JP3093142B2 - Resin sealing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing device used for manufacturing a light emitting diode having leads extending from a sealing resin in which a semiconductor light emitting chip is incorporated.

[0002]

2. Description of the Related Art In a light emitting diode, a semiconductor light emitting chip is sealed with a resin mold, and a plurality of leads extend from the resin mold. Such light emitting diodes are being mass-produced simultaneously using a lead frame.

FIG. 5 shows a lead frame 50 used for manufacturing a light emitting diode. In the lead frame 50, a plurality of pairs of leads 52 and 53 extend from the cradle 51 at right angles. The vicinity of the tip of each of the paired leads 52 and 53 is entirely connected by a tie bar 54 parallel to the cradle 51. Such a lead frame 50
It is composed of iron (Fe).

The lead frame 50 has one lead 52
The semiconductor light emitting chip 55 is die-bonded to the tip of the semiconductor light emitting chip 55 and the other lead 5
3 are wire-bonded by a bonding wire 56. Then, the semiconductor light emitting chip 55 and the bonding wire 56 are sealed together with the tips of the leads 52 and 53 by a resin mold 57,
Each of the pair of leads 52 and 53 is cut from the tie bar 54 and the cradle 51 to form a light emitting diode.

FIG. 6 is an exploded perspective view of a conventional resin sealing device used for manufacturing a light emitting diode. This resin sealing device has a mold case 61 in which a plurality of cavities 61a into which a liquid sealing resin is injected are provided in a straight line. Liquid resin is injected into the cavity 61 a of the mold case 61, and the tips of the leads 52 and 53 of the lead frame 50 are immersed. A semiconductor light emitting chip 55 is die-bonded to the tip of the lead 52 and is wire-bonded to the tip of the lead 53. The mold case 61 is fitted in a plurality of guide grooves 62 a provided along the longitudinal direction on the upper surface of an aluminum base member 62, and is supported on the base member 62. In each guide groove 62a of the base member 62, a plurality of mold cases 61 are arranged in a state of being arranged along the longitudinal direction.

The base member 62 includes a mold case 61.
A stainless steel etching plate 63 for positioning and fixing is provided. The etching plate 63 is positioned by a pair of reference pins 62b provided at diagonal positions of the base member 62. The etching plate 63 is provided with an opening 63a in which the mold case 61 is fitted and positioned, and further provided with a positioning recess 63b paired with a positioning projection 61b provided in the mold case. ing. These positions the mold case 61 in the longitudinal direction. The etching plate 63 is attached to the base member 62 by screws 64 in a state where the mold case 61 is fitted into the opening 63a. Each mold case 61 fitted in the guide groove 62 a of the base member 62 is fixed in a state of being positioned with respect to the base member 62 by being fitted in the opening 63 a of the etching plate 63.

A guide groove 6 is provided at each end of the base member 62.
A pair of side plates 64 are screwed so as to sandwich 2a. In the upper part of each side plate 64, a concave groove 64a is provided corresponding to the guide groove 62a formed in the base member 62, respectively. Then, each end of a long plate-shaped frame hanger 65 that supports the lead frame 50 is fitted into a pair of concave grooves 64a of the respective side plates 64 that are opposed to each other. .

The frame hanger 65 holds the lead frame 50 so that the tips of the leads 52 and 53 of the light emitting diode extend downward. The frame hanger 65 has a concave portion 65a formed on the lower surface of one end. The concave portion 65a is fitted to the bottom of a concave groove 64a provided on one side plate 64, so that the frame hanger 65 64.

In the resin sealing device having such a structure, when the mold case 61 is fitted into the guide groove 62a of the base member 62 and fixed by the etching plate 63, the cavity 61a of the mold case 61 A liquid sealing resin is injected. On the other hand, the lead frame 50 is held by the frame hanger 65 in a state where the semiconductor light emitting chip 55 is die-bonded to the leads 52 of the lead frame 50 and wire-bonded to the leads 53. Then, the respective ends of the frame hanger 65 are fitted into the concave grooves 64a of the side plate 64, respectively.
Are placed between the side plates 64. The frame hanger 65 is positioned with respect to the side plate 64 by the concave portion 65 a of the frame hanger 65.

In such a state, each lead 52 of the lead frame 50 held on the frame hanger 65
And 53 are immersed in a liquid thermosetting sealing resin filled in each cavity 61a of the mold case 61 in a state where the semiconductor light emitting chip 55 is die-bonded and wire-bonded. Then, the entire resin sealing device is set in an oven and heated to a temperature of about 100 ° C. Thereby, the sealing resin filled in each cavity 61a of the mold case 61 is cured. afterwards,
The resin sealing device is removed from the oven, the frame hanger 65 is moved upward with respect to the mold case 61, and the cured resin mold 57 is removed from the lead frame 50.
Are unified with the respective leads 52 and 53 from the respective cavity portions 61a of the mold case 61.

[0011]

In such a resin sealing device, the lead frame 50 is provided with a frame hanger 65.
By being bridged between the side plates 64 in a state of being held in the base member 62, it is positioned with respect to the mold case 61 placed on the base member 62. The mold case 61 is fitted into each guide groove 62 a of the base member 62, and is positioned and fixed by the etching plate 63. For this reason, the mold case 6
1 and the lead frame 50 are positioned with the base member 62, the etching plate 63, the respective side plates 64, the frame hanger 65 and the like interposed therebetween, and the respective cavity portions 61a of the mold case 61 are positioned. And the lead frame 50 cannot be accurately positioned, and may not be aligned in a predetermined state.

The base member 62 supporting the mold case 61 is made of aluminum, while the etching plate 63 attached to the base member 62 for positioning the mold case is made of stainless steel. Further, the lead frame 50 is made of iron. The linear expansion coefficient of the aluminum base member 62 is 23.1 × 10 ⁻⁶ (normal temperature), the linear expansion coefficient of the stainless steel etching plate 63 is 14.7 × 10 ⁻⁶ (normal temperature), and the iron lead frame 50 is Since the linear expansion coefficients are different from 11.8 × 10 ⁻⁶ (normal temperature), when heated by an oven, the mold case 61 and the lead frame 50 are displaced due to the difference in the respective linear expansion coefficients. May be in a state.

Further, the lead frame 50 is mounted on the frame hanger 65 so as not to warp. The leads 52 and 53 inserted into the cavity 61 a of the mold case 61 extend from the frame hanger 65. Because it is in a free state
Each of the leads 52 and 53 extending from the frame hanger 65 is warped, so that each of the cavity portions 61 a
There is a risk of misalignment.

FIG. 7A shows a light-emitting diode in which the sealing resin is cured in a state where each cavity portion 61a of the mold case 61 and the lead frame 50 are not accurately aligned. ) Indicates the mold case 6
1 shows a light emitting diode in which a sealing resin is cured in a state where each cavity portion 61a and the lead frame 50 are accurately aligned. When the sealing resin is cured in a state where each cavity portion 61a of the mold case 61 and the lead frame 50 are accurately aligned, FIG.
As shown in (b), the semiconductor light emitting chip 55 is disposed at the axial center of the resin mold 57, while each cavity 61 a of the mold case 61 is connected to the lead frame 5.
When 0 and the sealing resin is cured in a state that is not correctly aligned, as shown in FIG. 7 (a), the semiconductor light emitting chip 55 is in a state deviated by T ₃ from the axis of the resin mold 57 . If the cavities 61a of the mold case 61 and the lead frame 50 are not accurately aligned as described above, the quality of the manufactured light emitting diode will vary.

An object of the present invention is to solve such a problem, and an object of the present invention is to provide a resin sealing device capable of accurately positioning a mold case and a lead frame. Another object of the present invention is to provide a resin capable of minimizing the displacement between the mold case and the lead frame due to the heating even when the resin injected into the cavity of the mold case is heated for curing. It is to provide a sealing device. It is another object of the present invention to provide a resin sealing device that can easily cope with a case where the number of finished lead frame products is changed.

[0016]

A resin sealing device according to the present invention comprises: a mold case in which a plurality of cavities into which a liquid sealing resin is injected are arranged in a straight line; A guide groove is provided on the upper surface in which the portions are linearly arranged, and a plurality of reference pins are vertically arranged on the upper surface, and the base member is positioned by the respective reference pins of the base member. And a set plate for positioning each mold case fitted in the positioning groove of the base member, and a lead frame having a plurality of sets of leads by being mounted on the base member. Each set of leads is inserted into the cavity of each mold case positioned by the set plate. A frame support member attached to the base member while being positioned by the respective reference pins, and a lead frame supported by the frame support member and having each lead inserted into the cavity of the mold case with respect to the mold case. And a support that is attached to the mold case so as to be positioned and supported in a predetermined state by the set plate.

The frame support member has a guide plate which is inserted on each of the leads of the supported lead frame and is mounted on the set plate in a state of contact with the set plate. Is the same material as the lead frame,
The set plate and the frame support member are configured such that one side in the longitudinal direction is inflatable.

The frame support member has a pair of supports for supporting each end of the lead frame in the longitudinal direction, and one of the supports can change the mounting position.

[0019]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is an exploded perspective view showing an example of an embodiment of the resin sealing device of the present invention. This resin sealing device
A plurality of mold cases 10 for simultaneously forming resin molds of a plurality of light emitting diodes, a base member 20 supporting each mold case 10, and a set for positioning and fixing each mold case 10 supported by the base member 20 It has a plate 30 and a frame support member 40 positioned on the set plate 30 while supporting a plurality of lead frames 50.

As shown in FIG. 5, the lead frame 50 has a pair of leads 52 and 53 extending from a cradle 51 at right angles. The cradle 5 is located near the tip of each of the leads 52 and 53 forming a pair.
Tie bars 54 parallel to 1 are connected throughout. Such a lead frame 50 is made of iron (Fe).

The base member 20 is disposed so as to extend vertically from the base body 21, which is vertically abutted against each of the end faces of the base body 21, which is a horizontal elongated plate. And a side plate 22. On the upper surface of the base body 21, five guide grooves 21a extending in the longitudinal direction are provided in parallel with each other. Each guide groove 21a has a flat rectangular parallelepiped cross section,
A lower end portion of each of the plurality of mold cases 10 is fitted into each of the guide grooves 21a in a state where the plurality of mold cases 10 are arranged in a straight line.

On the upper surface along one side edge of the base body 21, reference pins 23 are provided near the respective ends. A screw hole 21b is provided in a corner of the base body 21 near one reference pin 23, and the other corner of the base body 21 is symmetrically positioned with respect to the screw hole 21b. , A screw hole 21c is provided.

The mold case 10 has a rectangular parallelepiped case body 11 extending along each guide groove 21a provided in the base body 21. Case body 11
Is about 1/6 of the length of each guide groove 21a in the longitudinal direction. Therefore, six mold cases 10 can be arranged in each guide groove 21a in a state of being aligned in the longitudinal direction.

FIG. 2A is a longitudinal sectional view of each mold case 10, and FIG. 2B is a transverse sectional view thereof. On the upper surface of each mold case 10, five cavities 11a are provided in a state of being aligned in the longitudinal direction. Each cavity portion 11a is formed in a cylindrical shape with a bottom surface projecting hemispherically downward, and a thermosetting sealing resin is injected into each cavity portion 11a in a molten state. . Each mold case 10 can be fitted in each positioning hole 31 and each positioning recess 31a of the set plate 30 in an aligned state. Each mold case 10
Is provided with a flange portion 11b protruding to each side. Each flange portion 11b is inserted into each guide groove 21a of the base member 20, and the upper surface of each flange portion 11b is flush with the upper surface of the base body 21 provided with each guide groove 21a. Further, a positioning projection 11c protruding upward is provided on each upper surface at the center in the longitudinal direction of the flange 11b.

Each of the mold cases 10 is fitted with one of the columns 14 having a downward U-shape in a paired state with the respective mold cases 10 in a state of being positioned. Each of the pillars 14 has a pair of legs 14 a extending vertically along each side surface of the case body 11,
A support portion 14b is provided between the upper ends of the legs 14a with a slight gap from the upper surface of the case body 11. The lower end of each leg 14a protrudes to each side while being placed on the flange 11b of the case body 11. The support portion 14b includes a central cavity portion 11a provided in the case main body 11 and the cavity portion 11a.
a above the space between the cavity 11a and the cavity 11a. The lead frame 5 is provided at the center of the support portion 14b.
A support groove 14c for supporting the 0 tie bar 54 in a fitted state is provided. The opening of the support groove 14c is
The guide portion 14d is continuous with the upper surface of b.

In each guide groove 21a of the base member 20, the same number of flange portions 1 of the mold case 10 are provided.
The set plate 30 is attached to the base member 20 when a predetermined number of mold cases 10 are inserted as shown in FIG. The set plate 30 is made of iron (Fe), like the lead frame 50.

The set plate 30 includes the base member 20.
The five positioning holes 31 provided in parallel corresponding to the respective guide grooves 21a are provided so as to penetrate vertically. Each positioning hole 31 has a width slightly larger than the width of the mold case 10, and each positioning protrusion 31 provided in the flange portion 11 b of the mold case 10 is located between adjacent positioning holes 31. Six positioning recesses 31a into which 11c fits are provided at the bottom.
In the mold case 10 inserted into each guide groove 21a of the base 20, the flange portion 11b is fitted into the positioning hole 31 of the set plate 30, and each positioning protrusion 11c is inserted into the positioning recess 31a of the set plate 30. It is positioned by being fitted. The mold case 10 positioned by the set plate 30 is in a state where the upper portion of the case main body 11a protrudes upward from each positioning hole 31.

On the inner surface of each positioning hole 31 extending in the longitudinal direction, a groove 32 extending in the vertical direction is provided so that each leg 14a of the support 14 attached to each mold case 10 is fitted. I have. Each groove 3
The support 14 fitted into the inside 2 is supported vertically by the groove 32.

At each end of one side edge of the set plate 30, through holes 33 and 34 through which the reference pins 23 provided at each end of the one side edge of the base member 20 are inserted respectively. Is provided. One through hole 34
Is longer in the longitudinal direction of the set plate 30, that is, in the direction in which the mold cases 10 are arranged along the guide grooves 21a of the base member 20. Further, screw insertion holes 35 and 36 are provided at two center-symmetric corners of the set plate 30 so as to face the screw holes 21b and 21c provided in the base body 21 of the base member 20, respectively. . One of the screw insertion holes 36 is also provided in each of the mold cases 1 arranged side by side in each of the guide grooves 21a.
It is longer in the direction along 0.

When the respective through holes 33 and 34 are inserted into the respective reference pins 23 on the base member 20 and positioned, the set plate 30 is provided with the respective screw insertion holes 35 and 36.
The screw holes 21b and 21c of the base member 20 are aligned, and the set plate fixing screws 37 and 38 are inserted into the screw insertion holes 35 and 36, respectively. Each of the set plate fixing screws 37 and 38 is provided with a screw portion 37b and 38b at the tip, respectively, and is located between the head portions 37a and 38a and the screw portions 37b and 38b, and is smaller than the screw portions 37b and 38b. The column-shaped shank portions 37c and 38c each having a large outer diameter are provided.

As shown in FIGS. 3 (a) and 3 (b), the insertion hole 36 has a long hole shape along the arrangement direction of each mold case 10, and the shank portion 38c of the set plate fixing screw 38 is A gap T ₁ is provided along the direction with the inner peripheral surface of the insertion hole 36. The head 38a of the set plate fixing screw 38 is
From the top surface also as a slight gap T ₂ is provided, the axial length of the set plate fixing screws 38 are set.

Accordingly, the set plate 30 positioned by each reference pin 23 is fixed to the base member 20 by screwing the set plate fixing screws 37 and 38 into the screw holes 21b and 21c. You. However, one of the insertion holes 34 and the screw insertion hole 3
6 has a long hole shape, the side portion of the set plate 30 is not restricted, and is in a state where it can expand along the arrangement direction of the mold cases 10.

As shown in FIG. 1, a frame supporting member 40 supporting a plurality of lead frames 50 is positioned on the set plate 30. FIG. 4 is a perspective view showing the frame support member 40 in a state where the frame support member 40 is turned upside down. FIG.
As shown in FIG. 4 and FIG. 4, the frame supporting member 40 has a flat plate-shaped guide plate 41 which is placed on the set plate 30 and brought into contact with the set plate 30. The guide plate 41 is made of iron like the lead frame 50. In the guide plate 41, five guide holes 41a extending in the longitudinal direction are provided in parallel. Each guide hole 41a is vertically penetrated, and an upper part of the mold case 10 projecting upward from each positioning hole 31 of the set plate 30 is inserted therethrough.

The guide plate 41 is provided with a pair of supports 42 and 43 for supporting the lead frame 50. One of the supports 42 is the guide plate 4
A support wall portion 42a vertically mounted on the upper surface of the first support member 1 along the width direction thereof, and a flat support having one side attached to the upper surface of the support wall portion 42a and supported horizontally. And a plate portion 42b. Support plate part 42b
Extends toward the center of the guide plate 41 so as to be parallel to the guide plate 41 at an appropriate interval. A window 42c is provided on the side of the support plate 42b on the distal end side.

As shown in FIG. 4, five frame support grooves 42d extending along the axis of each guide hole 41a in the guide plate 41 are provided on the lower surface of the support plate portion 42b of the support body 42. . Also, the support wall 42a
Has five frame support grooves 42e (see FIG. 1) continuous with each frame support groove 42d of the support plate 42b.
Each is provided in a vertical state.

The other support 43 has a structure symmetrical to the above-described support 42, and is provided on the upper surface of the support wall 43a.
A support plate 43b is provided to extend so as to approach the support plate 42b of the support 42 described above. A window 43c is provided on the support plate 43b, and five frame support grooves 43d are provided on the lower surface thereof. Further, five support grooves 43d are formed on the support wall 43a. Frame supporting groove 43e.

The support 43 is detachable from the guide plate 41. For example, as shown in FIG. 1, when supporting a lead frame 50 having 25 leads 52 and 53, A pair of positioning pins (not shown) provided on the guide plate 41 are attached at a position slightly closer to the other support 42.
When supporting the lead frame 50 having 30 leads 52 and 53, the support 43 includes a pair of positioning pins 44 provided on the upper surface of the end of the guide plate 41.
Is attached to the end on the guide plate 41.

On one side edge of the guide plate 41,
As shown in FIG. 4, through holes 41b and 41c through which the reference pins 23 provided on the base member 20 are inserted are provided. Each of the through holes 41b and 41c has a similar shape so as to be aligned with each of the through holes 33 and 34 of the set plate 30.
Is the mold case 10 fixed to the base member 20.
Are elongated along the direction of the arrangement. Therefore, one side of the guide plate 41 can also expand along the direction in which the mold cases 10 are arranged.

The resin sealing device having such a configuration is used as follows. For example, 25 leads 52 and 5
3 for each lead 52
While the semiconductor light emitting chip 55 is die-bonded thereon,
It is assumed that the semiconductor light emitting chip 55 and each lead 53 are wire-bonded by the bonding wire 56.
Then, five such lead frames 50 are prepared.

On the other hand, each guide groove 21a of the base member 20
Next, the flange portions 11b of the five mold cases 10 are arranged, and the respective mold cases 10 are linearly arranged. Further, the support 14 is connected to the groove 32
To be fitted. In such a state, each reference pin 23
Then, the through holes 33 and 34 of the set plate 30 are fitted to each other, and placed on the base body 21 of the base member 20. At this time, the flange portion 11b of each mold case 10 is fitted into each positioning hole 31 of the set plate 30, and each positioning convex portion 11c provided on the flange portion 11b is fitted into each positioning concave portion 31a. Thereby, the mold case 10 is positioned in a state where the respective upper portions extend above the set plate 30. In addition, the support portion 14b of the column 14 provided in each groove 32 of the set plate 30 is also supported in a vertical state protruding above the set plate 30.

In such a state, the set plate fixing screws 37 and 38 are inserted into the screw insertion holes 35 and 36 of the set plate 30, and the respective screw portions 37
b and 38b are screwed to the respective screw holes 21b and 21c of the base member 20. Then, a liquid thermosetting sealing resin is injected into each cavity 11a of each mold case 10.

The frame support member 40 is located at a position corresponding to the lead frame 50 having 25 leads 52 and 53 near the one end of the guide plate 41.
The detachable support 43 is attached, and as shown in FIG. 4, the support is turned upside down. In this state, the five lead frames 50 are vertically inserted into the respective guide holes 41a of the guide plate 41 with the tips of the leads 52 and 53 provided with the semiconductor element 55 and the bonding wires 56 facing upward. Insert it.
Each of the frame support grooves 42e and 4e provided in the support wall portions 42a and 43a of the support members 42 and 43, respectively.
The end of each lead frame 50 is fitted to 3e and lowered, and the cradle 51 of each lead frame 50 is fitted to each frame supporting groove 42d and 43d of the support plate portions 42b and 43b.

Thus, each lead frame 50 is vertically supported by the supports 42 and 43 of the frame support member 40. At this time, the tips of the leads 52 and 53 of each lead frame 50 project upward from the respective guide holes 41 a of the guide plate 41.

In this state, the frame supporting member 40 is turned upside down, and the through holes 41b and 41c of the guide plate 41 project upward from the through holes 33 and 34 of the set plate 30. It is fitted on the reference pin 23 and placed on the set plate 30 while being positioned.

As a result, each lead frame 50 supported vertically by the frame support member 40 is provided with a pair of leads 52 and 53, as shown in FIG. 2, in the cavity 11a of each mold case 10. Each is immersed in the injected sealing resin. At this time, the tie bar 54 of each lead frame 50 is fitted and supported in the support groove 14c of the support portion 14b of the column 14 provided on the set plate 30.

As described above, each lead frame 50 is attached to the base member 20 to which each mold case 10 is fixed.
Since the frame supporting member 40 on which the lead frame 50 is supported is directly positioned,
The leads 52 and 53 forming the pair and the cavities 11a of the mold cases 10 are accurately positioned without being displaced. In addition, each lead frame 50 supported by the frame support member 40 is
The tie bars 54 adjacent to the tip portions of the support members 2 and 53 are guided by the respective guide portions 14 d of the support body 14, and are supported by the support grooves 14.
Since the lead frame 50 is supported in a fitted state, the warp or the like of the lead frame 50 is corrected. As a result, each lead 5
Positions 2 and 53 and each cavity 11a are positioned with higher precision.

As described above, when the respective lead portions 52 and 53 of the lead frame 50 are immersed in the sealing resin of the respective cavities 11a, the entire resin sealing device is set in an oven, Heated to about 100 ° C. Thereby, the thermosetting sealing resin in each cavity 11a is cured.

At this time, the guide plate 41 of the frame supporting member 40 is made of the same iron as the lead frame 50, and the guide plate 41 has one insertion hole 41c through which the reference pin 23 is inserted. Because it is a hole and the side is not restrained by the base member 20,
Even when the lead frame 50 is heated and expanded, the guide plate 41 expands similarly to the lead frame 50. The set plate 30 is also made of the same iron as the lead frame 50.
0 indicates that one of the insertion hole 34 and the screw insertion hole 36 through which the reference pin 23 is inserted is a long hole and the side portion is the base member 20.
, It expands similarly to the lead frame 50. As a result, each mold case 10 restrained by the set plate 30 and each of the supports 42 and 43
And there is almost no possibility of misalignment with the lead frame 50 constrained by the guide plate 41.

Each of the supports 42 and 43 is made of aluminum.
, Its linear expansion can be almost neglected.

As described above, the sealing resin in the cavity 11a is hardened with little displacement between the lead frame 50 and each cavity 11a of each mold case 10.

When the sealing resin in each cavity 11a is cured, the entire resin sealing device is taken out of the oven. Then, from the base member 20 to the frame supporting member 40
Are separated, and the resin mold 5 in each cavity 11a is separated.
7 is released from the cavity 11a. Thereafter, the leads 52 and 53 are cut from the lead frame 50, respectively, to form light emitting diodes.

In the resin sealing device according to the present invention, one support 43 of the frame support member 40 is connected to the guide plate 4.
1 and a pair of positioning pins 44
Thereby, it can be easily attached to a position that can support a lead frame having 30 leads.
Each of the guide grooves 21a of the base member 20 also has six mold cases 10 having five cavities 11a.
Can be arranged and fixed in a straight line, so that it is possible to easily cope with 30 lead frames.

[0054]

As described above, the resin sealing device of the present invention provides:
Since the frame supporting member that supports the lead frame is directly positioned with respect to the base member that fixes the mold case, the positioning accuracy between the mold case and the lead frame is significantly improved.

Further, the lead frame, the set plate for positioning the mold case, and the guide plate of the frame support member for positioning the lead frame are
Since the set plate and the guide plate are made of the same material as the lead frame and thermally expand in the same manner, even when the sealing resin is cured, the displacement between the mold case and the lead frame hardly occurs.

Further, since the mold case is provided with a support for supporting the tie bar of the lead frame, the mold case and the lead frame can be supported at a position close to the mold case. , The positioning accuracy is further improved.

Since one support of the frame supporting member for supporting the lead frame is mounted at a different position with respect to the guide plate, it is possible to easily cope with the size of the lead frame. .

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an example of an embodiment of a resin sealing device of the present invention.

2A is a longitudinal sectional view showing a use state of a mold case used in the resin sealing device, and FIG. 2B is a transverse sectional view thereof.

FIG. 3A is an exploded perspective view showing a main part of a base member and a set plate used in the resin sealing device, and FIG.
Is a sectional view thereof.

FIG. 4 is an exploded perspective view showing a frame support member used in the resin sealing device in an upside down state.

FIG. 5 is a plan view of a lead frame.

FIG. 6 is an exploded perspective view showing an example of a conventional resin sealing device.

7A is a schematic front view showing a defective light emitting diode, and FIG. 7B is a schematic front view showing a non-defective light emitting diode.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Mold case 11 Case main body 11a Cavity part 11b Flange part 11c Positioning convex part 14 Post 14a Leg 14b Support part 14c Support groove 14d Guide part 20 Base member 21 Base body 21a Guide groove 21b, 21c Screw hole 22 Side plate 23 Reference pin Reference Signs List 30 set plate 31 positioning hole 31a positioning concave portion 32 groove portion 33, 34 through hole 35, 36 screw insertion hole 37, 38 set plate fixing screw 37a, 38a head 37b, 38b screw portion 37c, 38c shank portion 40 frame support member 41 guide Plate 41a Guide hole 41b, 41c Through hole 42, 43 Support body 42a, 43a Support wall 42b, 43b Support plate 42c, 43c Window 42d, 43d Frame support groove 42e, 43e Frame Jimizo 44 positioning pin 50 lead frame 51 cradle 52, 53 leads 54 tie bar 55 semiconductor light-emitting chip 56 bonding wire 57 resin mold

Continuation of the front page (56) References JP-A-52-70767 (JP, A) JP-A-52-72575 (JP, A) JP-A-61-189651 (JP, A) JP-A-3-13763 (JP) , U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21 / 56,23 / 28,33 / 00

Claims (3)

(57) [Claims] 1. A mold case in which a plurality of cavities into which a liquid sealing resin is injected are arranged in a straight line, and a guide to be fitted in a state in which lower ends of the plurality of mold cases are arranged in a straight line. A groove is provided on the upper surface, and a plurality of reference pins are arranged on the upper surface in a vertical state, and the base member is mounted on the base member in a positioning state by each reference pin of the base member. By being mounted, a set plate for positioning each mold case fitted in the positioning groove of the base member, and a lead frame having a plurality of sets of leads are supported, and each mold positioned by the set plate is supported. Each reference pin on the base member is inserted so that each set of leads is inserted into the cavity of the case. A frame support member that is mounted in a positioned state, and is attached to the mold case so that the lead frame supported by the frame support member and having each lead inserted into the cavity of the mold case is positioned relative to the mold case. And a column supported in a predetermined state by a set plate, and a resin sealing device. 2. The frame supporting member has a guide plate which is inserted on each of the leads of a supported lead frame and is mounted on the set plate in a state of being in contact with the set plate. The resin sealing device according to claim 1, wherein the plate is made of the same material as the lead frame, and the set plate and the frame support member are configured such that one side in the longitudinal direction is expandable. 3. The frame support member has a pair of supports for supporting each end of the lead frame in the longitudinal direction, and one of the supports can change a mounting position. The resin sealing device according to item 1.