JP3112563B2 - Processing method of metal / resin laminate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for processing a thin plate into a predetermined shape. More specifically, the present invention relates to a method for cutting a thin metal sheet into a predetermined shape by etching, and to easily and accurately cut the thin metal sheet.

[0002]

2. Description of the Related Art Heretofore, when a plate material such as a metal plate material is cut into a predetermined shape, a punching process using a mold has been performed. However, such a method has a disadvantage that the cost of manufacturing the mold is high, and the cost is high when the number of products is small. When the metal plate is thin, the size of the product to be cut is small, and the shape is complicated and high precision is required, the punching method using the die is not necessarily suitable.

For this reason, such thin metal plate materials as described above have been processed to small dimensions with high precision by etching. A conventional method using this etching will be described with reference to FIG. 1 in the figure is a thin plate material such as stainless steel. In order to process the sheet material by etching, first, a resist layer is applied to both sides of the sheet material 1, and after exposing, a predetermined portion of the resist layer is removed, and thereafter, a predetermined portion of the sheet material is removed by etching. And
The removal part 2 is formed. And, by this removing unit 2,
A product 3 having a predetermined shape is formed. In addition, these products 3
Each of the products 3 is formed with a thin bridge portion 4 in order to prevent the product 3 from falling off after etching, and these products 3 are connected to the sheet material 1 by these bridge portions 4. The part 4 is later cut.

[0004] Such a method has the advantages that it does not require an expensive mold, and that it can be processed with high accuracy even when the product 3 is small in size and has a complicated shape. Further, since these products 3 are connected to, for example, a strip-shaped thin plate material 1, it is convenient for handling after the etching process.

However, when the product 3 thus etched is separated from the sheet material 1, it is necessary to cut the bridge portion 4 as described above. Conventionally, the cutting of these bridges 4 has been performed manually using a simple tool, which is inefficient and the mark of cutting the bridges 4 remains on the product 3. .
For this reason, this cutting trace hinders the subsequent steps, and it may be necessary to further shape the cutting trace of the bridge.

[0006]

SUMMARY OF THE INVENTION The present invention has been made based on the above circumstances, and provides a method for easily and accurately cutting a thin metal plate by etching.

[0007]

According to the present invention, first, two metal thin plates are laminated via a resin layer to produce a metal / resin laminate. Next, the metal thin plates are etched to form cutting grooves along the planned cutting lines of the metal / resin laminate. This cutting groove has, for example, a width of 0.01 to
It has a narrow width of 0.2 mm and is formed continuously around the entire circumference of the product, and no portion corresponding to a conventional bridge portion is formed.

[0008]

The thin metal plate is cut off by such a cutting groove, but the resin layer remains, so that the separated portion, that is, the product portion is connected via the resin layer. I have.

When the product is cut off, the resin layer is cut off. The cutting of the resin layer is performed by a knife or shearing. When the resin layer is cut by this shearing, since both edges of the cutting groove of the above-mentioned thin metal plate substitute for a mold, the metal / metal sheet is cut.
When an external force is applied to the resin laminate, the resin layer is easily sheared at the cutting groove, and does not require a special mold or the like.

According to such a method, a thin plate material can be accurately and easily processed into a predetermined shape. Also,
Since the conventional bridge portion is not required, there is no need to cut the bridge portion, and there is no possibility that a cut mark of the bridge portion remains on the product.

[0011]

An embodiment of the present invention will be described below with reference to FIGS. 2 and 3 show the first embodiment of the present invention.
The following shows an example. This is for manufacturing a product as described in FIG.

That is, first, the metal / resin laminate 11 is manufactured. As shown in FIG. 3, the metal / resin laminate 11 is formed by laminating two metal sheets 12, 13 such as a stainless steel sheet with a resin layer 14 interposed therebetween. The resin layer 14 is made of, for example, an acrylic synthetic resin. The resin layer 14 is semi-cured after being applied on one of the metal sheets, and then the other metal sheet is superimposed on the resin sheet, and is pressed at a predetermined pressure. The resin layer 14 is pressurized and heated, and the resin layer 14 is fully cured and adheres to the other metal sheet, and the metal sheet 12,
13 are bonded and integrally laminated.

Next, on both sides of the metal / resin laminate 11,
That is, a resist layer is applied to the surfaces of the two metal sheets 12 and 13, a predetermined portion is removed after exposure, and then the metal sheets 12 and 13 are etched. Then, a cutting groove 16 is formed in the two thin metal plates 12 and 13 by this etching process. The cutting groove 16 is formed along a cutting line for separating the product 15 from the metal / resin laminate 11.
Is formed continuously over the entire circumference of the substrate, and a portion corresponding to the bridge portion of the above-described conventional etching method is not formed. In addition, the groove width of these cutting grooves 16 is preferably in the range of 0.01 to 0.2 mm.

Since the cutting grooves 16 are formed by such etching, these thin metal plates 12 and 1 are formed.
3, the product 15 portion is completely cut off, but since the resin layer 14 as described above remains, the product 15 portion is connected to the metal / resin joint plate 11 by the resin layer 14. , Never fall off.

In this state, since each product 15 is connected to, for example, the band-shaped metal / resin laminate 11, it can be stored, transported, or otherwise handled as it is.

When the product 15 is separated from the metal / resin laminate 11, the resin layer 14 at the cutting groove 16 is cut. The resin layer 14 may be cut using a cutter. Also, using appropriate tools, this product 15 and other parts of metal and
A shearing force may be applied to the resin laminate 11 to cut the resin layer 14 at the cutting groove 16 by shearing. In this case, since the width of the cutting groove 16 is narrow, the resin layer 14
In the case of shearing, the metal sheet 1 on both sides of the cutting groove 16
2, 13 edges serve as shearing dies. Therefore, when the resin layer 14 is sheared, a special mold or the like is not required, and the resin layer 14 is pressed by pressing both sides of the cutting groove 16 in opposite directions with an appropriate tool. It is easily sheared along the cutting groove 16. When the resin layer 14 is sheared, the resin layer 14 can be easily cut simply by pressing both sides of the cutting groove 16 in opposite directions with a finger or the like.

In addition, the product 15 is supplied continuously to the assembling apparatus or the like as the strip-shaped metal / resin laminate 11 without cutting the resin layer 14 until the above components are assembled. After positioning at a predetermined assembly position or a gripping position of a robot or the like, the product 15 is
May be pressed to cut the resin layer 14 to separate the product 15. In this manner, the small product 15 can be handled efficiently, and automation of assembly is facilitated.

In this method, the product 15 is formed of a sheet material in which two metal sheets 12 and 13 are laminated by bonding with a resin layer 14. Is strong, and the metal / resin laminate has mechanically sufficient properties. Product 1
Of course, the structure and material of the metal / resin laminate 11 can be changed as appropriate according to the design specifications required for 5. For example, the material, thickness and the like of the metal thin plates 12 and 13 are appropriately selected according to the specification, and the material of the resin layer 14 is selected as appropriate according to the design specification such as heat resistance. Alternatively, a conductive resin may be used.

FIGS. 4 and 5 show a second embodiment. This is a case where the product 15 as in the first embodiment has a hole 21. In such a case, the cutting groove 16 is formed along the planned cutting line of the product 15, and the cutting groove 22 is formed along the planned cutting line of the contour of the hole 21. The configuration of the cutting groove 22 of the hole 21 is the same as that of the above-described cutting groove 16. The cutting groove 16 is formed and at the same time, the cutting groove 22 for the hole 21 is formed. Form.

The resin layer 14 is cut at the same time as the cutting of the resin layer 14 at the cutting groove 16 or before or after the cutting of the resin layer 14 at the cutting groove 22 at the hole 21.
Is cut to form the hole 21.

FIGS. 6 and 7 show a third embodiment. This is a case where irregularities and grooves are formed on one surface of a product. In this embodiment, a cutting groove 33 is formed in the portion to be cut along the contour of the product 31 in the same manner as in the above embodiment. In addition, the above one metal sheet 1
2 are formed with irregularities and grooves having a predetermined shape, for example, groove portions 32. The groove 32 is formed by removing a predetermined portion of the one thin metal plate 12 by etching when forming the cutting groove 33.

Since the metal / resin laminate 11 has the resin layer 14 interposed between the two metal thin plates 12 and 13, the predetermined portion of one of the metal thin plates 12 is etched as described above. By removing, it is possible to form irregularities and grooves. According to such a method, a pattern, other irregularities and grooves can be formed on the surface of the product 31. In this embodiment, the grooves are formed only on one of the metal sheets 12, but the grooves and the irregularities may be formed on the other metal sheet 13 by etching.

FIGS. 8 to 10 show a fourth embodiment. This is the case where the product is, for example, a narrow, long strip-shaped product, for example, a decorative border for construction having a pattern formed on the surface.

In order to manufacture such a product 41, a plurality of cutting grooves 43 are formed parallel to each other along the longitudinal direction of the band-shaped metal / resin laminate 11, and these cutting grooves 43 are formed.
The product 41 is a band-like portion between the two. Further, in one of the metal thin plates 12 of these products 41, a concave portion 42 for displaying a pattern of a predetermined shape is formed by etching.

Then, in order to cut off such a product 41, the resin layer 14 in the portion of the cutting groove 43 is cut by a cutter or the like. Further, in the case of such long products, these products 41 may be separated by a method and an apparatus as shown in FIG. 10, for example.

In other words, this device is capable of forming
A pair of shafts 51 and 52 are arranged parallel to each other in a direction orthogonal to the longitudinal direction of the resin laminate 11. Each of the shafts 51 and 52 has a roller 53 having a large diameter.
a and a roller 53b having a small diameter are rotatably supported alternately. The width of these rollers 53a, 53b is formed slightly smaller than the width of the product 41 described above. Further, the roller of the shaft 51 and the roller of the shaft 52 are disposed so as to be in contact with each other via the metal / resin laminate 11 described above,
The roller 53a having a large diameter of one shaft and the roller 53b having a small diameter of the other shaft are configured to be in rolling contact with each other.

In such an apparatus, the product 41 of the metal / resin laminate 11 is sandwiched between the rollers described above, and the metal / resin laminate 11 is run. The large-diameter rollers 53a and the small-diameter rollers 53b come into contact with each other and are alternately arranged, so that the position of the product 41 sandwiched between these rollers is alternately shifted up and down as shown in FIG. It is out of alignment. Therefore, when the metal / resin laminate 11 is run in such a state, a large shearing force acts on the resin layer 14 in the portion of the cutting groove 43 between these products 41, whereby the resin layer 14 Are sheared, and these products 41 are separated. According to such a method,
The wide metal / resin laminate 11 can be easily cut into a number of narrow band products.

The present invention is not limited to the above embodiments. For example, the metal sheets need not be of the same thickness and of the same material, and one metal sheet and the other metal sheet may have different materials and different thicknesses. In such a case, the one metal sheet and the other metal sheet may be etched in separate steps.

[0029]

According to the present invention, two metal thin plates are laminated via a resin layer to produce a metal / resin laminate. Next, these thin metal plates are etched to form cutting grooves along the planned cutting line of the metal / resin laminate, and the resin layer in the cutting grooves is cut to separate the product. When the resin layer is cut, both edges of the cutting groove of the thin metal plate substitute for a mold, so if an external force is applied to the metal / resin laminate, the resin layer is cut. It is easily sheared at the groove and does not require a special mold or the like.

According to such a method, the thin plate material can be accurately and easily processed into a predetermined shape.
In addition, since a bridge portion is not required unlike the related art, there is no need to cut the bridge portion, and there is no possibility that a cut mark of the bridge portion remains on the product.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a conventional method of processing a plate material by etching.

FIG. 2 is a diagram illustrating a processing method according to a first embodiment of the present invention.

FIG. 3 is a sectional view taken along line 3-3 in FIG. 2;

FIG. 4 is a diagram illustrating a processing method according to a second embodiment of the present invention.

FIG. 5 is a sectional view taken along lines 5-5 in FIG. 4;

FIG. 6 is a diagram illustrating a processing method according to a third embodiment of the present invention.

FIG. 7 is a sectional view taken along the line 7-7 in FIG. 6;

FIG. 8 is a diagram illustrating a processing method according to a fourth embodiment of the present invention.

9 is a sectional view taken along lines 9-9 in FIG.

FIG. 10 is a diagram illustrating an apparatus and a method for separating a product according to a fourth embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 ... Metal / resin laminated board 12 ... Metal thin plate 13 ... Metal thin plate 14 ... Resin layer 15 ... Product 16 ... Cutting groove 21 ... Cutout hole 22 ... Cutting groove 31 ... Product 33 ... Cutting groove 41 ... Product 43 ... Cutting groove

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Mitsuo Kobayashi 4-10-1 Funatari, Itabashi-ku, Tokyo Japan Metal Co., Ltd. (58) Field surveyed (Int. Cl. ⁷ , DB name) C23F 1/02 B32B 1/00-35/00

Claims (4)

(57) [Claims] 1. A process for manufacturing a metal / resin laminate in which two metal thin plates are bonded and laminated via a resin layer, and cutting the two metal thin plates into portions to be cut by etching. A method for processing a metal / resin laminate, comprising: a step of forming a groove for use; and a step of cutting the resin layer in a portion corresponding to the groove for cutting. 2. The method for processing a metal / resin laminate according to claim 1, wherein said resin layer in a portion corresponding to said cutting groove is cut by shearing. 3. The method according to claim 2, wherein the width of the cutting groove is 0.01 to 0.2 mm. 4. The method for processing a metal / resin laminate according to claim 1, wherein a predetermined etching process is performed on at least one of said thin metal plates simultaneously with said etching process of said cutting groove. .