JP3102183B2 - Coating device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating apparatus used for applying an electrode material to an end face of a chip component to form an upper electrode and a lower electrode when producing chip components such as chip resistors. It is about.

[0002]

2. Description of the Related Art An example of a chip resistor among chip components will be described with reference to FIGS.

FIGS. 5A to 5F are manufacturing process diagrams for explaining the outline of a method of manufacturing a chip resistor. As shown in FIG. A slit is provided to obtain the resistor 24, and the ceramic substrate 20 is
And 20b, a resistor 20c, a protective glass 20d, and the like are formed by printing, baking, or the like.

[0004] Next, as shown in FIG.
1 is divided and removed, and as shown in FIG.
The connecting piece 22 is obtained by performing a primary division of dividing the ceramic substrate 20 on which 0a and 20b, the resistor 20c, the protective glass 20d, and the like are formed into strips.

[0005] Next, as shown in FIG.
A silver paste is applied to form end electrodes 23 on both end surfaces of the chip resistor 24, and the connecting piece 22 is divided into individual pieces as shown in FIG. obtain.

The finished product of the chip resistor 24 is as shown in FIG. 1F when viewed in a cross section in the secondary division direction. The upper electrode 20a is formed on the upper surface of the ceramic substrate 20, and the lower electrode 20b is formed on the lower surface. , A resistor 20c and a protective glass 20d are formed on the upper surface, and an end surface electrode 23 for connecting the upper surface electrode 20a and the lower surface electrode 20b is formed.

The chip resistor 24 manufactured as described above
Is the end face electrode 23 shown in FIG.
In order to form an electrode material, an application device for applying an electrode material to the end surface of the connection piece 22 of the chip resistor which is primarily divided into a strip shape is required. A conventional application device for applying this electrode material is described below. 4 will be described.

In FIG. 4, reference numeral 12 denotes an application roller, 9 denotes a squeegee, 11 denotes a pallet, 10 denotes a chip resistor which is primarily divided into strips, and 5 denotes a silver paste for forming an end electrode 23.

Next, the operation will be described. Application roller 12
The silver paste 5 is put between the squeegee 9 and the application roller 12 and the application roller 12 is rotated to form an application film having the same thickness as the gap between the application roller 12 and the squeegee 9 on the surface of the application roller 12. In this state, the pallet 11 on which the chip resistors 10 are arranged is moved under the application roller 12, and the silver paste 5 is applied to the end surfaces of the chip resistors 10.

Next, the chip resistor 10 is inverted with respect to the pallet 11 and transferred to another pallet, and the same operation as that described above is performed to apply the opposite end face of the chip resistor 10. .

[0011]

However, in the above-mentioned conventional configuration, since the gap between the pallet 11 and the coating roller 12 sandwiching the chip resistor 10 is constant, the coating is performed due to the variation in the height dimension of each chip resistor 10. The film thickness becomes uneven.

Further, the chip resistor 10 adheres to the application roller 12 at the time of coating, which causes a defect. Further, since the coating is performed while moving the pallet 11, the silver paste 5 is easily accumulated near the edge of the chip resistor 10, There is a problem that the thickness of the applied silver paste 5 becomes non-uniform.

An object of the present invention is to solve the above-mentioned conventional problems, and to provide an application apparatus capable of applying a silver paste having a uniform film thickness regardless of variations in individual height dimensions of chip resistors. It is the purpose.

[0014]

In order to solve this problem, a coating apparatus according to the present invention comprises a belt which is stretched via a roller and moves by the rotation of the roller, and a belt provided on a moving path of the belt. From the coating film forming section for applying the electrode material to the surface, and from the application section for transferring the electrode material applied to the surface of the belt to the chip component by contacting the chip component with the surface of the belt, which is also provided in the above-mentioned movement path. The configuration is as follows.

[0015]

With this structure, the chip resistor is pressed by its own weight onto a belt on which a silver paste for forming the end face electrode is formed to a constant film thickness, thereby irrespective of the variation of the height dimension of each chip resistor. A coating film having a uniform thickness can be formed on the chip resistor.

Further, since the coating can be performed with the belt stopped, a coating film having a uniform thickness can be formed on the chip resistor without the silver paste remaining near the edge of the chip resistor.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A coating apparatus according to an embodiment of the present invention will be described below with reference to the drawings. Note that components having the same configuration as the conventional example are denoted by the same reference numerals and will be described.

FIG. 1 is a front view showing an outline of a coating apparatus according to the present invention, in which 1 is a roller, 2 is a belt,
Reference numeral 3 denotes a backup of the belt 2, reference numeral 4 denotes a squeegee unit as a coating film forming unit, reference numeral 5 denotes a silver paste, reference numeral 6 denotes a coating unit as a coating unit, and reference numeral 10 denotes a chip resistor.

In the coating apparatus of the present invention thus configured, the squeegee unit 4 uniformly forms a film of the silver paste 5 on the outer periphery of the belt 2 guided by the roller 1, and in this state, applies the belt 2 to the coating unit. 6 and apply a chip resistor 10 held with its end face downward to the surface of the belt 2 by its own weight to form an end face electrode on the coating unit 6 to form a uniform silver on the end face of the chip resistor 10. It is formed by transferring a film of the paste 5.

FIG. 2 is a perspective view showing the configuration of the squeegee unit 4 shown in FIG. 1 in detail. In FIG. 2, reference numeral 2 denotes a belt, 5 denotes a silver paste, 7 denotes a squeegee backup, 8 denotes a block, and 9 denotes a block. It is a squeegee.

A squeegee 9 is held by a block 8, and the belt 2 is sandwiched between the block 8 and the squeegee backup 7, and the silver paste 5 is put between the belt 2 and the squeegee 9 to move the belt 2. A film of silver paste 5 having the same thickness as the gap of squeegee 9 can be formed.

FIG. 3 is a perspective view showing the structure of the coating unit 6 shown in FIG. 1 in detail. In FIG. 3, 2 is a belt, 3 is a backup of the belt 2, 10 is a chip resistor, and 13 is a holding pallet. It is.

In order to form an end face electrode on the holding pallet 13, a plurality of chip resistors 1 held with their end faces facing downward.
0 is pressed against the belt 2 on which the coating film is formed by the weight of the chip resistor 10. This allows individual chip resistors 10
Silver paste 5 having a uniform thickness can be formed on the end face of chip resistor 10 irrespective of the variation in the height dimension.

Further, since the coating can be performed while the belt 2 is stopped, the silver paste 5 having a uniform thickness is formed on the end face of the chip resistor 10 without the silver paste 5 remaining near the edge of the chip resistor 10. be able to.

[0025]

As described above, the coating apparatus according to the present invention is
An electrode material for forming an end surface electrode is applied to the surface of the belt by a coating film forming unit, and a plurality of chip components are pressed by its own weight onto the electrode material applied with a constant film thickness on the belt. by configuring the coating film of chip parts each independently uniform thickness variations in the height dimension Ji
It is possible to form the end face of the-up parts, no coating film accumulates it in the vicinity of the edge of the chip component <br/> by performing the coating operation in a state of stopping the belt, a coating film of uniform thickness An excellent coating apparatus that can be formed can be realized.

[Brief description of the drawings]

FIG. 1 is a front view showing an outline of a coating apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a coating film forming unit in the embodiment.

FIG. 3 is a perspective view showing a coating unit in the embodiment.

FIG. 4 is a perspective view showing a configuration of a conventional coating apparatus.

FIGS. 5A to 5F are manufacturing process diagrams for explaining a method of manufacturing a chip resistor; FIGS.

[Explanation of symbols]

 Reference Signs List 1 roller 2 belt 3 backup 4 squeegee unit 5 silver paste 6 application unit 7 squeegee backup 8 block 9 squeegee 10 chip resistor 13 holding pallet

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-1-214008 (JP, A) JP-A-5-21302 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01C 7 / 00,17 / 06

Claims (1)

(57) [Claims] A belt that is stretched via a roller and moves by the rotation of the roller; a coating film forming unit provided on a movement path of the belt and applying an electrode material to a surface of the belt; double on the surface of the provided belt
A coating device comprising a coating unit for transferring the electrode material coated on the surface of the belt to the chip components by bringing the end surfaces of the chip components into contact with the weight of the chip components.