JP3137372B2 - Automatic soldering equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic soldering apparatus for immersing a printed circuit board in molten solder for soldering.

[0002]

2. Description of the Related Art In an automatic soldering apparatus, during a long period of use, solder oxide adheres to the inside of a solder bath, which is blown up together with the flowing molten solder and adheres to a printed circuit board. In such a case, the lands may be short-circuited or the appearance may be deteriorated.

Further, when the oxide of the solder accumulates on the nozzle for jetting the molten solder, the nozzle is partially narrowed, and the jet state is changed, which may cause poor soldering such as bridges and icicles. .

[0004] Furthermore, in a solder bath, after long-term use, the copper of the printed circuit board gradually dissolves into the solder, resulting in a solder containing a large amount of copper. In addition to the poor solderability, the solder becomes not soldered, and the needle-like intermetallic compound of tin and copper adheres between the lands of the printed circuit board to generate a bridge.

For this reason, in an automatic soldering apparatus, an operation for periodically removing oxides in a solder bath, or a process of pumping out all the solder in the solder bath and replacing it with new solder (hereinafter referred to as a maintenance work). ) Had to do.

Conventionally, the solder bath of the automatic soldering apparatus can be drawn out of the main body of the automatic soldering apparatus so that the maintenance work can be easily performed. The structure in which the solder bath is drawn out is such that a caster installed in the solder bath moves on a rail, or a solder bath moves on a large number of roller-shaped conveyors.

In the conventional automatic soldering apparatus, when the solder bath is pulled out from the main body of the automatic soldering apparatus, the worker performs maintenance work as it is.

[0008]

By the way, when the solder bath is pulled out of the main body of the automatic soldering apparatus for maintenance work, the molten solder in the solder bath is pumped out of the solder bath. Since the solder bath is heated by the molten solder having a high temperature, an ascending air current is generated above the solder bath, so that fine solder oxide is rolled up. Therefore, if a worker performing maintenance work inhales a large amount of the oxide of the rolled-up solder, the solder is a heavy metal and poses a health problem. Floats indoors, falls down everywhere indoors and becomes dirty.

In view of the foregoing, it is an object of the present invention to provide an automatic soldering apparatus in which, when a maintenance work is performed by pulling out a solder bath outside an automatic soldering apparatus main body, an oxide of solder does not float outside of the automatic soldering apparatus. Mounting device.

[0010]

Means for Solving the Problems The inventors of the present invention have found that an ascending air current generated above a solder bath is generated, but if the air current is drawn into an automatic soldering apparatus which collects the air before floating. The present invention has been completed by noting that the floating of the oxide is eliminated.

The present invention relates to an automatic soldering apparatus capable of extracting a solder bath to the outside of an automatic soldering apparatus main body having an exhaust port, wherein a solder bath drawing-out opening provided in a wall of the automatic soldering apparatus main body is provided. And a cover that covers the opening. The cover has a main plate body rotatably attached to the upper edge of the opening, both side plate bodies rotatably mounted on both sides of the main plate body, and a free end portion of the main plate body. And an end plate freely mounted.

When the cover is lifted to a predetermined pivot position, the side plates and the end plates hang down below the main plate, and are attached to the main plate, the both side plates and the end plate. A hood is formed above the solder bath drawn out to a predetermined position outside the automatic soldering apparatus main body, and each end of both side plate bodies abuts against the wall of the automatic soldering apparatus main body. The hood is held at a predetermined rotation position.

[0013]

According to the present invention, when the solder bath is pulled out of the main body of the automatic soldering apparatus and maintenance work is performed, the oxide of the solder riding on the rising airflow of the solder bath is
It hits the hood, enters the body of the automatic soldering apparatus, and is discharged to the outside through the exhaust port of the apparatus body.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. In the automatic soldering apparatus shown in the embodiment, the hood uses the back plate of the main body of the automatic soldering apparatus.

The solder tank 2 placed in the main body 1 of the automatic soldering apparatus is normally on the roller conveyor 3 for installation as shown in FIG. 3 during normal times, and can be pulled out during maintenance work as shown in FIGS. It has become. When the solder bath is pulled out to the outside of the main body, the pull-out roller conveyor 4 having the same height as the installation roller conveyor 3 is placed outside and pulled out. The back plate 5 on the side from which the solder bath 2 is drawn out is opened upward by a hinge 6. Side plates 7, 7 are attached to both sides of the back plate 5 with hinges 6, and an end plate 8 is also attached to the lower end of the back plate 5 with hinges 6, so that when the back plate is opened, the side plates are connected. The end plate hangs down to form the hood 9.

In normal times, an exhaust port 10 is formed in the upper body where the solder bath is installed. A duct (not shown) is connected to the exhaust port 10, and the end of the duct is guided to the outside, so that gas entering the exhaust port 10 is exhausted to the outside. A ventilation fan may be installed at the exhaust port 10 to forcibly exhaust air. However, even without installing a ventilation fan, the gas in the automatic soldering apparatus can be sufficiently exhausted by a tunnel effect by connecting a duct. is there.

Next, maintenance work in the automatic soldering apparatus of the present invention will be described.

When the back plate 5 is lifted as shown by the arrow in FIG.
The side plates 7, 7 and the end plates 8 attached to the both sides of the back plate 5 with hinges 6 hang down by their own weight. At this time, the hanging end plate 8
When the side plates 7, 7 are brought into contact with both ends of the hood 9, a trapezoidal hood 9 can be formed. When the side plates 7 hang down, the end of the side plate on the side of the main body 1 hits the main body 1 and the hood can be maintained in the lateral direction.

If a hood is formed on the back of the main body 1,
After connecting the pull-out roller conveyor 4 to the setting roller conveyor 3, the solder bath 2 is pulled out from the main body 1 to the outside to perform maintenance work. Since the solder in the solder bath 2 drawn out is in a molten state, an upward airflow is generated above the solder bath 2. As shown in FIG. 2, the rising airflow hits the hood 9, flows into the main body 1 along the hood, and is discharged outside through the exhaust port 10 through the duct.

[0020]

Since the automatic soldering apparatus of the present invention has a structure in which a hood is formed on a solder bath drawn out of the main body, a solder oxide flowing out of a hot solder bath by an ascending air current. Collected in a hood, which can be discharged outside through a duct connected to an exhaust port. Therefore, in the automatic soldering apparatus of the present invention, there is no problem that the worker sucks the oxide during the maintenance or the inside of the room is stained by the oxide, so that an extremely excellent effect on environmental hygiene can be obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part of an automatic soldering apparatus according to the present invention.

FIG. 2 is a cross-sectional view of the automatic soldering apparatus of the present invention in a state where a solder bath is drawn out.

FIG. 3 is a cross-sectional view of the automatic soldering apparatus of the present invention in a state where a solder bath is inside a main body.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Automatic soldering apparatus main body 2 Solder tank 3 Coro conveyor for installation 4 Coro conveyor for drawer 5 Back plate 6 Hinge 7 Side plate 8 End plate 9 Hood 10 Exhaust port

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kenichi Tomizuka 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Inside Sony Corporation (72) Inventor Zen Mitsuo 23-23 Senjuhashi-do-cho, Adachi-ku, Tokyo Inside Industrial Co., Ltd. (72) Inventor Hidetoshi Nakamura 23, Senjuhashido-cho, Adachi-ku, Tokyo Inside Senju Metal Industry Co., Ltd. (56) References JP-A-63-309369 (JP, A) (58) Fields investigated Int.Cl. ⁷ , DB name) B23K 1/00-3/08 H05K 3/34 506

Claims (1)

(57) [Claims] 1. An automatic soldering apparatus capable of extracting a solder bath to the outside of an automatic soldering apparatus main body having an exhaust port, comprising: a solder tank drawing-out opening provided in a wall of the automatic soldering apparatus main body; A cover for covering the opening, wherein the cover is rotatably mounted on an upper edge of the opening, and both side plates rotatably mounted on both sides of the main plate, respectively. A body, and an end plate rotatably attached to the free end of the main plate, wherein when the cover is lifted to a predetermined rotation position, the both-side plate and the end plate are provided. Hang down below the main plate, and the main plate, the both side plates and the end plate are positioned above the solder bath drawn out to a predetermined position outside the automatic soldering apparatus main body. When a hood is formed, The end of each of the two side plates abuts against the wall of the main body of the automatic soldering apparatus so that the hood is held at the predetermined rotation position.