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JP3095636B2 - Manufacturing method of metal foil clad laminate - Google Patents
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JP3095636B2 - Manufacturing method of metal foil clad laminate - Google Patents

Manufacturing method of metal foil clad laminate

Info

Publication number
JP3095636B2
JP3095636B2 JP06233271A JP23327194A JP3095636B2 JP 3095636 B2 JP3095636 B2 JP 3095636B2 JP 06233271 A JP06233271 A JP 06233271A JP 23327194 A JP23327194 A JP 23327194A JP 3095636 B2 JP3095636 B2 JP 3095636B2
Authority
JP
Japan
Prior art keywords
metal foil
clad laminate
varnish
fluorescent dye
thermosetting resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP06233271A
Other languages
Japanese (ja)
Other versions
JPH0890718A (en
Inventor
秀志 牧野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP06233271A priority Critical patent/JP3095636B2/en
Publication of JPH0890718A publication Critical patent/JPH0890718A/en
Application granted granted Critical
Publication of JP3095636B2 publication Critical patent/JP3095636B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Laminated Bodies (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、電子、電気機器に使用
されるプリント配線板の材料として用いられる金属箔張
積層板の製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a metal foil-clad laminate used as a material for a printed wiring board used for electronic and electric equipment.

【0002】[0002]

【従来の技術】プリント配線板は、通常その最外層の導
体回路パターン上に半田付け時の導体回路パターン間の
半田付けによるショートの防止、または、導体回路パタ
ーンの表面保護のためにソルダーレジストが形成され
る。
2. Description of the Related Art A printed wiring board is usually provided with a solder resist on the outermost conductive circuit pattern to prevent a short circuit due to soldering between the conductive circuit patterns at the time of soldering or to protect the surface of the conductive circuit pattern. It is formed.

【0003】このソルダーレジストの形成方法には、感
光性樹脂(フォトレジスト)を用いた写真焼付け法が使
用されていた。この写真焼付け法は、フォトレジストを
用いて、ネガティブ又はポジティブマスクを重ね合わ
せ、露光機により回路パターンを露光する方法である。
As a method of forming the solder resist, a photographic printing method using a photosensitive resin (photoresist) has been used. This photographic printing method is a method in which a negative or positive mask is overlaid using a photoresist, and a circuit pattern is exposed by an exposure machine.

【0004】この露光機による回路パターンの露光は、
その作業性の点から両面同時露光が採用されている。と
ころが、例えば、プリント配線板の材料となる金属箔張
積層板を両面同時露光する場合、露光機により照射され
た光がフォトレジストを透過して、さらに積層板内を透
過し、紫外線領域の光が反対面のフォトレジストをも露
光することがあった。
[0004] Exposure of a circuit pattern by this exposure machine is as follows.
From the viewpoint of workability, double-sided simultaneous exposure is employed. However, for example, when simultaneously exposing a metal foil-clad laminate as a material for a printed wiring board on both sides, light irradiated by an exposure machine passes through the photoresist, further passes through the inside of the laminate, and emits light in the ultraviolet region. However, the photoresist on the opposite side was sometimes exposed.

【0005】特に、金属箔張積層板の厚みが薄くなると
その透過率も高くなり、そのために、基材に含浸する熱
硬化性樹脂組成物に紫外線吸収剤を配合したり、基材を
蛍光増白剤で処理する方法を用いて紫外線の透過防止を
おこなっていた。
[0005] In particular, as the thickness of the metal foil-clad laminate becomes thinner, the transmittance becomes higher. For this reason, an ultraviolet absorber is added to the thermosetting resin composition impregnated into the base material, or the base material is increased in fluorescence. A method of treating with a whitening agent was used to prevent transmission of ultraviolet rays.

【0006】しかしながら、これらの方法を使用して紫
外線の透過防止を行い、金属箔張積層板を製造すると、
紫外線吸収剤や蛍光増白剤を多量に使用すために、紫外
線吸収剤や蛍光増白剤が金属箔張積層板内に均一に分散
せず、金属箔張積層板としての耐熱性が低下したり、金
属箔張積層板の光の透過率にバラツキが生じて反対面の
フォトレジストを露光する欠点を有していた。
However, when these methods are used to prevent transmission of ultraviolet rays and produce a metal foil-clad laminate,
Due to the large amount of UV absorbers and fluorescent brighteners used, UV absorbers and fluorescent brighteners are not evenly dispersed in the metal foil-clad laminate, reducing the heat resistance of the metal foil-clad laminate. In addition, the light transmittance of the metal foil clad laminate varies, and the photoresist on the opposite surface is exposed.

【0007】[0007]

【発明が解決しようとする課題】本発明は上記の問題を
鑑みてなされたもので、その目的とするところは、本来
の金属箔張積層板の外観及び各特性を維持しつつ、光の
透過率が均一で、紫外線の吸収に優れた金属箔張積層板
を提供することにある。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has as its object to maintain the appearance and various characteristics of an original metal foil-clad laminate while transmitting light. An object of the present invention is to provide a metal-foil-clad laminate having a uniform rate and excellent ultraviolet absorption.

【0008】[0008]

【課題を解決するための手段】本発明の請求項1に係る
金属箔張積層板の製造方法は、熱硬化性樹脂を含有する
ワニスを基材に含有した1枚以上のプリプレグの外側に
金属箔を積層一体化した金属箔張積層板の製造方法にお
いて、上記プリプレグとして、紫外線を吸収する蛍光染
料を予めラジカル重合性化合物に溶解して蛍光組成物と
し、上記ラジカル重合性化合物と相溶性を有する触媒
に、上記蛍光組成物と熱硬化性樹脂とを溶解してワニス
とし、このワニスを基材に含浸したプリプレグを使用す
ることを特徴とする。
According to a first aspect of the present invention, there is provided a method of manufacturing a metal foil-clad laminate, comprising the steps of: providing a metal varnish containing a thermosetting resin on a substrate; In the method for producing a metal foil-clad laminate obtained by laminating and integrating foils, as the prepreg, a fluorescent dye that absorbs ultraviolet light is previously dissolved in a radical polymerizable compound to form a fluorescent composition, and the compatibility with the radical polymerizable compound is determined. A varnish obtained by dissolving the fluorescent composition and the thermosetting resin in a catalyst having the varnish, and using a prepreg obtained by impregnating the varnish into a base material.

【0009】また、本発明の請求項2に係る金属箔張積
層板の製造方法は、蛍光染料の含有量が熱硬化性樹脂成
分に対して、それぞれ、0.03〜5.0重量%である
ことを特徴とする。
Further, in the method for producing a metal foil-clad laminate according to claim 2 of the present invention, the content of the fluorescent dye is 0.03 to 5.0% by weight based on the thermosetting resin component. There is a feature.

【0010】以下、本発明をより詳細に説明する。本発
明の金属箔張積層板の製造方法で使用される蛍光染料
は、任意の範囲において光を吸収する蛍光染料であり、
この蛍光染料の紫外線の吸収波長領域は、回路パターン
の形成時に使用される紫外線硬化型ソルダーレジストの
感光波長領域を占めるものが好ましく、300〜450
nmであるのが好ましい。また、この蛍光染料の含有量
は、熱硬化性樹脂組成物に対して、それぞれ、0.03
〜5.0重量%の範囲であることが好ましく、0.03
重量%未満ではその配合した効果を得ることができず、
プリント配線板を製造する時に光が透過する。また、
5.0重量%を越えると、光を遮断する効果は向上する
が、得られた金属箔張積層板の耐熱性が低下する。
Hereinafter, the present invention will be described in more detail. The fluorescent dye used in the method for producing a metal foil-clad laminate of the present invention is a fluorescent dye that absorbs light in an arbitrary range,
The ultraviolet absorption wavelength region of the fluorescent dye preferably occupies the photosensitive wavelength region of the ultraviolet-curable solder resist used at the time of forming a circuit pattern.
It is preferably nm. The content of the fluorescent dye was 0.03 with respect to the thermosetting resin composition.
To 5.0% by weight, preferably 0.03% by weight.
If it is less than the weight%, the combined effect cannot be obtained,
Light is transmitted when manufacturing a printed wiring board. Also,
If it exceeds 5.0% by weight, the effect of blocking light is improved, but the heat resistance of the obtained metal foil-clad laminate is reduced.

【0011】この蛍光染料を溶解するラジカル重合性化
合物の代表的物質を示すと、ビニル基を含む単量体で、
液状状態で蛍光染料の溶解速度が早く、均一に分散する
ことができる。このラジカル重合性化合物としては、特
に限定はされないが、例えば、スチレン、ビニルトルエ
ン、ジビニルベンゼン、α−メチルスチレン、クロロス
チレン等の芳香族ビニル化合物類;酢酸ビニル、アジピ
ン酸ジビニルエステル等のビニルエステル類;ジアリル
フタレート;(メタ)アクリル酸;メチル(メタ)アク
リレート、ブチル(メタ)アクリレート、オクチル(メ
タ)アクリレート、エチレングリコールジ(メタ)アク
リレート、2−ヒドロキシエチル(メタ)アクリレート
等の(メタ)アクリル酸エステル類等が挙げられる。こ
れらの中でも、スチレンは、その溶剤性能、重合性反応
等が特に良く、好ましく使用される。このラジカル重合
性化合物は、単体または複数体が使用される。
A typical radical polymerizable compound that dissolves the fluorescent dye is a monomer containing a vinyl group,
In the liquid state, the fluorescent dye has a high dissolution rate and can be uniformly dispersed. The radical polymerizable compound is not particularly limited, but examples thereof include aromatic vinyl compounds such as styrene, vinyltoluene, divinylbenzene, α-methylstyrene, and chlorostyrene; vinyl esters such as vinyl acetate and divinyl adipate. Classes: diallyl phthalate; (meth) acrylic acid; (meth) such as methyl (meth) acrylate, butyl (meth) acrylate, octyl (meth) acrylate, ethylene glycol di (meth) acrylate, and 2-hydroxyethyl (meth) acrylate Acrylic esters and the like can be mentioned. Among these, styrene is particularly preferred because of its particularly good solvent performance and polymerization reaction. The radical polymerizable compound is used alone or in plural.

【0012】上記蛍光染料を溶解する熱硬化性樹脂組成
物としては、特に限定はされないが、積層板の製造に使
用される熱硬化性樹脂組成物で、例えば、不飽和ポリエ
ステル樹脂、エポキシ樹脂、ビニルエステル樹脂、フェ
ノール樹脂、ポリイミド樹脂等のいずれかを単独、変性
物又は混合物として用いることができる。また,必要に
応じて、上記樹脂に水酸化アルミニウム、クレー、タル
ク、シリカ、アルミナ、炭酸マグネシウム、炭酸カルシ
ウム、合成樹脂粉末又はガラス等の中空体等の充填材を
添加することもできる。
The thermosetting resin composition in which the fluorescent dye is dissolved is not particularly limited, and is a thermosetting resin composition used for manufacturing a laminate, for example, an unsaturated polyester resin, an epoxy resin, Any of a vinyl ester resin, a phenol resin, a polyimide resin and the like can be used alone, as a modified product, or as a mixture. If necessary, a filler such as a hollow body such as aluminum hydroxide, clay, talc, silica, alumina, magnesium carbonate, calcium carbonate, synthetic resin powder, or glass can be added to the above resin.

【0013】そして、この熱硬化性樹脂を溶解するため
に使用される溶媒としては、熱硬化性樹脂の種類により
様々なものが使用されるが、例えば、メチルエチルケト
ン、アセトン、トルエンなどがある。この溶媒は、製造
工程によっては使用しないものもある。
As the solvent used for dissolving the thermosetting resin, various solvents are used depending on the type of the thermosetting resin. Examples thereof include methyl ethyl ketone, acetone, and toluene. This solvent is not used depending on the production process.

【0014】上記蛍光染料と熱硬化性樹脂とを触媒に溶
解して得られたワニスを含浸する基材は、積層板を形成
する際に使用される基材であれば特に限定する必要はな
く、例えば、ガラス織布、ガラス不織布等が使用され
る。
The substrate to be impregnated with the varnish obtained by dissolving the fluorescent dye and the thermosetting resin in a catalyst is not particularly limited as long as it is a substrate used when forming a laminate. For example, a glass woven fabric, a glass nonwoven fabric, or the like is used.

【0015】上記金属箔としては、銅、アルミニウム、
鉄、ニッケル、亜鉛等の単独或いは合金の金属箔を用い
ることができる。
As the above metal foil, copper, aluminum,
Single or alloy metal foil of iron, nickel, zinc or the like can be used.

【0016】[0016]

【実施例】次に、本発明の実施例と比較例を説明する。Next, examples of the present invention and comparative examples will be described.

【0017】まずはじめに、下記の蛍光染料1、2を表
1に示す実施例1〜2、比較例1〜3に使用する配合比
に基づいてラジカル重合性化合物であるスチレンに配合
し、攪拌機に投入して溶解して蛍光組成物を製造する。
First, the following fluorescent dyes 1 and 2 were mixed with styrene, which is a radical polymerizable compound, based on the compounding ratio used in Examples 1 and 2 and Comparative Examples 1 to 3 shown in Table 1, and the mixture was stirred with a stirrer. It is added and dissolved to produce a fluorescent composition.

【0018】蛍光染料1 :1.3−(フェニル)−5
−(4−TERT−ブチル−フェニル)−ピラゾリン
:中央合成化学(株)社製ネオスーパーHR−101 最大吸収波長領域:355〜359nm 吸収波長領域:334〜380nm 蛍光染料2 :1−(フェニル)−3−(4−TERT
−ブチル−スチリル)−5−(4−TERT−ブチル−
フェニル)−ピラゾリン:中央合成化学(株)社製ネオ
スーパーHR−50 最大吸収波長領域:385〜389nm 吸収波長領域:364〜416nm つぎに、熱硬化性樹脂として不飽和ポリエステル(武田
薬品工業〔株〕製タケダポリマール6320F)を10
0重量部、触媒としてベンゾイルパーオキサイドを1重
量部、水酸化アルミニウムを20重量部、さらに、上記
で得られた蛍光組成物を加えてワニスとし、このワニス
ををガラス不織布(オリベスト社製、厚さ0.35m
m)に含浸した。
Fluorescent dye 1: 1.3- (phenyl) -5
-(4-TERT-butyl-phenyl) -pyrazoline
: Neo Super HR-101 manufactured by Chuo Gosei Kagaku Co., Ltd. Maximum absorption wavelength region: 355 to 359 nm Absorption wavelength region: 334 to 380 nm Fluorescent dye 2: 1- (phenyl) -3- (4-TERT)
-Butyl-styryl) -5- (4-TERT-butyl-
Phenyl) -pyrazolin: Neosuper HR-50 manufactured by Chuo Gosei Kagaku Co., Ltd. Maximum absorption wavelength region: 385 to 389 nm Absorption wavelength region: 364 to 416 nm Next, as a thermosetting resin, an unsaturated polyester (Takeda Pharmaceutical Co., Ltd. Takeda Polymer 6320F)
0 parts by weight, 1 part by weight of benzoyl peroxide as a catalyst, 20 parts by weight of aluminum hydroxide, and further, the fluorescent composition obtained above was added to form a varnish. 0.35m
m).

【0019】上記工程において、比較例4については、
不飽和ポリエステル(武田薬品工業〔株〕製タケダポリ
マール6320F)を100重量部、ベンゾイルパーオ
キサイドを1重量部、水酸化アルミニウムを20重量
部、蛍光染料1を熱硬化性樹脂に対して40重量%加
え、さらに、スチレンを添加してワニスを配合し、この
ワニスをガラス不織布(オリベスト社製、厚さ0.35
mm)に含浸してプリプレグを形成した。
In the above process, for Comparative Example 4,
100 parts by weight of unsaturated polyester (Takeda Polymer 6320F manufactured by Takeda Pharmaceutical Co., Ltd.), 1 part by weight of benzoyl peroxide, 20 parts by weight of aluminum hydroxide, and 40% by weight of fluorescent dye 1 based on thermosetting resin In addition, styrene is further added to mix a varnish, and this varnish is made of a glass nonwoven fabric (manufactured by Olivet, thickness 0.35).
mm) to form a prepreg.

【0020】上記で得られたそれぞれのプリプレグを、
電気用積層板銅箔(日本鉱業製、JTC、厚さ35μ
m)の処理面上に2枚積層し、さらに、その上に上記電
気用積層板銅箔を重ねた積層体を得た。
Each of the prepregs obtained above is
Copper foil for electrical laminate
m), a laminate was obtained by laminating two sheets on the treated surface and further laminating the above-mentioned copper foil for electric laminate on the laminate.

【0021】この積層体を硬化炉に連続して送り、硬化
炉内で100℃で15分間、次いで130℃で20分
間、加熱して、上記樹脂を加熱硬化して一体化すること
により、厚さ0.8mmの金属箔張積層板を得た。
The laminate is continuously sent to a curing furnace, and heated in a curing furnace at 100 ° C. for 15 minutes, and then at 130 ° C. for 20 minutes, and the resin is cured by heating and integrated to obtain a thickness. A metal foil-clad laminate having a thickness of 0.8 mm was obtained.

【0022】得られた金属箔張積層板について、以下の
試験方法により、光の透過性、耐熱性を評価した。その
結果を下記表1に示した。
The resulting metal foil-clad laminate was evaluated for light transmittance and heat resistance by the following test methods. The results are shown in Table 1 below.

【0023】光の透過性は、得られた金属箔張積層板を
エッチングして銅を除去し、銅が除去された基板の両面
にフォトレジスト(RSR−4000、太陽インキ
(株)製)を塗布して乾燥し、基板の表面に所定の回路
パターンが形成されたネガフィルムを面着して、紫外線
を照射した。そして、この基板を炭酸ナトリウム溶液に
て現像し、基板の裏面のレジストの残存の有無により光
の透過性を評価した。
For the light transmittance, the obtained metal foil-clad laminate is etched to remove copper, and a photoresist (RSR-4000, manufactured by Taiyo Ink Co., Ltd.) is applied to both sides of the substrate from which copper has been removed. The substrate was coated and dried, and a negative film having a predetermined circuit pattern formed thereon was applied to the surface of the substrate and irradiated with ultraviolet rays. Then, the substrate was developed with a sodium carbonate solution, and the light transmittance was evaluated based on the presence or absence of the resist on the back surface of the substrate.

【0024】また、耐熱性は、得られた金属箔張積層板
をエッチングして銅を除去し、銅が除去された基板をプ
レッシャークッカテスト(PCT:3atm、134
℃、90分処理)の後、260℃の半田槽に180秒間
浸漬した後の基板表面のフクレの有無により耐熱性を評
価した。
The heat resistance is measured by removing the copper by etching the obtained metal foil-clad laminate and subjecting the substrate from which the copper has been removed to a pressure cooker test (PCT: 3 atm, 134 atm).
(Treated at 90 ° C. for 90 minutes), and then dipped in a solder bath at 260 ° C. for 180 seconds to evaluate the heat resistance based on the presence or absence of blisters on the substrate surface.

【0025】[0025]

【表1】 [Table 1]

【0026】表1に示す如く、本発明の実施例1〜2に
おける金属箔張積層板は、蛍光染料を予めスチレン溶解
して、含浸用熱硬化性樹脂組成物を得るので、蛍光染料
が均一に分散されて、露光時に裏面のフォトレジストを
感光することなく、均一に光を遮断することができる。
また、この蛍光染料の配合量が、樹脂成分に対して、
0.03〜5.0重量%であるので、表面にフクレの発
生もなく耐熱性に優れることがわかる。
As shown in Table 1, the metal foil-clad laminates in Examples 1 and 2 of the present invention were prepared by dissolving a fluorescent dye in styrene in advance to obtain a thermosetting resin composition for impregnation. And can uniformly block light without exposing the photoresist on the back surface during exposure.
In addition, the amount of the fluorescent dye, based on the resin component,
Since it is 0.03 to 5.0% by weight, it can be seen that there is no blister on the surface and the heat resistance is excellent.

【0027】さらに、1種類の蛍光染料を溶解している
比較例2〜3に比べ、光の吸収波長領域の異なる2種類
の蛍光染料を溶解しているので、より効果的に光を遮断
することができることがわかる。
Furthermore, compared to Comparative Examples 2 and 3 in which one type of fluorescent dye is dissolved, two types of fluorescent dyes having different light absorption wavelength regions are dissolved, so that light is more effectively blocked. We can see that we can do it.

【0028】[0028]

【発明の効果】本発明に係る金属箔張積層板の製造方法
によると、紫外線を吸収する蛍光染料を予めラジカル重
合性化合物に溶解して蛍光組成物を形成した後、この蛍
光組成物を熱硬化性樹脂に溶解してワニスとし、このワ
ニスを基材に含浸したプリプレグを使用するので、この
プリプレグを使用して得られた金属箔張積層板は、蛍光
染料が均一に分散されて、均一に紫外線を吸収し、光の
遮蔽効果に優れ、露光時に裏面のフォトレジストを感光
することなく露光することができ、従来の積層板の性質
を損なうことなく、耐熱性にも優れている。
According to the method for manufacturing a metal foil-clad laminate according to the present invention, a fluorescent dye that absorbs ultraviolet light is dissolved in a radical polymerizable compound in advance to form a fluorescent composition, and then the fluorescent composition is heated. The varnish is dissolved in the curable resin to form a varnish, and the prepreg impregnated with the varnish is used.Therefore, the metal foil-clad laminate obtained using this prepreg has a uniform dispersion of the fluorescent dye and a uniform It absorbs ultraviolet light, has an excellent light blocking effect, can expose the backside photoresist during exposure without exposing it to light, and has excellent heat resistance without impairing the properties of conventional laminates.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI // B32B 27/04 B32B 27/04 Z 27/20 27/20 Z ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification code FI // B32B 27/04 B32B 27/04 Z 27/20 27/20 Z

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 熱硬化性樹脂を含有するワニスを基材に
含有した1枚以上のプリプレグの外側に金属箔を積層一
体化した金属箔張積層板の製造方法において、上記プリ
プレグとして、紫外線を吸収する蛍光染料を予めラジカ
ル重合性化合物に溶解して蛍光組成物とし、上記ラジカ
ル重合性化合物と相溶性を有する触媒に、上記蛍光組成
物と熱硬化性樹脂とを溶解してワニスとし、このワニス
を基材に含浸したプリプレグを使用することを特徴とす
る金属箔張積層板の製造方法。
1. A method for producing a metal foil-clad laminate in which a metal foil is laminated and integrated on one or more prepregs containing a varnish containing a thermosetting resin on a base material, wherein the prepreg is made of an ultraviolet ray. The fluorescent dye to be absorbed is dissolved in a radical polymerizable compound in advance to form a fluorescent composition, and a catalyst having compatibility with the radical polymerizable compound is dissolved in the fluorescent composition and a thermosetting resin to form a varnish. A method for producing a metal-foil-clad laminate, comprising using a prepreg obtained by impregnating a base material with a varnish.
【請求項2】 蛍光染料の配合量がワニスの熱硬化性樹
脂成分に対して、0.03〜5.0重量%であることを
特徴とする請求項1記載の金属箔張積層板の製造方法。
2. The metal foil clad laminate according to claim 1, wherein the amount of the fluorescent dye is 0.03 to 5.0% by weight based on the thermosetting resin component of the varnish. Method.
JP06233271A 1994-09-28 1994-09-28 Manufacturing method of metal foil clad laminate Expired - Fee Related JP3095636B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP06233271A JP3095636B2 (en) 1994-09-28 1994-09-28 Manufacturing method of metal foil clad laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06233271A JP3095636B2 (en) 1994-09-28 1994-09-28 Manufacturing method of metal foil clad laminate

Publications (2)

Publication Number Publication Date
JPH0890718A JPH0890718A (en) 1996-04-09
JP3095636B2 true JP3095636B2 (en) 2000-10-10

Family

ID=16952478

Family Applications (1)

Application Number Title Priority Date Filing Date
JP06233271A Expired - Fee Related JP3095636B2 (en) 1994-09-28 1994-09-28 Manufacturing method of metal foil clad laminate

Country Status (1)

Country Link
JP (1) JP3095636B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120230A (en) * 1992-10-06 1994-04-28 Rohm Co Ltd Formation of bump electrode in semiconductor component and semiconductor having bump electrode
US6158644A (en) 1998-04-30 2000-12-12 International Business Machines Corporation Method for enhancing fatigue life of ball grid arrays

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008146405A1 (en) * 2007-06-01 2010-08-19 株式会社日本化学工業所 Fluorescent material
JP5227283B2 (en) * 2009-09-30 2013-07-03 太陽ホールディングス株式会社 Resin composition and printed wiring board using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120230A (en) * 1992-10-06 1994-04-28 Rohm Co Ltd Formation of bump electrode in semiconductor component and semiconductor having bump electrode
US6158644A (en) 1998-04-30 2000-12-12 International Business Machines Corporation Method for enhancing fatigue life of ball grid arrays
US6283359B1 (en) 1998-04-30 2001-09-04 International Business Machines Corporation Method for enhancing fatigue life of ball grid arrays

Also Published As

Publication number Publication date
JPH0890718A (en) 1996-04-09

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