JP3109472B2 - Light emitting diode - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode, and more particularly, to a light emitting diode provided with any one or a combination of functional members such as a coloring member, an antibacterial member, a phosphorescent member, a photocatalyst, and an antireflection film. .

[0002]

2. Description of the Related Art Light emitting diodes (LEDs) in which a semiconductor light emitting element is packaged (resin mold, glass mold, etc.) are widely used for displaying pilot lamps, indicators, characters and figures, signals, decorations, designs, and the like. Mold prevention,
A configuration in which a photocatalyst is provided on the outer surface of a light emitting diode for the purpose of, for example, anti-fog has been proposed in, for example, JP-A-9-8361. The light emitting diode emits various lights such as red, green, and blue, or ultraviolet rays. 9 to 12 illustrate a conventional light emitting diode.

In FIG. 9, a light emitting diode 1 includes an LED chip 2 that emits light made of a pn-junction semiconductor crystal, and a molded lens 3 that seals the LED chip 2. The mold lens 3 is made of a transparent member such as an epoxy resin or an acrylic resin. Reference numeral 4 indicates an external lead, and reference numeral 5 indicates a gold wire. A cap 6 made of a transparent material such as glass or resin is integrally fitted so as to cover the outside of the molded lens 3. Mold lens 3
The cap and the cap 6 are integrated by using an adhesive, press-fitting, two-color molding, or the like. On the outer surface of the cap 6, a photocatalyst 7 such as titanium dioxide is disposed in a thin film of 0.3 μm or less.

The light emitting diode 10 shown in FIG. 10 has a configuration in which the cap 6 of the light emitting diode in FIG. 9 is omitted and the photocatalyst 7 is directly carried on the surface of the molded lens 3.

The light emitting diode 20 shown in FIG. 11 has a configuration in which the molded lens 3 of the light emitting diode in FIG. 9 is omitted and the photocatalyst 7 is directly carried on the surface of the cap 6.

A light emitting diode 30 shown in FIG. 12 has a structure provided with a plurality of LED chips 2 and has a structure in which a photocatalyst 7 is provided on an outer surface of a cap 6 having a rectangular cover shape.

A light emitting diode in which a fluorescent dye or a fluorescent pigment is mixed in a mold lens is disclosed in, for example,
No. 52609 has been proposed. The light emitting diode in this case is added with a fluorescent dye which is excited at around 420 to 440 nm and emits light having a wavelength having an emission peak at 480 nm for the purpose of improving the visibility and improving the brightness.

The above-mentioned conventional light emitting diode has a function of sterilizing, decomposing contaminants such as sweat, oily smoke and cigarette smoke by a photocatalyst, and adjusting an absorption wavelength by mixing a coloring member into an exterior member (sealing member). Having.

[0009]

However, the surface or the inside of the exterior member (sealing member) of the LED chip is formed.
One of the light-emitting diode or the like has not been proposed having both a light emitting diode or the accumulating member and the photocatalyst, having both the antimicrobial member and the accumulating member having a bactericidal action in the member.

According to the present invention, a functional member comprising a coloring member (dye / pigment), a fluorescent dye / pigment, a photocatalyst, a phosphorescent member, an antibacterial member, or a combination thereof is provided on the surface of the exterior member. It is an object to provide a light emitting diode. By providing these functional members, the light emitting diode can achieve anti-fogging, anti-mold, luminous properties, improvement in visibility and luminance, and the like.

[0011]

According to the present invention, there is provided a light emitting diode comprising: (1) at least two or more types of functional members are provided on a surface of an exterior member for sealing a semiconductor chip; The configuration was as follows. (2) At least two or more types of functional members are mixed in the exterior member for sealing the semiconductor chip. (3) At least two or more types of functionality are provided by disposing a first functional member on the surface of an exterior member that seals a semiconductor chip and mixing a second functional member inside the exterior member. The structure was provided with members. (4) An antibacterial member is provided on the outer surface of the exterior member for sealing the semiconductor chip. (5) A configuration in which a phosphorescent member is provided on the outer surface of the exterior member that seals the semiconductor chip. (6) An antibacterial member is mixed in an exterior member for sealing a semiconductor chip. (7) The light-storing member is mixed in the exterior member for sealing the semiconductor chip. (8) A configuration in which a coloring member is provided on the outer surface of the exterior member for sealing the semiconductor chip. (9) The light-storing member is provided on the outer surface of the exterior member for sealing the semiconductor chip, and the antireflection film is further provided on the outer surface. (10) A configuration in which a coloring member is provided on the outer surface of the exterior member for sealing the semiconductor chip, and an antireflection film is further provided on the exterior. (11) A structure in which a light-transmitting film sheet formed by kneading a functional member is laminated on a surface of a sealing member for sealing a semiconductor chip.

The first means for arranging the functional member on the surface of the exterior member is such that the functional member is included in a transparent adhesive member (vehicle / dispersion medium / carrier) and applied or printed. . In the second means, an adhesive layer is first provided on the surface of the exterior member, and then the functional member is sprayed.
Further, the functional member is pressed and embedded in the adhesive layer as needed. The third means is laminating a film sheet containing a functional member on a resin substrate.
Configuration. In addition, sputtering, evaporation, CVD, P
It goes without saying that any means such as VD and electrodeposition may be used.

In the above-described structure of the present invention, the functional member is a colored member (dye or pigment), a fluorescent dye, a fluorescent pigment, an antibacterial member, a light storage member, a photocatalyst, or the like. The combination includes a phosphorescent member and a photocatalyst, a phosphorescent member and an antibacterial member, a photocatalyst and an antibacterial member, a photocatalyst and a coloring member, an antibacterial member and a coloring member,
Fluorescent dye / pigment and photocatalyst, fluorescent dye / pigment and antibacterial member, etc. Of course, any other combination is possible.

As the dye, azo dye, anthraquinone dye, carbonium dye, indigoid dye, sulfur dye,
A phthalocyanine dye or the like was used. For example, as the blue dye, cyanine blue (A13511, manufactured by Dexter, Hysole Blue dye) or the like may be used. Needless to say, other colors such as red, green, and yellow may be set according to the purpose. The fluorescent dye may be of any color and material, and may be, for example, a blue-green fluorescent dye (manufactured by BASF Corporation). The same applies to the case where the pigment may be of any color and member such as red, blue, green, yellow, and white.

The absorption wavelength range of light due to coloring may be arbitrarily set. For example, green has a high absorption in a wavelength range of about 520 nm or less and about 570 nm or more, and red has a high absorption in a wavelength range of about 600 nm or less and about 630 nm or more.
In the case of blue, a high absorption rate of about 420 nm or less and about 500 nm or more was determined.

The form of the antibacterial member provided on the exterior member is any one of a powder particle form and a liquid form.
Further, the outer dimensions of the antibacterial member in the form of powder particles are set to about 0.0
It was about 5 μm to about 20 μm. The amount added was about 0.5% to 10% by weight. By disposing the antibacterial member on the surface of the sealing member, the living environment of bacteria attached to the sealing member is cut off.

Further, the antibacterial member was composed of any one of zeolite (antibacterial metal ion / silver, copper, zinc), chitosan, mugwort, hinoki (hinokitiol), hiba and the like. Zeolites are antibacterial ceramics that contain germicidal substances such as silver, copper, and zinc. Chitosan is a natural polysaccharide often contained in crab shells and shrimp shells, and has antibacterial and antifungal properties. The ratio of the powder particles embedded in the card surface, mixed in the adhesive, or mixed in the solution or water is sufficient in the ratio of about 0.3% to about several% by weight. did.

The mugwort has a tannin contained in the mugwort which has an antiallergic and antipruritic effect, a chlorophyll (chlorophyll) has a sterilizing and bacteriostatic effect, and the particle size of the mugwort containing an extract of mugwort is about 0.05 μm or more. It may be embedded or applied as a microcapsule of about 20 μm and fixed to the surface of the object. The cypress plays a role of a preservative to prevent tropilone contained in the cypress from attracting bacteria, mold, etc., and may be used as microcapsules having a particle size of several micrometers as in other antibacterial members.

As the liquid antibacterial member, hinoki or hiba essential oil or metronidazole, or silver acetate or silver nitrate is dissolved in pure water, and K ↓ 2SO ↓ 3 and K ↓ 2S ↓ are added to the solution. 2O ↓ 3 is sequentially added to obtain a solution containing at least one of a silver thiosulfato complex salt and a silver salt. Further, an antibacterial complex in which at least one of silver thiosulfato complex salt or silver salt is supported and adsorbed on hydrated amorphous silicon dioxide, and an outer shell coating layer is further formed on its outer surface, or an organic arsenic binazine or the like. It may be mixed at a ratio of about 0.5% to about 10% by weight.

In addition to the above, as an antibacterial member, iodoform, silver silica gel antibacterial agent particles, diphenyl ether type or silicon quaternary ammonium salt (trade name AC)
P-20, TK-520), a mixture of zirconium phosphate and silver oxide, a compound in which isothiocyanate is used as an antibacterial component and is included in cyclodextrin, or the like.

Any member may be used as the photocatalyst.
For example, fine powder particles of a photocatalyst made of titanium dioxide or a mixture of titanium dioxide and activated carbon were used. By disposing the photocatalyst powder particles or the thin film of the adhesive containing the photocatalyst on the surface of the object, the surface can be prevented from being stained, bacteria on the surface can be killed, and the smell attached thereto can be removed. In other words, a photocatalyst such as the sun or a fluorescent lamp that receives near-ultraviolet light of 300 nm to 400 nm is activated and oxidizes and decomposes organic substances (acetaldehyde, ammonia, etc.), nitrogen oxides, chlorine compounds, and the like.

The fine powder particles of the photocatalyst comprising titanium dioxide or a mixture of titanium dioxide and activated carbon are 0.001.
It has an outer shape of μm to several μm. Further, the ratio of the liquid (vehicle or the like) to be contained may be about 0.1% by weight to 10% by weight. The coating thickness may be arbitrarily determined according to the purpose of use. For example, it may be applied to a thickness of 0.1 μm to several μm. The means for applying to the mold lens or the cap is mixed with a liquid material, and is performed by spraying, electrostatic printing, inkjet, or the like. As a means for disposing titanium dioxide, any means such as vacuum deposition, CVD, sputtering, spraying, and electrodeposition may be used in addition to the above.

The titanium dioxide is preferably an anatase type, but may be a rutile type titanium dioxide metallized with copper, silver, platinum or other metals. Also, W
A photocatalyst may be formed of a semiconductor such as O ↓ 2, Cds, SrTiO ↓ 2, and MoS ↓ 2.

Further, it is the same that the photocatalyst may be impregnated with water or an organic solvent (such as aniline). The photocatalyst impregnated with water or an organic solvent may be mixed with a liquid material such as an arbitrary inorganic or organic binder, vehicle, paint, adhesive or the like, and applied to the surface of the target member. Water or an organic solvent evaporates during the heating and drying process of the liquid material to form pores in the photocatalyst holding film, thereby enabling the photocatalyst to be directly irradiated with near ultraviolet rays.

Further, the surface of the titanium oxide particles is covered with a photo-inert substance, the surface of the titanium dioxide particles is covered with a porous wall made of a photo-inert substance, or the surface of the titanium dioxide particles is 1 μm with ceramic apatite. Any one of the configurations, such as a configuration covering the thickness, may be used. As the photoinactive substance, silicon, aluminum, zirconium, calcium, barium, strontium,
Any one of magnesium, zinc, niobium, etc. or a combination thereof was used. By coating the surface of titanium dioxide with a photoinactive substance, a porous wall made of the photoinactive substance, apatite, etc., deterioration of the photocatalyst carrier (holding member) such as paper, resin, fiber, etc. can be reduced.

As the luminous substance, for example,
N night light or SrAl ↓ 2O ↓ 4: Eu (emission peak wavelength 520 nm, afterglow luminance 300 mcd / m ↑ 2 (20
20 minutes after irradiation with 0 LX for 4 minutes), afterglow time 20
00 minutes or more (time required to decay to 0.32 mcd / m ↑ 2)) or ZNs: Cu, or ZnS, C
Any member such as one or two kinds of sulfide phosphorescent materials such as dS, CaS, and (ZnCd) S may be used. The minimum application thickness of the adhesive member (vehicle) containing the phosphorescent substance is 0.1
It was about 10 μm to 10 μm. The mixing ratio of the luminous substance to be mixed in the adhesive member was in the range of 0.1% by weight to 10% by weight.

Examples of the adhesive member (vehicle) containing the functional member include a thermosetting acrylic resin member (for example, acrylic melamine resin), an alkyd melamine resin member, vinyl acetate, a fluororesin, a silicone resin, and the like.
Any one of an organic binder such as an epoxy resin type, a urethane type, and a UV resin (ultraviolet curable resin), a rubber member (eg, natural rubber, butyl rubber, etc.), vinyl chloride, and a phenol resin is used. The constituent materials of the mold lens and the cap are, for example, acrylic resin, epoxy resin, polycarbonate, vinyl chloride, vinylidene chloride,
Styrol, polyacetal, urethane, glass (for example, silica glass, borosilicate glass, soda-lime glass) and the like were used.

According to the present invention, one or a combination of two or more of functional members such as a coloring member, a photocatalyst, an antibacterial member, and a luminous substance can be easily disposed on the exterior member of the light emitting diode. The coloring member adjusts the light absorption wavelength range, the antibacterial member prevents the growth of mold and bacteria, and the photocatalyst decomposes pollutants attached to the air or on the surface. In addition, phosphorescent substances (called phosphorescent phosphors, phosphorescent paints, fluorescent paints, etc.) absorb and accumulate the light of sunlight and fluorescent lamps, and can maintain brightness for a certain period of time even when the lighting is interrupted and dark, To facilitate the operation of electronic devices and the like.

[0029]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first invention according to the present invention is a method for manufacturing a semiconductor device, comprising the steps of:
A light emitting diode characterized by having a second functional member overlaid on the functional member of, a colored member, a photocatalyst, an antibacterial member, a functional member such as a luminous substance, at least two or more, It can be easily disposed on the exterior member (sealing member) of the light emitting diode. Further, the combination of the functional members can be arbitrarily selected. Further, the brightness can be adjusted depending on the thickness of the functional member to be provided, and mass production can be performed by a coating method or the like.

Further, according to a second aspect of the present invention, there is provided a light emitting device characterized in that a vehicle in which a first functional member and a second functional member are mixed is provided on an outer surface of an exterior member for sealing a semiconductor chip. With a diode, at least two or more kinds of functional members such as a coloring member, a photocatalyst, an antibacterial member, and a luminous substance can be easily disposed on the exterior member of the light emitting diode. In addition, the time required for application is reduced to half of that of the first invention.

Further, the third invention is characterized in that one of a fluorescent dye and a fluorescent pigment is mixed in an exterior member for encapsulating a semiconductor chip, and a photocatalyst is provided on an outer surface of the exterior member. The fluorescent dye / fluorescent pigment adjusts the absorption wavelength range of light, and the photocatalyst decomposes contaminants attached to the surface to prevent mold and fogging.

Further, the fourth invention is characterized in that one of a fluorescent dye and a fluorescent pigment is mixed in an exterior member for encapsulating a semiconductor chip, and an antibacterial member is provided on an outer surface of the exterior member. The fluorescent dye / fluorescent pigment adjusts the light absorption wavelength range,
The antimicrobial member prevents the growth of mold and bacteria.

Further, a fifth invention is a light emitting diode characterized in that a light storage member is mixed in an exterior member for sealing a semiconductor chip, and a photocatalyst is provided on an outer surface of the exterior member. The luminous substance can maintain the brightness for a certain period of time even when the illumination is interrupted and becomes dark, and illuminates the surrounding area.
The photocatalyst decomposes contaminants attached to the surface.

In a sixth aspect of the present invention, there is provided a light emitting diode characterized in that a light storing member is mixed in an exterior member for sealing a semiconductor chip, and an antibacterial member is provided on an outer surface of the exterior member. In addition, the luminous substance can maintain the brightness for a certain period of time even when the illumination is interrupted and becomes dark, and illuminates the surrounding area. The antimicrobial member prevents the growth of mold and bacteria.

Further, a seventh aspect of the present invention is a light emitting diode characterized in that a coloring member is mixed in an exterior member for sealing a semiconductor chip, and an antibacterial member is provided on an outer surface of the exterior member. The coloring member adjusts the light absorption wavelength range, and the antibacterial member prevents the growth of mold and bacteria.

According to an eighth aspect of the present invention, there is provided a light emitting diode characterized in that at least two or more types of functional members are mixed in an exterior member for sealing a semiconductor chip. It is provided in the exterior member during the molding process and is suitable for mass production.

A ninth aspect of the present invention is a light emitting diode characterized in that an antibacterial member is provided on the outer surface of an exterior member for encapsulating a semiconductor chip. I do.

Further, a tenth aspect of the present invention is a light emitting diode characterized in that a light storing member is provided on an outer surface of an exterior member for sealing a semiconductor chip. Maintains time, brightness and illuminates the surroundings. In addition, it emits light to display characters and figures.

Further, an eleventh invention is a light emitting diode characterized in that an antibacterial member is mixed in an exterior member for encapsulating a semiconductor chip, and the antibacterial member has fungicidal and antifogging properties by a bactericidal action. Do.

Further, a twelfth invention is a light-emitting diode characterized in that a light-storing member is mixed in an exterior member for encapsulating a semiconductor chip. It can maintain brightness and illuminate the surroundings. In addition, it emits light to display characters and figures.

According to a thirteenth aspect of the present invention, there is provided a light emitting diode comprising a vehicle in which a coloring member is kneaded on an outer surface of an exterior member for sealing a semiconductor chip, wherein the coloring member absorbs light. By adjusting the wavelength range, visibility and luminance can be improved.

A fourteenth aspect of the present invention is a light emitting diode characterized in that a light storage member is applied to the outer surface of an exterior member for sealing a semiconductor chip, and an antireflection film is further applied thereon. The antireflection film improves the visibility.

According to a fifteenth aspect of the present invention, there is provided a light emitting diode in which a coloring member is applied to an outer surface of an exterior member for encapsulating a semiconductor chip, and an antireflection film is further applied thereon. The barrier film improves visibility.

A sixteenth invention is a light-emitting diode characterized in that a light-transmitting film sheet obtained by kneading a functional member is laminated on the surface of an exterior member for sealing a semiconductor chip. Thus, the amount of the functional member used can be reduced, and the luminance can be adjusted according to the thickness of the sheet.

A light emitting diode according to an embodiment of the present invention will be described below with reference to FIGS.

(Embodiment 1) FIG. 1 is a cross-sectional view of a main part near the surface of an exterior member (sealing member) constituting a light emitting diode according to Embodiment 1 of the present invention. LED chip,
The structure for sealing the gold wire, the external lead and the like is the same as in the case of FIGS. FIGS. 9 to 12 also show the shapes and combinations of the mold lenses and caps constituting the exterior member.
The configuration may be the same as or an arbitrary configuration. In FIG. 1, reference numeral 101 denotes an exterior member, 102 denotes a first functional member,
103 denotes a second functional member.

As shown in FIG. 1, the light emitting diode 100
Is an exterior member 1 for sealing an LED chip made of a semiconductor.
First, the first functional member 102 is applied to the outer surface (front surface) of the first functional member 101, and then the second functional member 103 is provided so as to overlap the first functional member 102. By arbitrarily selecting the combination of the first functional member 102 and the second functional member 103, a coloring member (dye, pigment), a fluorescent dye, a fluorescent pigment, a photocatalyst, an antibacterial member, a luminous substance, an anti-reflection material At least two types of functional members such as membranes can be easily arranged on the surface of the exterior member. In addition, brightness adjustment and color adjustment can be performed by adjusting the coating thickness of each functional member together with the mixing amount of each functional member, and mass production can be easily performed.

Each functional member is mixed and kneaded in a vehicle, for example, a transparent acrylic resin, epoxy resin, vinyl chloride or the like in a range of several weight% to 10 weight%. The coating thickness of each layer was in the range of 0.01 μm to several μm. The application means was any one of spray, electrostatic printing, ink jet, dipping, screen printing and the like. Of course, any other means may be used.

The means for disposing the functional members is not necessarily limited to the use of a resin-based vehicle. The dispersion medium may be a solvent such as water or alcohol. As a means for disposing the functional member, in addition to kneading and applying the mixture to the vehicle, an adhesive layer may be disposed on the surface of the exterior member first, and then the functional member may be dispersed. Then, if necessary, the functional member is pressed and embedded in the adhesive layer. further,
It may be arranged by means such as vapor deposition, sputtering, CVD, PVD, welding and the like. Further, it goes without saying that the coating thickness of the functional member may be different for each functional member. Any size may be set according to the purpose.

By providing a functional member on the surface of the exterior member (sealing member), the coloring member (dye, pigment) and the fluorescent dye / fluorescent pigment can adjust the light absorption wavelength range and improve the visibility and luminance. I can do it. The light storage member illuminates the surroundings for a certain period of time even in a dark place. Further, in the dot matrix type display device using the light emitting diode according to the present invention, the light storage member displays characters / graphics corresponding to the final image for a certain period of time even after the power is turned off. The antibacterial member prevents the growth of mold and bacteria, and the photocatalyst oxidizes and decomposes organic substances, nitrogen oxides, chlorine compounds, and the like. As a result, anti-fog and anti-mold of the mold lens and the cap, improvement of visibility, and improvement of brightness are realized.

(Embodiment 2) FIG. 2 is a sectional view showing a main part near the surface of an exterior member (sealing member) constituting a light emitting diode according to Embodiment 2 of the present invention. LED chip,
The structure for sealing the gold wire, the external lead and the like is the same as in the case of FIGS. FIGS. 9 to 12 also show the shapes and combinations of the mold lenses and caps constituting the exterior member.
The configuration may be the same as or an arbitrary configuration. In FIG. 2, reference numeral 111 denotes an exterior member, 112 denotes a first functional member,
Reference numeral 113 denotes a second functional member.

As shown in FIG.
Is an exterior member 1 for sealing an LED chip made of a semiconductor.
A mixture of a first functional member 112 and a second functional member 113 in a vehicle made of a transparent resin or the like is applied on the outer surface (front surface) of 11 to a predetermined thickness. First functional member 112 and second functional member 113
By arbitrarily selecting a combination with a coloring member (dye, pigment), a fluorescent dye, a fluorescent pigment, a photocatalyst, an antibacterial member,
At least two or more types of functional members such as a phosphorescent substance and light diffusion particles can be easily disposed on the exterior member of the light emitting diode. In addition, brightness adjustment and color adjustment can be performed by adjusting the coating thickness of each functional member together with the mixing amount of each functional member, and mass production can be easily performed.

Each functional member is mixed and kneaded in a vehicle such as a transparent acrylic resin, epoxy resin, vinyl chloride or the like in a range of several weight% to 10 weight%, respectively. The coating thickness was in the range of 0.01 μm to several μm. The application means, the dispersion medium, the type of the functional member, and the means for disposing the functional member may be implemented in the same manner as in the first embodiment. The second embodiment also has the same operation and effects as the first embodiment.

(Embodiment 3) FIG. 3 is a sectional view showing a main part near the surface of an exterior member (sealing member) constituting a light emitting diode according to Embodiment 3 of the present invention. LED chip,
The structure for sealing the gold wire, the external lead and the like is the same as in the case of FIGS. FIGS. 9 to 12 also show the shapes and combinations of the mold lenses and caps constituting the exterior member.
The configuration may be the same as or an arbitrary configuration. 3, reference numeral 121 denotes an exterior member, 122 denotes a first functional member,
Reference numeral 123 denotes a second functional member.

As shown in FIG.
Is an exterior member 1 for sealing an LED chip made of a semiconductor.
The first functional member 122 is kneaded into the inside of the exterior member 21, and a member obtained by kneading the second functional member 123 in a vehicle made of a transparent resin or the like is provided on the outer surface (surface) of the exterior member 121. It is characterized by being prepared for the film thickness. First
The color member (dye, pigment), fluorescent dye, fluorescent pigment, photocatalyst, antibacterial member, luminous substance, anti-reflection film, etc. can be selected by arbitrarily selecting the combination of the functional member 122 and the second functional member 123. At least two types of functional members can be easily disposed on the exterior member of the light emitting diode.
Further, it is possible to adjust the brightness and the color by adjusting the coating thickness of the second functional member together with the mixing amount of each functional member.
Easy mass production.

The addition amount of the first functional member 122 mixed into the exterior member 121 was set in a range of several weight% to 10 weight%. The second functional member is a vehicle such as a transparent acrylic resin, an epoxy resin, a resin member such as vinyl chloride,
Each is mixed and kneaded in the range of several weight% to 10 weight%. The coating thickness was in the range of 0.01 μm to several μm. Embodiment 1 also applies to the application means of the second functional member, the dispersion medium, the type of the functional member, and the arrangement means of the functional member.
What is necessary is just to implement it. The third embodiment has the same operation and effect as the first embodiment.

It should be noted that the means for disposing the second functional member is not necessarily limited to using a resin-based vehicle. The dispersion medium may be a solvent such as water or alcohol. As a means for disposing the functional member, in addition to kneading and applying the mixture to the vehicle, an adhesive layer may be disposed on the surface of the exterior member first, and then the functional member may be dispersed. Then, if necessary, the functional member is pressed and embedded in the adhesive layer. further,
It may be arranged by means such as vapor deposition, sputtering, CVD, PVD, welding and the like. Further, it goes without saying that the coating thickness of the functional member may be different for each functional member. Any size may be set according to the purpose.

(Embodiment 4) FIG. 4 is a sectional view showing a main part near the surface of an exterior member (sealing member) constituting a light emitting diode according to Embodiment 4 of the present invention. LED chip,
The structure for sealing the gold wire, the external lead and the like is the same as in the case of FIGS. Also, the shapes of the mold lens and the cap that constitute the exterior member may be the same as those in the embodiments of FIGS. 4, reference numeral 131 denotes an exterior member, 132 denotes a first functional member, 133
Indicates a second functional member.

As shown in FIG.
Is an exterior member 1 for sealing an LED chip made of a semiconductor.
It is characterized in that the first functional member 132 and the second functional member 133 are kneaded and dispersed inside 31. First functional member 132 and second functional member 133
By arbitrarily selecting a combination with a coloring member (dye, pigment), a fluorescent dye, a fluorescent pigment, a photocatalyst, an antibacterial member,
At least two or more types of functional members such as a phosphorescent substance,
It can be easily arranged on the exterior member of the light emitting diode. Also,
Luminance adjustment and color adjustment can be performed by adjusting the mixing amount of each functional member, and more excellent mass productivity can be exhibited.

The mixing amount of each functional member is several weight%.
It is mixed and kneaded in the range of 10 to 10% by weight. The fourth embodiment also has the same operation and effect as the first embodiment.

(Embodiment 5) FIG. 5 is a sectional view showing a main part near the surface of an exterior member (sealing member) constituting a light emitting diode according to Embodiment 5 of the present invention. LED chip,
The structure for sealing the gold wire, the external lead and the like is the same as in the case of FIGS. FIGS. 9 to 12 also show the shapes and combinations of the mold lenses and caps constituting the exterior member.
The configuration may be the same as or an arbitrary configuration. In FIG. 5, reference numeral 141 denotes an exterior member, and 142 denotes a light storage member. As shown in FIG. 5, the light-emitting diode 140 is provided on the outer surface (front surface) of an exterior member 141 for sealing an LED chip made of a semiconductor, in a vehicle made of a transparent resin or the like.
2 is kneaded with a predetermined thickness.

The brightness can be adjusted not only by the mixing amount of the light storage member but also by the coating thickness of the vehicle. Luminescent member 14
2 is a resin member such as a transparent acrylic resin, epoxy resin, vinyl chloride, etc.
It is mixed and kneaded in the range of 10% by weight. The coating thickness was in the range of 0.01 μm to several μm. The application means and the dispersion medium of the light storage member 142 may be implemented in the same manner as in the first embodiment. The luminous substance can maintain the brightness for a certain period of time even when the illumination is interrupted and becomes dark, and illuminates the surrounding area. In addition, it emits light to display characters and figures.

FIG. 6 shows an embodiment in which an antibacterial member 152 or a coloring member (dye or pigment) is provided instead of the light storage member in FIG. The antibacterial member can prevent mold and fogging of the mold lens and the cap by a sterilizing action. The coloring member can adjust the light absorption wavelength range and can improve the visibility and the luminance.

In addition, instead of coating and disposing the coloring member in the vehicle and disposing it on the surface of the exterior member, the coloring member may be provided on the surface of the mold lens or the cap by means such as sputtering, dipping, vapor deposition, CVD, or PVD. It goes without saying that it is good.

(Embodiment 6) FIG. 7 is a cross-sectional view of a main part near the surface of an exterior member (sealing member) constituting a light emitting diode according to Embodiment 6 of the present invention. LED chip,
The structure for sealing the gold wire, the external lead and the like is the same as in the case of FIGS. FIGS. 9 to 12 also show the shapes and combinations of the mold lenses and caps constituting the exterior member.
The configuration may be the same as or an arbitrary configuration.

In FIG. 7, reference numeral 161 denotes an exterior member,
62 indicates a light storage member. As shown in FIG. 7, the light emitting diode 160 is characterized in that a light storage member 162 is kneaded and dispersed inside an exterior member 161 for sealing an LED chip made of a semiconductor. It is possible to adjust the brightness and color of the light emitting diode by adjusting the mixing amount of the light storage member 162.
Easy mass production. The mixing amount is in the range of several weight% to 10 weight%, respectively. The luminous substance can maintain the brightness for a certain period of time even when the illumination is interrupted and becomes dark, and illuminates the surrounding area. In addition, it emits light to display characters and figures.

FIG. 8 shows an embodiment in which an antibacterial member 172 is provided instead of the light storage member in FIG. The antibacterial member can prevent mold and fogging of the exterior member by a bactericidal action.

(Embodiment 7) The light-emitting diode according to Embodiment 7 has a structure in which a light-transmitting film sheet including one or more functional members is laminated (laminated) on the surface of a sealing member of an LED chip. And (Not shown.) A so-called in-mold molding method is used.
The translucent film sheet and the LED chip are arranged in advance in a cavity formed by two split molds, and a translucent resin is injected and molded so that the translucent film sheet forms a skin. The skin may cover the entire surface of the molded lens or cap, or may be a part including the top. The functional member kneaded into the translucent film sheet may be any one of a coloring member, a luminous member, an antibacterial member, a photocatalyst, a fluorescent dye, a fluorescent pigment, and the like, or a combination thereof. The thickness dimension of the translucent film sheet was in the range of about several μm to 100 μm. In this case, the amount of the functional member used can be reduced, and the luminance can be adjusted according to the thickness of the sheet. In addition, various film sheets can be prepared in a separate process in advance, thereby facilitating model switching in the injection molding process.

In each of the first to seventh embodiments,
It goes without saying that the functional member may be any member other than the above. For example, apply an anti-reflection film to the outermost layer,
Alternatively, sputtering may be performed in multiple layers.

[0070]

As described above, the present invention relates to the function of any one of a coloring member, a fluorescent dye, a fluorescent pigment, a phosphorescent member, a photocatalyst, an antibacterial member, an antireflection member, and a light diffusing member, or a combination thereof. The member is easily arranged on the surface or inside of the exterior member constituting the light emitting diode.

The antibacterial member prevents the growth of mold and bacteria, and the photocatalyst decomposes contaminants (oil smoke, cigarette dust, etc.) attached to the surface of the light emitting diode. This makes it possible to prevent mold and fogging of the light emitting diode.

The luminous substance remains for a certain period of time even after the illumination is turned off.
It emits light to illuminate the surroundings and displays characters and figures. In addition, the photocatalyst is activated even after the light is turned off.

The coloring member, the fluorescent dye, and the fluorescent pigment can select a light absorption wavelength range, and can improve visibility and luminance.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a main part near a surface of an exterior member constituting a light emitting diode according to Embodiment 1 of the present invention.

FIG. 2 is a cross-sectional view of a main part near the surface of an exterior member forming a light emitting diode according to Embodiment 2 of the present invention.

FIG. 3 is a cross-sectional view of a main part near the surface of an exterior member forming a light-emitting diode according to Embodiment 3 of the present invention.

FIG. 4 is a cross-sectional view of a main part near a surface of an exterior member forming a light emitting diode according to a fourth embodiment of the present invention.

FIG. 5 is a cross-sectional view of a main part near the surface of an exterior member forming a light emitting diode according to a fifth embodiment of the present invention.

FIG. 6 is an essential part cross-sectional view near the surface of an exterior member constituting another light emitting diode according to Embodiment 5 of the present invention;

FIG. 7 is an essential part cross-sectional view near the surface of an exterior member constituting a light-emitting diode according to Embodiment 6 of the present invention.

FIG. 8 is a cross-sectional view of a main part near the surface of an exterior member that constitutes another light-emitting diode according to Embodiment 6 of the present invention.

FIG. 9 is a cross-sectional view of a main part schematically showing a conventional light emitting diode.

FIG. 10 is a cross-sectional view of a main part schematically showing another conventional light emitting diode.

FIG. 11 is a cross-sectional view of a main part schematically showing another conventional light emitting diode.

FIG. 12 is a sectional view of a main part schematically showing another conventional light emitting diode.

[Explanation of symbols]

100, 110, 120, 130, 140, 150, 1
60,170 Light emitting diode 101,111,121,131,141,151,1
61, 171 Exterior member (sealing member) 102, 112, 122, 132 First functional member 103, 113, 123, 133 Second functional member 142, 162 Luminescent member 152, 172 Antibacterial member

Continuation of the front page (56) References JP-A-49-19785 (JP, A) JP-A-9-27642 (JP, A) JP-A-7-193282 (JP, A) JP-A-9-8361 (JP) JP-A-8-248901 (JP, A) JP-A-50-20683 (JP, A) JP-A-9-225319 (JP, A) JP-A-7-176794 (JP, A) JP-A-1-238073 (JP, A) JP-A-10-5598 (JP, A) JP-A-10-244166 (JP, A) JP-A-6-254139 (JP, A) A) Full-scale sho 57-108285 (JP, U) Full-scale sho 62-34452 (JP, U) Full-scale sho 55-97911 (JP, U) Full-scale sho 61-9863 (JP, U) (58) Survey Field (Int.Cl. ⁷ , DB name) H01L 33/00 B01J 21/00-38/74 B01D 53/86-53/90

Claims (5)

(57) [Claims] A titanium dioxide particle whose surface is covered with apatite is provided on a surface of an exterior member for sealing a semiconductor chip.
A light emitting diode comprising: a light member . 2. A light-storing member layer is first provided on a surface of an exterior member for encapsulating a semiconductor chip.
Titanium dioxide particles covered with apatite
A light emitting diode, characterized in that: 3. An adhesive layer is provided on a surface of an exterior member for sealing a semiconductor chip, and apatite is provided on a surface of the adhesive layer.
Fixes the titanium dioxide particles whose surface has been covered with the luminous member
A light emitting diode, characterized in that: 4. Titanium dioxide particles whose surface is covered with apatite are deposited on the surface of an exterior member for sealing a semiconductor chip.
Characterized by applying an adhesive mixed with an optical member
Light emitting diode . 5. Titanium dioxide covered with apatite
A light emitting diode , wherein a film sheet in which particles and a light storage member are kneaded in advance is laminated on a surface of a sealing member of a semiconductor chip.