JP3152033B2 - IC card mounting structure of IC card - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a mounting structure of an IC module mounted on an IC card.

[0002]

2. Description of the Related Art As shown in FIG. 4, a conventional IC module is mounted on an IC card.
The IC module 43 was fitted into the device.

The IC module 43 includes a printed circuit board 4
4, IC chip 45, sealing resin portion 46, external terminals, bonding wires and the like. The printed circuit board 44 has a rectangular plate shape, and the IC chip 4
5 is fixed by resin sealing. The IC chip 45 is connected to a wiring pattern on the printed circuit board 44 via a bonding wire. This wiring pattern is connected to external terminals on the other surface of the printed circuit board 44.

The card base material 41 is a flat plate made of plastic and has a thickness of about 0.76 mm. A concave portion 42 into which the IC module 43 is fitted is formed on one surface of the card base material 41.
Are formed. The recess 42 is provided in the IC module 4
In correspondence with the shape of No. 3, it is formed by a two-step concave portion of a deep portion into which the IC chip 45 and the sealing resin portion 46 are fitted, and a shallow portion into which the peripheral portion of the printed circuit board 44 is fitted.

Then, after adhering, for example, a sheet-like adhesive 47 to the peripheral surface of the printed circuit board 44, the IC module 43 is fitted into the recess 42, and the adhesive is heated. As a result, the peripheral portion of the printed circuit board 44 is bonded to the shallow portion of the concave portion 42 by the adhesive 47,
The module 43 is mounted on the card base material 41.

[0006]

However, in such a conventional mounting structure of an IC module, the IC module may be broken by heat generated at the time of mounting. That is, disconnection of the bonding wire, separation of the bonding pad, and the like occurred due to thermal stress (such as expansion of the sealing resin). Further, when the card base material is bent, bending stress concentrates on a portion where the sectional area of the card base material changes rapidly. As a result, cracking of the portion, peeling of the adhesive, breakage of the printed circuit board, disconnection of the bonding wire, and the like may occur.

[0007]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an IC module mounting structure of an IC card which prevents breakage of an IC module and peeling of an adhesive during manufacture and use.

[0008]

According to a first aspect of the present invention, an IC card includes a card base having a concave portion, and an IC module fitted in the concave portion. Module base material, an IC chip fixed to the center of the module base material, and a sealing resin portion covering the IC chip. I fixed to the inner wall
In the IC module mounting structure of the C card, a hollow portion defined between the sealing resin portion and the inside of the concave portion,
This is an IC module mounting structure of an IC card filled with a resin filler having high heat dissipation.

[0009]

According to a third aspect of the present invention, there is provided an IC module mounting structure, wherein the IC card has a card base having a concave portion, and an IC module fitted in the concave portion.
The IC module includes a flat module base, an IC chip fixed to the center of the module base,
A sealing resin portion for covering the IC chip, wherein a peripheral portion of the module base material is fixed to an inner wall of the recess by an adhesive in an IC module mounting structure of an IC card, and the inside of the recess is It is characterized in that a heat radiating material is interposed in a cavity defined between the sealing resin portion.

[0011]

In the IC module mounting structure according to the first aspect, since the cavity is filled with a filler made of a resin having high heat radiation, heat is radiated by the filler and the sealing resin is formed. No thermal stress remains. Also, IC
When the card is bent, the bending stress concentrates on the concave portion. This is because the cross section of the concave portion is suddenly changed.
A large bending force acts on the filler through the concave portion, and the bending force is absorbed by the filler. Or
The bending force acting on the filler does not concentrate on a part but acts in a dispersed manner. As a result, peeling and breakage of the IC module are reduced.

[0012]

In the IC module mounting structure according to the third aspect, heat is dissipated through the cavity by the heat dissipating material. Therefore, the heat radiation and cooling action from the sealing resin portion and the like are enhanced, and module destruction or the like due to residual thermal stress is prevented.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing a first embodiment of an IC module mounting structure of an IC card according to the present invention. FIG. 2 is a sectional view showing a mounting structure according to the second embodiment.
FIG. 3 is a sectional view of an IC module mounting portion according to the third embodiment.

The IC card according to the first embodiment has a card base 11 and an IC module 12 mounted thereon.

The card substrate 11 is made of, for example, vinyl chloride, A
It is made of BS resin, polyester, polypropylene, styrene resin, acrylic, polycarbonate, plastic resin such as vinyl chloride / vinyl acetate copolymer, etc., and a single layer or a plurality of layers are laminated by heat laminating or an adhesive. It has a flat plate shape of .76 mm.
In the figure, a single-layer state is described. This card base material 11
A concave portion 13 for fitting the IC module 12 is formed on the upper surface of the device.

The IC module 12 is printed on a printed circuit board (module base) 14, an IC chip 15, a resin mold section 16, external terminals, bonding wires, and the printed circuit board 14 on the side where the IC chip 15 is mounted. It is configured to include a wiring pattern, and a through hole for electrically connecting the wiring pattern to an external terminal.

The printed circuit board 14 is a rectangular plastic plate, and an IC chip 15 is fixed and mounted at the center of the lower surface. The IC chip 15 is connected to a wiring pattern on the printed board 14 by a bonding wire. This wiring pattern is further connected to an external terminal through a through hole. Data is exchanged with an external device via the external terminal.
The bonding wire and the IC chip 15 are sealed with a molding resin to form a substantially trapezoidal resin molded portion 16, and the resin molded portion 16 protrudes from the printed board 14 by a predetermined height. The shape of the IC module may be a circle, an ellipse, or a polygon in addition to the rectangle. Although not shown, a flat IC module substrate may be a lead frame-shaped conductor, and may be directly connected to an IC chip, so that a through hole is unnecessary and an external connection terminal may be used.

The adhesive 17 adhered to the peripheral edge of the lower surface of the printed circuit board 14 is in the form of a sheet.
A rectangular window is provided so that the resin mold portion 16 is fitted. The adhesive 17 makes the printed circuit board 14
Is fixed to the bottom wall of the recess 13 of the card base material 11. As the adhesive 17, for example, a thermal adhesive film such as acrylic or SBR, or a double-sided adhesive sheet coated with a (pressure-sensitive) adhesive is used. Instead of the sheet-like adhesive 17, a synthetic rubber-based adhesive such as silicon can be used.

Then, the resin mold portion 16 and the concave portion 1 are formed.
A cavity 18 is formed between the three bottom walls, and the cavity 18 is filled with a filler 19. Filling material 19
For example, a material having a high heat radiation effect, such as a silicon-based resin, is used.

The procedure for mounting the IC module 12 in the recess 13 will be described below. First, an adhesive 17 having a rectangular flat plate shape and having a rectangular window at the center thereof is prepared. Also,
The IC module 12 is mounted on the printed circuit board 14 by the IC chip 1
5 is prepared as a resin mold. Further, a recess 13 having a predetermined shape is formed in the card base material 11.

Next, the adhesive 17 is overlaid on one surface of the printed circuit board 14 (the surface on which the IC chip 15 is molded). Then, these are pressed, and the adhesive 17 is fixed to the peripheral portion of the printed circuit board 14.

Then, a paste-like filler 19 is applied to the bottom surface of the concave portion 13 of the card base material 11 to a predetermined thickness.
Next, the IC module 12 is fitted into the recess 13 of the card base 11 with the resin mold portion 16 facing down. Then, when the surface of the resin mold portion 16 comes into contact with the filler 19, a predetermined force is applied to press it. Then, the paste-like filler 19 wraps around the cavity 18 of the recess 13 and is filled.

Then, the IC module 12 is mounted on the card substrate 11 with the adhesive 17 by heating / pressing. When the external force acts on the IC module, in particular, the IC chip 15, the filler 19 has a function of dissipating the heat applied at the time of fixing by the adhesive 17 and a function of buffering the external force.

[0025]

[0026]

In the second embodiment shown in FIG. 2, a heat radiating material 31 such as aluminum foil is provided at the bottom of the hollow portion 18, that is, the concave portion 13. The heat dissipating material 31 radiates the heat at the time of bonding to the outside. Heat dissipation material 3
1 is mounted on the cavity 18 by placing a heat radiating material 31 having substantially the same shape as the recess 13 on the bottom wall of the recess 13 and then bonding the IC module 12 with the adhesive 17. Other components and operations are the same as those in the above embodiment.

[0028]

According to the present invention, breakage of the IC module, peeling of the adhesive and the like can be prevented.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an IC module mounting portion of an IC card according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing an IC module mounting portion of an IC card according to a second embodiment of the present invention.

FIG. 3 is a sectional view showing a conventional IC card module mounting portion.

[Explanation of symbols]

 11 card base material, 12 IC module, 13 recess, 14 module base material, 15 IC chip, 16 sealing resin part, 17 adhesive, 18 cavity, 19 filler, 31 heat dissipation material.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-3-205197 (JP, A) JP-A-60-209882 (JP, A) JP-A-1-145197 (JP, A) 27374 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) B42D 15/10 521 G06K 19/077

Claims (2)

(57) [Claims] An IC card has a card base having a concave portion, and an IC module fitted in the concave portion. The IC module has a flat module base and a central portion of the module base. An IC chip fixed to the
A sealing resin portion for covering the IC chip, wherein a peripheral portion of the module base material is fixed to an inner wall of the recess by an adhesive in an IC module mounting structure of an IC card; An IC module mounting structure for an IC card, wherein a hollow portion defined between the sealing resin portion and the sealing resin portion is filled with a resin filler having high heat dissipation. 2. An IC card comprising: a card base having a concave portion; and an IC module fitted in the concave portion. The IC module has a plate-shaped module base and a central portion of the module base. An IC chip fixed to the
A sealing resin portion for covering the IC chip, wherein a peripheral portion of the module base material is fixed to an inner wall of the recess by an adhesive in an IC module mounting structure of an IC card; An IC module mounting structure for an IC card, wherein a heat radiating material is interposed in a cavity defined between the sealing resin and the sealing resin.