JP3103199B2 - Image sensor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image sensor used for a facsimile, a printer, a copy, an optical character reader, and the like.

[0002]

2. Description of the Related Art FIG. 4 is a sectional view of a general contact type (simple contact type) image sensor. In this image sensor, a transparent cover (glass cover) is provided above the frame 40.
Lighting board 43 having light emitting element 42 attached thereto 41
Are fixed to the frame 40 at an angle to the surface of the glass cover 41. Further, a spherical plastic lens 44 is disposed immediately above the light emitting element 42, and a rod lens which is an optical system for condensing light reflected from a document (not shown) serving as an imaging target on the glass cover 41. An array 45 is fixed to the frame 40 perpendicular to the surface of the glass cover 41. Immediately below the rod lens array 45, a sensor substrate 47 having a light receiving element 46 for receiving light from the array 45 is disposed. The elastic piece 48 attached to the lighting board 43 allows the plastic lens 44
Is held, the rod lens array 45 is pressed against the frame 40, and the sensor board 47 is pressed against the lower portion of the frame 40 by the stoppers 49 engaged with the protrusions 40 a and 40 b provided on both side surfaces of the frame 40. ing.

In such an image sensor, light emitted from the light emitting element 42 is obliquely incident on the glass cover 41 through the plastic lens 44,
Irradiate the original on the top of the document. Light that is reflected perpendicularly to the glass cover 41 from the document is collected by the rod lens array 45, received by the light receiving element 46, and converted into an electric signal.

[0004]

By the way, not only the close-contact type but also the frame of the complete close-contact type image sensor are generally manufactured by forming aluminum into a predetermined shape by extrusion or die-casting. It is a target. However, when aluminum is used, the material cost (aluminum cost) increases, which hinders the cost reduction of the image sensor. In addition, the frame becomes relatively heavy, which is not suitable for reducing the weight of the image sensor.

[0005] On the other hand, in many of the reduced image sensors, the frame is made of resin. However, because of the use of insulating resin, the ground for noise removal is not taken directly from the frame like an aluminum frame, but from each part in the frame. Hang on. Therefore, an object of the present invention is to provide an image sensor that can be grounded directly from a frame in addition to realizing low cost and light weight.

[0006]

According to another aspect of the present invention, there is provided an image sensor according to the conventional image sensor, wherein a frame is made of resin, and the light receiving portion or the light receiving portion is formed on the resin frame. Base with parts
Place a plate, attach a reinforcing plate to the back of this board,
The board is supplemented by an elastic stopper that is detachably attached to the
It is characterized by being pressed and supported against the frame together with the hard plate . In general, resin is cheaper and lighter than aluminum. Therefore, by making the frame made of resin, the cost and weight of the image sensor can be reduced as compared with the case of aluminum. However, the resin has a slightly inferior tendency in terms of rigidity than aluminum, since the resin frame warp easily, a reinforcing plate on the back surface of the substrate disposed on the frame
Elastic clasp removably mounted on the frame
Presses and supports the board together with the reinforcing plate against the frame
By doing so, the problem of the warpage of the resin frame is solved, and the resin frame functions sufficiently as an image sensor, and the frame can be made of resin.

In order to prevent the frame from warping, it is important that the reinforcing plate itself has a small warpage. The reinforcing plate is made of a material having high rigidity (eg, aluminum) and is formed into a required shape by pressing or the like. Process. In order to process the resin into a frame having a predetermined shape, injection molding or the like may be used. In addition to the above configuration, by making the resin conductive, it is not necessary to ground the components in the frame, and the ground can be taken directly from the frame. As the conductive resin, polycarbonate, ABS, polyacetal,
Polypropylene is exemplified, and specifically, a conductive filler such as carbon or aluminum flake may be added to a resin as a raw material, kneaded, and injection-molded.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an image sensor according to the present invention will be described based on embodiments. FIG. 1 is a sectional view of an image sensor according to one embodiment. In this image sensor, frame 1
A transparent cover (glass cover) 11 is attached to an upper portion of the frame 10. Frame 1
Inside 0, a lighting board 13 having a light emitting element (eg, an LED chip) 12 is fixed to the frame 10 at an angle to the surface of the glass cover 11. A rod lens array (optical system) 14 for condensing reflected light from a document (not shown) as an object to be imaged abutting on the glass cover 11
Is perpendicular to the surface of the glass cover 11.
It is fixed to. Directly below the rod lens array 14, a sensor substrate 16 having a light receiving element 15 for receiving light from the array 14 is arranged. These glass cover 11, lighting substrate 13, rod lens array 14
Is screwed or fixed with a screw or an adhesive.

A reinforcing plate 17 is mounted on the back surface of the sensor substrate 16, and the sensor substrate 16 with the reinforcing plate 17 is attached to the frame 1 by an elastic stopper 19 made of, for example, stainless steel.
0 is pressed and supported at the lower part. The catch 19 can be attached to and detached from the frame 10 by engaging and disengaging projections 10 a and 10 b provided on both side surfaces of the frame 10. The action of the reinforcing plate 17 and the stopper 19 causes the resin frame 1
The zero warpage is always corrected. The connector 18 is soldered to the back side of the sensor board 16.
In this embodiment, as shown in one side view of FIG. 3A and the bottom view of FIG. 3B, the stopper 19 is provided at only two locations on both ends of the image sensor. Of course, the number of the stoppers 19 is not limited to two, and an appropriate number may be used according to the entire length of the image sensor.

In FIG. 3, the reinforcing plate 17 is not attached over the entire length of the sensor board 16, but is connected to the connecting portion 16a with the hybrid board portion 30 on which electronic components and the like are mounted and the connector 18 is provided. In such a case, the reinforcing plate 17 does not exist to secure those spaces. Furthermore,
As shown in FIG. 3A, since the frame 10 is made of a conductive resin, a screw hole 10c for directly taking ground from the frame 10 is formed on a side surface of the frame 10.
A ground wire extending from the electronic device such as a facsimile or a copy is fixed to the screw hole 10c with a screw, and the image sensor is grounded.

In this image sensor, the light emitted from the light emitting element 12 is obliquely incident on the original on the glass cover 11, and the reflected light from the original is collected by the rod lens array 14 and received by the light receiving element 15. And converted into an electrical signal. FIG. 2 is a sectional view of an image sensor according to another embodiment. In this image sensor, the light emitting element 22 and the light receiving element 25 are mounted on the same substrate (sensor / illumination integrated substrate) 26, and the rod lens array 24 is disposed obliquely with respect to the glass cover 21 in FIG. The configuration is almost the same as that of the embodiment. The reinforcing plate 27 is a sensor / lighting integrated substrate 26
The projections 20 on both sides of the frame 20
The board 26 with the reinforcing plate 27 is securely fixed to the lower portion of the frame 20 by the elastic stoppers 29 engaged with a and 20b. In the case of the embodiment of FIG. 2, not only is the warp of the resin frame 20 prevented, but also the reinforcing plate 27 is made of aluminum, so that the reinforcing plate 27 dissipates heat from the light emitting element 22. Also works as

[0012]

As described above, in the image sensor of the present invention, the frame is made of resin, and the light receiving portion or the substrate provided with the light receiving portion and the light emitting portion is arranged on the resin frame.
Then, attach a reinforcing plate to the back of this board and attach it to the frame.
The board is shared with the stiffener by a resilient clasp
As a result, the following effects are exhibited. (1) By the action of the reinforcing plate and the elastic stopper, the resin
The camber is effectively and constantly corrected. ( 2 ) Since the frame is made of resin, the price and weight of the image sensor can be reduced as compared with the case where the frame is made of aluminum. ( 3 ) By making the resin conductive, grounding for noise removal can be taken directly from the frame, and no troublesome grounding work is required as in the case where the frame is made of aluminum. ( 4 ) Since the frame is made of resin, it can be easily formed into a predetermined shape, and the dimensional accuracy is improved.

[Brief description of the drawings]

FIG. 1 is a sectional view of an image sensor according to an embodiment of the present invention.

FIG. 2 is a sectional view of an image sensor according to another embodiment of the present invention.

FIG. 3 is a side view and a bottom view of one side of the image sensor shown in FIG. 1;

FIG. 4 is a cross-sectional view of an image sensor according to a conventional example.

[Explanation of symbols]

 10, 20 Conductive resin frame 11, 21 Glass cover (transparent cover) 12, 22 Light emitting element 14, 24 Rod lens array (optical system) 15, 25 Light receiving element 17, 27 Reinforcement plate 19, 29 Elastic stopper

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H04N 1/024-1/036 H04N 1/04-1/207

Claims (1)

(57) [Claims] 1. A frame is provided with a transparent cover for contacting an object to be imaged, and a light emitting unit for irradiating light to the object to be imaged in the frame and for condensing reflected light from the object to be imaged. An image sensor comprising: an optical system; and a light receiving unit for receiving light from the optical system, wherein the frame is made of a resin, and
Arrange the light receiving part or the substrate on which the light receiving part and the light emitting part are provided.
Then, attach a reinforcing plate to the back of this board and attach it to the frame.
The board is shared with the stiffener by a resilient clasp
An image sensor characterized by being pressed and supported against a frame .