JP3149503B2 - Plasma cleaning equipment for substrates - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma cleaning apparatus for a substrate, and more particularly, to an assembling structure of a mounting portion for transferring a substrate into and out of a casing for plasma generation and a substrate transfer means.

[0002]

2. Description of the Related Art In a manufacturing process of a substrate on which electronic components are mounted, an electrode of a semiconductor chip mounted on the substrate and an electrode of the substrate are connected by wires. In such a wire bonding step, if impurities are attached to the electrodes of the substrate, the wires cannot be firmly bonded to the electrodes. These impurities include hand grease that adheres when workers handle the substrate by hand, gasified oil that floats in the air, oxide films that are naturally formed on the electrode surface, and gases such as oxygen and nitrogen in the air. There are adsorption films and the like.

As a means for removing such impurities prior to wire bonding, the present applicant has previously proposed a plasma cleaning apparatus (Japanese Unexamined Patent Publication No. Hei.
No. 159143). This is particularly the case in FIGS. 1 and 2
As shown in FIG. 2, the substrate 20 conveyed by the first conveyor 17 is transferred onto the receiver 10 by the transfer means 21, the receiver 10 is advanced into the casing 1, and After closing the opening 2, plasma such as Ar gas is generated in the casing 1 to clean the surface of the substrate 20, and then the mounting portion 10 is pulled out of the casing 1, and the substrate 20 on the mounting portion 10 is removed. Delivery means 2
1, the paper is transferred to the second conveyor 18 and transported to the next step.

[0004]

In the above-described plasma cleaning apparatus, the mounting section 10, the first conveyor 1
7, the second conveyor 18 and the delivery means 21 are separately assembled. However, when these means 10, 17, 18, 21 are assembled separately, a considerably large assembling error occurs, and as a result, the first conveyor 17 to the receiver 10 and the second to the second receiver 10 by the transfer means 21. There was a problem that the delivery error of the substrate 20 to the conveyor 18 was likely to occur.

In the case where a lid member 11 is provided integrally with the receiver 10 and the opening 2 of the casing 1 is opened and closed by entering and exiting the receiver 10 as in the above-mentioned conventional means, the same applies. Due to an assembly error, the opening 2 cannot be tightly closed by the lid member 11, and there is a problem that the airtightness of the casing 1 is easily impaired.

Accordingly, an object of the present invention is to provide a plasma cleaning apparatus which can solve the above-mentioned problems of the conventional means.

[0007]

According to the present invention, a mounting portion for positioning and mounting a mounting portion, a first conveyor, a second conveyor and a delivery means is mounted on a plasma generating casing. A flange is provided so that these means can be integrally assembled to the flange.

[0008]

According to the above construction, since each means is integrally mounted on the same flange, each mounting error can be substantially eliminated, and the transfer of the substrate can be performed reliably.

[0009]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an overall perspective view of the plasma cleaning apparatus. Reference numeral 1 denotes a cylindrical casing, and a pipe 2 for supplying a plasma generating gas such as Ar gas is provided upright on the upper part of the casing. Reference numeral 8 denotes a main body box in which the casing 1 is installed. Reference numeral 3 denotes a flange mounted on the front surface of the casing 1, to which components described below are attached.

Reference numeral 10 denotes a mounting portion made of an aluminum plate which enters and exits from an opening 4 formed in the flange 3 in a slit shape, and a lid member 11 of the opening 4 is attached to a rear portion thereof. The lid member 11 is supported by a bracket 14 erected on the nut 12. Reference numeral 13 denotes a feed screw with which the nut portion 12 is screwed. Reference numeral 15 denotes a drive motor for driving the nut portion. When the motor 15 is driven, the nut portion 12 moves in the Y direction along the feed screw 13 and the mounting portion 10 is opened. It goes in and out of the casing 1 from the part 4. In addition, the lid member 11 moves integrally with the placement unit 10 to open and close the opening 4. That is, the nut part 12 and the feed screw 13 constitute a moving means for reciprocating the mounting part 10 in the Y direction. In FIG. 5, reference numeral 29 denotes a packing for sealing the opening 4.

In FIG. 1, reference numerals 9 denote brackets mounted on both sides of the lid member 11, on which guide rods 16 are mounted. 17, 18 sandwich the mounting portion 10,
This is a conveyor arranged in a direction intersecting with the mounting portion 10, and the substrate 20 is moved in the Y direction which is the moving direction of the mounting portion 10.
It is transported in the X direction perpendicular to the direction (see also FIG. 4). 19
Is a stopper for stopping the substrate 20. Reference numeral 21 denotes a delivery unit for transferring the substrate 20, which includes a horizontally long holder 22, a timing belt 23 provided in the holder 22,
A drive unit 25 held by the timing belt 23;
The suction pad 24 driven up and down by the drive unit 25
And a drive motor 26 for the timing belt 23. The suction pad 24 reciprocates in the X direction between the conveyor 17 and the placement unit 10 and between the placement unit 10 and the conveyor 18 to suck and transfer the substrate 20.

FIG. 2 shows the above means 10, 17, 18, 21.
2 shows an assembling means to the flange 3. Reference numeral 31 denotes a slide bearing mounted on the flange 3, and the mounting portion 10 is assembled to the flange 3 by inserting the guide rod 16 into the slide bearing 31. Reference numeral 32 denotes an L-shaped bracket on which the above-mentioned conveyors 17 and 18 are supported. As shown in FIG. It is assembled to the flange 3 by screwing into the hole 35. Reference numeral 36 denotes a pin protruding from the upper part of the flange 3. The delivery means 21 is mounted on the flange 3 by placing the lower surface of the holder 22 on the pin 36 and screwing a screw 34 into the pin.

In FIG. 2, reference numeral 37 denotes an L-shaped plate, which is attached to a lower portion of the flange 3. 38 is the flange 3
, And comes into contact with the upper surface of the L-shaped plate 37. The flange 3 is assembled to the main body box 8 via an L-shaped plate 37. Thus, each of the above means 1
0, 17, 18 and 21 are positioned on mounting portions such as the slide bearing 31, pins 33 and 36, and the hole 35 provided on the flange 3 and are integrally mounted on the flange 3, so that an assembling error is caused. Can be made extremely small.

The operation of this plasma cleaning apparatus is as follows.
The operation is similar to that of the above-mentioned Japanese Patent Application Laid-Open No. 3-159143, and its operation will be described below. 1 and 4, the substrate 20 conveyed by the conveyor 17 is a stopper 1
Stop at 9 Then, the suction pad 24 of the transfer means 21 sucks and takes up the substrate 20 and transfers it to the mounting portion 10 (see FIG. 5). At this time, the receiver 10
Is driven toward the casing 1 by driving the motor 15, and the suction pad 24 reciprocates between the conveyor 17 and the mounting portion 10 to mount the substrate 20 in synchronization with the pitch feeding. By transferring the substrate 20 to the mounting portion 10, the substrates 20 are sequentially aligned and mounted on the mounting portion 10 one by one.

When a large number of substrates 20 are mounted in this way, the mounting portion 10 completely enters the casing 1 and
The lid member 11 closes the opening 4 (see FIG. 6). Next, a vacuum pump (not shown) is operated to reduce the pressure inside the casing 1 and supply Ar gas into the casing 1.
Next, plasma is generated inside the casing 1 by applying a high-frequency AC voltage to the electrode portion of the casing 1. At this time, a part of the Ar gas is ionized, and the Ar gas molecules and the ionized Ar + and minus electrons move violently at high speed in the casing 1 to collide with the surface of the substrate 20 to remove impurities adhering to the electrode portion. The removed impurities are sucked and removed by a vacuum pump.

After the impurities have been removed in this manner,
Open the valve (not shown) to return the inside of the casing 1 to normal pressure. Next, the mounting portion 10 is pitch-fed in the direction opposite to the previous direction and is pulled out of the casing 1. At this time, in synchronism with the pitch feed, the suction pad 24 moves the placement unit 10 and the conveyor 18.
The substrate 20 is transferred to the conveyor 18 and then transferred to a wire bonding step. In the above operation, the placing section 10, the conveyors 17, 18, the delivery means 21
And the like are accurately assembled to the flange 3 without an assembly error, so that the substrate 20 can be reliably delivered. Also, as shown in FIG. 5, with the lid member 11 closed, the packing 9 firmly contacts the flange 3 and the opening can be completely sealed.

[0017]

As described above, according to the present invention, the mounting portion,
A mounting portion for positioning and mounting the first conveyor, the second conveyor, and the delivery means is provided on the flange, and these means are integrally mounted on the flange. Thus, the delivery of the substrate by the delivery means can be reliably performed.

[Brief description of the drawings]

FIG. 1 is a perspective view of a plasma cleaning apparatus according to the present invention.

FIG. 2 is an exploded view of a main part of the plasma cleaning apparatus according to the present invention.

FIG. 3 is a side view of a main part of the plasma cleaning apparatus according to the present invention.

FIG. 4 is a partial plan view of the plasma cleaning apparatus according to the present invention.

FIG. 5 is a partial side view of the plasma cleaning apparatus according to the present invention.

FIG. 6 is a partial sectional view of a plasma cleaning apparatus according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Casing 3 Flange 4 Opening 10 Mounting | placing part 17 1st conveyor 18 2nd conveyor 20 Substrate 21 Delivery means 31 Mounting part 33 Mounting part 35 Mounting part 36 Mounting part

──────────────────────────────────────────────────続 き Continuation of the front page (51) Int.Cl. ⁷ identification code FI H01L 21/60 301 H01L 21/302 N (58) Investigated field (Int.Cl. ⁷ , DB name) H01L 21/68 H01L 21 / 304 645 H01L 21/304 648

Claims (1)

(57) [Claims] 1. A casing for generating plasma, a flange mounted on the casing, a mounting portion for a substrate provided in front of the flange and entering and exiting from an opening formed in the flange, A first conveyor for transporting the substrate to the mounting portion, and a second conveyor for unloading the substrate from the mounting portion.
And a transfer means for transferring the substrate between the mounting portion and the first and second conveyors, and positioning the mounting portion, the first conveyor, the second conveyor and the transfer means. A plasma cleaning apparatus for a substrate, wherein a mounting portion to be mounted and mounted is provided on the flange and integrally mounted on the flange.