JP3144279B2 - Sensor manufacturing pallet and infrared sensor manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an infrared sensor used for non-contact temperature detection, human body detection, etc., and more particularly to the structure of an infrared sensor and a pallet for manufacturing the sensor, and a method of manufacturing the infrared sensor. About.

[0002]

2. Description of the Related Art Conventionally, as an infrared sensor, FIG.
The infrared sensor 20 has a flat plate-shaped infrared filter 21.
An opening window 22 for exposing the infrared filter 21 to the outside is formed, and a metal case 23 in which a sensor element (not shown) is disposed is provided inside.

[0003] The infrared filter 21 here has an insulating layer (not shown) formed on the inner and outer surfaces. The infrared filter 21 is formed around the opening window 22 and protrudes outward. It is arranged in the step portion 24 of the case 23 and is fixed by using a conductive adhesive 25.

In this case, the infrared sensor 2
0 is generally manufactured according to the following procedure. First, as shown in FIG. 7A, a sensor manufacturing pallet 27 having a through hole 26 formed to hold the case 23 in a downward state is prepared, and the case held by the sensor manufacturing pallet 27 is prepared. A conductive adhesive 25a having a thermosetting property is applied on the inner surface of the step portion 24 of 23. The conductive adhesive 25a is applied to a conductive adhesive 25b for conduction which is subsequently applied.
It is applied to prevent it from flowing out, and it goes without saying that an insulating adhesive can be used at all.

Next, as shown in FIG. 7 (b), the infrared filter 21 is placed in the step portion 24 of the case 23, and the conductive adhesive 25a is cured. As described above, the thermosetting conductive adhesive 25b is applied between the end face of the infrared filter 21 and the inner face of the case 23 and then cured. As a result, the infrared filter 21 and the case 23 are electrically connected via the conductive adhesive 25b (15), and the infrared sensor 20 taken out from the through hole 26 of the sensor manufacturing pallet 27 is 6 has the essential structure shown in FIG.

[0006]

However, the conventional infrared sensor 20 and the manufacturing method have the following disadvantages. That is, first, the infrared filter 21 in this case has a high material cost,
In spite of having only to have a shape and a size corresponding to the opening window 22 of the case 23, if the above-described conventional configuration is adopted, the infrared filter Due to the support of the infrared filter 21, the size of the infrared filter 21 becomes unnecessarily large, resulting in an increase in material cost.

Since the step 24 needs to be formed around the opening window 22 in the case 23, the processing cost of the case 23 also increases. Further, when fixing the infrared filter 21 to the case 23, it is necessary to separately apply the conductive adhesives 25a and 25b for prevention of flow-out and conduction and to carry out the curing in two steps. Will also increase.

By the way, in order to avoid such inconvenience, an infrared sensor 3 having a main structure as shown in FIG.
0 is also considered. That is, the infrared sensor 30
Has an infrared filter 31 and a case 33 in which an opening window 32 for accommodating the infrared filter 31 is formed. In this case, the infrared filter 31 has a step portion 34 formed on its own end face, And this step 34
Are fixed to the edge of the opening window 32 using a conductive adhesive 35. However, in the case where this configuration is employed, the size of the infrared filter 31 itself increases with the formation of the step portion 34, and as a result, the material cost also increases.

The present invention has been made in view of these inconveniences, and it is possible to simplify the structure of each of an infrared filter and a case and to simplify a manufacturing procedure and a sensor manufacturing pallet and an infrared sensor. It is an object to provide a method for manufacturing a sensor.

[0010]

[0011]

SUMMARY OF THE INVENTION According to the present invention, a sensor is manufactured.
Pallet is a flat infrared filter and this infrared
A case in which an opening window for accommodating the line filter is formed.
The end face of the infrared filter uses conductive adhesive.
When manufacturing an infrared sensor fixed to the edge of a window
The infrared filter and the case
Has a pallet bottom where the outer surfaces of
The bottom of this pallet has an infrared filter
Corresponding to the end faces facing each other
Position and the distance between these end faces
Also form a wide groove.

The method of manufacturing an infrared sensor according to the present invention also includes a step of contacting an outer surface of the case with a bottom surface of the pallet of the sensor manufacturing pallet to dispose an end surface of the opening window on the groove. A step of housing the infrared filter and bringing the outer surface of the infrared filter into contact with the bottom of the pallet, and arranging the end face of the infrared filter also on the concave groove; The method is characterized by including a step of applying an adhesive and a step of heating and curing the conductive adhesive.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a cross-sectional perspective view showing only the essential structure of the infrared sensor according to the present embodiment in a simplified manner, and reference numeral 1 in this figure denotes the infrared sensor. 2 is an exploded cross-sectional perspective view of the sensor manufacturing pallet according to the present embodiment, FIG. 3 is a perspective view showing a modification of the pallet bottom plate, and FIG. 4 is a manufacturing method of the infrared sensor according to the present embodiment. FIG. 5 is a process sectional view showing a procedure, and FIG. 5 is a process sectional view showing a manufacturing procedure when a sensor manufacturing pallet having a structure different from that of the present embodiment is used.

The infrared sensor 1 according to the present embodiment comprises:
As shown in FIG. 1, a flat-plate-shaped infrared filter 2 through which infrared light is transmitted, and a rectangular opening window 3 for storing and holding the infrared filter 2 are formed, and a sensor element (see FIG. (Not shown) is provided, and the outer surface of the infrared filter 2 housed in the opening window 3 is arranged flush with the outer surface of the case 4. I have. The end face of the infrared filter 2 is fixed to the edge of the opening window 3 using a conductive adhesive 5, and the end faces of the infrared filter 2 and the opening window 3 facing each other by the action of surface tension. Gap S between
1 (see FIG. 4 (a)).
Thus, the infrared filter 2 and the case 4 are electrically connected. An insulating layer (not shown) is formed on the inner and outer surfaces of the infrared filter 2 as in the conventional example.

That is, the infrared filter 2 here is:
Unlike the infrared filter 31 shown in FIG. 8, that is, the infrared filter 31 in which the step 34 is formed on the end surface, the infrared filter 31 has a simple flat plate shape having a size corresponding to the opening window 3 of the case 4. I have. In this case, only the opening window 3 is formed in the case 4, and the step portion 24 as in the case 23 shown in FIG. 6 is not formed.
Therefore, in the infrared sensor 1 according to the present embodiment, the structure of each of the infrared filter 2 and the case 4 is simplified as compared with the conventional example.

Further, the sensor manufacturing pallet 10 is used for manufacturing the infrared sensor 1 and includes a pair of upper and lower pallet plates 11 and 12 as shown in FIG. Is formed with a through hole 13 having a shape suitable for housing the case 4.
On the surface of the lower pallet plate 12 arranged so as to close the lower opening of the through hole 13, that is, on the pallet bottom surface, a concave groove 14 having a predetermined depth is formed in a frame shape. Therefore, in the sensor manufacturing pallet 10, the outer surface of the case 4 disposed in the through hole 13 of the upper pallet plate 11 on which the opening window 3 is formed, and the infrared filter 2 disposed in the opening window 3. The outer surface of the pallet comes into contact with the pallet bottom surface after being flush with each other.

The groove 14 formed on the bottom surface of the pallet at this time is disposed at a position corresponding to the end faces of the infrared filter 2 and the opening window 3 facing each other, that is, at a position corresponding to the gap S1. In addition, the width is wider than the space between these end faces. Here, it is not necessary that the concave groove 14 has the above-mentioned structure, that is, a structure in which the upper opening is closed over the entire periphery by the infrared filter 2 and the case 4. Of course, as shown in each of a) to (c), the concave groove 14 may be open to the outside air. That is, in the structure shown in FIGS. 3A and 3B, the upper and lower pallet plates 1 are formed after the four or two corners of the concave groove 14 are extended.
It is open to the outside air from between the outer end surfaces of 1, 12
Further, in the structure shown in FIG. 3C, a plurality of small-diameter through-holes 15 provided along the thickness direction of the lower pallet plate 12 are opened at the bottom surface of the concave groove 14 so that the recess is formed. The groove 14 is open to the outside air.

Next, a procedure for manufacturing the infrared sensor 1 according to the present embodiment will be described with reference to FIG.

First, as shown in FIG. 4A, a sensor manufacturing pallet 10 is prepared by stacking upper and lower pallet plates 11 and 12, and the upper side of the sensor manufacturing pallet 10 is formed. Through hole 13 of pallet plate 11
The case 4 is put in and stored. In this case, the outer surface of the case 4 is brought into contact with the pallet bottom surface, which is the surface of the lower pallet plate 12, and the end surface of the opening window 3 is arranged on the concave groove 14. Subsequently, the infrared filter 2 is housed in the opening window 3 of the case 4 to bring the outer surface of the infrared filter 2 into contact with the bottom of the pallet, and the end face of the infrared filter 2 is also arranged on the concave groove 14.

Then, as shown in FIG. 4B, a conductive adhesive 5 is applied between the end face of the infrared filter 2 and the edge of the opening window 3 using a well-known dispenser (not shown) or the like. Then, the conductive adhesive 5 is cured (finally cured) by heating. The conductive adhesive 5 applied at this time entered the gap between the end faces of the infrared filter 2 and the opening window 3 by the action of its own surface tension, and was kept in the gap. It is cured as it is. As a result, the infrared filter 2 and the case 4 constituting the infrared sensor 1 are electrically connected to each other via the conductive adhesive 5, and the infrared sensor removed from the sensor manufacturing pallet 10 Reference numeral 1 has the essential configuration shown in FIG.

When the sensor manufacturing pallet 10 has the structure shown in FIG. 2, the upper opening of the concave groove 14 is closed by the infrared filter 2 and the case 4, so that the concave groove 14 is closed. As the air present in the space 14 is heated and expanded, the fixed state by the conductive adhesive 5 becomes insufficient, and the infrared filter 2 and the case 4 are incompletely flush, and the infrared filter 2 is inclined. There is a danger that it will be in a state of being left. However, when the sensor manufacturing pallet 10 including the lower pallet plate 12 as shown in FIG.
4 is free to flow in and out, and the air expanded in the concave groove 14 escapes to the outside air, so that an advantage that the infrared filter 2 and the case 4 are flush with each other is obtained.

That is, when the infrared sensor 1 is manufactured according to the above procedure, the conductive adhesive 5 may be applied only once and then cured by heating, so that the number of steps can be reduced. It is. According to an experiment conducted by the inventor of the present invention, the bonding strength between the infrared filter 2 and the case 4 in the infrared sensor 1 manufactured according to the above manufacturing procedure is 10.65 kgf on average, and Average bond strength at 20 10.3
It has been confirmed that it is practically sufficient without much difference from kgf.

By the way, in this embodiment, FIG.
1 using the sensor manufacturing pallet 10 shown in FIG.
The infrared sensor 1 having the structure shown in FIG. 5 is manufactured, but the infrared sensor 1 is manufactured using the sensor manufacturing pallet 17 shown in FIG. 5, that is, the sensor manufacturing pallet 17 having a structure different from that of the present embodiment. 1 can also be manufactured. That is, the sensor manufacturing pallet 17 in this case is formed with the bottomed hole 18 for storing the infrared filter 2 and the case 4 in a downward state and holding the outer surfaces of the infrared filter 2 and the case 4 in a flush state. When the infrared sensor 1 is manufactured using the sensor manufacturing pallet 17, after the infrared filter 2 and the case 4 are stored in the bottomed hole 18, the conductive adhesive 5 is applied. And heat curing.

However, when the sensor manufacturing pallet 17 is used, a gap S2 may be present between the outer surfaces of the infrared filter 2 and the case 4 and the bottom surface of the bottomed hole 18. The conductive adhesive 5 drawn into the gap due to the capillary phenomenon caused by the existence of the gap may adhere to the outer surface of the infrared filter 2. On the other hand, when the sensor manufacturing pallet 10 shown in FIG. 2 or FIG.
4, the conductive adhesive 5 is held in the gap S1 between the mutually facing end faces of the infrared filter 2 and the opening window 3 by the action of the surface tension. This has the advantage that no inconvenience occurs.

[0026]

As described above, according to the infrared sensor according to the present invention, it is not necessary to form a step on the end face of the infrared filter, and the infrared filter can be minimized in size. In addition, since it is not necessary to form a step on the case, the structures of the infrared filter and the case can be simplified, and the material cost and the processing cost can be reduced.
Further, there is also obtained an effect that steps related to application and curing of the conductive adhesive can be reduced to simplify the manufacturing procedure.

[Brief description of the drawings]

FIG. 1 is a sectional perspective view schematically showing only a main part structure of an infrared sensor according to the present embodiment.

FIG. 2 is an exploded cross-sectional view showing a sensor manufacturing pallet.

FIG. 3 is a perspective view showing a modification of the pallet bottom plate.

FIG. 4 is a process cross-sectional view showing a procedure for manufacturing the infrared sensor according to the embodiment.

FIG. 5 is a process cross-sectional view showing a manufacturing procedure when a sensor manufacturing pallet having a structure different from that of the present embodiment is used.

FIG. 6 is a sectional perspective view schematically showing only a main part structure of an infrared sensor according to a conventional example.

FIG. 7 is a process sectional view showing a manufacturing procedure of the infrared sensor according to the conventional example.

FIG. 8 is a sectional perspective view showing a modification of the infrared sensor according to the conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Infrared sensor 2 Infrared filter 3 Window 4 Case 5 Conductive adhesive 10 Pallet for sensor production 14 Groove

Continuation of the front page (56) References JP-A-7-159234 (JP, A) JP-A-5-1946 (JP, A) JP-A-7-243909 (JP, A) JP-A 8-250616 (JP) , A) JP-A-63-318786 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) G01J 1/02-1/04 G01J 5/02-5/08 H01L 23/04 -23/06 H01L 31/02 G02B 5/20-5/28

Claims (3)

(57) [Claims] 1. An infrared filter having a flat plate shape and an infrared filter
A case in which an opening window for accommodating the line filter is formed.
The end face of the infrared filter uses conductive adhesive.
When manufacturing an infrared sensor fixed to the edge of a window
A pallet for manufacturing a sensor to be used, wherein the infrared filter and the outer surface of the case are flush with each other.
The pallet has a pallet bottom surface
The infrared filter and the opening window
Are located at positions corresponding to the end faces facing each other, and
Form a concave groove wider than the space between these end faces.
A pallet for manufacturing a sensor, comprising: 2. The groove formed in the groove by heating expands in the groove.
So that the air can escape into the open air,
2. The device according to claim 1, wherein the device is opened.
Pallet for sensor production. 3. A pallet bottom surface of a sensor manufacturing pallet.
Contact the outer surface of the case and place the end face of the opening window on the groove.
Place the infrared filter inside the opening window
Touch the outer surface of the infrared filter to the bottom of the pallet
In addition, the end face of this infrared filter is also placed on the groove.
Between the edge of the infrared filter and the edge of the open window
Applying a conductive adhesive and heating the conductive adhesive
Curing by heating
A method for manufacturing a line sensor.