JP3121066B2 - Imaging device - Google Patents
Imaging deviceInfo
- Publication number
- JP3121066B2 JP3121066B2 JP03277876A JP27787691A JP3121066B2 JP 3121066 B2 JP3121066 B2 JP 3121066B2 JP 03277876 A JP03277876 A JP 03277876A JP 27787691 A JP27787691 A JP 27787691A JP 3121066 B2 JP3121066 B2 JP 3121066B2
- Authority
- JP
- Japan
- Prior art keywords
- solid
- imaging device
- state imaging
- transparent member
- state
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Endoscopes (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、耐性の向上を図る撮像
装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an imaging device for improving the durability.
【０００２】[0002]
【従来の技術】従来、内視鏡などに用いられている撮像
装置は、小型化の要求に応えるべく、例えば特開昭６２
−１２２１５０号公報の第３図に見られるように、固体
撮像素子を透明部材で封止してパッケージ化したものが
多い。2. Description of the Related Art Conventionally, an imaging device used for an endoscope or the like is disclosed in
As seen in FIG. 3 of JP-A-122150, many solid-state imaging devices are sealed with a transparent member and packaged.
【０００３】このような撮像装置では、上記透明部材か
ら入射した光の一部が上記透明部材側面にて反射し、上
記固体撮像素子の受光エリアに入射してフレアー、ゴー
ストとなりやすい。そのため、透明部材側面には、反射
防止用の遮光塗料が塗布されている。In such an image pickup apparatus, a part of the light incident from the transparent member is reflected on the side surface of the transparent member, enters the light receiving area of the solid-state image pickup device, and easily becomes flare or ghost. Therefore, a light-shielding paint for preventing reflection is applied to the side surface of the transparent member.
【０００４】[0004]
【発明が解決しようとする課題】しかし、一般に、この
種の遮光塗料にはＮａ，Ｋ，Ｃｌなどの金属イオンが含
まれており、この遮光塗料中のイオンが上記透明部材と
上記固体撮像素子との境界面から侵入し、ボンディング
ワイヤなどを伝って固体撮像素子のアルミボンディング
パッドに達すると、このボンディングパッドにかかる電
位によってパッドが腐蝕する不具合がある。However, in general, this type of light-shielding paint contains metal ions such as Na, K, and Cl, and the ions in the light-shielding paint are converted into the transparent member and the solid-state imaging device. When it enters from the boundary surface of the solid-state image sensor and reaches the aluminum bonding pad of the solid-state imaging device through a bonding wire or the like, there is a problem that the pad is corroded by a potential applied to the bonding pad.
【０００５】とくに、内視鏡に用いる撮像装置では、洗
浄、消毒のために内視鏡を水、薬液に浸漬することが一
般的であり、内視鏡内は９０％以上の高湿度に達するこ
とがある。したがって、このような高湿度の環境下で使
用される撮像装置には多量の水分が含まれることにな
り、固体撮像素子のアルミ配線やボンディングパッド表
面には水酸化アルミニウム（Ａｌ(OH)3 ）ができてしま
う。この水酸化アルミニウム（Ａｌ(OH)3 ）は、両性で
酸にもアルカリにも溶ける性質があり、不純物を含む水
など上記水酸化アルミニウム（Ａｌ(OH)3 ）に反応しや
すいイオンが侵入すると、腐蝕の進行が一層助長され
る。In particular, in an imaging apparatus used for an endoscope, the endoscope is generally immersed in water or a chemical solution for cleaning and disinfection, and the inside of the endoscope reaches a high humidity of 90% or more. Sometimes. Therefore, an imaging device used in such a high humidity environment contains a large amount of water, and aluminum hydroxide (Al (OH) 3 ) is present on the surface of aluminum wiring and bonding pads of the solid-state imaging device. Can be done. This aluminum hydroxide (Al (OH) 3 ) is amphoteric and has the property of being soluble in both acids and alkalis. When ions that easily react with the aluminum hydroxide (Al (OH) 3 ), such as water containing impurities, enter the aluminum hydroxide (Al (OH) 3 ). In addition, the progress of corrosion is further promoted.
【０００６】この対策として、上記特開昭６２−１２２
１５０号公報の第１図、第２図に示されているようにパ
ッケージの外周をセラミックや金属枠で覆うことも考え
られるが、装置全体が大型化してしまい、最近の小型化
の要請に対応することが困難になる。As a countermeasure against this, Japanese Patent Laid-Open Publication No.
As shown in FIG. 1 and FIG. 2 of Japanese Patent Publication No. 150, it is conceivable to cover the outer periphery of the package with a ceramic or metal frame. However, the entire device becomes larger, and in response to recent demands for miniaturization. It becomes difficult to do.
【０００７】本発明は、上記事情に鑑みてなされたもの
で、簡単な構造で、小型化を充分満足しつつ、耐性の向
上を図ることのできる撮像装置を提供することを目的と
している。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide an image pickup apparatus which has a simple structure, can sufficiently satisfy miniaturization, and can improve resistance.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
本発明による撮像装置は、入射光強度を電気信号に変換
する固体撮像素子と、この固体撮像素子の裏面を取り付
ける基材と、前記固体撮像素子の撮像面側に設けられた
第１の電極と前記基材の固体撮像素子取付け側の面に設
けられた第２の電極とを電気的に接合して前記固体撮像
素子から電気信号を取り出す電気信号取出し部とを具備
した撮像装置において、前記固体撮像素子の撮像面と前
記電気信号取出し部と前記基材の固体撮像素子取付け側
の面とを透明部材で封止し、この透明部材の光入射面及
び前記透明部材と前記基材との密着面を除き前記透明部
材と前記基材との境界線を含む両者の側表面に、金属イ
オンを含まない組成で遮光性を有する合成樹脂材を塗布
したことを特徴とする。In order to achieve the above object, an image pickup apparatus according to the present invention comprises a solid-state image sensor for converting incident light intensity into an electric signal, and a back surface of the solid-state image sensor .
Substrate provided on the imaging surface side of the solid-state imaging device.
The first electrode and the substrate are provided on the surface of the substrate on the side where the solid-state imaging device is mounted.
In the image pickup apparatus having an electrical signal output member of a second electrode kicked electrically joined withdrawing electric signal from the solid-state imaging surface of the solid-state image pickup element and the front
The electrical signal extraction unit and the solid-state imaging device mounting side of the base material
Sealed and surface of a transparent member, the light incident surface 及 of the transparent member
Except the contact surface between the fine said transparent member and said base member said transparent portion
The metal surface is provided on both side surfaces including the boundary line between the material and the base material.
It is characterized in that a synthetic resin material having a composition not containing ON and having a light-shielding property is applied.
【０００９】[0009]
【作 用】上記構成において、固体撮像素子の撮像面と
前記電気信号取出し部と前記基材の固体撮像素子取付け
側の面とを封止した透明部材の光入射面及び前記透明部
材と前記基材との密着面を除き前記透明部材と前記基材
との境界線を含む両者の側表面に、金属イオンを含まな
い組成で遮光性を有する合成樹脂材を塗布したので、固
体撮像素子と透明部材との境界面から侵入するイオンが
なく、従って、イオンによる腐蝕から固体撮像素子、電
気信号取出し部を有効に保護することができる。[Operation] In the above configuration, the imaging surface of the solid-state imaging device is
The solid-state imaging device mounted in the base material and the electric signal take-out portion
The light incident surface of the transparent member sealing the side surface and the transparent portion
Except the contact surface between the the wood substrate the transparent member and the base member
No metal ions are present on both side surfaces, including the boundary
Having applied the synthetic resin material having a light shielding property in the stomach composition, ions entering from the boundary surface between the solid-state image pickup element and the transparent member
Therefore, the solid-state imaging device and the electrical signal output portion can be effectively protected from corrosion by ions .
【００１０】[0010]
【実施例】以下、図面に基づいて本発明の実施例を説明
する。Embodiments of the present invention will be described below with reference to the drawings.
【００１１】図１〜図５は本発明の第一実施例を示し、
図１は撮像装置で（ａ）は（ｂ）ののＡ−Ａ断面図、
（ｂ）は（ａ）のＢ−Ｂ断面図、図２は内視鏡先端部の
断面図、図３〜図５はプリズム部の態様別断面図であ
る。1 to 5 show a first embodiment of the present invention.
1A and 1B are cross-sectional views of the imaging device taken along line AA of FIG.
(B) is a cross-sectional view taken along the line BB of (a), FIG. 2 is a cross-sectional view of a distal end portion of the endoscope, and FIGS.
【００１２】図中の符号１は撮像装置で、この撮像装置
１のセラミックベース２にＣＣＤなどの固体撮像素子３
がダイボンディングされている。また、上記固体撮像素
子３と、この固体撮像素子３のアルミボンディングパッ
ド４、および、上記セラミックベース２のボンディング
パッド５とがアルミボンディングワイヤ６で電気的に接
続されている。なお、このパッド４，５、ワイヤ６で電
気信号取出し部Ｅを構成している。In FIG. 1, reference numeral 1 denotes an imaging device, and a solid-state imaging device 3 such as a CCD is mounted on a ceramic base 2 of the imaging device 1.
Are die bonded. The solid-state imaging device 3 is electrically connected to the aluminum bonding pad 4 of the solid-state imaging device 3 and the bonding pad 5 of the ceramic base 2 by aluminum bonding wires 6. Note that the pads 4 and 5 and the wire 6 constitute an electric signal extracting unit E.
【００１３】また、上記セラミックベース２と上記固体
撮像素子３との表面が透明部材の一例である透明樹脂材
７で封止されている。The surfaces of the ceramic base 2 and the solid-state imaging device 3 are sealed with a transparent resin material 7, which is an example of a transparent member.
【００１４】また、上記透明樹脂材７の少なくとも光入
射面７ａと、上記固体撮像素子３との密着面を除く部分
に反射防止用の遮光性塗料８が塗布されている。A light-shielding paint 8 for preventing reflection is applied to at least a portion of the transparent resin material 7 except for a light incident surface 7a and a contact surface with the solid-state imaging device 3.
【００１５】この遮光性塗料８は、Ｎａ，Ｋ，Ｃｌなど
元素周期上の１Ａおよび７Ａの金属イオンを含まない組
成からなる合成樹脂材で、例えば、黒いエポキシ系接着
剤である。The light-shielding paint 8 is a synthetic resin material having a composition not containing metal ions of 1A and 7A in the element cycle such as Na, K, and Cl, and is, for example, a black epoxy adhesive.
【００１６】なお、符号９は上記固体撮像素子３の撮像
面であるイメージエリアである。Reference numeral 9 denotes an image area which is an imaging surface of the solid-state imaging device 3.
【００１７】図２に上記撮像装置１を組込んだ側視型内
視鏡の先端部１１を示す。FIG. 2 shows a distal end portion 11 of a side-viewing type endoscope in which the image pickup device 1 is incorporated.
【００１８】この内視鏡先端部１１の金属製の先端部本
体１１ａに、予め一体に組立てられた撮像ユニット１２
が０リング１３で水密性を保持しつつ図示しない固定ビ
スで着脱自在に固定されている。An imaging unit 12 previously assembled integrally with a metal distal end body 11a of the endoscope distal end 11
Are detachably fixed by fixing screws (not shown) while maintaining watertightness by an O-ring 13.
【００１９】また、上記先端部本体１１ａにはライトガ
イドファイバ１４が図示しない固定ビスで固定されてい
るとともに、このライトガイドファイバ１４の先端面に
対向する位置に照明レンズ１５が水密状態で固定されて
いる。なお、符号１６は送気送水ノズル、１７は送気送
水チャンネルである。A light guide fiber 14 is fixed to the distal end body 11a with a fixing screw (not shown), and an illumination lens 15 is fixed in a watertight state at a position facing the distal end surface of the light guide fiber 14. ing. Reference numeral 16 denotes an air / water nozzle, and 17 denotes an air / water channel.
【００２０】また、上記先端部本体１１ａの外周に、絶
縁性を有する先端カバー１８が設けられている。A distal end cover 18 having an insulating property is provided on the outer periphery of the distal end portion main body 11a.
【００２１】一方、上記撮像ユニット１２の電気的絶縁
性を有する枠体１９にカバーレンズ２０およびプリズム
２１が接着固定されている。また、この枠体１９の上記
プリズム２１の反射方向に対物レンズ２２を収納するレ
ンズ枠２３が接着固定されており、さらに、レンズ枠２
３の上記対物レンズ２２の出射方向に、上記撮像装置１
をピント調整後接着固定した枠体２４が固設されてい
る。また、この枠体２４には上記撮像装置１に接続する
回路基板２５が収納されている。On the other hand, a cover lens 20 and a prism 21 are adhered and fixed to a frame 19 of the image pickup unit 12 having electrical insulation. Further, a lens frame 23 for accommodating the objective lens 22 is adhered and fixed in the reflection direction of the prism 21 of the frame body 19.
3 in the emission direction of the objective lens 22, the imaging device 1
After the focus adjustment, the frame body 24 is fixedly adhered. The frame 24 houses a circuit board 25 connected to the imaging device 1.
【００２２】この回路基板２５には図示しない複数のリ
ード線が接続されており、これらのリード線が図示しな
いビデオプロセッサに接続されている。A plurality of lead wires (not shown) are connected to the circuit board 25, and these lead wires are connected to a video processor (not shown).
【００２３】また、図３に示すように上記プリズム２１
が、プリズム本体２１ａと、このプリズム本体２１ａを
インサート部材として成形する吸湿性の低い樹脂あるい
は粉体よりなる枠部２１ｂとで構成されている。Further, as shown in FIG.
Are composed of a prism main body 21a and a frame portion 21b made of a resin or powder having low hygroscopicity and molded using the prism main body 21a as an insert member.
【００２４】（作 用）次に、上記構成による実施例の
作用について説明する。(Operation) Next, the operation of the embodiment having the above configuration will be described.
【００２５】内視鏡先端部１１の撮像ユニット１２に組
込んだ撮像装置１のセラミックベース２と固体撮像素子
３との表面を封止する透明樹脂材７の外周に塗布した遮
光性塗料８を合成樹脂材としたので、この遮光性塗料８
中に金属イオンが含まれておらず、したがって、上記固
体撮像素子３と上記透明樹脂材７との境界面から侵入す
るイオンによって上記固体撮像素子３のアルミボンディ
ングパッド４、セラミックベース２のボンディングパッ
ド５、および、これらを接続するアルミボンディングワ
イヤ６が腐蝕することがない。また、高湿度下で上記パ
ッド４、ワイヤ６などの表面に水酸化アルミニウム（Ａ
ｌ(OH)3 ）が生成されても、この水酸化アルミニウム
（Ａｌ(OH)3 ）に上記イオンが反応しないため腐蝕が進
行することもなく、上記撮像装置１全体を腐蝕から有効
に保護することができる。A light-shielding paint 8 applied to the outer periphery of a transparent resin material 7 for sealing the surfaces of the ceramic base 2 and the solid-state image pickup device 3 of the image pickup device 1 incorporated in the image pickup unit 12 of the endoscope end portion 11 is provided. Since the synthetic resin material is used, this light-shielding paint 8
Since no metal ions are contained therein, the aluminum bonding pad 4 of the solid-state imaging device 3 and the bonding pad of the ceramic base 2 are formed by ions entering from the interface between the solid-state imaging device 3 and the transparent resin material 7. 5 and the aluminum bonding wire 6 connecting them are not corroded. In addition, under high humidity, aluminum hydroxide (A)
Even if 1 (OH) 3 ) is generated, the ions do not react with the aluminum hydroxide (Al (OH) 3 ), so that the corrosion does not progress, and the entire image pickup device 1 is effectively protected from corrosion. be able to.
【００２６】また、撮像ユニット１２が予め一体に組立
てた状態で内視鏡先端部本体１１ａに組付けられている
ので、部品交換時に固体撮像素子３のピントがずれるこ
とがなく再調整が不要で、また、交換時にユニット内に
ごみなどが混入することもなく、良好な修理性を得るこ
とができ、部品交換の効率化を図ることができる。Further, since the imaging unit 12 is assembled to the endoscope distal end main body 11a in a state of being assembled in advance, the solid-state imaging device 3 is not defocused at the time of component replacement, and no re-adjustment is required. In addition, it is possible to obtain good repairability without dust or the like being mixed in the unit at the time of replacement, and to improve the efficiency of component replacement.
【００２７】さらに、プリズム２１の枠部２１ｂがプリ
ズム本体２１ａをインサート部材として樹脂成形あるい
は粉体成形されているので、プリズム本体２１ａの形状
が複雑であっても容易に成形することができ、この枠部
２１ｂを上記プリズム本体２１ａに合せて切削したり放
電加工したりする必要がなく、高精度で安価に製造する
ことができる。Further, since the frame portion 21b of the prism 21 is formed by resin molding or powder molding using the prism main body 21a as an insert member, the prism main body 21a can be easily molded even if the shape thereof is complicated. There is no need to cut or perform electric discharge machining of the frame portion 21b in accordance with the prism main body 21a, and it is possible to manufacture the frame portion 21b with high precision at low cost.
【００２８】なお、図４に示すように、上記プリズム２
１の枠部２１ｂに位置決め突起２１ｃを同時に形成する
ようにすれば、この位置決め突起２１ｃに係合する位置
決め穴を上記内視鏡先端部１１に組込んだ撮像ユニット
１２の枠体１９に形成しておくことで組付け位置を治具
を用いたりすることなく簡単に割出すことができ、正確
な位置に接着固定させることができる。Incidentally, as shown in FIG.
If the positioning projections 21c are formed simultaneously on one frame portion 21b, a positioning hole to be engaged with the positioning projections 21c is formed in the frame body 19 of the imaging unit 12 incorporated in the endoscope distal end portion 11. By doing so, the assembling position can be easily determined without using a jig, and can be bonded and fixed at an accurate position.
【００２９】また、図５に示すようにプリズム２１の枠
部２１ｂを透明樹脂で形成すればインサート部材である
プリズム本体２１ａの上面を覆うことができる。その結
果、このプリズム本体２１ａと枠部２１ｂとの界面が上
記撮像ユニット１２のカバーレンズ２０側に露呈しない
ので内部への湿気の侵入を防止することができる。If the frame 21b of the prism 21 is made of a transparent resin as shown in FIG. 5, the upper surface of the prism body 21a as an insert member can be covered. As a result, since the interface between the prism body 21a and the frame portion 21b is not exposed to the cover lens 20 side of the imaging unit 12, it is possible to prevent moisture from entering the inside.
【００３０】（第二実施例）図６は本発明の第二実施例
による撮像装置で（ａ）は（ｂ）のＡ−Ａ断面図、
（ｂ）は（ａ）のＢ−Ｂ断面図である。(Second Embodiment) FIGS. 6A and 6B show an image pickup apparatus according to a second embodiment of the present invention, wherein FIG.
(B) is BB sectional drawing of (a).
【００３１】この実施例に示す撮像装置３１では、固体
撮像素子３２のボンディングパッドに、ＴＡＢ（テープ
・オートメィデット・ボンディグ）テープ３３の一端に
設けた電気信号取出し部であるバンプ３３ａがボンディ
ングされており、このＴＡＢテープ３３の外部端子を兼
用する他端が上記固体撮像素子３２の側面に沿って曲げ
形成されて後方へ延出されている。In the image pickup device 31 shown in this embodiment, a bump 33a as an electric signal output portion provided at one end of a TAB (tape / automated bond) tape 33 is bonded to a bonding pad of the solid-state image pickup device 32. The other end of the TAB tape 33, which also serves as an external terminal, is bent along the side surface of the solid-state imaging device 32 and extends rearward.
【００３２】また、上記固体撮像素子３２の表面にカバ
ーガラス３４が当接され、このカバーガラス３４と固体
撮像素子３２との間が透明樹脂材３５で接着封止されて
いる。さらに、この透明樹脂材３５にて上記ＴＡＢテー
プ３３が固体撮像素子３２の側面に接着されている。な
お、固体撮像素子３２の裏面をベース部材あるいは上記
透明樹脂材３５で封止しても良い。A cover glass 34 is in contact with the surface of the solid-state image sensor 32, and the space between the cover glass 34 and the solid-state image sensor 32 is bonded and sealed with a transparent resin material 35. Further, the TAB tape 33 is adhered to the side surface of the solid-state imaging device 32 with the transparent resin material 35. Note that the back surface of the solid-state imaging device 32 may be sealed with a base member or the transparent resin material 35.
【００３３】さらに、上記カバーガラス３４の少なくと
も光入射面３４ａと固体撮像素子３２との密着面を除く
部分、および固体撮像素子３２の側面に第一実施例と同
様の反射防止用の遮光性塗料（例えば、黒いエポキシ系
接着剤）８が塗布されている。Further, at least a portion of the cover glass 34 except for a contact surface between the light incident surface 34a and the solid-state image pickup device 32 and a side surface of the solid-state image pickup device 32 are provided with the same light-shielding paint for anti-reflection as in the first embodiment. (For example, a black epoxy adhesive) 8 is applied.
【００３４】なお、符号３６は固体撮像素子３２の撮像
面であるイメージエリアである。Reference numeral 36 denotes an image area which is an imaging surface of the solid-state imaging device 32.
【００３５】上記カバーガラス３４と固体撮像素子３２
とを封止する部材、および、遮光塗料８が樹脂材である
ため、前記第一実施例と同様境界面から侵入するイオン
によって固体撮像素子３２のパッドなどが腐蝕すること
がなく、有効に保護することができる。The cover glass 34 and the solid-state image sensor 32
The sealing member and the light-shielding paint 8 are made of a resin material, so that the pad and the like of the solid-state imaging device 32 are not corroded by ions entering from the boundary surface as in the first embodiment, and are effectively protected. can do.
【００３６】[0036]
【発明の効果】以上、説明したように本発明によれば、
反射防止用の遮光部材を金属イオンを含まない合成樹脂
材としたので、固体撮像素子と透明部材との境界面にイ
オンが侵入しても電気信号取出し部などを腐蝕から有効
に保護し、耐性の向上を図ることができる。As described above, according to the present invention,
Since the anti-reflection light-blocking member is made of a synthetic resin material that does not contain metal ions, even if ions enter the interface between the solid-state imaging device and the transparent member, the electrical signal output section and other parts are effectively protected from corrosion, and have resistance. Can be improved.
【００３７】また、合成樹脂材を塗布しただけであるた
め構造が簡単で小型化を充分満足することができる。Further, since the synthetic resin material is merely applied, the structure is simple and the miniaturization can be sufficiently satisfied.
【図１】図１〜図５は本発明の第一実施例を示し、図１
は撮像装置で（ａ）は（ｂ）のＡ−Ａ断面図、（ｂ）は
（ａ）のＢ−Ｂ断面図1 to 5 show a first embodiment of the present invention.
FIG. 2A is an AA cross-sectional view of FIG. 2B, and FIG. 2B is a BB cross-sectional view of FIG.
【図２】内視鏡先端部の断面図FIG. 2 is a cross-sectional view of an endoscope end portion.
【図３】図３〜図５はプリズム部の態様別断面図FIG. 3 to FIG. 5 are cross-sectional views according to modes of a prism portion.
【図４】同上FIG. 4
【図５】同上FIG. 5
【図６】本発明の第二実施例による撮像装置で（ａ）は
（ｂ）のＡ−Ａ断面図、（ｂ）は（ａ）のＢ−Ｂ断面図FIGS. 6A and 6B are cross-sectional views taken along line AA of FIG. 6B, and FIG. 6B is a cross-sectional view taken along line B-B of FIG.
１………………撮像装置 ３，３２………固体撮像素子 ７，３４………透明部材 ７ａ，３４ａ…光入射面 ８………………樹脂材 ９，３６………撮像面 Ｅ，３３ａ……電気信号取出し部 1 imaging device 3, 32 solid-state imaging device 7, 34 transparent member 7a, 34a light incident surface 8 resin material 9, 36 imaging surface E, 33a ... Electrical signal extraction unit
Claims (1)
像素子と、この固体撮像素子の裏面を取り付ける基材
と、前記固体撮像素子の撮像面側に設けられた第１の電
極と前記基材の固体撮像素子取付け側の面に設けられた
第２の電極とを電気的に接合して前記固体撮像素子から
電気信号を取り出す電気信号取出し部とを具備した撮像
装置において、 前記固体撮像素子の撮像面と前記電気信号取出し部と前
記基材の固体撮像素子取付け側の面とを透明部材で封止
し、この透明部材の光入射面及び前記透明部材と前記基
材との密着面を除き前記透明部材と前記基材との境界線
を含む両者の側表面に、金属イオンを含まない組成で遮
光性を有する合成樹脂材を塗布したことを特徴とする撮
像装置。1. A solid-state image sensor for converting the intensity of incident light into an electric signal, and a substrate on which a back surface of the solid-state image sensor is mounted.
And a first power supply provided on the imaging surface side of the solid-state imaging device.
Provided on the surface of the pole and the substrate on the side where the solid-state imaging device is mounted
In the image pickup apparatus having an electrical signal output member of the second electrode electrically joined withdrawing electric signal from the solid-state imaging device, the electrical signal extraction section and the front and the imaging surface of the solid-state imaging device
The surface of the substrate on the side where the solid-state imaging device is mounted is sealed with a transparent member, and the light incident surface of the transparent member and the transparent member and the substrate are sealed.
Border the contact surface between wood and the Except transparent member and the base member
An imaging device, characterized in that a synthetic resin material having a composition not containing metal ions and having a light-shielding property is applied to both side surfaces thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03277876A JP3121066B2 (en) | 1991-10-24 | 1991-10-24 | Imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03277876A JP3121066B2 (en) | 1991-10-24 | 1991-10-24 | Imaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05121709A JPH05121709A (en) | 1993-05-18 |
| JP3121066B2 true JP3121066B2 (en) | 2000-12-25 |
Family
ID=17589523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03277876A Expired - Fee Related JP3121066B2 (en) | 1991-10-24 | 1991-10-24 | Imaging device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3121066B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4538158B2 (en) * | 2001-01-29 | 2010-09-08 | Ｈｏｙａ株式会社 | Side view of electronic endoscope |
| JP4672301B2 (en) * | 2004-07-28 | 2011-04-20 | 富士フイルム株式会社 | Solid-state imaging device and method for manufacturing solid-state imaging device |
| JP4486005B2 (en) | 2005-08-03 | 2010-06-23 | パナソニック株式会社 | Semiconductor imaging device and manufacturing method thereof |
| JP5078468B2 (en) * | 2007-07-03 | 2012-11-21 | オリンパス株式会社 | Endoscope |
| JP5389376B2 (en) * | 2008-05-14 | 2014-01-15 | オリンパスメディカルシステムズ株式会社 | Endoscope imaging unit |
| US9350906B2 (en) * | 2008-10-02 | 2016-05-24 | Omnivision Technologies, Inc. | Encapsulant module with opaque coating |
| JP2010135821A (en) * | 2010-01-21 | 2010-06-17 | Panasonic Corp | Semiconductor imaging device and method of manufacturing same |
| JP2017113077A (en) * | 2015-12-21 | 2017-06-29 | ソニー・オリンパスメディカルソリューションズ株式会社 | Endoscope device |
-
1991
- 1991-10-24 JP JP03277876A patent/JP3121066B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05121709A (en) | 1993-05-18 |
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