it comes out.

[0008] The object of the present invention is to increase the variety,
An object of the present invention is to provide a metal substrate terminal that can be obtained in an existing mold without causing a new terminal mold, and a method of fixing the terminal.

[0009]

The metal substrate terminal of the present invention comprises a plurality of pins connected to a plurality of substrate terminal pads;
A plurality of blocks into which the tops of these pins are press-fitted are separated
Upper pin freely connected and resin molded
The guide and the block into which the lower part of each pin is press-fitted
Under several parts that are detachably connected and resin molded
Pin guides and these upper and lower pin guides
Supports both ends, and connects these upper and lower
Positioning guides for arranging pin guides at predetermined intervals in parallel
Protruding from the parallel upper pin guide.
The length of the output pin can be changed by adjusting the interval
It is characterized by the following.

[0010]

[0011]

More specifically, a plurality of blocks (3 in FIG. 1) into which pins (3 in FIG. 1) are press-fitted one by one are detachably connected and molded to form an upper pin guide 5 and a lower pin guide.
The terminal portion (2) including the metal pin ( 6 ) has no positioning protrusion with the metal substrate (21), and the upper pin guide 5 and the lower pin
The positioning guides (11, 12) having a shape that can be used by cutting the required number of pins with the guide 6 and having positioning protrusions (16a, 16b) are separate from the terminal portion (2). A metal plate (21) having an abutment surface (15) for fitting dimensions with the fitting portion (13, 14) with the portion (2), formed as an integral terminal in combination with the terminal portion (2); Can be fixed on top.

Further, instead of using the positioning guide having the positioning protrusion as described above, a jig (31 in FIG. 3) for positioning the metal substrate (21) relative to other terminals is used. Alternatively, it can be fixed on a metal substrate (21).

According to the metal substrate terminal and the method of fixing the same according to the present invention, the terminal portion which can be formed freely according to the required number of pins and the positioning guide are provided with a projection for forming the fitting portion and the combined dimensions. The terminal pins can be soldered to the pads by assembling them at the contact portions to form an integrated terminal, inserting the positioning protrusions of the positioning guide into the positioning holes of the metal substrate and fixing them.

When the positioning guide is not used, a terminal pin may be fixed on a pad of the metal substrate and soldered by using a jig for positioning relative to another terminal on the metal substrate. it can.

Therefore, a metal substrate terminal can be obtained at low cost without making a mold for each product, and a flexible product can be developed without being limited by the number of terminal pins.

[0017]

Next, a first embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is an exploded perspective view showing a metal substrate terminal and a method for fixing the same according to the first embodiment.
Is a cross-sectional view at the time of fixing.

Referring to FIG. 1, a terminal portion 2 which is a component of the metal substrate terminal 1 has a pin 3 having a pin base 4.
When the upper portion of the pin guide 5 and pin guide 6 of the lower part a plurality of pin 3 of one by one is press-fitted, is connected freely separated from one another, respectively, to the left and right ends of the upper portion of the pin guide 5 Pin guides 7 and 8 in which pins 3 are not press-fitted
Are connected one by one. Over several
The pin guide 5 at the portion and the pin guide 6 at the lower portion, including the connection portion, are molded with a resin that resists the heat of solder reflow.

The upper pin guide 5 and the lower pin
Since the end of the connection of the guide 6 is cut, some cutting burrs 9a and 9b are provided. In addition, the upper pin guide 5 and the lower pin guide 6 are arranged in parallel with each other with a predetermined space therebetween via the pin 3.

On the other hand, the positioning guides 11 and 12, which are the other components of the metal substrate terminal 1, are fitted with the above-mentioned terminal 2 by fitting portions 13a, 14a and 13b, respectively.
14b, abutment surfaces 15a and 15b for determining a combination dimension with the terminal portion 2, positioning protrusions 16a and 16b for determining a relative position with respect to the substrate side, and a contact surface 1 with the metal substrate surface.
7a and 17b. The positioning guides 11 and 12 have the same shape, and the pin guides 5 and 6
Similarly to the above, it is molded with a resin that can withstand solder reflow heat. Further, the fitting portion 13a with the terminal portion 2,
13b, 14a, and 14b have a structure in which the cutting burrs 9a and 9b of the terminal portion 2 escape.

The metal substrate terminal 1 is constructed by combining the terminal portion 2 and the positioning guide portions 11 and 12 as described above, and cuts an arbitrary number of the pin guides 5 and 6 connected to each other. Separately, the terminal portions 2 can be provided according to the required number of pins.

The metal substrate 21 has, in its terminal mounting portion, terminal positioning holes 22 and 23 for inserting the positioning protrusions 16a and 16b of the metal substrate terminal 1, and terminal pads 24 having the same number of terminal pins. I have. A solder paste 25 is printed on the terminal pads 24 in advance.

Next, a method of combining the terminal portion 2 for forming the metal substrate terminal 1 with the positioning guide portions 11 and 12, and a method of mounting and fixing the terminal portion 2 to the metal substrate will be described with reference to FIGS. .

First, a method of assembling the terminal portion 2 for forming the metal substrate terminal 1 and the positioning guide portions 11 and 12 is as follows. The pin guide 7 at the end of the terminal portion 2 is inserted into the fitting portion of the positioning guide portion 11. 13a, and at the same time, the pin guide 6 below the pin adjacent to the pin guide 7 is inserted into the fitting portion 14a of the positioning guide portion 11, and the pin guide 7 adjacent to the pin guide 7 is inserted.
The abutment surface 15a of the positioning guide 11 is pressed against the pin 3 press-fitted into the lower pin guide 6, and the terminal 2 is fixed to the positioning guide 11. Similarly, the opposite side of the terminal portion 2 is also fixed to the positioning guide portion 12, and the metal substrate terminals 1 are combined.

Terminal section 2 and positioning guide sections 11 and 12
Positioning protrusion 16 of metal substrate terminal 1 combined with
When the (16a, 16b) is inserted into the terminal positioning holes 22, 23 of the metal substrate 21, the pin base 4 is
It is fixed in contact with the terminal pad 24 on which the solder paste 25 is printed in advance. In this state, when passing through the reflow furnace, the pin base portion 4 and the terminal pad 24 are soldered with the solder paste 25 and connected. FIG. 2 is a sectional view showing this state.

Next, the effect of the first embodiment of the present invention will be described. In the first embodiment, since the terminals for the metal substrate are divided into the terminal portion and the positioning guide portion, the terminal portion and the positioning guide portion are manufactured by using a single mold to manufacture terminals having different numbers of pins. Can do things. Therefore, there is no need to make a terminal mold for each product,
Terminals can be manufactured and purchased at low cost, and flexible product development that is not restricted by the number of terminal pins becomes possible.

In particular, in recent years when multi-product small-quantity production is expanding, the above-described effects are great.

Further, since the configuration is made up of two pin guides which are arranged in parallel at a distance from each other, the length of the pins can be changed freely, and the height of the pins can be adjusted. You can also plan.

Next, an example corresponding to the first embodiment will be described with reference to the drawings.

Referring to FIG. 1, the terminal portion 2 of the metal substrate terminal 1 is processed so that the tip is easy to insert, and the tip is 2 m.
0.5 m with pin base 4 bent at right angles by m
a pin 3 of m (square) x 13.8 mm (length), and an upper pin guide 5 and a lower pin which are press-fitted into the pin 3 and have a block of 2.5 mm (square) x 1.3 mm (thickness). 21 guides 6 are connected to each other so that they can be separated from each other,
Pin guides 7 and 8 to which the pin 3 is not press-fitted are connected to the left and right ends of the upper pin guide 5 one by one. A plurality of upper pin guides 5 and a lower pin guide
The pin guide 6 is molded from a PPS resin that withstands solder reflow heat, including the connection portion. Also on
The ends of the connection between the pin guide 5 and the lower pin guide 6 are provided with some cutting burrs 9a and 9b by cutting. The upper pin guide 5 and the lower pin guide 6
The pins 3 are arranged in parallel with each other with a predetermined distance interposed therebetween.

Positioning guide 11 of metal substrate terminal 1
And 12 are fitting portions 13a, 14a and 13b, 14b with the terminal portion 2 and two positioning protrusions 16a, 16a.
b, butting surfaces 15a and 15b for obtaining a combined dimension of 55.88 mm with the terminal portion 2 between the centers of the positioning protrusions 16a and 16b, and contact surfaces 17a and 17b with the surface of the metal substrate 21. It is configured. The positioning guides 11 and 12 have the same shape and, like the pin guides 5 and 6, are molded from PPS resin that can withstand the heat of solder reflow. Further, the fitting portion 13 with the terminal portion 2
a, 13b, 14a, and 14b are cutting burrs 9 of the terminal portion 2;
a and 9b escape.

The metal substrate terminal 1 is formed by combining the terminal portion 2 and the positioning guide portions 11 and 12 as described above, and the upper pin guide 5 and the lower pin guide 6 are cut and separated by an arbitrary number. , And the terminal portion 2 according to the required number of pins.

The metal substrate 21 is made of aluminum and has, in its terminal mounting portion, terminal positioning holes 22 and 23 for inserting the positioning protrusions 16a and 16b, and terminal pads 24 having the same number as 21 terminal pins. I have. A solder paste 25 is printed on the terminal pads 24 in advance.

Next, the method of combination in this embodiment and the method of mounting and fixing to a metal substrate are the same as in the case of the first embodiment described above. Omitted.

Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 3 is an exploded perspective view showing the second embodiment.

Referring to FIG. 3, the metal substrate terminal 10 is formed.
Are pin 3, pin base 4, upper pin guide 5 and lower
Only the terminal section 2 including the pin guide 6 is provided, and does not have the positioning guide section as in the first embodiment. Similarly, the metal substrate 21 has only the same number of terminal pads 24 as the number of terminal pins in the terminal mounting portion thereof.
There is no terminal positioning hole as in the embodiment.

The positioning jig 31 has the same number of holes 32 as the number of terminal pins at the same pitch as the terminal pitch. On the opposite side (not shown), the number of other terminal pins on the metal substrate 21 is different. This is a jig having the same number of holes as that described above, and for defining the relative positional relationship between two pin groups on the metal substrate 21.

Next, the metal substrate 21 of the metal substrate terminal 10
A method of mounting the components on a computer will be described with reference to FIG.

Unlike the case of the first embodiment, the positioning jig 31 is inserted into and fixed to the tip of the pin 3 of the metal substrate terminal 10 without using the positioning guide. Similarly, a pin of another terminal is inserted into the opposite side of the positioning jig 31 and fixed. While satisfying the positional dimensional relationship between the two terminals, the metal substrate terminal 1 is placed on the terminal pad 24 on which the solder paste 25 is printed in advance on the metal substrate 21.
0 is mounted. In this state, when the reflow furnace is passed, the pin base 4 and the terminal pad 24 are soldered with the solder paste 25 and connected. Thereafter, the positioning jig 31 is removed. The positioning jig 31 can be reused any number of times.

According to the second embodiment of the present invention, in addition to the effects of the first embodiment, since the positioning guide portion is not required, the terminal can be manufactured and purchased at a lower cost. Have.

[0042]

The first effect is that it is not necessary to make a terminal mold for each product. This makes it possible to manufacture and purchase the terminals at low cost. In particular, the effect is large in high-mix low-volume production.

The reason is that the metal substrate terminal is divided into a terminal portion which can be cut and separated and a positioning guide portion.
This is because terminals having different numbers of pins can be manufactured using one mold for both the terminal portion and the positioning guide portion.

A second effect is that a design can be made which is not restricted by the number of terminal pins during product development. This enables flexible product development.

The reason is that the terminals for the metal substrate are divided into the terminal portion and the positioning guide portion, so that it is possible to manufacture terminals having different numbers of pins by using a single mold for both the terminal portion and the positioning guide portion. Because we can.

A third effect is that the height of the terminal pins can be adjusted, and the thickness of the entire metal substrate can be reduced.

The reason is that the terminal portion is composed of two pin guides which are arranged in parallel with a space therebetween, so that the length of the pins can be changed.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a first embodiment of a metal substrate terminal and a method for fixing the same according to the present invention.

FIG. 2 is a cross-sectional view at the time of fixing a portion cut along the line AA in FIG. 1;

FIG. 3 is an exploded perspective view showing a second embodiment of the present invention.

FIG. 4 is a perspective view showing a conventional method of fixing a terminal for a metal substrate.

[Explanation of symbols]

 1,10 Terminal for metal substrate 2 Terminal part 3 Pin 4 Pin base part 5,6,7,8 Pin guide 9a, 9b Cutting burr 11,12 Positioning guide part 13,13a, 13b Fitting part 14,14a, 14b Fitting part 15, 15a, 15b Abutment surface 16, 16a, 16b Positioning protrusion 17, 17a, 17b Contact surface with metal substrate surface 21 Metal substrate 22, 23 Terminal positioning hole 24 Terminal pad 25 Solder paste 31 Positioning jig 32 hole

Continuation of the front page (56) References JP-A-61-200676 (JP, A) JP-A-1-307179 (JP, A) JP-A-58-23180 (JP, A) JP-A-53-25888 (JP) JP-A-49-80588 (JP, A) JP-A-6-29009 (JP, U) JP-A-3-39263 (JP, U) JP-B-42-20009 (JP, B1) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01R 24/00 H01R 12/22 H01R 12/04 H01R 43/00

Claims (1)

(57) [Claims] 1. A plurality of terminals connected to a plurality of substrate terminal pads.
Pin and the block into which the top of each pin is pressed
Plural pieces are detachably connected and resin molded
The upper pin guide and the lower part of each pin
Locks are detachably connected and resin-molded
And the lower and upper pin guides
Support both ends of the
And the lower pin guides are arranged in parallel at a predetermined interval
An upper pin pin with a positioning guide
The length of the pin protruding from the id is variable by adjusting the distance
A terminal for a metal substrate, characterized in that it is made possible.