JP3145359B2 - Vacuum processing apparatus and substrate vacuum processing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum processing apparatus and a substrate vacuum processing method, and more particularly to a vacuum processing having a plurality of vacuum processing chambers and a substrate vacuum processing method using the same.

[0002]

2. Description of the Related Art In a vacuum processing apparatus such as a dry etching apparatus, a CVD apparatus or a sputtering apparatus, a plurality of predetermined substrates to be processed are housed in a substrate cassette as one unit (generally called a lot). It is a general vacuum processing apparatus transport system and its operation method that the efficiency of production is improved by putting the processed substrates into the substrate cassette and collecting the processed substrates in the same unit.

However, in the above vacuum processing apparatus, particularly in an apparatus utilizing a reaction by an active gas such as a dry etching apparatus and a CVD apparatus, a reaction product adheres and accumulates in a processing vessel as the processing is performed. Often, problems such as deterioration of vacuum performance, increase of dust, and decrease in the level of an optical monitor signal occur, and in order to avoid such problems, an operation of periodically cleaning the inside of the processing container is performed. Cleaning work includes so-called wet cleaning, which wipes off deposits with an organic solvent, etc., and dry cleaning, which uses active gas or plasma to decompose the deposits. From the viewpoint of workability and efficiency, dry cleaning is superior. These features are becoming essential as production lines become more automated.

An example of a transfer system for a vacuum processing apparatus having such a function is the apparatus disclosed in Japanese Utility Model Laid-Open No. 63-127125.

Further , Japanese Patent Application Laid-Open No. 62-44571 discloses
In the device shown, one vacuum chamber and load
Lock and unload lock rooms and their locks
Two independent vacuum lock chambers corresponding to
Load lock chamber and unload lock chamber
Supply and recovery side cassettes are provided for
I have. Further, Japanese Unexamined Patent Application Publication No. 63-153270 discloses
Equipment, two vacuum processing chambers and one lock
Cassettes, supply and collection side cassettes and each cassette
Belt conveyers provided for substrate transfer corresponding to
Has a bayer. Further, Japanese Unexamined Patent Application Publication No. 2-52449
In the apparatus disclosed in the publication, one vacuum processing chamber
And two auxiliary vacuum chambers and cassettes on the supply and recovery sides
And bells provided for each cassette
Equipped with a conveyor. In addition, actual opening 58-956
In the device disclosed in Japanese Patent Publication No. 36, the supply side and
Substrates provided for each cassette on the collection side
Equipped with a belt conveyor for conveyance.

[0006]

SUMMARY OF THE INVENTION In these devices,
Is usually an air atmosphere containing multiple substrates in the height direction.
Transfer between the cassette and lock chamber
A cassette elevator to transport each substrate by the device
Requires a complicated structure and a complicated lock room.
Or the cassette is divided into a supply side and a collection side.
Thus, there is a problem that management of the substrate becomes complicated.

An object of the present invention is to solve the above problems,
The configuration is simple, and it can be automated for production lines.
Vacuum processing equipment and vacuum for easy substrate management
It is to provide a processing method .

[0008]

A feature of the present invention is that a substrate is
A plurality of cassettes to be stored , an atmosphere transfer device operating in the atmosphere, and a plurality of vacuum processing chambers for processing substrates one by one.
And, the unprocessed substrate and the load lock chamber for loading into the vacuum processing chamber, eh Bei and unload lock chamber for unloading the processed substrate from the vacuum processing chamber, in every one of the substrate
In the vacuum processing apparatus for processing , before the atmospheric transfer apparatus
On a substantially horizontal coplanar surface at a predetermined position on the surface.
Multiple cassette tables on which cassettes are placed are fixedly arranged
The load lock chamber and the unload lock chamber
The load lock chamber is provided on the air side and the vacuum side, respectively.
And unload lock chamber in air or vacuum
The unprocessed substrate or the process to switch
Equipped with an isolation valve that opens and closes each time a loaded substrate is loaded and unloaded.
The atmosphere transfer device includes the load lock chamber and an unload
X, Y, Z and θ located on the front common to the lock chamber
A robot having an axis, and facing the unprocessed substrate
Load cassette from one of the cassettes
Transported one by one through the isolation valve to the
Substrate from the unload lock chamber via the isolation valve
It is configured to collect one sheet at a time in the original position of the original cassette.
It is in being.

Another feature of the present invention is that a plurality of
A cassette, and an air transport device that operates in an air atmosphere ,
A plurality of vacuum processing chambers for processing one by one the substrate, a load lock chamber for loading the unprocessed substrate into the vacuum processing chamber,
The vacuum processing apparatus and a unload lock chamber for unloading the processed substrate from the vacuum processing chamber, the vacuum processing method of a substrate for processing a substrate in one by one, the air
The transfer device includes the load lock chamber and the unload lock.
Located on the front common to the chambers and has X, Y, Z and θ axes
And the load lock chamber and the
Load lock chambers are provided on the atmosphere side and vacuum side, respectively.
The load lock chamber and the unload lock chamber
Untreated to switch to ambient or vacuum atmosphere
It is opened and closed each time a substrate or the processed substrate is loaded and unloaded.
An isolation valve, and a predetermined valve on the front surface of the atmospheric transfer device.
Fixedly located on a substantially horizontal coplanar position.
One of the multiple cassette tables on which each cassette is placed
The cassette containing the unprocessed substrate is placed on the crab.
Removing the untreated substrate by the atmospheric transfer device.
The board is isolated from the cassettes of any of the cassette tables.
A step for transferring each sheet to the load lock chamber via a valve.
And the processed substrate processed in the vacuum processing chamber.
Recover the original power from the unload lock chamber via the isolation valve.
Collecting each piece at the original position of the set .
It is in.

According to the present invention, a cassette containing unprocessed substrates is placed on a cassette table. At this time, since the cassette table is horizontal, the supply operation of the cassette can be simplified, and it is easy to respond to automation of the production line.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIG.

FIG. 1 is a diagram showing an application of a vacuum processing apparatus according to the present invention to an apparatus for performing a dry etching process on a semiconductor wafer.

The apparatus is provided with a plurality (usually 25) for supplying an object to be processed to the apparatus in a state where the unprocessed wafers are stored, and storing and processing the processed wafers at the original position again. A plurality of cassettes 1a capable of storing wafers,
1b and 1c, on which the cassettes 1a, 1b, 1c are mounted and always fixed on a horizontal or near-horizontal plane without changing the position and attitude for determining the position of introduction / discharge to the apparatus. Cassette table 2a, 2 fixed in position
b, 2c, a load lock chamber (substrate receiving chamber) 5 for introducing a wafer into a vacuum atmosphere, which is equipped with a vacuum exhaust device and a gas introducing device (not shown), and an unload lock chamber for taking the wafer into the atmosphere ( Substrate unloading chamber) 6.
Etching 11 for performing etching process on wafer
(11a, 11b, 11c), an isolation valve 12 capable of separating them airtightly, and a load lock chamber (substrate receiving chamber) 5 / unload lock chamber (substrate unloading chamber) 6 and cassettes 1a, 1b, 1c. Between the load lock chamber (substrate receiving chamber) 5 / unload lock chamber (substrate unloading chamber) 6 and the cassettes 1a, 1b, 1c provided with a robot having X, Y, Z and θ axes. And a first transfer device 13 for transferring wafers.

As an operation of the apparatus, first, cassettes 1a and 1b storing unprocessed wafers are supplied from a stocker (not shown) to the apparatus by a robot or an operator, and are mounted on the cassette tables 2a and 2b. At this time, since the cassette tables 2a and 2b are on the same horizontal plane, it is possible to simplify the operation of supplying the cassette, and it is easy to respond to automation of the production line. On the other hand, the cassette table 2
On c, a cassette 1c containing dummy wafers is placed.

The apparatus is capable of recognizing the production information given to the cassette by itself, based on information sent from a higher-level control device, or by a command input by an operator.
The wafer can be processed by any of the methods.

An unprocessed wafer (substrate) 20 stored in the cassette 1a is extracted by the first transfer device 13, and a load lock chamber (substrate receiving device) disposed on the opposite side of the first transfer device 13 from the cassette 1a. To chamber 5) Isolation valve 12a
Carry in through. At this time, the wafer (substrate) 20
It may be stored in any place in the cassette 1a. After the wafer (substrate) 20 enters the load lock chamber (substrate receiving chamber) 5 from the isolation valve 12a, and exits the unload lock chamber (substrate unloading chamber) 6 from the isolation valve 12b, the atmosphere outside the apparatus is completely complete. Because it is in a state of being cut off,
A partition is provided between the isolation valves 12a and 12b, and the cassette tables 2a and 2b and the cassettes 1a and 1b mounted thereon are provided.
In addition, only the first transfer device 13 can be placed in the clean room where the cleanliness is high, and the rest can be placed in the maintenance room where the cleanliness is low. After closing the isolation valve 12a, the load lock chamber (substrate receiving chamber) 5 is evacuated to a predetermined pressure by an exhaust device (not shown), and then the isolation valve 12b is opened to transfer the wafer (substrate) 20. The wafer is transferred to each of the etching chambers 11 (11a, 11b, 11c) by a vacuum transfer device (not shown) provided in the chamber 16, and is placed on each of the sample tables 8 (8a, 8b, 8c).

Each of the etching chambers 11a, 11b, 11
In c, an isolation valve 12a ', 12b', 12c '(not shown) is provided between the transfer chamber 16 and the transfer chamber 16 so as to airtightly separate them.

Each of the etching chambers 11 (11a, 11b, 1)
The wafer (substrate) 20 carried into 1c is subjected to an etching process under predetermined conditions. During this time, the load lock chamber (substrate receiving chamber) 5 is returned to the atmospheric pressure by the gas introduction device 4 with the isolation valves 12a and 12b closed, and the same as the first wafer from the opened isolation valve 12a. 2
The first wafer is loaded by the first transfer device 13,
It is evacuated again to a predetermined pressure by the exhaust device.
When the etching process of the first wafer (substrate) 20 is completed, the isolation valve 12c is opened, and the processed wafer (substrate) 20 is carried out to the unload lock chamber (substrate unloading chamber) 6, and then the isolation valve is opened. 12c is closed and the isolation valve 12 is closed.
b is opened, a second wafer is carried in from the load lock chamber (substrate receiving chamber) 5, and after the isolation valve 12b is closed, the etching process is started.

The processed wafer (substrate) 20 carried out to the unload lock chamber (substrate unloading chamber) 6 returns to the atmospheric pressure in the unload lock chamber (substrate unloading chamber) 6, and then passes through the first isolation valve 12d. It is taken out into the atmosphere by the transport device 13 and returned to the original position in the cassette 1a that was initially stored.

By repeating the above operation, the processing of the unprocessed wafers stored in the cassette 1a is completed, and when the wafers are stored again in the original position, the cassette 1a can be collected.
The apparatus is replaced with a cassette containing another unprocessed wafer, but the apparatus continues to process the unprocessed wafers in the cassette 1b, and another unprocessed wafer is processed before processing of all the wafers in the cassette 1b is completed. When a cassette containing wafers is supplied, the apparatus can always be operated continuously. At this time, since the cassette 1a and the cassette 1b are on the same horizontal plane, the operation of collecting the cassette 1a and the operation of supplying a cassette containing another unprocessed wafer are not affected by the access to the cassette 1b by the transfer device 13. Can be done without giving.

In the etching chamber 11, the reaction product adheres to and accumulates on the inner wall surface as the processing is repeated. Therefore, it is necessary to remove the adhered substance by plasma cleaning and restore the original state. In practice, the dummy wafers 30 stored in the cassette 1c are extracted by the first transfer device 13, and thereafter the processing is performed in exactly the same manner as in the case of the processing target wafer (substrate) 20. Can be returned to the original position in the cassette 1c, and the dummy wafers 30 are always stocked in the cassette 1c.

If all of the dummy wafers 30 in the cassette 1c have been used for plasma cleaning, or if the dummy wafers 30 have failed due to several uses, the dummy wafers 30 will not be used.
Are exchanged every cassette 1c.

Therefore, it is not necessary to treat the plasma cleaning as a special processing sequence, the plasma cleaning can be performed as a series of operations by incorporating the cleaning into a normal etching process, and the cleaning cycle can be arbitrarily set. is there. There is no need for a special mechanism for plasma cleaning from the hardware of the apparatus, and the dummy wafer 30 is mounted on one of the plurality of cassette tables (2c in this example).
It is only necessary to install a cassette (1c in this example) in which the wafer to be processed 20 is stored instead of the cassette in which the dummy wafer 30 is stored. It is needless to say that the installation enables more efficient production.

Further, since the dummy wafer once used for the plasma cleaning is returned to the original cassette in the atmosphere again, in the vacuum chamber, the used dummy wafer and the normal processing are to be processed. Unprocessed wafers are not mixed, and there is no concern about product contamination.

[0025]

According to the present invention, a horizontal coplanar power supply is provided.
Set, adoption of atmospheric transfer device with robot and isolation valve
This eliminates the need to raise and lower the cassette table, making the configuration simple.
Be clean. In addition, automation for production lines is possible.
is there. In addition, since it returns to the original position of the original cassette,
Easy board management.

[Brief description of the drawings]

FIG. 1 is a plan view of a dry etching apparatus according to an embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate cassette, 2 ... Cassette stand, 5 ... Load lock chamber (substrate receiving chamber), 6 ... Unload lock chamber (substrate unloading chamber), 8 ... Sample table, 11 ... Etching chamber, 12 ... Isolation valve, 13 ... First transfer device, 16: transfer chamber, 20: wafer (substrate), 30: dummy wafer.

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Atsushi Ito 794, Higashi-Toyoi, Kazamatsu-shi, Yamaguchi Pref. Hitachi, Ltd. Kasado Plant (56) References JP-A-62-44571 (JP, A) JP-A Sho 63-153270 (JP, A) JP-A-2-52449 (JP, A) JP-A-58-95636 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/68 H01L 21/205 H01L 21/3065

Claims (2)

(57) [Claims] 1. A plurality of cassettes for storing substrates, an atmospheric transfer device operating in an atmospheric atmosphere, a plurality of vacuum processing chambers for processing substrates one by one, and a method for loading unprocessed substrates into the vacuum processing chamber. A load lock chamber and an unload lock chamber for unloading the processed substrate from the vacuum processing chamber, and a vacuum processing apparatus for processing substrates one by one. A plurality of cassette tables on which the cassettes are respectively mounted are fixedly arranged on a substantially horizontal plane, and provided on the atmosphere side and the vacuum side of the load lock chamber and the unload lock chamber, respectively. An isolation valve that is opened and closed each time one unprocessed substrate or one processed substrate is loaded and unloaded to switch the chamber and the unload lock chamber to the atmospheric atmosphere or the vacuum atmosphere. The atmospheric transfer device is positioned on the front common to the load lock chamber and the unload lock chamber, X, Y, Z and θ
A robot having an axis, transferring the unprocessed substrates one by one from the cassette of any one of the cassette tables to the load lock chamber via the isolation valve, and unloading the processed substrates. A vacuum processing apparatus characterized in that each of the cassettes is recovered from the lock chamber to the original position of the original cassette via the isolation valve. 2. A plurality of cassettes for accommodating substrates, an atmospheric transfer device operating in an atmospheric atmosphere, a plurality of vacuum processing chambers for processing substrates one by one, and an unprocessed substrate to be loaded into the vacuum processing chamber. A vacuum processing apparatus provided with a load lock chamber and an unload lock chamber for unloading a processed substrate from the vacuum processing chamber. The device is located on the front surface common to the load lock chamber and the unload lock chamber, and includes X, Y, Z and θ.
A load lock chamber and an unload lock chamber are provided on the atmosphere side and the vacuum side, respectively, for switching the load lock chamber and the unload lock chamber to an atmosphere atmosphere or a vacuum atmosphere. It has an isolation valve that is opened and closed each time the unprocessed substrate or the processed substrate is carried in and out, and is fixedly arranged on a substantially horizontal same plane at a predetermined position on the front surface of the atmospheric transfer device. Loading the cassette containing the unprocessed substrate on one of a plurality of cassette tables on which the cassette is mounted; and loading the unprocessed substrate onto the cassette on one of the cassette tables by the atmospheric transfer device. Transferring the wafers one by one to the load lock chamber via the isolation valve from the vacuum processing chamber. Recovering the original cassette from the load lock chamber to the original position of the original cassette via the isolation valve one by one.