JP3099077B2 - Image sensor module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image sensor module used in a document reading section such as a facsimile, an image scanner, a copying machine, and an electronic blackboard.

[0002]

2. Description of the Related Art In recent years, a contact type image sensor capable of reading an original at an equal magnification has been used in an original reading unit such as a facsimile, instead of a CCD type image sensor requiring a reduction optical system. .

In general, as shown in FIG. 15, an image sensor has a sensor substrate 101 on which photoelectric conversion elements 100 are juxtaposed.
And a circuit board 104 on which a driving IC 102 and the like are mounted are used as an image sensor module 108 configured to be adhered to a frame 106. Almost all of the sensor board 101 and the circuit board 104 are made of a colorless and transparent resin 110.
The sensor substrate 101 and the circuit board 104 are physically and chemically protected. The image sensor module 108 is used by being attached to a predetermined position such as a facsimile, and reads an image on a document by forming an image on the sensor substrate 101 at a magnification of 1 by a rod lens array or the like.

[0004]

However, when manufacturing such an image sensor module 108, it is necessary to attach the sensor board 101 to a predetermined position on the circuit board 104, and it is extremely difficult to perform this alignment. Met. For this reason, there has been a problem that the imaging position is shifted and the performance is reduced. In addition, so-called “resin dripping” in which the coated resin 110 drips on the outer peripheral portion of the circuit board 104 or the frame 106, or so-called “sharpness” in which the coating thickness of the resin 110 is small and cuts off at the ridge line of the sensor substrate 101 occurs. Or something. Further, there is a problem that a lens effect is generated at the curved surface portion of the coated resin 110.

On the other hand, Japanese Patent Application Laid-Open No. Hei 2-268562 discloses an image sensor (corresponding to an image sensor module in the present application) which can easily align a sensor substrate. There is no description about the effects, sharpness, lens effect, etc., and it is considered that these problems have not been solved. In addition, it is difficult to form a stopper surface for aligning the sensor substrate in the longitudinal direction by molding or the like, which is not practical.

[0006] Japanese Patent Application Laid-Open No. 2-305172 discloses that
As shown in FIG. 16, an insulating substrate 116 (corresponding to a circuit board in the present application) having an elongated hole 114 is attached to a plastic film 112 and is positioned in the elongated hole 114. An image sensor 120 (corresponding to an image sensor module in the present application) configured by attaching a line sensor element 118 (corresponding to a sensor substrate in the present application) is disclosed. Such an image sensor 12
In the case of 0, since the resin 122 fills the elongated hole 114 and is coated on the line sensor element 118 and the insulating substrate 116, it is considered that the above-mentioned resin sagging, sharpness, lens effect, etc. do not occur. It was extremely difficult to align the element 118.

[0007] Therefore, the present inventors have conducted intensive studies in manufacturing an image sensor module so that the sensor substrate can be easily aligned and resin sagging, sharpness, and lens effect do not occur. As a result, the present invention has been achieved.

[0008]

The gist of the image sensor module according to the present invention is as follows. A sensor board on which a plurality of photoelectric conversion elements are arranged, a circuit board for operating the sensor board, In an image sensor module including a sensor substrate and a frame for supporting and fixing the circuit board, a projection is provided on the frame, and at least one side of the sensor substrate contacts the projection of the frame. Thus, the sensor board is provided, and the circuit board is provided so as to surround at least the other two sides of the sensor board.

[0009]

Further, in such an image sensor module, a resin is coated so as to cover at least the entire sensor substrate.

[0011]

According to this image sensor module, the sensor substrate is disposed so that at least one side thereof is in contact with the projecting portion of the frame, and is naturally positioned and fixed in a direction perpendicular to the side contacting the projecting portion. . This makes the alignment of the sensor substrate relatively easy. Further, a circuit board is provided so as to surround the other side of the sensor board, and the sensor board is surrounded by the projecting portion of the frame and the circuit board. As a result, even when the resin is coated so as to cover the entire sensor substrate, resin sagging, sharpness, lens effect, and the like hardly occur.

Further, when the engaging portion of the circuit board is engaged with a specific portion of the frame and the circuit board is positioned and fixed to the frame, the sensor board surrounded by the circuit board comes into contact with the projecting portion. In the direction along the set side, the position is naturally fixed. This makes the alignment of the sensor substrate complete and easy.

[0013]

Next, an embodiment of an image sensor module according to the present invention will be described in detail with reference to the drawings.

As shown in FIGS. 1 and 2, an image sensor module 10 according to the present invention includes a sensor board 14 on which a plurality of photoelectric conversion elements 12 are arranged, and a circuit board for operating the sensor board 14. And a frame 18 for supporting and fixing the sensor board 14 and the circuit board 16, and further coated with a resin 20 so as to cover the entire sensor board 14.

The sensor substrate 14 is made of amorphous silicon
a photoelectric conversion element 12 made of a thin film semiconductor such as a-Si or CdS-CdSe is formed one-dimensionally on a substrate such as glass;
Further, on this substrate, a block wiring (not shown) for applying a drive voltage to the photoelectric conversion element 12, a channel wiring (not shown) for leading a signal from the photoelectric conversion element 12, and the like are also formed. I have.

The frame 18 is formed by drawing aluminum or the like, and a protruding portion 22 having the same height as the thickness of the sensor substrate 14 is integrally formed on a long side thereof. The protruding portion 22 is for positioning and fixing the sensor substrate 14 in a direction perpendicular to the side (Y direction shown in FIG. 2) of the sensor substrate 14 by abutting one side of the sensor substrate 14 against the A surface of the protruding portion 22. is there.

Since the frame 18 is formed by a drawing process, as shown in FIG. 3, "R" 24 is formed at each corner along the drawing direction, and the protruding portion 22 rises. The inside corners are no exception. Therefore, a relief 26 is formed in the inner corner portion so that the sensor substrate 14 can be completely brought into contact with the surface A of the protrusion 22.

On the other hand, the circuit board 16 is formed by mounting a driving IC, a signal processing IC, and the like on a printed wiring board.
It is U-shaped so as to surround three sides of 4.
The length of the circuit board 16 in the longitudinal direction is the same as the length of the frame 18, so that the circuit board 16 itself fits on the frame 18. That is, the circuit board 16 not only serves to make the periphery of the sensor board 14 coplanar with the sensor board 14, but also causes the sensor board 14 to abut against the protruding portion 22 by abutting the sensor board 14 against the B surface of the circuit board 16. It also has a role of positioning and fixing the sensor substrate 14 in a direction along one side of the substrate 14 (X direction shown in FIG. 2). Here, the circuit board 16
End faces 27a, 27b of the frame 18
Since the circuit board 16 is positioned and fixed to the frame 18 by matching with the positions a and 28b, both end surfaces 28a and 28b of the frame 18 are specific portions serving as reference surfaces for positioning and fixing the circuit board 16; Both end surfaces 27a and 27b of the circuit board 16 constitute an engaging portion that engages with this specific portion.

Since the circuit board 16 is cut by punching or the like, normally, as shown in FIG. 4, "drip" 29 occurs at each corner when the circuit board 16 is extracted from the punching die. Therefore, the above-mentioned frame 18
As in the case of (1), a relief 30 is formed in the inside corner portion of the circuit board 16 so that the sensor board 14 can completely contact the surface B of the circuit board 16. The relief 30 is preferably formed at both corners. However, when the cutout portion of the circuit board 16 is formed slightly larger than the sensor board 14, at least the side where the sensor board 14 abuts. It is enough if it is formed.

The resin 20 is used to physically and chemically protect ICs and wirings on the sensor board 14 and the circuit board 16.
A colorless and transparent resin such as a silicone resin, an epoxy resin, or a urethane resin is used so that an image can be formed on the photoelectric conversion element 12 above.

Such an image sensor module 10
Then, one side of the sensor substrate 14 is
Since the sensor substrate 14 is disposed while being abutted on the second substrate 2, the sensor substrate 14 can be easily positioned and fixed in the Y direction. Further, the circuit board 16 is provided so as to surround the other three sides of the sensor board 14, and the both end faces 27 a and 27 b of the circuit board 16 are aligned with the both end faces 28 a and 28 b of the frame 18, so that the circuit board 16 is formed. By positioning the sensor substrate 14 on the frame 18 and then abutting the sensor substrate 14 against the surface B of the circuit substrate 16, the sensor substrate 14 can be easily positioned and fixed also in the X direction. As described above, since the alignment of the sensor substrate 14 can be completed completely and easily, the image sensor module 1
0 can be easily assembled. Here, although both end surfaces 27a and 27b of the circuit board 16 are aligned with both end surfaces 28a and 28b of the frame 18, the longitudinal dimension of the circuit board 16 and the longitudinal dimension of the frame 18 are different. In this case, one of the end faces may be aligned.

Further, even if the resin 20 is coated so as to cover the IC and the like on the sensor board 14 and the circuit board 16,
Since the sensor substrate 14 and its surroundings are flush with each other, resin sagging, sharpness, lens effect, and the like are unlikely to occur as in the related art. Therefore, it is possible to provide the image sensor module 10 with good reading accuracy and good appearance. Moreover, since the amount of the resin 20 is smaller than in the conventional case, the image sensor module 10 is inexpensive.

Further, in the case of such an image sensor module 10, since the frame 18 can be manufactured by drawing or the like, the cost is low and the practicability is excellent. Further, since the image sensor module 10 has a substantially rectangular parallelepiped shape as a whole, it is very easy to handle and can be easily attached to a facsimile or the like.

As described above, one embodiment of the image sensor module according to the present invention has been described in detail. However, the present invention is not limited to the above-described embodiment, but can be implemented in other modes.

For example, as shown in FIG.
The length of the protruding portion 34 provided on the circuit board 36 may be substantially the same as the length of the sensor substrate 14, and both ends of the circuit board 36 may be fitted on both sides of the protruding portion 34. In this case, after positioning and fixing the circuit board 36 with reference to one end face 38 of the protruding portion 34, the sensor board 1
4, and is positioned and fixed. Although the post-processing of the frame 32 is necessary, the positioning of the sensor substrate 14 is easier than the case where the end surface of the circuit board 16 is aligned with the end surface of the frame 18 as in the image sensor module 10 described above. . Here, the end surface 38 of the protruding portion 34 is a specific portion serving as a reference surface for positioning and fixing the circuit board 36, and the end portion 39 of the circuit board 36 forms an engaging portion that engages with this specific portion. ing.

As shown in FIG. 6, the circuit board 40 is L
It may be a letter shape. In this case, a lens effect may be generated near the short side of the sensor substrate 14 which is not surrounded by the circuit board 40. However, when the photoelectric conversion element 12 formed in the vicinity is a dummy element, For example, when a lead electrode such as a block wiring or a channel wiring is formed on the circuit board 40,
Is enough. That is, the circuit board may be provided so as to surround at least two sides of the sensor board.

As shown in FIG. 7, the projecting portion 44 of the frame 42 may be L-shaped. In this case, the circuit board 46 may have an L shape so as to surround the remaining two sides of the sensor board 14. In this example, the sensor substrate 14 can be positioned and fixed in both the X and Y directions by the L-shaped protrusion 44. Therefore,
The circuit board 46 only surrounds the sensor board 14 to prevent resin dripping and the like, but does not fix the sensor board 14 in position. As described above, a circuit board that does not have a role of positioning and fixing the sensor board may be used. At least a circuit board that has a role of surrounding the sensor board has a sufficient effect of preventing resin dripping or the like. Further, as in this example, the sensor substrate may be provided such that two sides of the sensor substrate are in contact with the projecting portions of the frame.

As shown in FIG. 8, a circuit board 48 which is slightly smaller than the outer periphery of the frame 18 may be used. As described above, if only one end surface of the circuit board 48 reaches one end surface of the frame 18, the positioning of the sensor substrate 14 is sufficiently possible.

Further, as shown in FIG. 9, a relief 50 depressed in a U-shape is formed on the projecting portion 54 of the frame 52, and the sensor substrate 14 is brought into contact with both ends of the projecting portion 54 so as to be positioned and fixed. It may be something that has been done. in this case,
If the depth of the relief 50 is minimized, the sensor substrate 1
Since it is equivalent to a state in which the periphery of 4 is almost completely surrounded, the lens effect and the like by the resin do not occur, and the same effect as that of the above-described embodiment can be obtained. In addition, even if the sensor substrate 14 has some burrs or the like, sufficient positioning by butting can be performed.

As shown in FIG. 10, a columnar locking projection 60 is provided on the frame 58, and a long hole 64 is opened at a predetermined position of the circuit board 62 corresponding to the locking projection 60. The circuit board 62 is positioned and fixed by engaging the long hole 64 with the stop projection 60.
4 may be configured to be fixed. In this case, the end face of the circuit board 62 does not have to reach the end face of the frame 58. Here, the locking projection 60 is a specific portion of the frame 58, and the elongated hole 64 of the circuit board 62 forms an engaging portion that engages with this specific portion. As is clear from this example, when the sensor board is positioned and fixed on the circuit board, any form can be used as long as the sensor board can be positioned and fixed by fixing the circuit board with reference to somewhere on the frame. good.

Further, as shown in FIG. 11, when image light is incident from the frame 66 side, the resin 68 for coating the sensor substrate 14 and the like may be opaque. Further, it is preferable that the height of the protrusion 70 and the thickness of the circuit board 16 be the same as the thickness of the sensor board 14. In this case, since the resin 68 becomes flat, the thickness of the image sensor module can be reduced.

As shown in FIG. 12, when image light is incident from the photoelectric conversion element 12 side, the height of the projection 74 provided on the frame 72 and the thickness of the circuit board 76 are larger than the thickness of the sensor board 14. The larger the size, the better. In this case, since the resin 78 becomes flatter, the lens effect is further reduced.

As shown in FIG. 13, utilizing the fact that the circuit board 16 has a U-shape, block wiring and channel wiring are taken out from the short side of the sensor board 14 so that unnecessary It is also possible to reduce unnecessary routing. In this case, the size of the image sensor module can be further reduced, and the cost can be further reduced.

Further, as shown in FIG.
And its surroundings are on the same plane, so if the shield tape 80 is attached, the noise is further reduced.

In addition, the protruding portion is not integral with the frame body, but may be provided with another member. In addition, the present invention can be carried out in various modified, modified, and modified forms based on the knowledge of those skilled in the art without departing from the gist of the present invention. .

[0036]

According to the image sensor module of the present invention, since the frame is provided with a projection, if the sensor substrate is disposed such that at least one side of the sensor substrate is in contact with the projection, the sensor substrate is provided. Can be relatively easily performed. In addition, the sensor board is arranged so that at least one side of the sensor board is in contact with the projecting portion of the frame, and the circuit board is arranged so as to surround at least two other sides of the sensor board. Even when the resin is coated so as to cover the entire sensor substrate, resin sagging, sharpness, lens effect, and the like hardly occur. In addition, the amount of resin is smaller than in the conventional case, and the cost can be further reduced.

Further, the circuit board is provided with an engaging portion for engaging with a specific portion of the frame so that the sensor board can be positioned and fixed in a direction along one side of the sensor board which is in contact with the projecting portion of the frame. Therefore, the alignment of the sensor substrate can be completed completely and easily.

As described above, the present invention has excellent effects such as easy assembling and manufacturing an image sensor module having good reading accuracy and good appearance.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of an image sensor module according to the present invention.

2 is a diagram of the image sensor module shown in FIG. 1, wherein FIG. 2 (a) is a plan view and FIG. 2 (b) is a cross-sectional side view taken along the line bb in FIG. 2 (a).

FIG. 3 is an enlarged side view showing a frame of the image sensor module shown in FIGS. 1 and 2;

FIG. 4 is an enlarged plan view showing a part of a circuit board of the image sensor module shown in FIGS. 1 and 2;

5A and 5B are diagrams showing another embodiment of the image sensor module according to the present invention, wherein FIG. 5A is a plan view and FIG.
It is a sectional side view in the bb line in the inside.

FIG. 6 is a plan view showing still another embodiment of the image sensor module according to the present invention.

FIG. 7 is a plan view showing still another embodiment of the image sensor module according to the present invention.

FIG. 8 is a plan view showing still another embodiment of the image sensor module according to the present invention.

FIG. 9 is a plan view showing still another embodiment of the image sensor module according to the present invention.

FIG. 10 is an exploded perspective view showing still another embodiment of the image sensor module according to the present invention.

FIG. 11 is a sectional side view showing still another embodiment of the image sensor module according to the present invention.

FIG. 12 is a sectional side view showing still another embodiment of the image sensor module according to the present invention.

FIG. 13 is a plan view showing a part of still another embodiment of the image sensor module according to the present invention.

FIG. 14 is a plan view showing a part of still another embodiment of the image sensor module according to the present invention.

FIG. 15 is a diagram showing an example of a conventional image sensor module. FIG. 15 (a) is a plan view, and FIG.
FIG. 3C is a cross-sectional front view taken along the line cc in FIG.

16A and 16B are diagrams showing another example of the conventional image sensor module. FIG. 16A is a plan view, and FIG.
The cross-sectional side view at the -b line, and FIG.
It is sectional front view in the line.

[Explanation of symbols]

 10, an image sensor module 12, a photoelectric conversion element 14, a sensor board 16, 36, 40, 46, 48, 62, 76; a circuit board 18, 32, 42, 52, 58, 66, 72; a frame 20, a resin 22, 34, 44, 54, 70, 74; projecting portions 27a, 27b, 39, 64; engaging portions 28a, 28b, 38, 60;

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H04N 1/028

Claims (2)

(57) [Claims] A sensor board on which a plurality of photoelectric conversion elements are juxtaposed; a circuit board for operating the sensor board;
An image sensor module comprising a frame for supporting and fixing the sensor board and the circuit board, wherein a protrusion is provided on the frame, and at least one side of the sensor board contacts the protrusion on the frame. An image sensor module, wherein the sensor substrate is disposed so as to be in contact with the sensor substrate, and the circuit substrate is disposed so as to surround at least the other two sides of the sensor substrate. 2. The image sensor module according to claim 1, wherein a resin is coated so as to cover at least the entire sensor substrate.