JP3090585B2 - Bare chip continuity inspection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bare chip continuity inspection machine for conducting continuity inspection of bare chips alone. More particularly, the present invention relates to a bare chip continuity inspection machine that can make a bare chip contact an inspection probe at an accurate position and that automatically performs a continuity inspection.

[0002]

2. Description of the Related Art Conventionally, a bare chip manufactured by subdividing (cutting) a semiconductor wafer is used for the following reasons.
It was not tested on its own. That is, since the bare chip itself is very small and easily damaged, it is difficult to handle. Further, the interval between the bonding pads formed on the bare chip is set to a small value of several tens of microns to several hundreds of microns. Further, when the bare chip is brought into contact with the inspection probe for the continuity test, the contacted portion may be damaged, which may lead to the failure of the bare chip. In this case, without using the test <br/> machinery for performing automatic continuity test, it is conceivable to inspect one by one bare chip manually, poor efficiency in this case,
In addition, it is inevitable that the bare chip is damaged and defective products are produced.

For this reason, the bare chip alone has been subjected to molding and completed as an IC chip without conducting a continuity test, and then a final test is performed as a finished product.

[0004]

However, if a defective product is found in the final inspection and the cause is due to poor conduction of the bare chip, the wasteful inspection which has not been performed if the continuity inspection of the bare chip has been performed. This means that a high production cost is spent on defective products. For this reason, there has been a demand for practical use of an inspection machine capable of automatically performing a continuity inspection using a bare chip alone.

The present invention has been made in view of such circumstances, and has as its object to provide a bare chip inspection machine capable of automatically performing a continuity inspection of a bare chip alone.

[0006]

In order to achieve the above object, a bare chip continuity inspection device according to claim 1 is provided with a rotating shaft installed substantially horizontally, and mounted on the rotating shaft radially outward. A plurality of chucks, an image processing location and an inspection location set around the rotation axis, a rotation driving means for rotating the rotation axis to move the chuck to the image processing location and the inspection location, and a plurality of chucks installed at the inspection location. Inspection probe, reference position setting means for setting a position corresponding to the inspection probe in the image processing location as a reference position, image processing means for detecting the position of the bare chip held by the chuck in the image processing location, and the position of the rotation axis A rotation axis position correcting unit that adjusts the position of the bare chip detected by the image processing unit to the reference position, and the position of the bare chip matches the reference position. Moving the chuck in the inspection location, it is constructed by a rotary shaft moving means for performing a conductivity test by contacting a bare chip test probe.

In this case, the chuck desirably includes a heater provided inside the chuck surface to warm the bare chip held by the chuck, and a temperature sensor provided near the chuck surface.

In addition, when at least one of the chuck and the inspection probe is moved by the chuck and comes into contact with the inspection probe, the movement distance of the chuck is limited to prevent buckling of the needle of the inspection probe. Preferably, a stopper is provided.

Further, it is preferable that at least one of the chuck and the inspection probe is provided with a light-shielding wall surrounding the bare chip held by the chuck and the needle of the inspection probe when the chuck and the inspection probe are in contact with each other.

Further, according to the present invention, the needle of the inspection probe projects in the vertical direction and comes into contact with the bare chip.

[0011]

Therefore, in the bare chip continuity inspection apparatus according to the first aspect, first, the reference position setting means sets a reference position, that is, a position in which the position of the inspection probe is accurately reflected in the image processing place. Then, when the chuck chucks the bare chip, at the image processing place, the image processing means detects the position of the bare chip held by the chuck, the rotation axis position correcting means adjusts the position of the rotation axis, and determines the position of the bare chip as the reference position. To match. Thereafter, when the rotating shaft moving means moves the chuck, the bare chip held by the chuck accurately contacts the inspection probe, and a continuity test is performed.

In the bare chip continuity inspection device according to the second aspect, the bare chip held by the chuck can be directly heated by the heater and this temperature can be detected by the temperature sensor, so that the bare chip is suitable for the continuity inspection. Heated to the specified temperature and inspected.

Further, in the bare chip continuity inspection apparatus according to the present invention, when the chuck is moved to bring the bare chip into contact with the inspection probe, the needle buckling prevention stopper limits the moving distance of the chuck, and the chuck is moved relative to the inspection probe. Is prevented from approaching beyond a certain distance. Therefore,
The needle of the inspection probe does not bend more than necessary.

Further, in the bare chip continuity inspection device according to the fourth aspect, at the time of the continuity inspection, the light-shielding wall surrounds the bare chip and the needle of the inspection probe and blocks incident light. Therefore, the polarity of the signal of the bare chip is switched by the influence of light during the continuity test, so that it is possible to avoid a situation where a normal test result cannot be obtained.

Further, in the bare chip continuity inspection device according to the fifth aspect, the needle always comes into contact with the bonding pad of the bare chip and is not damaged.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The construction of the present invention will be described below in detail with reference to the embodiments shown in the drawings.

FIGS. 1 and 2 show a bare chip inspection machine provided with a bare chip continuity inspection device according to the present invention.
The bare chip inspection machine 1 includes a bare chip supply / discharge device 2, a centering device 3, a bare chip continuity inspection device 4, an inspection probe 5 (see FIG. 20), and the like. In the bare chip inspection machine 1, the bare chip continuity inspection device 4 functions as a bare chip positioning device.

The bare chip inspection machine 1 is installed on a gantry 7 that moves along a rail 6. The gantry 7 is divided into a supply / discharge-side gantry 83 and an inspection-side gantry 84. The supply / discharge side mount 83 is provided with the bare chip supply / discharge device 2. The monitor 8 and a switch panel (not shown) are attached to predetermined positions of the frame 83a of the gantry 83. On the other hand, the centering device 3 and the bare chip continuity inspection device 4 are installed on the inspection side gantry 84. Further, a tester gantry 10 shown in FIG. 19 is accommodated inside the gantry 7. The test probe 5 is attached to the tester device 9 supported by the tester gantry 10.

Each of the frames 83 and 84 has a plurality of wheel mechanisms 11 as moving means, and is arranged movably on the rail 6. Each of the gantry 83 and 84 is provided with a position fixing means . Position fixing means, rail 6
And a stopper for stopping the movement of the wheel while the wheel mechanism 11 is in contact with the wheel mechanism 11.
Is fixed. Therefore, if the stopper is removed, the inspection side base 84 can be moved along the rail 6. Usually, the inspection side gantry 84 is fixed.

On the other hand, the supply / discharge side mount 83 is provided with a knock pin type positioning mechanism 12 as a position fixing means. This positioning mechanism 12 is shown in FIG.
As described above, the horizontal knock pin 87b fixed to the connecting table 89 attached to the supply / discharge side frame 83 via the vibration isolating member, for example, the vibration isolating rubber 90, and the vertical knock pin 87a vertically moved by the actuator, for example, the air cylinder 93c. Are respectively fitted into the horizontal hole 88b and the vertical hole 88a of the connection holder 88 attached to the inspection side frame 84, and the supply / discharge side frame 83 is connected and fixed to the inspection side frame 84.

More specifically, the supply / discharge side stand 8 of the rail 6
3 moves the fitting the knock pin 87b in the horizontal hole 88b, the knock pin 8 drives the cylinder 93 c in this state
7a may be fitted into the vertical hole 88a, and the knock pin 87a
The photo sensor 93a fixed to the connection holder 88 detects the dog 93b that moves together with the connector 93, and confirms the fixing operation. According to this configuration, the two supports 8 are provided by the two-way knock pins.
The positions of the bases 3 and 84 are accurately determined, and the vibration on the side of the supply / discharge side frame 83 is absorbed by the vibration isolating rubber 90 and is not directly transmitted to the side of the inspection side frame 84.

As shown in FIG. 22, this position fixing means fixes a horizontal knock pin 87 'to a connecting table 89 on the supply / discharge side frame 83 side and a horizontal hole 88' of a connecting holder on the inspection side frame 84 side. In this state, and in this state
U-shaped grooves 94 provided on both sides of a connecting plate 91 spanning
May be fitted to the bolts 92 and the bolts 92 may be tightened to fix the mounts 83 and 84 via the vibration isolating rubber 90.

In this embodiment, the supply / discharge side frame 83 is connected to the inspection side frame 84 and fixed, but the supply / discharge side frame 83 may be fixed to the floor. In this case, it is possible to omit the vibration isolating member by providing a small gap between each of the pedestals 7, and at this time, it is also possible to prevent the vibration of the supply and discharge pedestal 83 from being directly transmitted to the inspection pedestal 84. can do. In addition, a bracket is fixed to each of the mounts 83 and 84, and a knock pin 87 is attached to a side wall portion thereof.
May be provided so that they can be inserted and removed in the vertical direction. In this case, one of the brackets is attached to the gantry via the vibration-proof rubber. Alternatively, position fixing means for fixing adjusters to the floor by providing adjusters that can be adjusted forward and backward at the four corners of the frames 83 and 84 may be used.

The bare chip supply / discharge device 2 supplies or discharges a bare chip 95 to / from a bare chip continuity inspection device 4 described later. The bare chip 95 is formed in a size of, for example, 2 mm × 4 mm. A large number of the bare chips 95 are provided on the tray 13, for example, 49 (7
(× 7 rows). And this tray 1
3 further has a plurality of sheets, for example, four sheets (2
(× 2 rows). The bare chips 95 are arranged on the tray 13 with the pattern surface on which the bonding pads are formed facing upward. Therefore, the pattern surface of the bare chip is not damaged.

The bare chip supply / discharge device 2 includes a magazine rack 15, a lifter 16, a pallet feeder 17, an XY robot 18, and the like, as shown in detail in FIGS. The magazine rack 15 can accommodate, for example, up to ten pallets 14 arranged vertically. The magazine rack 15 is attached to a lift plate of a lifter 16, and the magazine rack 15 as a whole is lifted and lowered by the lifter 16. Then, of the pallets 14 stored in the magazine rack 15, the pallets 14 located at a predetermined height are pulled out by the pallet feeder 17 and transported. On the other hand, the pallet 14 conveyed in the return direction by the pallet feeder 17 is pushed into the magazine rack 15 at this height position. At a predetermined position of the pallet 14, a notch (not shown) for engaging the hook piece 19 of the slider 85 of the pallet feeder 17 with the pallet 14 is provided. The hook piece 19 fits into the notch with respect to the pallets 14 at the same height and is hooked in the moving direction of the slider 85. Therefore, in this case, the pallet feeder 17 can pull out the pallet 14. On the other hand, when the magazine rack 15 moves up and down, the hook pieces 19 pass vertically through the cutouts of the pallets 14. Therefore, in this case, the hook piece 19 does not interfere with the elevation of the magazine rack 15.

The pallet feeder 17 is disposed along the depth direction of the gantry 7, that is, along the direction of arrow Y in the figure, and reaches a place 20 (hereinafter, this position is referred to as a delivery place) close to the bare chip continuity inspection device 4 shown in the figure. 14 is conveyed.
Then, when the pallet 14 is transported to the delivery location 20, the pallet feeder 17 inserts a knock pin into the pallet 14 at the delivery location 20 and lifts it slightly to accurately position the pallet 14 and fix its position.

The magazine rack 15, the lifter 16 and the pallet feeder 17 are provided two each, and are arranged side by side in the width direction of the gantry 7, that is, in the direction of arrow X in the figure.

The XY robot 18 is an orthogonal type robot. The XY robot 18 is arranged in a space above the gantry 7 and is fixed to the supply / discharge side gantry 83. The XY robot 18 has a pair of vacuum chucks 21 and 22 and moves the chucks 21 and 22 horizontally in a space where the pallet feeder 17, the centering device 3, and the bare chip continuity inspection device 4 are installed. .

Each of the vacuum chucks 21 and 22 is arranged as shown in FIG.
As shown in FIG. 8 to FIG. 8, they are provided at predetermined intervals in the X direction. The chucking portion 23 of each of the vacuum chucks 21 and 22 (only the chuck 22 side is shown in FIG. 7) is formed by an inclined surface extending in a quadrangular pyramid shape as shown in FIG. 6B. Therefore, the chucking portion 23 contacts only the edge portion of the upper surface of the bare chip 95, and does not contact the pattern portion of the bare chip 95 to damage this portion. Further, of the vacuum chucks 21 and 22, the supply-side chuck 21 (the chuck illustrated on the left side in FIGS. 6 and 8) located on the right side in the X direction of the gantry 7 is provided with the positions of the bare chips arranged on the tray 13. In order to ensure that the bare chip can be chucked even if the position is slightly shifted, suction ports are provided at four places.

On the other hand, the discharge side chuck 22 (the chuck shown on the right side in FIGS. 6 and 8) located on the left side in the X direction of the gantry 7 has a suction port at one place as shown in FIG. Is provided. Since the discharge-side chuck 22 takes out the inspected bare chip 95 ′ from the suction chuck 35 described later, the bare chip is sucked in a state where the bare chip is already accurately positioned. Therefore, even a single suction port does not hinder chucking. The vacuum chucks 21 and 22 are connected to separate actuators, for example, air cylinders 24 and 25, respectively, and move up and down independently of each other. Shafts 2 of chucks 21 and 22
Numerals 1a and 22a are supported on support plates 24a and 25a so as to be movable up and down, respectively, and are urged in the downward direction by springs 21b and 22b. Stoppers 21c, 22c are fixed to the shafts 21a, 22a and are prevented from falling off.
The support plates 24a and 25a are also supported by a guide bar so as to be movable up and down, and are urged upward by a spring.
Therefore, the chucks 21 and 22 are supported in a floating state, and even if the cylinders 24 and 25 are overstroke, the chucks 24 and 25 are lowered only by a predetermined stroke.

A defective pallet 26 and a spare pallet 27 are provided on the supply / discharge side stand 83. The defective pallets 26 are stored in each pallet feeder 17.
In between, the spare pallets 27 are arranged on the back side of the pallet feeder 17 located on the left side in the X direction.
Each of the pallets 26 and 27 is placed on a pallet stand 28 shown in FIGS. 9 and 10, and is positioned by a pair of pins 28a. Each pallet stand 28 is fixed to a supply / discharge side stand 83. Each pallet 26, 2
The pallets 26 and 27 may be arranged at other places, or the places where the pallets 7 are arranged may be exchanged. in this way,
A place where the pallets 26 and 27 are arranged is a bare chip storage place.

The centering device 3 includes a bare chip 95 mounted on a base plate 29, as shown in FIG.
Are lightly pressed simultaneously from four directions along the base plate 29 to roughly position the bare chip with respect to a reference position described later. Base plate 29
Is fixed to a camera stand 75 described later. A temporary positioning field 30 is set on the base plate 29. Then, four pressing pieces 31 are arranged so as to surround the temporary positioning field 30. Each pressing piece 3
1 can move in a direction approaching or leaving the temporary positioning field 30 by an actuator. For example, each pressing piece 3
.., 31 are constantly pulled by a tension spring 32 in a direction approaching the temporary positioning field 30. In addition, each pressing piece 3
Reference numerals 1 are respectively connected to pneumatic cylinders (not shown). Then, when air pressure is supplied to each pneumatic cylinder, each pressing piece 31 moves away from the temporary positioning field 30 against the spring force of the tension spring 32. Therefore,
The four pressing pieces 31 approach or separate in a cross shape as a whole while moving simultaneously. In addition, the temporary positioning field 30
A vacuum suction port is provided below, and the suction operation is performed at the time of positioning to maintain the positioning state of the bare chip 95, and the suction is released when the chuck 21 sucks the bare chip 95. The pressing piece 31,
.., 31 may be provisionally positioned using a screw feed mechanism using a stepping motor or the like. The reason why the centering device 3 is installed on the inspection side gantry 84 is that when the supply / discharge side gantry 83 is moved for maintenance of the apparatus, a slight displacement cannot be avoided when the position of the supply / discharge side gantry 83 is returned. This is to eliminate the influence of the displacement.

As shown in FIGS. 12 to 14, the bare chip continuity inspection device (bare chip positioning device) 4 includes a chuck section, a chuck position correcting section, a chuck vertical moving section, an image processing section, and the like.

The chuck section includes a rotating body 33 serving as a rotating shaft which is installed substantially horizontally, a vertical rod 34, a pair of suction chucks 35 and the like. The rotating body 33 is disposed substantially horizontally, and is rotatably attached to the support 36 using a pair of bearings 37. Therefore, the rotating body 33 functions as a rotating shaft that can rotate accurately without rattling with respect to the support 36. Further, as shown in FIG. 15, the vertical rod 3
4 is rotatably mounted using a pair of bearings 38. Therefore, the vertical rod 34 rotates accurately without rattling with respect to the rotating body 33.

At the upper and lower ends of the vertical rod 34, suction chucks 35, 35 having the same structure are respectively attached. Each suction chuck 35 is mounted radially outward of the rotating body 33. Each suction chuck 35, 3
Reference numeral 5 is connected to a vacuum source / vacuum generator (not shown) and holds a work (bare chip or dummy chip) using negative pressure.

Each suction chuck 35 has a built-in heater 39 and a temperature sensor 40 (only one suction chuck 35 is shown in the figure) for performing a temperature test of a bare chip. The heater 39 is arranged near the tip of the suction chuck 35 and heats the bare chip held by the suction chuck 35. The temperature sensor 40 is also disposed near the tip of the suction chuck 35, and detects the temperature of this portion. In this case, accurate temperature control can be performed and heating can be performed in a very short time as compared with the case of performing a temperature test after forming a package, and the test time can be greatly reduced. The light shielding wall 98 to prevent the light hits the bare chip bathed in light from the surroundings is provided when pressed against the test probe 5 bare chips around the suction chuck 35. The light shielding wall 98 is formed in a bank shape over the entire periphery of the suction chuck 35. The amount of protrusion of the bare chip suction surface or these light shielding wall 98 prevents the in the case close to the test probe 5 is lowered the suction chuck 35, too close to the distal end surface of the test probe 5, the seat of the needle 78 It is set to a predetermined value to prevent buckling. The light shielding wall 98 regulates the approach movement of the suction chuck 35 to the inspection probe 5 at a position where there is a sufficient margin with respect to the elastic limit of each needle 78. In addition, the shading wall 98
Surrounds the inspection probe 5 and the bare chip when they come into contact with each other to prevent light from entering. Suction chuck 35
In the case of the present embodiment, the main body 99 is provided with a main body 99 provided with a suction hole 96 communicating with a vacuum source, a nozzle plate 97 forming a nozzle portion for sucking the bare chip 95, and a cylindrical light shielding wall 98. The light shielding wall 98 may be provided not only on the chuck side but also on the inspection probe 5 side.

The chuck section is rotated as a whole by an inversion stepping motor (hereinafter simply referred to as an inversion motor) 41. That is, the output side pulley 43 is fitted and fixed to the output shaft 41 a via the gear box of the reversing motor 41 attached to the support plate 42. The output pulley 43 is connected by a belt 45 to an input pulley 44 fitted and fixed to the shaft of the rotating body 33, and the rotation of the output pulley 43 is accurately transmitted to the input pulley 44. The reversing motor 41 rotates the rotating body 33 back and forth by 180 degrees so that each suction chuck 35 is rotated.
Swap the top and bottom positions of. That is, the inversion motor 41
Turns the suction chucks 35 up and down. The belt 45 is a tension roller 45a as shown in FIG.
The rotating body 33 and the output shaft of the motor 41 may be directly connected. In this case, a pulley, a belt,
No tension mechanism is required.

The chuck position correcting section includes a θ angle adjusting mechanism, X
It comprises a direction adjusting mechanism, a Y direction adjusting mechanism, and the like.
The θ angle adjusting mechanism adjusts the rotation angle (hereinafter, referred to as θ angle) of each suction chuck 35 about the θ axis with the vertical rod 34 as the θ axis. That is, the input side pulley 46 is fitted and fixed at a predetermined position in the middle of the vertical rod 34 serving as the θ axis. The input side pulley 46 is connected to an output side pulley 48 fitted and fixed to an output shaft 47 a of a stepping motor 47 by a belt 49.
FIG. 1 shows a bottom surface of the plate 50 fixed to the rotating body 33.
As shown in FIG. 6, a tension mechanism 51 is attached. The tension mechanism 51 applies tension to the belt 49. Therefore, the rotation of the output pulley 48 is transmitted to the input pulley 46 accurately. Stepping motor 47
Adjusts the θ angle of each chuck 35 by rotating the vertical rod 34 forward or backward by a desired angle.

The Y-direction adjusting mechanism moves a slide plate (hereinafter referred to as a Y-side slide plate) 53 in the Y direction with respect to the base plate 52 fixed to the inspection side base 84.
That is, it is moved in the width direction of the gantry 84 indicated by the arrow Y in the figure,
The position of each suction chuck 35 in the Y direction is adjusted. The Y-direction adjusting mechanism includes a Y-
A rail (hereinafter, referred to as Y-side rail) 54 fixed along the direction, and a slider (hereinafter, referred to as Y-side rail) fixed to the bottom surface of the Y-side slide plate 53 and moving along the Y-side rail 54.
Y-side slider) 55 and Y-side slide plate 5
3 includes a stepping motor (hereinafter, referred to as a Y-side motor) 56 fixed by using a bracket.

The output shaft of the Y-side motor 56 is connected to a threaded rod 57 arranged along the Y direction. The screw rod 57 passes through a slide box (hereinafter, referred to as a Y-side box) 58 fixed on the base plate 52. The screw rod 57 and the Y-side box 58 are connected by a screw pair. Therefore, when the screw rod 57 rotates, the screw rod 57 moves in the axial direction with respect to the Y-side box 58 by a distance corresponding to the number of rotations. That is, Y
When the side motor 56 rotates forward or backward, the Y side slide plate 53 moves by a corresponding distance in the arrow Y direction according to the rotation direction and the number of rotations of the Y side motor 56. Note that reference numeral 59 in the figure denotes a photo sensor. This photo sensor 5
9 detects the original position of the Y-side slide plate 53 with respect to the base plate 52. Therefore, the motor can be driven with the number of pulses based on this position to set the position.

The X-direction adjusting mechanism moves the slide plate (hereinafter referred to as the X-side slide plate) 60 in the X direction, that is, the depth direction of the gantry 84 indicated by an arrow X in the figure, with respect to the Y-side slide plate 53. , Each suction chuck 35
Is adjusted in the X direction. The X-direction adjusting mechanism includes a rail (hereinafter, referred to as an X-side rail) 61 fixed on the Y-side slide plate 53 along the X-direction,
A slider (hereinafter, referred to as an X-side slider) 62 fixed to the bottom surface of the X-side slide plate 60 and moving along the X-side rail 61, and a stepping motor ( Hereafter, X
63) and the like.

The output shaft of the X-side motor 63 is connected to a threaded rod 64 arranged along the X direction. The screw rod 64 passes through a slide box (hereinafter, referred to as an X-side box) 65 fixed on the Y-side slide plate 53. The screw rod 64 and the X-side box 65 are connected by a screw pair. Therefore, when the screw rod 64 rotates, the screw rod 64 moves in the axial direction with respect to the X-side box 65 by a distance corresponding to the number of rotations. That is, X
When the X-side motor 63 rotates forward or backward, the X-side motor 6
The Y-side slide plate 53 moves by a corresponding distance in the direction of the arrow X in accordance with the rotation direction and the number of rotations of 3. Since this movement is feed by the screw rod 64, occurrence of backlash is inevitable, and the backlash is removed by adding a spring 60a to offset. Although illustration is omitted,
A similar spring is provided on the Y side. Note that reference numeral 66 in FIG.
Is a photo sensor. This photo sensor 66 has Y
The relative position of the X side slide plate 60 with respect to the side slide plate 53 is detected.

The chuck vertical moving unit moves the chuck unit in the Z direction, that is, the vertical direction indicated by the arrow Z in FIG. It changes the degree. The chuck vertical moving part is a rail (hereinafter, referred to as a Z-side rail) 73 fixed to the vertical plate 67 side along the vertical direction.
And a slider that moves along the Z-side rail 73 (hereinafter, referred to as a slider).
A Z-side slider 74, an elevating body 71 attached to the Z-side slider 74, a stepping motor (hereinafter referred to as a Z-side motor) 69 fixed to the vertical plate 67 using a bracket, and the like. ing. Z side motor 69
The output shaft of is provided with a screw rod 70 disposed along the vertical direction.
Is connected. The screw rod 70 passes through the inside of the elevating body 71. The screw rod 70 and the elevating body 71 are connected by a screw pair. Therefore, when the screw bar 70 rotates, the elevating body 71 and the Z-side slider 74 move up and down with respect to the screw bar 70 by a distance corresponding to the number of rotations. That is, when the Z-side motor 69 rotates forward or backward, the elevating body 71 and the Z-side slider 74 move up or down by the corresponding distance according to the rotation direction and the number of rotations. A plate 68 is attached to the elevating body 71 and the Z-side slider 74, and the support plate 42 is attached to the plate 68. Therefore, the chuck portion is also moved up and down integrally with the elevating body 71 and the Z-side slider 74. Note that reference numeral 72 in the figure denotes a photo sensor. The photo sensor 72 detects the original position of the elevating body 71. Therefore, the motor can be driven with the number of pulses based on this position to set the position.

As shown in FIGS. 17 and 18, the camera 76 of the image processing section is mounted on a camera stand 75 fixed on the inspection side frame 84, and is disposed above the suction chuck 35 so as to face the same. ing. Therefore, the camera 76 is mounted on the suction chuck 3 located at the image processing place.
The surface of the bare chip or dummy chip held by 5 can be photographed from above. The camera 76 is electrically connected to a controller including a microcomputer, and supplies a captured image of a workpiece such as a bare chip to the controller as an image signal. Then, the controller performs computer processing on the image signal supplied from the camera 76 using a known image processing method, recognizes a position of a contact flaw of a dummy chip and a position of a bonding pad of a bare chip, which will be described later, and stores and recognizes the reference position. The movement of the chuck portion is controlled by determining the position and calculating the amount of error from the reference position to obtain the corrected movement amount. Since the image processing method performed by the controller is a known method, a detailed description thereof will be omitted. In addition, since a defect such as a chipping of a bonding chip of a bare chip can be detected before the inspection based on the image signal, useless work of inspecting a defective product can be eliminated.

The inspection probe 5 is arranged on a tester device 9 installed on a tester gantry 10.
5 below. The tester mount 10 is shown in FIG.
As shown in FIG. Therefore, the tester gantry 10 can be exposed by releasing the fixing of the gantry 83 on the supply / discharge side, moving the gantry 83, and expanding the space between the gantry 83 on the supply / discharge side and the inspection base 84. Then, in this state, maintenance of the tester device 9,
For example, replacement of the inspection probe 5 can be easily performed. When the inspection probe 5 is replaced, the handle 77 is rotated to lower the height of the tester gantry 10,
After the tester device 9 is lowered, the inspection probe 5 is replaced.

The inspection probe 5 is, as shown in FIG.
The block portion 5b is connected to the handler base 7 of the tester device 9.
9 is fixed from below with screws 80, and the main body 5 c protrudes toward the suction chuck 35. This inspection probe 5
Is the number corresponding to the number of bare chip bonding pads,
For example, it has 60 needles 78. Each needle 78 is arranged corresponding to a bonding pad of a bare chip. Therefore, when the suction chuck 35 is lowered and the bare chip hits the inspection probe 5, each needle 78 contacts the corresponding bonding pad and is electrically connected. Further, the inspection probe 5 is provided with a guide plate 5a provided with a fine hole for guiding the needle 78 to a position corresponding to the bonding pad of the bare chip. In the drawing, reference numeral 81 denotes a fixture ring, and reference numeral 82 denotes a PT plate.

The bare chip inspection machine 1 configured as described above operates as follows.

Prior to the bare chip continuity test, first,
A correction amount for positioning the bare chip inspection machine 1 is obtained using the dummy chip. The dummy chip is manufactured by, for example, cutting a glass plate having a surface on which gold is vapor-deposited, slightly larger than a bare chip, for example, into a size of 4 mm × 6 mm. Of course, the dummy chip is not limited to this, and may be any one that is easily scratched, and may be a glass plate coated with magic ink.

The operator 86 places a dummy chip (not shown) directly on the suction chuck 35 located above the bare chip continuity inspection device 4. Of course, it may be performed using the bare chip supply / discharge device 2 or the centering device 3. The dummy chip is sucked by the suction chuck 35 and is reliably held. Next, the operator 86 operates the inversion motor 41 to invert each suction chuck 35 and moves the chuck 35 holding the dummy chip downward. As a result, the dummy chip faces the inspection probe 5. Each suction chuck 3 of the bare chip continuity inspection device 4
5 is inverted in the vertical direction, so that the bare chip continuity inspection device 4 is compared with the case where each chuck is inverted in the horizontal direction.
Installation space can be kept small.

Thereafter, the chuck chuck 35 of the bare chip continuity inspection device 4 is operated by operating the Z-side motor 69 to lower the suction chuck 35 until the light-shielding wall 98 contacts the guide plate 5a of the probe 5. Needle 7
8. The dummy chip is placed on the suction chuck 35 by the hand of the operator 86, but the dummy chip is formed to be relatively large, so that the dummy chip surely hits the inspection probe 5. This contact, the dummy chip a number of contact scratches indicating the position of the needle 78 of the test probe 5 is formed.

Next, the Z-side motor 6 of the chuck vertical moving portion
After the suction chucks 35 are raised by operating the suction chuck 9, the vertical motor 34 is turned over by operating the reversing motor 41, and the upper and lower suction chucks 35 are exchanged. As a result, the suction chuck 35 holding the dummy chip moves upward, and the dummy chip faces the camera 76 of the image processing unit. At this position, the camera 76 captures the contact surface of the dummy chip as an image signal and performs image processing with the controller of the image processing unit to recognize the position of each contact flaw. The position of each contact flaw corresponds to the position of each needle 78 of the inspection probe 5, and the image processing unit stores this position as a reference position. This treatment is performed using at least two contact flaws, more preferably two contact flaws at both ends. here,
The dummy chip is removed from the suction chuck 35.

Thereafter, the operator 86 moves the bare chip 9
5 is conducted. First, the case where the continuity inspection of the bare chip 95 supplied from the right pallet feeder 17 in the X direction is performed and the inspected bare chip 95 is transferred to the left pallet feeder 17 in the X direction will be described. The XY robot 18 moves the supply-side chuck 21 to the delivery location 20 of the right pallet feeder 17, and further moves the supply-side chuck 21 downward so that the bare chips arranged on the predetermined tray 13 on the pallet 14 A predetermined one is chucked. Then, the XY robot 18 places the bare chip 95 on the temporary position determination field 30 of the centering device 3 by raising the chuck 21 → horizontal movement → lowering. When the bear chip 95 is placed on the temporary positioning area 30,
The centering device 3 cuts off the supply of compressed air. As a result, the four pressing pieces 31 approach in a cross shape, and the bare chip 9 is pressed.
5 is lightly pressed from four directions, and the bare chip 95 is provisionally positioned. When the supply of the compressed air to the centering device 3 is restarted, the four pressing pieces 31 are separated from the bare chip 95 in a cross shape.

Thereafter, the XY robot 18 chucks the bare chip 95 again with the supply side chuck 21,
The chuck 21 is placed on the suction chuck 35 on the upper side of the bare chip continuity inspection device 4 by raising → horizontal movement → lowering. At this time, the bare chip 95 ′ before being placed on the suction chuck 35 has been previously taken out by the discharge-side chuck 22. Of course, in the first inspection, since there is no previous bare chip 95 ', this removing operation is unnecessary. In this state, the pattern surface of the bare chip is on the upper side, and an image signal obtained by capturing the pattern by the camera 76 is subjected to computer processing by the controller to detect the position of each bonding pad.

Since the bare chip is provisionally positioned by the centering device 3, the deviation from the reference position is slight, and the position of the bonding pad of the bare chip 95 is surely within the field of view of the camera 76. And
The bare chip continuity inspection device 4 compares the stored reference position with the detected position of each bonding pad, and operates the X-direction adjustment means, the Y-direction adjustment means, and the θ-direction adjustment means to determine the positional deviation. 34 suction chucks 3
5 is finely adjusted and corrected. These means automatically correct the displacement of the bare chip 95, so that the operator 86 does not need to adjust the displacement. Further, since the displacement of the position of the bare chip is corrected based on the position of the bonding pad, the cut position of the bare chip is shifted and the position of the bonding pad is relatively deviated with respect to the contour of the bare chip. Even when the burrs at the time of cutting remain on the contour of the bare chip, the bare chip is well positioned. This position correction may be performed before the inversion of the vertical rod 34 or during the inversion / descent. In the present embodiment, it is controlled so as to be directed to the test probe 5 side after the position correction.

When the position of the bonding pad coincides with the reference position, the reversing motor 41 is operated to invert each suction chuck 35, and the Z-side motor 69 is operated to lower the suction chuck 35. Thereby, the bonding pad of the bare chip 95 contacts the needle 78 of the inspection probe 5 at an accurate position, and the continuity test is performed. in this case,
Suction chuck 35 is the light shielding wall 98 is inspected probe of peripheral 5
Is lowered until just before contact with the guide plate 5a, and the descending feed amount is determined. Thereafter, the operation is performed with this feed amount. Therefore, although the light-shielding wall 98 is set so as not to contact the guide plate 5a, even if it hits, the light-shielding wall 98 does not lower any more and the lowering is limited. For this reason, the distance between the tip surface of the inspection probe 5 and the bare chip always becomes the set distance, and the bare chip 95 pushes and bends the expensive needles 78 downward too much, causing them to buckle or greatly shortening their life. Insufficient contact with each needle 78 can be prevented from causing a contact failure. Also,
Since the light-shielding wall 98 surrounds the bare chip and the needles 78 and blocks light that strikes the bare chip, it prevents the inspection signal from being switched between plus and minus due to the light and prevents the inspection result from becoming abnormal.

In this case, the chuck up-down moving section is
Suction chuck 3 perpendicular to the tip surface of inspection probe 5
5 is lowered to bring the bare chip bonding pad into direct contact with the needle 78. For this reason, the contact flaw is smaller than when the bonding pad is obliquely contacted with the needle 78, and the size of the contact flaw can be minimized. In addition, even when the amount of protrusion of each needle 78 of the inspection probe 5 varies, a so-called escape phenomenon of the needle 78 (the contact position is shifted if it is inclined) is prevented and the needle 78 and the bonding pad are satisfactorily formed. Can be contacted.

Further, since the heater 39 built in each suction chuck 35 directly heats the bare chip 95, the bare chip before the inspection can be smoothly heated to a temperature suitable for the continuity inspection. Therefore, it is not necessary to perform preheating before performing this test in order to perform the continuity test, and it is possible to perform the test by accurate temperature control.

When the continuity inspection of the bare chip is completed, the suction chuck 35 is lifted to separate the bare chip from the needle 78 of the inspection probe 5, and then the suction chuck 35 is turned over and the suction chuck 35 holding the bare chip is moved upward. Go to Then, the inspected bare chips 95 ′ are chucked by the discharge-side chuck 22 of the XY robot 18 and arranged on the tray 13 on the pallet 14 waiting at the delivery place 20 of the left pallet feeder 17. This allows
The continuity inspection of one bare chip is completed.

As described above, bare chip continuity inspection device 4
Has two suction chucks 35, and in practice, each suction chuck 35 is used together to perform a continuity test of the bare chip alternately. That is, when the XY robot 18 places the bare chip 95 before inspection on the suction chuck 35, the bare chip 95 ′ whose continuity has been previously tested is placed on the suction chuck 35. Therefore, the XY robot 18
First, the inspected bare chip is removed from the suction chuck 35 by the discharge-side chuck 22, and then, the bare chip before inspection is transferred to the suction chuck 35 by the supply-side chuck 21. Since the operation of the XY robot 18 can be performed independently of the operation of the inspection device 4, the bare chip can be discharged and the next bare chip can be supplied during the inspection, and an efficient operation can be realized.

Then, the image processing section detects the position of the bonding pad of the bare chip transferred to the upper suction chuck 35, and the chuck position correcting section corrects a deviation from the reference position. In this case, since the controller of the image processing unit has already stored the reference position, it is not necessary to reset the reference position using the dummy chip.

Thereafter, the bare chip continuity inspection device 4 turns over each suction chuck 35. In this state, the lower suction chuck 35 holds the bare chip before the inspection whose position has been corrected, and the upper suction chuck 35 holds the bare chip after the inspection. Thereafter, the suction chucks 35 are lowered, and the bare chips held by the lower suction chucks 35 are brought into contact with the inspection probe 5 to perform a continuity test. Then, when the continuity test is completed, each suction chuck 35 is raised. Next, the bare chip of the upper suction chuck 35 is changed from the inspected one to the one before the inspection,
Thereafter, the same procedure is repeated to automatically perform the continuity test of the bare chip.

In the bare chip inspection machine 1 of this embodiment, three modes are set as the operation procedure of the continuity inspection.

First, the first mode will be described. This operation mode is executed when the operator 86 operates the switch panel to select the first mode. First
In the mode (1), the right pallet feeder (hereinafter referred to as supply pallet feeder 17) 17 in the X direction to the left pallet feeder (hereinafter referred to as discharge pallet feeder in the first mode).
A continuity test is performed while transferring the bare chips to 17, and the bare chips in the trays 13 (hereinafter referred to as spare trays) on the spare pallet 27 are inspected and replenished by the number reduced by the detection of defective products.

More specifically, the supply-side pallet feeder 17 is a pallet 1 on which bare chips before inspection are placed.
4 and the discharge side pallet feeder 17
Are moved to the delivery location 20, respectively. Further, the operator 86 prepares an empty tray as a tray (hereinafter referred to as a defective tray) 13 on the defective product pallet 26, and a tray on which bare chips before inspection are arranged as the spare tray 13, respectively. .

Thereafter, the XY robot 18 moves the tray (hereinafter referred to as the first tray) on the pallet 14 of the supply side pallet feeder 17.
In the description of the mode, the bare chip is chucked from the supply tray 13), and the bare chip is transferred to the bare chip continuity inspection device 4 via the centering device 3. The XY robot 18 stores the place where the bare chips are chucked from the supply side tray 13 and selects the bare chips in order from the end. Then a continuity test is performed,
As a result, if the bare chips are acceptable, the XY robot 18 transfers the bare chips to a tray 13 (hereinafter, referred to as a discharge tray in the description of the first mode) on the pallet 14 of the discharge pallet feeder 17. Line up. X
The Y robot 18 stores the position where the bare chips are arranged on the discharge side tray 13, and arranges the non-defective bare chips in order from the end.

On the other hand, if the result of the continuity test is unacceptable, the XY robot 18 arranges the inspected bare chips on the defective tray 13. The XY robot 18 stores the position where the bare chips are arranged in the defective product tray 13 and arranges the defective bare chips in order from the end. And in this case, X
The Y robot 18 chucks the bare chip in the spare tray 13 as a bare chip to be inspected next, and transfers it to the bare chip continuity inspection device 4 via the centering device 3. And, as a result of inspection, if this bare chip is a good product,
The XY robot 18 transfers the bare chip to the discharge tray 13.
Refill with good quality bare chips. On the other hand, if the inspection result is unacceptable, the same procedure is repeated until a good product is obtained. Of course, there is little possibility that the defect is repeated many times because the defect is usually small. However, in any case, if the defect continues, it is a problem in a lot unit and it is preferable to stop the operation by issuing an alarm or the like.

Since four trays 13 are placed on each pallet 14, the four supply trays 13 on the pallet 14 placed on the supply pallet feeder 17 are provided.
Until is empty, the continuity test of the bare chip is repeated. When the four supply-side trays 13 become empty, the supply-side pallet feeder 17 accommodates the pallets 14 on which these empty trays 13 are placed in the magazine rack 15 from the delivery location 20 and places the magazine racks in the pallet 1.
The next pallet 14 (on which four trays 13 on which the bare chips before inspection are arranged) is moved from the magazine rack 15 to the delivery place 20, and the pallets 14 are exchanged. Similarly, in the discharge side pallet feeder 17, when the pallet 14 at the delivery location 20 is filled with good-quality bare chips, the pallet 14 is accommodated in the magazine rack 15, and the pallet 14 on which the empty tray 13 is placed is placed in the magazine rack. Delivery place 20 from 15
And the pallet 14 is replaced. The bare chip inspection machine 1 automatically performs the continuity inspection of all the bare chips supplied by the supply side pallet feeder 17.

When the operation procedure is set to the first mode,
There is no empty space in the discharge side tray 13, and the same number of products that have passed the inspection can be conveyed to the next step.

Next, the second mode will be described. This operation mode is performed when the operator 86 operates the switch panel to select the second mode. Second
In this mode, even if the bare chips are inspected,
The non-defective bare chip is returned to the same position on the same tray 13 without transferring the non-defective product.

That is, each pallet feeder 17 moves the pallets 14 on which the bare chips before inspection are placed, respectively, to the delivery place 20. The operator 86 prepares an empty tray as the defective tray 13. After that, the XY robot 18 first chucks the bare chips from the tray (hereinafter, referred to as right tray) 13 on the pallet 14 of the pallet feeder 17 on the right side in the X direction, and passes through the centering device 3 to the bare chip continuity inspection device 4. hand over. The XY robot 18 stores the position where the bare chips are chucked from the right tray 13, and selects the bare chips in order from the end. Then, a continuity test is performed, and as a result, if the bare chip is a passed product, the XY robot 18 returns the good bare chip to the original position on the right tray 13. On the other hand, if the result of the continuity test is
The Y robot 18 transfers the bare chips to the defective tray 13.
Line up. The XY robot 18 stores the position where the bare chips are arranged in the defective product tray 13 and arranges the defective bare chips in order from the end.

When the continuity inspection of all the bare chips on the four right trays 13 is completed, the right pallet feeder 17 moves the pallet 14 on which these trays 13 are placed.
From the delivery location 20 in the magazine rack 15.
In this case, the position of each tray 13 where the defective bare chip was placed is left empty. Thereafter, the right pallet feeder 17 raises the magazine rack by one pallet and moves the next pallet 1 from inside the magazine rack 15.
4 (on which four trays 13 on which bare chips before inspection are arranged) are moved to a delivery place 20 to exchange the pallets 14.

When the inspection of all the bare chips on the pallets 14 stored in the magazine rack 15 of the right pallet feeder 17 is completed, the bare chip inspecting machine 1 then checks the continuity of the bare chips on the pallets 14 of the left pallet feeder 17. To start. Then, the same procedure as described above is repeated, and the left pallet feeder 1
Pallet 1 stored in magazine rack 15 on the 7 side
Inspection of all bare chips for 4 is automatically performed.

When the operation procedure is set to the second mode,
The continuity test is performed on the bare chips for each lot, and the chips can be transported to the next process without mixing the bare chips between the lots. Therefore, it is possible to manage the lot of bare chips. Further, since a total of 20 pallets 14 can be stored in each magazine rack 15, unmanned operation for a long time is possible while performing automatic inspection of a large amount of bare chips, and operation suitable for night operation or the like can be performed. .

Next, the third mode will be described. This operation mode is executed when the operator 86 operates the switch panel to select the third mode. Third
In the second mode, the non-defective bare chips after the inspection are returned to the same position on the same tray 13 as in the second mode.

That is, each pallet feeder 17 moves the pallets 14 on which the bare chips before inspection are placed, to the delivery place 20. The operator 86 prepares an empty tray as the defective tray 13 and a tray on which bare chips before inspection are arranged as the spare tray 13.

Thereafter, the XY robot 18 first chucks the bare chips from the right tray 13 and passes them to the bare chip continuity inspection device 4 via the centering device 3. X
The Y robot 18 stores the positions where the bare chips are chucked from the right tray 13 and selects the bare chips in order from the end. Then a continuity test is performed, and as a result,
If the bare chip is a passed product, the XY robot 18
Returns the non-defective bare chip to the same position on the right tray 13.

On the other hand, if the result of the continuity test is unacceptable, the XY robot 18 arranges the bare chips on the defective tray 13. The XY robot 18 is the defective product tray 1
3 stores the position where the bare chips are arranged, and arranges the defective bare chips in order from the end. Then, in this case, the XY robot 18 chucks the bare chip in the spare tray 13 as a bare chip to be inspected next, and transfers it to the bare chip continuity inspection device 4 via the centering device 3. As a result of the inspection, if the bare chip is a good product, X
The Y robot 18 arranges the bare chips on the right tray 13 and replenishes the good bare chips. On the other hand, if the inspection result is unacceptable, the same procedure is repeated until a good product is obtained.

When the continuity inspection of all the bare chips on the four right trays 13 is completed, the right pallet feeder 17 transfers the pallets 14 on which these trays 13 are placed, as in the case of the second mode. It is stored in the magazine rack 15 from the place 20. However, in the third mode, non-defective products are replenished when defective products are found.
After the inspection, the pallets 14 housed in the magazine rack 15 are filled with good products. Thereafter, the right pallet feeder 17 replaces the pallet 14, and the bare chip inspecting machine 1 automatically repeats the continuity inspection of the bare chip.

When the inspection of all the bare chips on the pallets 14 stored in the magazine rack 15 of the right pallet feeder 17 is completed, the bare chip inspecting machine 1 then checks the continuity of the bare chips on the pallets 14 of the left pallet feeder 17. To start. Then, the above procedure is repeated, and all the bare chips are automatically inspected for the pallet 14 stored in the left magazine rack 15.

When the operation procedure is set to the third mode,
Each tray 13 has no empty space, and the same number of products that have passed the inspection can be grouped on the tray 13 and transported to the next process. In addition, when both magazine racks 15 are combined, a total of 20 pallets 14 can be stored. As a result, driving suitable for unmanned driving for a long time at night can be performed.

In the bare chip inspection machine 1 of this embodiment, the gantry 7 is divided into an inspection gantry 84 and a supply / discharge gantry 83,
They are connected via vibration isolating means, for example, rubber rubber.
Therefore, the XY robot 18 and each pallet feeder 17
Can be prevented from being transmitted to the bare-chip continuity inspection device 4 side, and the inspection-side pedestal 84 and the supply-discharge-side pedestal 83 are connected so as not to be displaced. Can be secured.
In addition, since the mounts 83 and 84 can move on the rails 6, the installation space for the bare chip inspection machine 1 is minimal, and maintenance work can be easily performed. In other words, the knock pin, which is the position fixing means of the supply / discharge side frame 83, is removed, and the supply / discharge side frame 83 is moved away from the inspection side frame 84, thereby maintaining the tester device 9 housed in the inspection side frame 84. Work can be done easily. Further, by removing both the position fixing means of each of the frames 83 and 84, the entire bare chip inspection machine 1 can be moved.

The dummy tip can also be used to check the state of wear of each needle 78 of the inspection probe 5. In other words, while conducting the bare chip continuity test, the condition of each contact scratch is checked periodically by using a dummy chip to check the abrasion state of each needle 78 and the contact between these and the bare chip bonding pad. The state can be determined, and the time for replacing the inspection probe 5 can be known.

It is desirable to reset the reference position using the dummy chip even when the inspection probe 5 is replaced during the continuity inspection of the bare chip. When the inspection probe 5 is replaced, the position of the inspection probe 5 often slightly shifts before and after the replacement. Therefore, by resetting the reference position using the dummy chip after the replacement, the subsequent continuity test can be satisfactorily restarted.

The above embodiment is one preferred embodiment of the present invention, but the present invention is not limited to this embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in this embodiment, the camera 76 of the image processing means is fixed to the camera stand 75,
The camera 76 may be set up and down. In this case, the efficiency of the bare chip continuity test can be further improved by synchronizing the elevation of the camera 76 with the elevation of each suction chuck 35 of the bare chip continuity inspection device 4.
That is, each suction chuck 35 descends, and the lower chuck 3
While conducting the continuity test of the bare chip held by 5,
At the same time, the position of the bonding pad of the bare chip before inspection held by the upper chuck 35 can be detected.

In the present embodiment, the bare chip inspection apparatus 4 has two suction chucks 35 at both ends of the vertical rod 34. However, the number of suction chucks 35 is not limited to this, and three or more chucks 35 are required. The bare chip inspection device 4 may be configured to include the suction chuck 35 described above. In this case, it is desirable to install the suction chucks 35 at equal intervals radially with respect to the rotating body 33. When the vertical rod 34 is provided with a corresponding angle, for example, three suction chucks 35, the vertical rod 34 is controlled to be rotated by 120 °. By increasing the number of the suction chucks 35, the efficiency of the bare chip conduction test can be further improved.

Further, in this embodiment, the light shielding wall 98 is used.
Is provided on the suction chuck 73, but may be provided on the inspection probe 5 side, or may be provided on both the inspection probe 5 and the suction chuck 35.

In this embodiment, the light shielding wall 98 functions as a needle buckling prevention stopper for restricting the approach movement of the suction chuck 35 with respect to the inspection probe 5. A buckling prevention stopper may be provided. In this case, the needle buckling prevention stopper may be provided on either the inspection probe 5 side or the suction chuck 35 side, or may be provided on both the inspection probe 5 and the suction chuck 35.

In the bare chip inspection machine 1 of this embodiment, three modes are set as the operation procedure of the continuity inspection. However, it is not always necessary to set all three types of operation modes. Of course, only the operation mode may be set, or any two operation modes may be set in combination.

In this embodiment, the inspection probe 5 is arranged below each suction chuck 35, and each suction chuck 35 is lowered, and the dummy chip or bare chip is brought into contact with the inspection probe 5 from above. it is not necessary to place the test probe 5 below the suction chuck 35, for example, it may be configured to place the test probe 5 upward or to the side of each suction chuck 35.

In this embodiment, the rotary shaft 35 is arranged horizontally and the suction chucks 35 are turned upside down. However, it is not always necessary to turn the suction chucks 35 up and down. The suction chuck 35 may be inverted.

In this embodiment, the image processing location is set above the inspection probe 5. However, it is not always necessary to set the image processing location above the inspection probe 5. For example, the image processing location may be set on the side of the inspection probe 5. It is desirable to determine the set position according to the layout design of the bare chip inspection machine 1 such as setting the place.

[0092]

As described above, in the present invention,
Since the bare chip continuity inspection device was configured as described above,
The continuity inspection of the bare chip alone can be performed, and the inspection work can be automated. Further, since the rotating shaft to which the chuck is attached is disposed substantially horizontally, the chuck can be turned upside down and the installation space can be saved. Further, since a plurality of chucks are provided, the efficiency of the continuity test can be improved. In addition, since the rotation axis position correcting means is provided, it is possible to easily correct the position of the bare chip.

Further, in the bare chip continuity inspection device according to the second aspect, since the heater and the temperature sensor are built in the chuck, the bare chip can be directly heated, and the temperature control during the continuity inspection is facilitated. ,
Preheating can be eliminated.

In the bare chip continuity inspection device according to the third aspect, since the needle buckling prevention stopper is provided on at least one of the chuck and the inspection probe, it is possible to prevent the needle of the inspection probe from buckling. it can.

Further, in the bare chip continuity inspection device according to the fourth aspect, since the light shielding wall is provided on at least one of the chuck and the inspection probe, it is possible to prevent light from hitting the bare chip or the needle of the inspection probe during the continuity inspection. Can be prevented, and a highly accurate continuity test can be performed.

Furthermore, in the bare chip continuity inspection device according to the fifth aspect, since the contact is made only at the tip of the needle, the dent of the bonding pad is reduced, and the deflection of the needle even if the protrusion amount or the parallelism of the needle varies. It does not cause suction failure due to suction.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a schematic configuration of a bare chip inspection machine provided with a bare chip continuity inspection device according to the present invention.

FIG. 2 is a plan view of the bare chip inspection machine of FIG. 1;

FIG. 3 is a plan view of a pallet feeder of the bare chip inspection machine of FIG. 1;

FIG. 4 is a side view of the pallet feeder as viewed from the direction of arrow IV in FIG. 3;

FIG. 5 is a front view of the pallet feeder as viewed from the direction of arrow V in FIG. 3;

6A and 6B are diagrams showing the periphery of the vacuum chuck of the XY robot of the bare chip inspection machine in FIG. 1; FIG. 6A is a front view showing the entire chuck; FIG. () Is a plan view showing the suction surface of the discharge-side vacuum chuck.

FIG. 7 is a side view of the vacuum chuck as viewed from the direction of arrow VII in FIG. 6;

FIG. 8 is a plan view of the vacuum chuck of FIG. 6;

FIG. 9 is a front view of a pallet stand of the bare chip inspection machine of FIG. 1;

FIG. 10 is a plan view of the defective product pallet as viewed from the direction of arrow X in FIG. 9;

FIG. 11 is a plan view of a centering device of the bare chip inspection machine of FIG. 1;

FIG. 12 is a side view of a bare chip continuity inspection device of the bare chip inspection machine of FIG. 1;

13 is a rear view of the bare chip continuity inspection device as viewed from the direction of arrow XIII in FIG. 12;

14 is a plan view of the bare chip continuity inspection device of FIG.

15 is a sectional view showing details of a chuck portion of the bare chip continuity inspection device of FIG. 12;

FIG. 16 is a sectional view of the chuck portion taken along the line XVI-XVI in FIG. 15;

FIG. 17 is a front view showing a camera stand of the bare chip inspection machine of FIG. 1;

FIG. 18 is a plan view of the camera stand of FIG. 17;

FIG. 19 is a side view showing a tester gantry of the bare chip inspection machine of FIG. 1;

FIG. 20 is a sectional view showing an inspection probe of the bare chip inspection machine of FIG. 1;

FIG. 21 is a diagram showing an example of a means for connecting a gantry,
(A) is a plan view, (B) is a plan view showing a main part, and (C) is a plan view.
Side view, (D) shows the positional relationship between the knock pin and the dog
FIG .

FIG. 22 is a view showing another example of the means for connecting the gantry;
(A) is a plan view and (B) is a side view.

[Explanation of symbols]

Reference Signs List 1 bare chip inspection machine 2 bare chip supply / discharge device 3 centering device 4 bare chip continuity inspection device (bear chip positioning device) 5 inspection probe 13 tray 33 rotating body 35 suction chuck 41 inversion motor 95 bare chip 95 'inspected bare chip

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shoichi Funaki 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Limited (56) References JP-A-7-98361 (JP, A) JP-A-2-236149 (JP, A) JP-A-8-297152 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/66 G01R 31/26

Claims (5)

(57) [Claims] A rotating shaft installed substantially horizontally; a plurality of chucks mounted radially outward on the rotating shaft; an image processing place and an inspection place set around the rotating shaft; Rotation driving means for rotating the shaft to move the chuck to the image processing location and the inspection location; an inspection probe installed at the inspection location; and a reference position setting for setting a position corresponding to the inspection probe at the image processing location as a reference position. Means, image processing means for detecting the position of the bare chip held by the chuck at the image processing location, and rotation axis position correction means for adjusting the position of the rotation axis to match the position of the bare chip detected by the image processing means with the reference position After the position of the bare chip coincides with the reference position, the chuck is moved at the inspection location and the inspection probe is brought into contact with the bare chip to test the continuity. A bare-chip continuity inspection device, comprising: 2. The chuck according to claim 1, wherein the chuck includes a heater provided inside the chuck surface to warm a bare chip held by the chuck, and a temperature sensor provided near the chuck surface. Bare chip continuity inspection equipment. 3. A needle buckle for preventing a buckling of a needle of the inspection probe by restricting a moving distance of the chuck when the chuck moves and comes into contact with the inspection probe, at least one of the chuck and the inspection probe. 3. The bare chip continuity inspection device according to claim 1, further comprising a prevention stopper. 4. The apparatus according to claim 1, wherein at least one of the chuck and the inspection probe includes a light-shielding wall surrounding a bare chip held by the chuck and a needle of the inspection probe when the chuck contacts the inspection probe. 4. The bare chip continuity inspection device according to any one of items 1 to 3. 5. The bare chip continuity inspection device according to claim 1, wherein the needle of the inspection probe projects in a vertical direction and contacts the bare chip.