JP3107324B2 - Ultrasonic inspection equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic inspection apparatus, and more particularly to an ultrasonic inspection apparatus suitable for sequentially and efficiently inspecting a plurality of inspection objects such as electronic parts and material parts.

[0002]

2. Description of the Related Art Conventionally, in order to check the soundness of electronic parts and material parts, such as ICs, ceramic materials, organic materials and composite materials, which are produced in plurals, inspection is performed by a nondestructive inspection technique such as ultrasonic waves. Often do. In the inspection of voids and peeling defects inside the IC by, for example, an ultrasonic inspection method, a sampling inspection of a product is performed.

[0003] An ultrasonic probe is used as an object to be inspected.
Conventional techniques for inspecting C include, for example, Japanese Unexamined Patent Publication No. 1-10992.
There is a technique described in Japanese Patent Publication No. 58-58. In this prior art, X
The ultrasonic probe attached to the YZ scanner is put in water, and the IC is placed in the water below. At this time, the adjustment is performed so that the plane in the XY directions of the ultrasonic probe and the inspection surface of the IC are parallel. Next, by adjusting the distance between the ultrasonic probe and the IC, the focal point of the ultrasonic focused beam emitted from the ultrasonic probe is adjusted to the position of the inspection surface inside the IC.
In this state, transmission and reception of ultrasonic waves are performed while mechanically scanning the ultrasonic probe in the X and Y directions, and information such as the amplitude and phase of reflected waves at each position on the inspection surface is detected and recorded. A two-dimensional distribution image of the information is formed. Next, the presence or absence of a defect, the size of the defect or the area ratio of the defect are calculated from the formed image, and the IC is determined based on the determination reference value.
Is determined.

[0004]

However, the prior art described above has a problem that the inspection efficiency is poor because the inspection objects are individually taken out. For this reason, it is inevitable that a sampling inspection is performed in which several pieces are taken out from a large number of test objects.

[0005] In the prior art, since the test object is placed in water for the test, the test object is formed of a porous material or a composite material, so that the test object is separated between the materials. When there is a state defect, there is a problem that moisture infiltrates into the inspected object and remarkably lowers the reliability of the inspected object. In particular, when the object to be inspected is, for example, an IC, when moisture permeates and the moisture resistance deteriorates, corrosion of electrode wiring and chip pad portions, inter-pin leak failure,
Characteristic degradation or the like occurs, and the life of the IC is shortened. Also, I
Even if there is no defect in C, by immersing the IC in water, residual moisture around the lead of the IC and oxidation due to residual moisture in a minute gap smaller than the detection limit of the ultrasonic inspection, etc. This is a factor that shortens the life of the IC.

An object of the present invention is to provide an ultrasonic inspection apparatus capable of continuously and efficiently inspecting a plurality of inspected objects.

Another object of the present invention is to provide an ultrasonic inspection apparatus suitable for inspecting an object to be inspected whose performance deteriorates due to penetration of moisture.

Another object of the present invention is to provide an ultrasonic inspection apparatus capable of obtaining accurate and stable inspection information.

[0009]

SUMMARY OF THE INVENTION The object is to provide a rail or rail.
Means that the object to be inspected is continuously transferred to the inspection position by the conveyor, and that the object to be inspected continuously transferred by the transfer means comes to the inspection position facing the ultrasonic probe.
Device under test across the acoustic coupling can ultrasonic feeler
Positioning means for performing three-dimensional positioning relative to the child ,
Ultrasonic of the ultrasonic probe with respect to the surface of the object to be inspected
Parallel adjusting means for adjusting the wave emitting surface in parallel .

[0010] The object of the present invention is to provide the positioning means at least in a vertical direction and a transfer direction of the test object in a horizontal plane with an acoustic coupling between the test object and the ultrasonic probe at the test position. While configured to be relatively positionable, using an array probe for the ultrasonic probe, a direction orthogonal to the transport direction of the test object in a horizontal plane,
The scanning in at least one of the parallel direction and the oblique direction is electronically switched by electronically switching the driving elements of the array probe, and is placed in a liquid tank as the acoustic coupling. This is also achieved by using a liquid that has been used.

[0011] Also, even when the liquid is used as an acoustic coupling, the liquid level is set at a predetermined position with respect to the vertical position of the test object at the test position. In addition, a foreign matter remover is provided on the inlet side of the test object in the liquid tank, and a liquid drop remover for removing liquid droplets attached to the test object is provided on the outlet side. This is achieved by providing a liquid-proof means for performing a liquid-proof treatment on a portion of the test object that requires liquid-proof on the inlet side of the test object in the liquid tank.

Another object of the present invention is to use an elastic body as the acoustic coupling and to form the elastic body by laminating a plurality of elastic pieces having different sound speeds from each other. Is achieved.

Still another object is achieved by providing the acoustic coupling with a temperature adjusting means for maintaining the acoustic coupling at a constant temperature.

[0014]

According to the present invention, a transfer means for continuously transferring an object to be inspected to an inspection position of the object to be inspected, and an acoustic coupling between the object to be inspected and the ultrasonic probe at the inspection position, Positioning means for relatively positioning in three-dimensional directions. Therefore, the plurality of inspection objects are continuously transferred to the inspection position by the transfer means. The positioning means relatively positions the inspection object transferred by the transfer means and the ultrasonic probe at the inspection position in the three-dimensional direction. The ultrasonic probe transmits and receives ultrasonic waves through an acoustic coupling to an inspection surface of the inspection object at an inspection position of the inspection object, and an amplitude of a reflected wave from the inspection surface of the inspection object, The information such as the phase is transmitted to the information processing department. As described above, in the present invention, the inspection object is continuously sent to the inspection position, and the inspection surface of the inspection object and the ultrasonic probe are automatically aligned to perform the inspection. Inspection by sound waves can be performed efficiently. Therefore,
Even if a large number of test objects are produced, such as electronic components and material components, it is possible to perform ultrasonic inspection on all of them.

According to the present invention, the positioning means can position the test object and the ultrasonic probe at the test position relative to at least a vertical direction and a transfer direction of the test object in a horizontal plane. Make up. On the other hand, an array probe is used as the ultrasonic probe, and scanning in at least one of a direction orthogonal to a transport direction of the test object in a horizontal plane, a parallel direction, and an oblique direction is performed by the array probe. Electronic scanning is performed by electronically switching the child drive elements.
Thereby, the relative positioning time between the object to be inspected and the array probe at the detection position can be significantly reduced, and the inspection efficiency can be further improved.

Further, in the present invention, a liquid such as water contained in a liquid tank is used as the acoustic coupling. Therefore, a liquid generally used for the acoustic coupling is used for inspection. The efficiency can be improved.

In the present invention, the liquid tank is provided with liquid level adjusting means. Then, the liquid level adjusting means adjusts the liquid level to a predetermined position with respect to the vertical position of the test object at the inspection position. This allows
The ultrasonic probe is placed in the liquid, and only the part that does not interfere with the liquid to be inspected can be immersed in the liquid above the liquid, so that the liquid adheres to the object to be inspected. And troubles caused by permeation or permeation can be prevented.

Further, in the present invention, a foreign matter removing tool is used to wipe off and remove air bubbles and other foreign matter adhering to the object to be inspected at the inlet side of the object to be inspected in the liquid tank. The influence on the image information due to foreign matter such as the above can be extremely reduced, and accurate image information can be obtained. In addition, at the outlet side of the test object in the liquid tank, the droplet, which is an acoustic coupling, attached to the test object is removed by a liquid drop remover, so that the liquid component adheres to the test object. It is possible to eliminate troubles such as performance degradation of the test object due to the remaining or remaining.

In the present invention, a liquid-proof means is provided on the liquid tank at the entrance side of the object to be inspected, and the liquid-proof means performs liquid-proof treatment on a portion of the object to be inspected which requires liquid-proof. Like that. As a result, it is possible to eliminate troubles such as performance degradation of the test object caused by the liquid component adhering or remaining on the test object.

Further, in the present invention, an elastic body is used as the acoustic coupling. This makes it possible to eliminate all troubles such as performance degradation due to the liquid content of the test object by applying the present invention to the test object which dislikes the liquid content at all among the electronic components and the like.

Further, in the present invention, the elastic body is constituted by laminating a plurality of elastic body pieces having different sound velocities from each other, and the elastic body is pressed against an object to be inspected for inspection. As described above, as the acoustic coupling, a laminated body in which elastic pieces having different sound velocities are laminated is used, and as a result, the ultrasonic radiation surface of the array probe can have an ultrasonic focusing effect, More accurate inspection information can be obtained.

In the present invention, the acoustic coupling is provided with a temperature adjusting means, and the temperature adjusting means keeps the acoustic coupling at a constant temperature. As a result, it is possible to reduce variation in the flaw detection sensitivity due to a change in the sound speed or attenuation of the ultrasonic wave due to a change in the temperature of the acoustic coupling, and to obtain accurate information.

[0023]

Embodiments of the present invention will be described below with reference to the drawings.

<First Embodiment> FIGS. 1 to 6 show a first embodiment of the present invention. FIG. 1 is a side view of an ultrasonic inspection apparatus for an IC as an object to be inspected. 2 is a side view of an attitude control unit of the array probe when an array probe is used as an ultrasonic probe, FIG. 3 is a front view of the attitude control unit, and FIG. 4 is a liquid as an acoustic coupling. FIG. 5 is an explanatory view showing an example of a contact state between the liquid level and the IC when the liquid surface is used. FIG. 5 is an explanatory view showing another example of a contact state between the liquid level and the IC.
Is a flowchart in this embodiment.

In the first embodiment shown in these figures, FIG.
As shown in FIG. 1, an array probe 1 which is an ultrasonic probe,
Transfer means for the IC 27 to be inspected, positioning means for the IC 27, a liquid tank 15 containing a liquid 16 as an acoustic coupling, a liquid level adjusting means for adjusting the liquid level 17 of the liquid 16, and a liquid tank 15, a foreign matter removing unit 21, a droplet removing tool 22, and a drying device 23, an electronic scanning ultrasonic transmitting and receiving unit 24, an imaging device 25, and an IC 27.
And a pass / fail determination unit 26.

As shown in FIG. 1, the array probe 1 is provided with an acoustic lens 2 and an attitude control unit 3. The array probe 1 has an IC through an acoustic lens 2
An ultrasonic focused beam 7 is emitted to the inspection surface 27, and I
The reflected wave from the inspection surface of C27 is taken in.

As shown in FIGS. 2 and 3, the attitude control unit 3 includes a spherical bearing 4, a pair of two tilt adjusting mechanisms 5,
6. Then, the attitude control unit 3 operates the tilt adjusting mechanisms 5 and 6 to tilt the array probe 1 via the spherical bearing 4, and the ultrasonic radiation surface of the array probe 1 (the surface of the acoustic lens 2). , IC27 with respect to the inspection surface and the degree of parallelism can be adjusted.

As shown in FIG. 1, the transfer means of the IC 27 is a rail 8, a plurality of rollers 9 arranged to be rollable in the rail 8, and is vertically provided on the shaft of the roller 9. An arm 10, a chain 11 supported by the arm 10 and arranged to run in one direction below the rail 8, and an IC connected to a link of the chain 11.
The holder 12 is provided. The rail 8
Is formed in an inverted trapezoidal shape at an inspection position above the array probe 1, and when the IC 27 held by the IC holder 12 passes through an area formed in the downward shape. And the ultrasonic probe of the array probe 1.

As shown in FIG. 1, the positioning means of the IC 27 includes a pair of two IC pressing jigs 13 arranged in a region of the rail 8 formed in a descending shape, and an upper side of the liquid tank 15. And a positioning rail 14 fixed to the positioning rail. In the positioning means of the IC 27, when the IC 27 held by the IC holder 12 approaches the inspection position, the upper surface of the IC pressing jig 13 is pressed, and the lower surface 31 of the IC 27 is pressed against the positioning rail 14, and the array probe IC2 for one ultrasonic radiation surface
7 in the vertical direction Z-Z and the transfer direction Y-Y.

In this embodiment, the scanning of the ultrasonic wave in the direction XX orthogonal to the transfer direction YY of the IC 27 is performed as follows.
This is performed by electronically switching the driving elements of the array probe 1.

As shown in FIG. 1, the liquid tank 15 contains a liquid (water) 16 as an acoustic coupling. In this liquid 16, the ultrasonic transmitting and receiving portion of the array probe 1 and the acoustic lens 2 are placed. A seal 18 is provided between the bottom plate of the liquid tank 15 and the outer peripheral surface of the array probe 1.

The liquid level adjusting means is, as shown in FIG.
It is provided with a liquid level sensor 19 and a liquid level adjuster 20. In this liquid level adjusting means, the liquid 16 is supplied into the liquid tank 15 or the liquid 16 in the liquid tank 15 is discharged by the liquid level adjuster 20 based on the liquid level information detected by the liquid level sensor 19. The liquid level 17 in the liquid tank 15 is maintained at a predetermined level.

As shown in FIG. 1, the foreign matter removing tool 21 is provided on the entry side of the IC 27 in the liquid tank 15, and wipes foreign matter such as air bubbles adhered to the lower surface 31 of the IC 27 and its surroundings. And remove it.

As shown in FIG. 1, the liquid drop remover 22 is provided at the outlet of the IC 27 in the liquid tank 15, and wipes and removes the liquid drops attached to the IC 27.

The drying device 23 is, as shown in FIG.
It is provided outside the liquid tank 15 on the exit side of the IC 27, and blows warm air toward the IC 27 to dry it.

The electronic scanning ultrasonic transmission / reception section 24 uses the electronic scanning of the ultrasonic focused beam 7 and the mechanical scanning by the transfer means of the IC 27 in combination to apply the ultrasonic focused beam 7 to the entire inspection surface of the IC 27. It is configured to radiate accurately, take in the reflected wave of the ultrasonic wave from the inspection surface of the IC 27, and output the intensity of the reflected wave to the imaging device 25.

The imaging device 25 receives a received signal of a reflected wave from the electronic scanning ultrasonic transmission / reception unit 24, and applies an amplitude intensity to a reflected wave within a preset time range in the received signal. The voltage is converted to a voltage corresponding to the following, the voltage is measured, recorded in a memory, an image of a planar intensity distribution of the reflected wave intensity on the inspection surface of the IC 27 is created, and displayed on a CRT. It is configured to output image information to the pass / fail determination unit 26.

The pass / fail judgment unit 26 is provided with the imaging device 2
The image information of the reflected wave intensity input from step 5 is processed to calculate the area ratio of a portion recognized as abnormal, and the calculated area ratio is compared with a determination reference value. When the value exceeds the determination reference value, the IC 27 is determined to be defective. When it is determined that the IC 27 to be inspected is defective, the output is output to a defective IC selection unit (not shown).

The defective IC selection section picks up or marks the defective IC and performs selection.

The ultrasonic inspection apparatus of the first embodiment operates and operates as follows.

First, in this embodiment, a liquid 16 is contained in a liquid tank 15 as an acoustic coupling. In this liquid 16, the ultrasonic transmitting and receiving portion of the array probe 1 and the acoustic lens 2 are placed.

Therefore, in step 101 shown in FIG.
The IC 27 is continuously transferred to the inspection position. The transfer of the IC 27 is performed along the rail 8 via the chain 11, the arm 10 and the roller 9 while holding the IC 27 by the IC holder 12 in the transfer means. On the way to the inspection position, the lower surface 3 of the IC 27 is
Wipe around 1 to remove air bubbles and other foreign matter.

Next, in step 102 shown in FIG.
Before C27 enters the liquid surface 17 in the liquid tank 15, the liquid tank 1
The liquid level in 5 is adjusted. In this liquid level adjustment, the position of the liquid level 17 in the liquid tank 15 is detected by the liquid level sensor 19 constituting the liquid level adjusting means, and the detection result is compared with a reference value. Is exceeded, the liquid 16 in the liquid tank 15 is discharged from the liquid level controller 20, and when the inspection result is equal to or less than the reference value, the liquid 16 is supplied into the liquid tank 15 through the liquid level controller 20. Do it. In this embodiment, the reference value of the liquid level is, as shown in FIG.
The liquid 16 is set at a position where the lower surface 31 of the C27 is not immersed and the liquid 16 does not seep or adhere to the lead 30 from a joint boundary surface between the mold resin material 29 and the chip 28 inside. As shown in FIG. 5, the liquid 16 may overflow, and the lower surface 31 of the IC 27 may be brought into close contact with the liquid surface 17 by the surface tension of the liquid 16.

Next, in step 103 shown in FIG.
The IC 27 is positioned at the inspection position.

The positioning of the IC 27 at the inspection position is as follows.
A pair of two IC pressing jigs 13 provided at a position corresponding to the inspection position on the rail 8 of the transfer means of the IC 27
Pushes the upper surface of the IC holder 12 with the lower surface 3 of the IC 27.
1 is pressed against the positioning rail 14, thereby positioning the IC 27 in the vertical direction ZZ and the transfer direction YY of the IC 27. By electronically switching the driving elements of the array probe 1, the transfer of the IC 27 is performed. The scanning in the direction XX orthogonal to the direction can be performed.

Subsequently, in step 104 shown in FIG.
The attitude of the array probe 1 is controlled so that the ultrasonic focused beam 7 is properly emitted to the chip surface, which is the inspection surface of the IC 27, and the reflected ultrasonic wave is captured. By the way, I
In this embodiment for inspecting whether or not the interface between the mold resin material 29 of C27 and the chip 28 inside is good, the IC 27
Moves along the rail 8 and the tip of the beam approaches the ultrasonic focused beam 7 radiated from the array probe 1, the array probe 1 causes the lower surface 31 of the IC 27 as shown in FIG. , The reflected waves a and b from the receiver are received. This reflected wave a,
b is a reflected wave by the ultrasonic focused beam 7 at the right end and the left end of the electronic scanning range W set so as to sufficiently cover the width of the chip 28. Due to the reflected waves a and b, the lower surface 31 of the IC 27 with respect to the ultrasonic emission surface of the array probe 1
Check the parallelism and distance of.

First, the parallelism is checked by operating one or both of the tilt adjusting mechanisms 5 and 6 of the array probe 1 so that the time difference between the reflected waves a and b becomes 0 (zero). For example, the time from the transmission of the ultrasonic focused beam 7 to the reception of the reflected wave a is 15.56 μs, and the time from the transmission of the ultrasonic focused beam 7 to the reception of the reflected wave b. If it is 15.29 μs, the difference is 0.27 μs, and the distance difference is about 0.2 mm when the sound speed in the liquid is 1500 m / s. Therefore, the tilt adjusting mechanism 5 or 6 of the array probe 1 is set to 0.2 mm (the fulcrum is the tilt adjusting mechanism 5, 5 in FIG. 3).
By moving vertically up and down by 0.1 mm), the distance between them becomes equal, and the ultrasonic radiation surface of the array probe 1 and the lower surface 31 of the IC 27 become parallel.

Next, in checking the distance, it is confirmed whether or not the focus of the ultrasonic focused beam 7 is on the chip surface which is the inspection surface of the IC 27. Ultrasonic waves are refracted when passing obliquely through boundaries of media having different sound speeds. In this embodiment, the speed of sound is 2500 m from a liquid having a sound speed of 1500 m / s.
/ S, since the focused ultrasonic beam 7 propagates to the mold resin material 29 of the IC 27 of IC / s, the focal length in the mold resin material 29 is equivalent to the sound speed ratio (1500/2500 = 1.67).
Be shortened. For example, assuming that the focal length F of the ultrasonic focused beam 7 in the liquid is 15 mm, in order to focus on a depth of 2 mm from the lower surface 31 of the IC 27 to the chip surface, which is the inspection surface, a distance of 2 mm in the liquid is required. 3.34 which is .67 times
It is necessary to reduce the distance between them by mm. The distance in the liquid at this time is 15-3.34 = 11.66 mm, and the time from when the ultrasonic focused beam 7 is transmitted to when the reflected wave from the lower surface 31 of the IC 27 is received is 11.6.
It can be seen that 6 × 2/1500 = 15.54 μs. Therefore, the entire array probe 1 is moved up and down to
If the reflected wave from the lower surface 31 of C27 is received at a position of 15.54 μs, the focal point of the ultrasonic focused beam 7 matches the chip surface which is the inspection surface.

Next, in step 105 shown in FIG.
An ultrasonic wave is transmitted / received to / from the inspection surface of the IC 27. For transmission and reception of the ultrasonic wave, the array probe 1 is controlled by the electronic scanning transmission / reception unit 24, and the array probe 1 transmits the acoustic lens 2 and the liquid 16 which is an acoustic coupling to the IC 27.
The ultrasonic focused beam 7 is radiated to the inspection surface, and the entire inspection surface of the IC 27 is scanned by the ultrasonic focused beam 7, and the reflected wave from the inspection surface of the IC 27 is captured by the array probe 1.

Next, in step 106 shown in FIG.
Record and display the intensity distribution of the reflected wave from the inspection surface of C27. The recording and display of the intensity distribution of the reflected wave are performed by the imaging device 25 by converting the reflected wave within a predetermined time range of the received signal into a voltage corresponding to the amplitude intensity, and measuring this voltage. , And an image of a planar intensity distribution of the reflected wave intensity on the inspection surface of the IC 27 is created and displayed on the CRT.

Next, in step 107 shown in FIG.
The pass / fail determination unit 26 processes the image information of the intensity distribution of the reflected wave, calculates the area ratio of a part recognized as abnormal, and compares the calculated area ratio with a determination reference value. As a result of the comparison, when the area ratio of the portion recognized as abnormal exceeds the determination reference value, the IC 27 to be inspected is determined to be defective and output to the defective IC sorting unit.

Subsequently, in step 108 shown in FIG.
The IC 27 to be inspected is moved from the inspection position to a subsequent process. During the movement of the IC 27, the droplets adhering to the lower surface 31 of the IC 27 are removed by the droplet removing tool 22 shown in FIG. 1, and then the drying is performed by the drying device 23. Deterioration is prevented beforehand.

As described above, in the first embodiment, the IC 27 is continuously sent to the inspection position by the transfer means.
Since the ultrasonic inspection is performed by positioning in the three-dimensional direction at the inspection position, the inspection efficiency can be improved.

Further, the IC 27 is moved vertically with respect to the array probe 1 by a mechanical positioning means at the inspection position.
Z and the transfer direction Y-Y of the IC 27 are determined,
By electrically switching the drive elements of the array probe 1, scanning in the direction XX orthogonal to the transfer means of the IC 27 is enabled, and ultrasonic waves are scanned.
In both X and Y directions, 1/30 of the mechanical scanning technology
Can be faster.

Further, before the inspection, the foreign matter such as bubbles is removed by wiping the IC 27 with the foreign matter remover 21, so that the influence of foreign matters such as bubbles on image information is extremely reduced, and an accurate image is obtained. Information can be obtained.

Moreover, even when the liquid 16 commonly used as an acoustic coupling is used, the liquid level is properly adjusted by the liquid level sensor 19 and the liquid level adjuster 20 which constitute the liquid level adjusting means. Therefore, for example, it is possible to prevent a problem that the adhesive adheres to the seam of the mold resin material 29 of the IC 27 or the boundary between the mold resin material 29 and the lead 30 and soaks into the inside. The liquid adhered to the IC 27 is wiped off by the removing tool 22,
Next, since the drying is performed by the drying device 23, it is possible to prevent the performance of the IC 27 from deteriorating due to the adhesion and remaining of the liquid.

<Second Embodiment> Next, FIG. 7 is a front view of a main portion showing a second embodiment of the present invention. In the second embodiment, a liquid-proof film attaching means for attaching the liquid-proof film 32 to the lower surface side of the IC 27 at the inspection position is provided.

The liquid-proof film attaching means includes a rewind drum 33 for winding the liquid-proof film 32 wound in a loop, and a liquid tank 15.
A liquid-proof film sticking jig 34 installed outside the inlet side of the IC 27, a liquid-proof film peeling jig 35 installed outside the outlet side of the IC 27 in the liquid tank 15, and a separated liquid-proof film 32 And a take-up drum 36.

In this liquid-proof film sticking means, the liquid-proof film 32 is rewound from the rewind drum 33, and before the IC 27 enters the liquid 16 in the liquid tank 15, the jig 34 for the liquid-proof film sticks the lower surface of the IC 27. A liquidproof film 32 is adhered to 31 to protect it. Next, when the IC 27 comes out of the liquid tank 15 via the inspection position, the liquid-proof film 32 is
Is peeled off and wound around the winding drum 36.

As described above, in the second embodiment, before the IC 27 enters the liquid 16 in the liquid tank 15, the IC 2
The liquid-proof film 32 is adhered to the lower surface 31 of the IC 7, and the IC 27 is protected until it passes over the liquid 16, so that the liquid 16 that is widely used as an acoustic coupling is used, Can be prevented beforehand from being attached. In this embodiment, the drying device 23 shown in FIG. 1 may be omitted.

In place of the above-described liquid-proof film sticking means, a means for performing liquid-proof treatment such as applying or spraying a liquid-resistant paint may be provided.

The other structure and operation of the second embodiment are the same as those of the first embodiment.

<Third Embodiment> FIG. 8 is a front view of a main part showing a third embodiment of the present invention. In the third embodiment, the IC conveyor belt conveyor 37 and the liquid tank 3
8, the IC handler 40, the control device 44, the CRT 4
5 is provided.

The belt conveyor 37 sequentially conveys the IC 27 to be inspected.

The liquid tank 38 is arranged at the inspection position of the IC 27, and the liquid tank 38 contains a liquid (not shown) which is an acoustic coupling. In this liquid, the ultrasonic transmitting / receiving portion of the array probe 1 and the acoustic lens 2 are placed. The liquid tank 38 is provided with a positioning jig 39 for the IC 27 and a liquid level adjusting means (not shown). The IC handler 40 has a pedestal 41, an arm 42 supported by the pedestal 41, and an IC chuck 43 attached to a tip of the arm 42.

The control unit 44 has the following functions: (1) a function of controlling the array probe 1, the IC handler 40 and the CRT 45;
(2) The reflected ultrasonic wave is taken in from the array probe 1,
A function of recording the intensity distribution of the reflected wave, (3) a function of creating and outputting a planar intensity distribution image based on the information of the intensity distribution of the reflected wave, and (4) an abnormality from the created intensity distribution image. Function to calculate the area ratio of the part recognized as (5)
It has a function of comparing the calculated area ratio with a judgment reference value, judging the quality of the inspection surface of the IC 27, and outputting the result.

The CRT 45 displays an image of the reflected wave intensity distribution based on a command from the control device 44.

In the third embodiment, the ICs 27 are sequentially conveyed by the belt conveyor 37. The IC handler 40 grips the IC 27 on the belt conveyor 37 via the arm 42 and the IC chuck 43, carries the IC 27 to the inspection position, and delivers it to the positioning jig 39 provided above the liquid tank 38. The positioning jig 39 three-dimensionally positions the IC 27 with respect to the array probe 1. Therefore, an ultrasonic focused beam is radiated from the array probe 1 through the acoustic lens 2 and a liquid as an acoustic coupling, and a reflected wave from the inspection surface of the IC 27 is captured. Output to In the control device 44, the IC 2
7, a received signal of the reflected wave of the inspection surface is input, an image of the intensity distribution of the reflected wave is created, the image is processed, and the I
At the same time as determining whether or not C27 is acceptable, an image of the created intensity distribution of the reflected wave is displayed on the CRT 45. After the inspection,
The IC handler 40 includes an arm 42 and an IC chuck 43.
, The IC 27 placed on the liquid tank 38 is gripped and returned to the belt conveyor 37. The belt conveyor 37 conveys the inspected IC 27 to a subsequent process.

In the third embodiment described above, I
C27 can be continuously transferred to the inspection position and inspected, so that the inspection efficiency can be improved.

<Fourth Embodiment> FIG. 9 is a side view showing a fourth embodiment of the present invention. In the fourth embodiment, a traveling carriage 47 having a belt conveyor 46 for IC transport, a column 48, an arm 49, a vertical ZZ moving mechanism 50, and an XX direction moving mechanism 51 in a horizontal plane is provided. ,
An array probe 1 supported by the XX moving mechanism 51, an elastic body 52 as an acoustic coupling connected to a lower portion of the array probe 1, and an XX moving mechanism 51; And a control device 54 attached to the camera.

The belt conveyor 46 is configured to convey the IC 27 to be inspected in one direction YY in a horizontal plane.

The traveling carriage 47 is moved to a predetermined inspection position and is fixed at that position. The traveling carriage 47 is provided with a column 48 and an arm 49 extending horizontally from an upper portion of the column 48.

The vertical ZZ moving mechanism 50 is vertically provided at the end of the arm 49.

The XX moving mechanism 51 is supported by the vertical ZZ moving mechanism 50, and is mounted to be rotatable about the axis of the vertical ZZ moving mechanism 50. The attached member is transferred in the direction YY of the IC 27.
Can be moved in the direction XX orthogonal to the direction.

The elastic body 52 is formed of a laminated body in which elastic pieces 52a, 52b, 52c having different sound velocities are laminated, so that the sound wave emitting surface of the array probe 1 has an ultrasonic wave focusing effect. ing.

The position monitoring camera 53 is connected to the I
When the elastic body 52 approaches the C27, the position of the end of the elastic body 52 is imaged, and the position information is output to the control device 54.

The control device 54 controls the traveling carriage 47 to an IC.
27, and a function of accurately setting the inspection position in the up-down direction based on the position information input from the position monitoring camera 53.
In addition to the function of controlling the Z movement mechanism 50 and the XX direction movement mechanism 51, it has the same functions as (2) to (5) in the control device 44 of the third embodiment.

In the fourth embodiment, the traveling carriage 47 is moved by the control device 54 in the YY direction at the inspection position of the IC 27, and is positioned at that position. The controller 54 operates the vertical ZZ moving mechanism 50 to position the XX moving mechanism 51, the array probe 1, and the elastic body 52 at predetermined upper limit positions. XX direction moving mechanism 51 is operated by the controller 54 based on the position information from the position monitoring camera 53 at the time of the test, and the end of the elastic body 52 is moved to the inspection position of the IC 27. It is positioned so that it adheres correctly.

Here, the ICs 27 are sequentially conveyed toward the inspection position by the belt conveyor 46. I to be inspected
When the C27 arrives at the inspection position, the vertical ZZ moving mechanism 50 is operated, and the lower surface of the elastic body 52 is pressed against the inspection surface of the IC 27 and is brought into close contact therewith.

The situation is imaged by the position monitoring camera 53 and output to the control device 54. When the lower surface of the elastic body 52 comes into close contact with the inspection surface of the IC 27, the vertical direction Z- The Z movement mechanism 50 is stopped. Next, I is passed through the elastic body 52 by the array probe 1.
An ultrasonic focused beam is emitted to the inspection surface of C27, the reflected wave is captured, and the received signal is output to the control device 54. In the control device 54, the array probe 1
A received signal of a reflected wave from the inspection surface of the IC 27 is input from the controller, an image of the intensity distribution of the reflected wave is created, the image is processed, and the quality of the IC 27 to be inspected is determined, and a CRT or a defective IC selection unit (which Are also output).

After inspecting the IC 27 to be inspected, the vertical movement Z-Z movement mechanism 50 is operated by the control device 54 to raise the members attached thereto at the same time. The IC 27 that has been inspected is transported to a subsequent process by the belt conveyor 46.

Also in the fourth embodiment, since the IC 27 can be continuously sent to the inspection position and the inspection can be performed, the inspection efficiency can be improved.

Further, in the fourth embodiment, elastic pieces 52a-52 having different sound speeds are used as acoustic couplings.
c, the array probe 1 is used.
The ultrasonic radiation surface can have an ultrasonic focusing effect, so that more accurate inspection information can be obtained.

In this embodiment, a self-adhesive adhesive is applied to the bottom surface of the elastic body 52, and the elastic body 52 is placed on the upper surface of the IC 27 to be inspected via the adhesive.
May be brought into close contact with each other.

<Fifth Embodiment> FIG. 10 shows a fifth embodiment of the present invention, and is a side view of a main part. In the fifth embodiment, a base plate 55 having a liquid reservoir 56 at an inspection position, an array probe scanning mechanism 58, a transport band 59 for a device to be inspected, a guide jig 60 for a transport band, The device 61 is provided.

The liquid reservoir 56 contains a liquid 57 which is an acoustic coupling. In this liquid 57, the transmitting and receiving portion of the array probe 1 for transmitting and receiving ultrasonic waves and the acoustic lens 2 are placed.

The array probe scanning mechanism 58 supports the array probe 1. The array probe scanning mechanism 58 is finely adjusted by the controller 61 in the inspection position in the vertical direction ZZ, in one direction YY in the horizontal plane and in the direction XX orthogonal thereto. It has become.

The transport belt 59 is provided so that the inspection object 62 can be sequentially moved toward the inspection position.

The guide jig 60 for the transport band is provided with the liquid reservoir 5.
6 are disposed at the bottom on the entrance side and the bottom on the exit side of the test object 62, guide the transport band 59 in an inverted trapezoid in the liquid reservoir 56, and allow the test object 62 to pass through the liquid 57. It has become.

The controller 61 has the functions (2) to (5) of the controller 44 in the third embodiment, in addition to controlling the array probe scanning mechanism 58.

The test object 62 may be immersed in the liquid 57.

In the fifth embodiment, the inspection object 62 is sequentially conveyed toward the inspection position by the conveyance band 59, and the conveyance band 59 is reversed by the guide jig 60 provided in the liquid reservoir 56 at the inspection position. The test object is guided in a trapezoid, and thereby the test object 62 is immersed in the liquid 57. When the inspection object 62 reaches the inspection position, an ultrasonic focused beam is radiated from the array probe 1 to the inspection surface of the inspection object 62 through the acoustic lens 2 and the liquid 57 that is an acoustic coupling. The reflected wave is captured, and a received signal of the reflected wave is output to the control device 61. The control device 61 receives a reflected wave reception signal of the inspection surface of the inspection object 62 from the array probe 1, creates an image of the intensity distribution of the reflection wave, processes the image, and processes the image. The quality of the inspection object 62 is determined and output to a CRT, a defective inspection object selection unit (neither is shown), or the like. After the inspection, the inspection object 62 is the liquid 5
7 and sent to the subsequent process by the transport band 59.

In the fifth embodiment, the inspection object 6
2 is sent to the inspection position one after another for inspection, so that the inspection efficiency can be improved.

<Other Embodiments> Further, as another embodiment of the present invention, by providing a temperature adjusting means for keeping the temperature of a liquid or an elastic body as an acoustic coupling constant,
Variations in flaw detection sensitivity due to changes in the speed of sound or attenuation of ultrasonic waves due to temperature changes in the acoustic coupling can be reduced.

[0095]

According to the first aspect of the present invention described above, the transfer means for continuously transferring the test object to the inspection position of the test object, and the transfer means for continuously transferring the test object to the test position. Since the test object coming and the array probe are provided with positioning means for positioning relative to each other in the three-dimensional direction by sandwiching the acoustic coupling at the test position,
There is an effect that a plurality of inspected objects can be inspected continuously and efficiently, and thus, even if a large number of inspected objects such as electronic parts and material parts are produced, ultrasonic inspection can be performed on all of them. effective.

According to the invention described in claim 2 of the present invention, the positioning means includes an acoustic coupling between the object to be inspected and the array probe at the inspection position, at least in the vertical direction and in the horizontal plane. In addition to being configured to be relatively positionable with respect to the transport direction of the test object in, using an array probe for the array probe, a direction orthogonal to the transfer direction of the test object in a horizontal plane, and a parallel direction Since the scanning in at least one of the oblique directions is electronically performed by electronically switching the driving elements of the array probe,
As a result, the time required for the relative positioning between the object to be inspected and the array probe at the inspection position can be significantly reduced, and the effect of further improving the inspection efficiency can be achieved.

According to the third aspect of the present invention, since the liquid put in the liquid tank is used as the acoustic coupling, a liquid generally used for the acoustic coupling is used. In addition, there is an effect that the inspection efficiency can be improved.

According to the invention described in claim 4 of the present invention, the liquid tank is provided with liquid level adjusting means for adjusting the liquid level to a predetermined position with respect to the vertical position of the test object at the inspection position. As a result, it is possible to perform inspection by immersing only a portion that does not cause a problem even when immersed in the liquid of the test object. As a result, it is possible to prevent a trouble caused by the liquid component permeating the test object.

According to the fifth aspect of the present invention, a foreign matter removing tool is provided on the liquid tank at the entrance side of the object to be inspected,
A droplet removing device is provided on the outlet side, and accurate image information can be obtained by wiping and removing bubbles and other foreign materials attached to the object to be inspected by the foreign material removing device. Since the droplet remover removes droplets attached to the object to be inspected, troubles such as performance degradation of the object to be inspected due to liquid adhering or remaining on the object to be inspected are eliminated. There is an effect to get.

According to the invention described in claim 6 of the present invention, a liquid-proof means for performing liquid-proof processing on a portion of the test object requiring liquid-proof is provided on the inlet side of the test object in the liquid tank. Since the liquid-proof means performs liquid-proof processing on portions of the device under test where liquid-proofing is required, the performance of the device under test is deteriorated due to the liquid adhering or remaining on the device under test. There is an effect that can solve the trouble of.

According to the seventh aspect of the present invention, since an elastic body is used as the acoustic coupling, the acoustic coupling is applied to a test object which completely dislikes a liquid component, and a liquid component of the test object is used. This has the effect of eliminating all troubles such as performance degradation due to the above.

According to the eighth aspect of the present invention, since the elastic body is formed by laminating a plurality of elastic pieces having different sound velocities from each other, the elastic body is provided on the ultrasonic radiation surface of the array probe. As a result of having the effect of focusing the ultrasonic waves, there is an effect that more accurate inspection information can be obtained.

According to the ninth aspect of the present invention, since the acoustic coupling is provided with a temperature adjusting means for maintaining the acoustic coupling at a constant temperature, the ultrasonic wave caused by a temperature change is provided. As a result, it is possible to obtain more accurate inspection information.

[Brief description of the drawings]

FIG. 1 is a side view showing a first embodiment of the present invention.

FIG. 2 is a side view of an attitude control unit of the array probe according to the first embodiment.

FIG. 3 is a front view of FIG. 2;

FIG. 4 is an explanatory diagram showing an example of a contact state between a liquid surface and a test object when a liquid is used as an acoustic coupling.

FIG. 5 is an explanatory diagram showing another example of FIG. 4;

FIG. 6 is a flowchart of the first embodiment.

FIG. 7 is a side view of a main part showing a second embodiment of the present invention.

FIG. 8 is a front view showing a third embodiment of the present invention.

FIG. 9 is a side view of a main part of a fourth embodiment of the present invention.

FIG. 10 is a side view of a main part of a fifth embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Array probe, 2 ... Acoustic lens, 3 ... Array controller attitude | position control part, 7 ... Ultrasonic focused beam, 8 ... Rail which comprises IC transfer means, 9 ... The same roller, 10 ... Arm, 11 ... Chain, 12 ... IC holder, 13 ...
An IC pressing jig constituting IC positioning means,
14: positioning rail, 15: liquid tank, 16: liquid as acoustic coupling, 17: liquid level, 19: liquid level sensor constituting liquid level adjusting means, 20: liquid level adjuster, 2
1: foreign matter removing tool, 22: droplet removing tool, 23: drying device,
24: electronic scanning ultrasonic transmission / reception unit, 25: imaging device,
26: pass / fail determination unit, 27: IC as an object to be inspected, 31 ...
Lower surface of IC, 32: liquid-proof film, 33: rewind drum constituting liquid-proof means, 34: liquid-proof film sticking jig, 35 ...
Liquid-proof film peeling jig, 36 ... Winding drum, 37 ... I
C conveyor belt conveyor, 38: liquid tank, 39: IC positioning jig, 40: IC handler, 42: arm, 4
3 ... IC chuck, 44 ... Control device, 45 ... CRT, 4
6 ... Conveyer belt for IC transport, 47 ... Truck, 4
8 Column, 49 Arm, 50 Moving mechanism in the vertical direction Z-Z, 51 XX moving mechanism, 52 Elastic body as acoustic coupling, 52a to 52c Elastic piece, 5
3 position monitoring camera, 54 control device, 55 base plate, 56 reservoir, 57 liquid as acoustic coupling, 58 array scanning mechanism, 59 transport band,
Reference numeral 60: a guide jig for the transport band, 61: a control device, 62: an object to be inspected.

──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Jun Kubota 1168 Moriyama-cho, Hitachi City, Ibaraki Prefecture Inside the Energy Research Laboratory, Hitachi, Ltd. Inside the factory (72) Inventor Shigeo Kuroda 2326 Imai, Ome-shi, Tokyo Inside the Device Development Center, Hitachi, Ltd. (56) References JP-A-3-87654 (JP, A) JP-A-2-1933061 (JP, A JP-A-1-214756 (JP, A) JP-A-63-148864 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) G01N 29/00-29/28

Claims (9)

(57) [Claims] An ultrasonic inspection apparatus for transmitting and receiving ultrasonic waves to and from an object to be inspected using an ultrasonic probe and inspecting the soundness of the object to be inspected.
Means for continuously transferring the object to the inspection position, and an ultrasonic probe which is continuously transferred by the transfer means
Positioning means for relatively three-dimensionally positioning the object to be inspected and the ultrasonic probe with an acoustic coupling therebetween when coming to an inspection position facing the surface of the object to be inspected;
To adjust the ultrasonic emission surface of the ultrasonic probe in parallel
An ultrasonic inspection apparatus comprising: a row adjusting unit . 2. An array probe is provided on said ultrasonic probe.
The ultrasonic inspection apparatus according to claim 1, wherein: 3. The ultrasonic inspection apparatus according to claim 1, wherein a liquid contained in a liquid tank is used as the acoustic coupling. 4. The liquid tank according to claim 3, wherein said liquid tank is provided with liquid level adjusting means for adjusting a liquid level to a predetermined position with respect to a vertical position of the test object at an inspection position. Ultrasonic inspection equipment. 5. The apparatus according to claim 1, wherein a foreign matter removing device is provided on an entrance side of the object to be inspected in the liquid tank, and a droplet removing device for removing droplets adhered to the object to be inspected is provided on an outlet side. 3
The ultrasonic inspection apparatus according to the above. 6. An inlet side of an object to be inspected in the liquid tank,
4. The ultrasonic inspection apparatus according to claim 3, further comprising a liquid-proof means for performing liquid-proof processing on a portion of the test object requiring liquid-proof. 7. The ultrasonic inspection apparatus according to claim 1, wherein an elastic body is used as the acoustic coupling. 8. The ultrasonic inspection apparatus according to claim 7, wherein said elastic body is constituted by laminating a plurality of elastic body pieces having different sound speeds from each other. 9. An ultrasonic inspection apparatus according to claim 1, wherein said acoustic coupling is provided with a temperature adjusting means for keeping said acoustic coupling at a constant temperature.