JP3133101B2 - Method for producing polyhexamethylene adipamide with low triamine - Google Patents
Method for producing polyhexamethylene adipamide with low triamineInfo
- Publication number
- JP3133101B2 JP3133101B2 JP03184504A JP18450491A JP3133101B2 JP 3133101 B2 JP3133101 B2 JP 3133101B2 JP 03184504 A JP03184504 A JP 03184504A JP 18450491 A JP18450491 A JP 18450491A JP 3133101 B2 JP3133101 B2 JP 3133101B2
- Authority
- JP
- Japan
- Prior art keywords
- polymer
- bht
- polyhexamethylene adipamide
- content
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920002302 Nylon 6,6 Polymers 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title description 9
- 229920000642 polymer Polymers 0.000 claims description 44
- 238000006116 polymerization reaction Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 16
- 239000005749 Copper compound Substances 0.000 claims description 12
- 150000001880 copper compounds Chemical class 0.000 claims description 12
- 239000007864 aqueous solution Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- -1 hexamethylene ammonium adipate salt Chemical compound 0.000 claims description 5
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 230000000704 physical effect Effects 0.000 description 9
- 239000000835 fiber Substances 0.000 description 8
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 8
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 235000019253 formic acid Nutrition 0.000 description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
- UFFRSDWQMJYQNE-UHFFFAOYSA-N 6-azaniumylhexylazanium;hexanedioate Chemical compound [NH3+]CCCCCC[NH3+].[O-]C(=O)CCCCC([O-])=O UFFRSDWQMJYQNE-UHFFFAOYSA-N 0.000 description 3
- 229910021595 Copper(I) iodide Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- LSXDOTMGLUJQCM-UHFFFAOYSA-M copper(i) iodide Chemical compound I[Cu] LSXDOTMGLUJQCM-UHFFFAOYSA-M 0.000 description 3
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000009987 spinning Methods 0.000 description 3
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 2
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 239000003708 ampul Substances 0.000 description 2
- 238000011088 calibration curve Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 2
- QTMDXZNDVAMKGV-UHFFFAOYSA-L copper(ii) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- DJZKNOVUNYPPEE-UHFFFAOYSA-N tetradecane-1,4,11,14-tetracarboxamide Chemical compound NC(=O)CCCC(C(N)=O)CCCCCCC(C(N)=O)CCCC(N)=O DJZKNOVUNYPPEE-UHFFFAOYSA-N 0.000 description 2
- SIOVKLKJSOKLIF-HJWRWDBZSA-N trimethylsilyl (1z)-n-trimethylsilylethanimidate Chemical compound C[Si](C)(C)OC(/C)=N\[Si](C)(C)C SIOVKLKJSOKLIF-HJWRWDBZSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- XJKSTNDFUHDPQJ-UHFFFAOYSA-N 1,4-diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=C(C=2C=CC=CC=2)C=C1 XJKSTNDFUHDPQJ-UHFFFAOYSA-N 0.000 description 1
- AWGBWLXGUPTXHF-UHFFFAOYSA-N 2,2,2-trifluoro-n-methyl-n-(2,2,2-trifluoroacetyl)acetamide Chemical compound FC(F)(F)C(=O)N(C)C(=O)C(F)(F)F AWGBWLXGUPTXHF-UHFFFAOYSA-N 0.000 description 1
- BMYNFMYTOJXKLE-UHFFFAOYSA-N 3-azaniumyl-2-hydroxypropanoate Chemical compound NCC(O)C(O)=O BMYNFMYTOJXKLE-UHFFFAOYSA-N 0.000 description 1
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- 229910021589 Copper(I) bromide Inorganic materials 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 229910021590 Copper(II) bromide Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910001508 alkali metal halide Inorganic materials 0.000 description 1
- 229910001615 alkaline earth metal halide Inorganic materials 0.000 description 1
- MRNZSTMRDWRNNR-UHFFFAOYSA-N bis(hexamethylene)triamine Chemical compound NCCCCCCNCCCCCCN MRNZSTMRDWRNNR-UHFFFAOYSA-N 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- NKNDPYCGAZPOFS-UHFFFAOYSA-M copper(i) bromide Chemical compound Br[Cu] NKNDPYCGAZPOFS-UHFFFAOYSA-M 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 229940045803 cuprous chloride Drugs 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- CVFJNXQOIZKPMG-UHFFFAOYSA-L dipotassium;dioxido-oxo-phenyl-$l^{5}-phosphane Chemical compound [K+].[K+].[O-]P([O-])(=O)C1=CC=CC=C1 CVFJNXQOIZKPMG-UHFFFAOYSA-L 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009661 fatigue test Methods 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 229930184652 p-Terphenyl Natural products 0.000 description 1
- NAYYNDKKHOIIOD-UHFFFAOYSA-N phthalamide Chemical compound NC(=O)C1=CC=CC=C1C(N)=O NAYYNDKKHOIIOD-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 1
- 229920006123 polyhexamethylene isophthalamide Polymers 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 235000007715 potassium iodide Nutrition 0.000 description 1
- VENHOSDSAVICHW-UHFFFAOYSA-M potassium phenylphosphinate Chemical compound [K+].[O-]P(=O)C1=CC=CC=C1 VENHOSDSAVICHW-UHFFFAOYSA-M 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 235000009518 sodium iodide Nutrition 0.000 description 1
- 229940048086 sodium pyrophosphate Drugs 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- 125000004044 trifluoroacetyl group Chemical group FC(C(=O)*)(F)F 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- NCPXQVVMIXIKTN-UHFFFAOYSA-N trisodium;phosphite Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])[O-] NCPXQVVMIXIKTN-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polyamides (AREA)
- Artificial Filaments (AREA)
- Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、物性の優れたポリヘキ
サメチレンアジパミドの製造方法に関する。さらに詳し
くは、強度耐疲労性などの物性の優れたタイヤコードな
どの産業資材用のポリヘキサメチレンアジパミドの製造
方法に関する。The present invention relates to a polyhexene having excellent physical properties.
The present invention relates to a method for producing Samethylene Adipamide . More specifically , manufacture of polyhexamethylene adipamide for industrial materials such as tire cords with excellent physical properties such as strength and fatigue resistance
About the method .
【0002】[0002]
【従来の技術】ポリヘキサメチレンアジパミドの製造方
法としては、例えば米国特許3,562,206号に記
載されているように、50重量%のヘキサメチレンアン
モニウムアジペート塩(以下AH塩という)水溶液を用
いて、これを濃縮し、溶融重合してプレポリマーを得
て、これを固相重合する方法が採られてきた。2. Description of the Related Art As a method for producing polyhexamethylene adipamide, for example, as described in US Pat. No. 3,562,206, a 50% by weight aqueous solution of hexamethylene ammonium adipate salt (hereinafter referred to as AH salt) is used. A method has been employed in which the polymer is concentrated and melt-polymerized to obtain a prepolymer, which is then subjected to solid-phase polymerization.
【0003】しかし、このような方法では、ポリマー分
子鎖の分岐の原因になるビスヘキサメチレントリアミン
(以下BHTという)が生成する。このBHTは、3つ
の反応基を有しているため、3方向に重合反応しポリマ
ー分子中に分岐を生じる。さらに反応が進むと網目状に
なり、分子が三次元化しゲルを形成することになる。[0003] However, in such a method, bishexamethylenetriamine (hereinafter referred to as BHT) that causes branching of the polymer molecular chain is generated. Since this BHT has three reactive groups, it undergoes a polymerization reaction in three directions to cause branching in the polymer molecule. As the reaction proceeds further, the molecules form a network, and the molecules become three-dimensional and form a gel.
【0004】このため、ポリマーの物性、例えば粘弾性
などが影響を受ける。また、このポリマーを用いた繊維
あるいは成形体はその物性に影響を受け、例えば耐疲労
性などが低下する。また、このポリマーを用いて成形体
を製造する時には、例えば繊維の製造時には、BHTが
ポリマー分子鎖中に存在すると粘度の斑が生じ、切れ糸
や毛羽が発生する。このため、BHTの少ないポリマー
が求められていた。[0004] For this reason, the physical properties of the polymer, such as viscoelasticity, are affected. In addition, a fiber or a molded body using this polymer is affected by its physical properties, for example, the fatigue resistance and the like are reduced. Further, when a molded body is produced using this polymer, for example, in the production of fibers, if BHT is present in the polymer molecular chain, unevenness in viscosity occurs, and cut yarns and fluff are generated. For this reason, a polymer with less BHT has been demanded.
【0005】これまでにBHTを減少させる方法として
は、例えば特開平2−99610号公報のような方法が
開示されている。これは、先ず、溶融重合方法により蟻
酸相対粘度が70以下のポリマーを製造し、これを18
0〜240℃の比較的低温で蟻酸相対粘度が80以上に
なるまで固相重合する方法である。しかし、この方法で
はポリマー中のBHTは、その中に記載されているよう
に2モル/kg程度(430mg/g)にしかできなか
った。As a method for reducing BHT, a method as disclosed in Japanese Patent Application Laid-Open No. 2-99610 has been disclosed. First, a polymer having a formic acid relative viscosity of 70 or less is produced by a melt polymerization method.
This is a method in which solid phase polymerization is performed at a relatively low temperature of 0 to 240 ° C. until the formic acid relative viscosity becomes 80 or more. However, according to this method, BHT in the polymer was only about 2 mol / kg (430 mg / g) as described therein.
【0006】[0006]
【発明が解決しようとする課題】本発明の目的は強度、
耐疲労性などの物性が優れたポリヘキサメチレンアジパ
ミドの製造方法を提供するにある。SUMMARY OF THE INVENTION An object of the present invention is to provide strength,
Po Li hexamethylene adipamide where properties such as fatigue resistance superior
An object of the present invention is to provide a method for producing a mid .
【0007】[0007]
【課題を解決するための手段】本発明者らは、ポリヘキ
サメチレンアジパミドの分子鎖構造とその繊維及び成形
体の物性との関係を鋭意研究した結果、BHTの含有量
と繊維及び成形体の物性とは密接な関係があることを見
出した。また、BHTの生成過程を詳細に研究した結
果、BHTの生成は、アミノ末端基量の多い重合工程の
初期において、水分の寄与を受けて生成し、さらに銅化
合物が共存するとBHTの生成はより顕著になることを
見出し本発明に到った。Means for Solving the Problems The present inventors have conducted intensive studies on the relationship between the molecular chain structure of polyhexamethylene adipamide and the physical properties of the fibers and molded articles thereof. I found that there is a close relationship with physical properties of the body. Further, as a result of a detailed study of the formation process of BHT, it was found that BHT is formed due to the contribution of moisture in the early stage of the polymerization process having a large amount of amino terminal groups, and the formation of BHT is further enhanced when a copper compound is present. The present invention was found to be remarkable and led to the present invention.
【0008】すなわち、本発明は、AH塩水溶液を用い
て銅化合物の含有量が銅元素としてポリマーに対して3
0ppm以上であるポリヘキサメチレンアジパミドを溶
融重合する方法において、重合系内の水分率が15重量
%以下のところで銅化合物を添加することを特徴とする
ポリマー分子中に含まれるビスヘキサメチレントリアミ
ンの量がポリマー1g当たり0.4mg以下であるポリ
ヘキサメチレンアジパミドの製造方法、である。That is, according to the present invention, the content of a copper compound is set to 3
In a method of melt-polymerizing polyhexamethylene adipamide of 0 ppm or more, a copper compound is added at a water content of 15% by weight or less in a polymerization system.
Bishexamethylene triamid contained in polymer molecules
Wherein the amount of polyhexamethylene adipamide is 0.4 mg or less per gram of polymer .
【0009】本発明に用いるヘキサメチレンアジパミド
は、分子鎖の繰り返し単位が−NH(CH2 )6 NHC
O(CH2 ) 4 CO−よりなるポリヘキサメチレンアジ
パミドである。分子量は、特に規定はしないが、繊維、
成形体では、数平均分子量10,000〜30,000
が好ましい。なお、共重合体成分を15%未満含んでも
よい。共重合し得る他の成分として、例えば、ε−カプ
ラミド、ポリヘキサメチレンセバカミド、ポリヘキサメ
チレンイソフタラミド、ポリヘキサメチレンテレフタラ
ミド、ポリキシレンフタラミドなどを共重合させてもよ
い。The hexamethylene adipamide used in the present invention has a molecular chain repeating unit of --NH (CH 2 ) 6 NHC
Polyhexamethylene adipamide consisting of O (CH 2 ) 4 CO—. Although the molecular weight is not particularly specified, fibers,
In the molded article, the number average molecular weight is 10,000 to 30,000
Is preferred. The copolymer component may be contained in less than 15%. As other components that can be copolymerized, for example, ε-capramide, polyhexamethylene sebacamide, polyhexamethylene isophthalamide, polyhexamethylene terephthalamide, polyxylene phthalamide, and the like may be copolymerized.
【0010】本発明で用いられる銅化合物は、沃化第一
銅、臭化第一銅、臭化第二銅、塩化第一銅、塩化第二
銅、酢酸銅などが用いられる。ポリマー中の銅化合物の
量は、銅元素として30ppm以上であることが必要で
ある。銅元素の含有量が、30ppm未満であると、熱
安定剤としての効果が小さい。The copper compound used in the present invention includes cuprous iodide, cuprous bromide, cupric bromide, cuprous chloride, cupric chloride, copper acetate and the like. It is necessary that the amount of the copper compound in the polymer is 30 ppm or more as a copper element. When the content of the copper element is less than 30 ppm, the effect as a heat stabilizer is small.
【0011】また、安定剤は、銅化合物とともに、アル
カリまたは、アルカリ土類金属のハロゲン化物、例えば
沃化カリウム、塩化カリウム、沃化ナトリウム、臭化ナ
トリウム、塩化カルシウム、好ましくは沃化カリウムを
添加することが好ましい。またさらに、無機及び有機の
燐化合物、例えばピロリン酸ソーダ、亜燐酸ソーダ、次
亜燐酸ソーダ、トリフェニルホスファイト、フェニルホ
スフィン酸カリウム、フェニルホスホン酸カリウム、好
ましくは次亜燐酸ソーダを併用して含有させるのが好ま
しい。The stabilizer may be an alkali or alkaline earth metal halide such as potassium iodide, potassium chloride, sodium iodide, sodium bromide, calcium chloride, preferably potassium iodide, together with the copper compound. Is preferred. Furthermore, inorganic and organic phosphorus compounds, for example, sodium pyrophosphate, sodium phosphite, sodium hypophosphite, triphenyl phosphite, potassium phenylphosphinate, potassium phenylphosphonate, preferably containing sodium hypophosphite in combination It is preferred that
【0012】また、その他の添加剤として、触媒、光安
定剤、顔料、艶消し剤などを含んでいてもよい。本発明
のポリヘキサメチレンアジパミドは分子鎖中に含まれる
BHTの量が、ポリマー1g当たり0.4mg以下であ
ることが必要である。好ましくは、0.3〜0.01m
g/gである。Further, other additives may include a catalyst, a light stabilizer, a pigment, a matting agent, and the like. In the polyhexamethylene adipamide of the present invention, the amount of BHT contained in the molecular chain needs to be 0.4 mg or less per 1 g of the polymer. Preferably, 0.3 to 0.01 m
g / g.
【0013】BHTの含有量が0.4mg/gを越える
と、ポリマー分子の分岐度合が大きくなり、繊維あるい
は成形体の物性が低下する、例えば耐疲労性が低くな
る。溶融ポリマーでは、分岐することにより粘性が変化
し、例えば繊維の紡糸延伸時にポリマーの粘度斑が生
じ、これにより糸切れ、毛羽が発生する。BHTがポリ
マー中に0.4mg/g以下含有する製造方法を以下に
説明する。When the content of BHT exceeds 0.4 mg / g, the degree of branching of the polymer molecules increases, and the physical properties of the fiber or the molded product are reduced, for example, the fatigue resistance is reduced. In a molten polymer, the viscosity changes due to branching. For example, when the fiber is drawn by spinning, unevenness in the viscosity of the polymer occurs, thereby causing yarn breakage and fluff. The production method in which BHT is contained in the polymer in an amount of 0.4 mg / g or less will be described below.
【0014】50重量%AH塩水溶液を70重量%まで
濃縮した後、予熱し、反応器で17.5kg/cm2 の
加圧下で水分を除去しながら重合を行う。この重合系の
水分が15重量%以下になったところで、銅化合物を添
加する。この後、常圧にもどして水分をさらに除去し所
定の重合度とする。このとき、15重量%を越える水分
の存在下で銅化合物を添加すると、銅化合物は、BHT
の生成を促進するため、最終的にポリマー中のBHTの
含有量を0.4mg/g以下にすることはできない。After the 50% by weight aqueous solution of AH salt is concentrated to 70% by weight, it is preheated, and the polymerization is carried out while removing water under a pressure of 17.5 kg / cm 2 in a reactor. When the water content of the polymerization system becomes 15% by weight or less, a copper compound is added. Thereafter, the pressure is returned to normal pressure, and water is further removed to obtain a predetermined polymerization degree. At this time, when the copper compound is added in the presence of water exceeding 15% by weight, the copper compound becomes BHT
In order to promote the formation of BHT, the content of BHT in the polymer cannot be finally reduced to 0.4 mg / g or less.
【0015】従って、銅化合物の添加は、重合系内の水
分率が15重量%以下になったところで添加する必要が
ある。添加する工程は、加圧重合終了時、常圧重合時、
あるいは重合終了時などの水分率が15重量%以下にな
っている状態であればどこでも構わない。Therefore, it is necessary to add the copper compound when the water content in the polymerization system becomes 15% by weight or less. The step of adding is at the end of pressure polymerization, at the time of normal pressure polymerization,
Alternatively, any condition may be used as long as the moisture content is 15% by weight or less, such as at the end of polymerization.
【0016】[0016]
【実施例】以下に実施例を用いて、さらに詳しく説明す
る。なお、以下に各特性の測定方法を示す。 BHT 40mgのポリマーを10mlのガラスアンプルに入
れ、47%臭化水素酸を0.4ml加え、窒素で充分に
置換した後、封管する。これを150℃で4時間加熱
し、ポリマーを加水分解する。冷却後、ガラスアンプル
を開封し、エバポレーターを用いて、60℃、4時間蒸
発乾固し、さらに80℃、2時間、オイルポンプで減圧
しながら乾燥させる。The present invention will be described in more detail with reference to the following examples. In addition, the measuring method of each characteristic is shown below. BHT 40 mg of the polymer is placed in a 10 ml glass ampoule, 0.4 ml of 47% hydrobromic acid is added, the atmosphere is sufficiently replaced with nitrogen, and the tube is sealed. This is heated at 150 ° C. for 4 hours to hydrolyze the polymer. After cooling, the glass ampule is opened, evaporated to dryness at 60 ° C. for 4 hours using an evaporator, and further dried at 80 ° C. for 2 hours while reducing the pressure with an oil pump.
【0017】これに内部標準としてp−ターフェニル
(p−terphenyl)20mgをピリジン50m
lに溶解させた溶液を0.2ml添加する。次に、N,
O−ビス(トリメチルシリル)アセトアミド(N,O−
bis(trimethylsilyl)acetam
ide)を0.5ml加えて、90℃、0.5時間加熱
し、トリメチルシリル誘導体化する。To this, as an internal standard, 20 mg of p-terphenyl was added with 50 m of pyridine.
0.2 ml of the solution dissolved in l. Next, N,
O-bis (trimethylsilyl) acetamide (N, O-
bis (trimethylsilyl) acetam
ide) is added thereto, and the mixture is heated at 90 ° C. for 0.5 hour to form a trimethylsilyl derivative.
【0018】さらに、N−メチルビストリフルオロアセ
トアミド(N−methylbistrifluoro
acetamide)を0.5ml加え、90℃、0.
5時間加熱し、トリフルオロアセチル誘導体化する。こ
れをガスクロマトグラフィーで測定した。あらかじめ作
成した検量線を用いてBHTのピーク強度よりその量を
求めた。 銅元素 ポリマー1.0gに0.1規定の硝酸を加えて加熱し溶
解する。冷却した後、原子吸光法で測定し、検量線と比
較して、その量を求めた。 蟻酸相対粘度(以下、VRという) 90重量%蟻酸にポリマー濃度11.0g/dlとなる
ように溶解せしめた溶液の25℃における相対粘度であ
る。 耐疲労性 ディップコードをゴムに埋め込みチューブとし、このチ
ューブを用いて、グッドイヤー法で150℃、120分
の疲労試験を実施した後、コードを取り出し、その強力
の低下を調べた。 ダイスウェル比 キャピログラフlB(東洋精機製作所製)を用いて、3
00℃のダイスウェル比つまり紡孔径(D0 )と紡孔下
2mmにおける吐出したポリマーの径(D)の比を測定
した。 ポリマー中の水分率 カールフィシャー水分計を用いて、150℃で水分率を
測定した。 切れ糸率 9.5kg巻、100パーンにおける切れ糸パーン数で
求めたFurthermore, N-methylbistrifluoroacetamide (N-methylbistrifluoro)
acetamide) at 90 ° C.
Heat for 5 hours to trifluoroacetyl derivatize. This was measured by gas chromatography. Using a previously prepared calibration curve, the amount was determined from the peak intensity of BHT. Copper element 0.1 g of nitric acid is added to 1.0 g of the polymer and heated to dissolve. After cooling, the amount was measured by an atomic absorption method and compared with a calibration curve to determine the amount. Relative viscosity of formic acid (hereinafter referred to as VR) The relative viscosity at 25 ° C. of a solution of 90% by weight formic acid dissolved at a polymer concentration of 11.0 g / dl. Fatigue Resistance A dip cord was embedded in rubber to form a tube, and a fatigue test was performed at 150 ° C. for 120 minutes using the tube by the Goodyear method. Die swell ratio Using Capillograph IB (manufactured by Toyo Seiki Seisakusho), 3
The die swell ratio at 00 ° C., that is, the ratio of the spinning diameter (D0) to the diameter (D) of the discharged polymer 2 mm below the spinning was measured. Moisture content in polymer The moisture content was measured at 150 ° C. using a Karl Fischer moisture meter. Cut yarn ratio 9.5 kg wound, determined by the number of cut yarns at 100 yarns
【0019】[0019]
【実施例1】当モルのヘキサメチレンジアミンとアジピ
ン酸からなるヘキサメチレンジアンモニウムアジペート
の50重量%水溶液を濃縮槽で70重量%水溶液まで1
20℃で濃縮した。次に、重合反応槽において230℃
に加熱して、17.5kg/cm2 に保ちつつ重合を行
い、縮合水を蒸発除去して、70重量%水溶液から90
重量%水溶液まで濃縮し、VRが10のポリマーを得
た。EXAMPLE 1 A 50% by weight aqueous solution of hexamethylene diammonium adipate consisting of equimolar hexamethylene diamine and adipic acid was converted to a 70% by weight aqueous solution in a concentration tank.
Concentrated at 20 ° C. Next, at 230 ° C.
The polymerization was carried out while maintaining the temperature at 17.5 kg / cm 2 , and the condensed water was removed by evaporation.
The solution was concentrated to a weight% aqueous solution to obtain a polymer having a VR of 10.
【0020】重合反応槽の出口において、ポリマーの水
分率は10重量%であった。この時点において沃化第一
銅5重量%及び沃化カリウム50重量%よりなる沃化第
一銅、沃化カリウム混合水溶液をポリマー中の銅含有量
が80ppmになるように計量して、17.5kg/c
m2 の加圧状態で添加した。次いで、このポリマーを1
7.5kg/cm2 から常圧1kg/cm2 まで減圧し
て溶解水分を280℃で蒸発除去して、VRが32のポ
リマーを得た。このポリマーをさらに0.5kg/cm
2 に減圧して290℃で縮合水を除去し、VRが80の
ポリマーを得た。At the outlet of the polymerization reactor, the water content of the polymer was 10% by weight. At this time, an aqueous mixed solution of cuprous iodide and potassium iodide comprising 5% by weight of cuprous iodide and 50% by weight of potassium iodide was measured so that the copper content in the polymer was 80 ppm. 5kg / c
It was added in a pressurized state of m 2 . The polymer is then
The pressure was reduced from 7.5 kg / cm 2 to normal pressure of 1 kg / cm 2 , and the dissolved water was removed by evaporation at 280 ° C. to obtain a polymer having a VR of 32. 0.5 kg / cm
The pressure was reduced to 2 , and the condensed water was removed at 290 ° C. to obtain a polymer having a VR of 80.
【0021】このポリマーはBHT含有量を測定した結
果、ポリマー1gあたり0.35mgであった。また、
銅含有量が78ppmであった。As a result of measuring the BHT content of this polymer, it was found to be 0.35 mg / g of the polymer. Also,
The copper content was 78 ppm.
【0022】[0022]
【比較例1】当モルのヘキサメチレンジアミンとアジピ
ン酸からなるヘキサメチレンジアンモニウムアジペート
を計量槽で50重量%水溶液に調製した。この水溶液に
酢酸銅をヘキサメチレンジアンモニウムアジペートに対
して216ppmになるように添加した。Comparative Example 1 An equimolar amount of hexamethylene diammonium adipate comprising hexamethylene diamine and adipic acid was prepared in a 50% by weight aqueous solution in a measuring tank. Copper acetate was added to this aqueous solution so as to be 216 ppm based on hexamethylene diammonium adipate.
【0023】この50重量%水溶液を実施例1と同様の
方法で溶融重合し、VRが80のポリマーを得た。得ら
れたポリマーは、BHT含有量がポリマー1gあたり
0.73mgであった。また、銅含有量が70ppmで
あった。This 50% by weight aqueous solution was melt-polymerized in the same manner as in Example 1 to obtain a polymer having a VR of 80. The resulting polymer had a BHT content of 0.73 mg / g of polymer. Further, the copper content was 70 ppm.
【0024】[0024]
【実施例2】異なる重合方法で得たBHTの含有量の異
なる2種類のポリマーを用いて1890d/312fの
タイヤコード原糸をスピンドローテイクアップ法で製造
した。得られた繊維は強度が10.3g/dで、含まれ
るBHTの量が、それぞれ0.67mg/g、0.38
mg/gであった。製造時の切れ糸率はそれぞれ10.
2%、4.8%であった。このように、BHTの量を
0.4mg/g以下にすることにより、切れ糸率が激減
した。Example 2 Two kinds of polymers having different BHT contents obtained by different polymerization methods were used to produce a 1890d / 312f tire cord raw yarn by a spin draw take-up method. The obtained fiber had a strength of 10.3 g / d and contained BHT of 0.67 mg / g and 0.38 mg / g, respectively.
mg / g. The yarn breakage rate at the time of manufacture is 10.
2% and 4.8%. As described above, by setting the amount of BHT to 0.4 mg / g or less, the yarn breakage rate was drastically reduced.
【0025】[0025]
【実施例3】実施例2で得られたタイヤコード原糸を下
撚り、上撚りを付して生コードを得た。このコードを接
着剤処理しディップコードを得た。さらに、このディッ
プコードをゴムに埋め込みチューブとし、このチューブ
を用いて耐疲労性を調べた結果、BHTの含有量が0.
38mg/gの方が0.67mg/gと比較して、強力
が5%向上していた。Example 3 The raw cord of the tire cord obtained in Example 2 was twisted and twisted to obtain a raw cord. This cord was treated with an adhesive to obtain a dip cord. Further, the dip cord was embedded in rubber to form a tube, and the tube was used to examine the fatigue resistance.
The strength of 38 mg / g was improved by 5% as compared with 0.67 mg / g.
【0026】[0026]
【実施例4】本発明及び従来法で得たBHT含有量の異
なる4種類のポリマーの物性を調べた。これらのポリマ
ーに含まれるBHTの含有量を測定したところ、それぞ
れ0.29mg/g、0.35mg/g、0.50mg
/g、0.73mg/gであった。これらのポリマーの
ダイスウェル比は、それぞれ1.41、1.43、1.
52、1.55であった。Example 4 Physical properties of four kinds of polymers having different BHT contents obtained by the present invention and the conventional method were examined. When the content of BHT contained in these polymers was measured, they were 0.29 mg / g, 0.35 mg / g, and 0.50 mg, respectively.
/ G, 0.73 mg / g. The die swell ratios of these polymers are 1.41, 1.43, 1.
52 and 1.55.
【0027】このように、BHTの含有量が0.4mg
/g以下では、0.4mg/gを越えるものに比べて、
ダイスウェル比が急激に小さくなっている。このダイス
ウェル比は、ポリマーの弾性を示し、これが大きいほど
紡糸性、成形性が悪化することを意味している。従っ
て、本発明のポリマーは紡糸性、成形性が向上している
ことが判る。Thus, the content of BHT was 0.4 mg.
/ G or less, compared with those exceeding 0.4 mg / g,
Die swell ratio is rapidly decreasing. The die swell ratio indicates the elasticity of the polymer, and the larger the die swell ratio, the worse the spinnability and moldability. Therefore, it is understood that the polymer of the present invention has improved spinnability and moldability.
【0028】[0028]
【発明の効果】本発明のポリヘキサメチレンアジパミド
は、溶融時の溶融粘性が均一である。従って、本発明の
ポリヘキサメチレンアジパミドを用いて繊維を紡糸延伸
すると、切れ糸、毛羽の発生が非常に少なくなり、収率
が向上し、あるいは延伸倍率が向上するため高強度が実
現できる、という効果があり、強度、耐疲労性等の物性
が向上する。The polyhexamethylene adipamide of the present invention has a uniform melt viscosity during melting. Therefore, when the fiber is spun and drawn using the polyhexamethylene adipamide of the present invention, the generation of cut yarn and fluff is extremely reduced, the yield is improved, or the draw ratio is improved, so that high strength can be realized. And physical properties such as strength and fatigue resistance are improved.
【0029】プラスチック成形においても、溶融粘性が
均一であり、成形性、特性の向上が期待できる。本発明
の製造方法によると従来のものに比べてBHTの含有量
が極めて少ないポリヘキサメチレンアジパミドが得られ
る。Also in plastic molding, the melt viscosity is uniform, and improvement in moldability and properties can be expected. According to the production method of the present invention, polyhexamethylene adipamide having a very low content of BHT as compared with the conventional one can be obtained.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) C08G 69/00 - 69/50 D01F 6/60 D02G 3/48 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 7 , DB name) C08G 69/00-69/50 D01F 6/60 D02G 3/48
Claims (1)
ト塩水溶液を用いて銅化合物の含有量が銅元素としてポ
リマーに対して30ppm以上であるポリヘキサメチレ
ンアジパミドを溶融重合する方法において、重合系内の
水分率が15重量%以下のところで銅化合物を添加する
ことを特徴とするポリマー分子中に含まれるビスヘキサ
メチレントリアミンの量がポリマー1g当たり0.4m
g以下であるポリヘキサメチレンアジパミドの製造方
法。1. A method for melt-polymerizing polyhexamethylene adipamide having a copper compound content of 30 ppm or more as a copper element with respect to a polymer by using an aqueous solution of hexamethylene ammonium adipate salt in a polymerization system. Wherein the copper compound is added at a content of not more than 15% by weight.
The amount of methylenetriamine is 0.4 m / g of polymer
g of polyhexamethylene adipamide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03184504A JP3133101B2 (en) | 1991-07-24 | 1991-07-24 | Method for producing polyhexamethylene adipamide with low triamine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03184504A JP3133101B2 (en) | 1991-07-24 | 1991-07-24 | Method for producing polyhexamethylene adipamide with low triamine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0525269A JPH0525269A (en) | 1993-02-02 |
| JP3133101B2 true JP3133101B2 (en) | 2001-02-05 |
Family
ID=16154350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03184504A Expired - Fee Related JP3133101B2 (en) | 1991-07-24 | 1991-07-24 | Method for producing polyhexamethylene adipamide with low triamine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3133101B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006273945A (en) * | 2005-03-28 | 2006-10-12 | Asahi Kasei Chemicals Corp | Method for producing polyamide resin composition |
-
1991
- 1991-07-24 JP JP03184504A patent/JP3133101B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006273945A (en) * | 2005-03-28 | 2006-10-12 | Asahi Kasei Chemicals Corp | Method for producing polyamide resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0525269A (en) | 1993-02-02 |
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