JP3162292B2 - IC handler - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC handler for transferring and transferring ICs to a predetermined section, for example, sequentially transferring a plurality of ICs to a predetermined section of an IC test apparatus, and discharging the tested IC from the test apparatus. It is a handler,
By increasing the speed of unloading, the operation rate of the IC test equipment and the like is improved.

[0002]

2. Description of the Related Art In an IC test apparatus and the like, a pick-and-place method and a rotary index method are widely known as IC handlers for transporting an IC to a predetermined portion and carrying out a tested IC from the predetermined portion.
In a predetermined part (measurement part) of the C test apparatus, the probe needle is brought into contact with the IC pad with an appropriate pressure, or the IC lead is brought into contact with the IC lead to the test pad.
It is necessary to press C with a clamp from above or to push up the probe needle toward the IC.

In a conventional IC handler that moves an IC holder by an air cylinder, a motor, or the like, an air cylinder, a motor, or the like is generally used as a driving source of the IC holder that moves by sucking an IC.
In order to clamp the IC or push up the probe needle in the test apparatus, an air cylinder and a motor other than the driving source used in the IC handler were required.

[0004]

As described above,
In the conventional IC handler, means for transporting an IC to a predetermined portion and means for bringing a probe needle into contact with the IC in the predetermined portion are operated by different driving sources.

Therefore, a large number of I
When checking C, it is impossible to reduce the test interval to 0.5 seconds or less, and there is a problem that the operation rate of an expensive test apparatus is low. Further, since there is no means for monitoring the contact pressure between the IC and the probe needle or the contact between the IC lead and the test pad, the probe needle or the IC lead may be deformed or the measurement board of the test apparatus may be damaged due to overload. There were also problems such as.

[0006]

SUMMARY OF THE INVENTION It is an object of the present invention to reduce the time for transporting an IC and to prevent damage to the IC caused when the transported IC is pressed against a predetermined portion.

A first IC handler according to the present invention for achieving the above object comprises a rotating shaft intermittently rotating by a predetermined angle, an IC
The supply unit holds the IC and rotates intermittently with the rotating shaft,
A plurality of IC holders for separating the ICs at the C discharging portion, and a guide formed to move the plurality of IC holders in the length direction of the rotating shaft, and a cylindrical shape disposed outside the rotating shaft. A body, pressing means for pressing the IC holder facing the predetermined part toward the predetermined part, and a drive source for intermittently rotating the rotating shaft and reciprocating the pressing means toward the predetermined part. The rotation shaft is provided with at least one guide extending at a predetermined angular interval, the guide extending in the length direction of the rotation shaft, and the IC holder sliding in the length direction of the rotation shaft. The plurality of IC holders sliding along the guide include first engagement means projecting toward the guide of the cylindrical body and engaging with the guide, and a first engagement means opposite to the first engagement means. And a second engaging means which projects in the direction and engages the pressing means, and is provided at a position facing the predetermined portion. A cut-out portion is formed in the guide of the cylindrical body, which is formed in a curve in which the IC holder approaches the predetermined portion, from which the first engaging means of the IC holder approaching the predetermined portion is disengaged. When the shaft stops rotating, the IC holder includes at least the IC supply unit, the predetermined unit, and the IC.
That is, it is configured to be located at the discharge section.

A second IC handler according to the present invention for achieving the above object comprises a loading tray for supplying ICs,
A preheat panel for preheating the IC, a rotary head unit, a cooling panel for cooling the IC, an unloading tray for sending out the IC, a first carrier for transferring the IC to an IC supply unit of the rotary head unit, The second for transferring the IC from the rotary head to the cooling panel
And a first loading robot that transports the IC of the loading tray to the preheat panel;
A second loading robot for mounting the IC on the pre-heat panel on the first carrier, a first unloading robot for transferring the IC on the second carrier to the cooling panel, and an IC for the cooling panel. The unloading robot shown in FIG. 2 for transferring to the unloading tray is provided. The rotary head section rotates intermittently by a predetermined angle, and the IC supply section holds the IC and intermittently rotates together with the rotation axis. A plurality of I's that rotate and separate the IC at the IC discharger
A C holder, a tubular body formed with a guide for moving the plurality of IC holders in the longitudinal direction of the rotating shaft, and disposed outside the rotating shaft; and the IC holder facing a predetermined portion. And a driving source for intermittently rotating the rotating shaft and reciprocating the pressing unit toward the predetermined portion, wherein the rotating shaft has a longitudinal direction. , And at least one guide at which the IC holder slides in the length direction of the rotation shaft is provided at predetermined angular intervals.
The plurality of IC holders sliding along the guide of the rotating shaft includes first engagement means projecting toward the guide of the cylindrical body and engaging with the guide, and a first engagement means. A second engaging means projecting in a direction opposite to the joining means and engaging with the pressing means, and wherein the IC holder is formed in a curve approaching the predetermined part at a position facing the predetermined part. The guide of the cylindrical body is formed with a cutout portion in which the first engaging means of the IC holder approaching the predetermined portion is disengaged, and when the rotation shaft stops rotating, the IC holder is at least the IC holder. That is, it is configured to be located at the IC supply section, the predetermined section, and the IC discharge section.

Further, the third object of the present invention to achieve the above object is as follows.
In the first and second IC handlers, the IC handler presses the IC to a predetermined portion via the overload prevention member and the load cell, and the IC holder of the IC holder is a vacuum suction, and The IC holder is provided with an IC heating heater, and the vacuum suction pipe is connected to each IC holder under the rotation shaft, and the wiring of the heater is connected through the rotation shaft. is there.

In the first and second IC handlers according to the present invention, the means for transporting the IC to the predetermined portion and the means for pressing the IC against the predetermined portion are performed by the same driving source. Therefore, in the related art in which the drive source for transporting the IC to the predetermined portion and the drive source for pressing the IC against the predetermined portion are separate, it is necessary to replace the IC, which could hardly be made 0.5 seconds or less. The required time can be reduced to about 0.4 seconds or less.

Further, the IC is pressed against a predetermined portion through the overload preventing member and the load cell, thereby preventing damage to the IC and introducing a suction pipe connected to the IC holder from below the rotating shaft. At the same time, the rotation shaft can be made thinner by being introduced from above the rotation shaft of the wiring connected to the IC holder.

[0012]

FIG. 1 shows an IC according to an embodiment of the present invention.
It is a top view which shows the schematic structure which utilized the handler for the IC test apparatus.

In FIG. 1, reference numeral 1 denotes a loading tray in which a large number of test ICs are arranged in a plane, and 2 denotes an IC before the test.
Pre-heat panel for pre-heating the IC, 3 is the tested IC
Cooling panel, 4 is cooled and tested IC
A rotary head for transferring the preheated IC to a predetermined portion of the test apparatus 6 and taking out the tested IC, and a linear carrier 7 for transferring the IC of the preheat panel 2 to the rotary head 5. ,
Reference numeral 8 denotes a rotating carrier for moving the tested IC to the vicinity of the cooling panel.

Further, 9 is a loading robot for transporting the IC in the tray 1 to the preheat panel 2, 10 is a loading robot for mounting the IC in the preheat panel 2 on the straight carrier 7, and 11 is a cooling panel for cooling the IC of the rotating carrier 8. Unloading robot to transport to 3, 1
Reference numeral 2 denotes an unloading robot for sending the IC of the cooling panel 3 to the tray 4.

The IC suction pad 14 of the loading robot 9 moves vertically along the rail 15 in the figure, and the rail 15 moves horizontally along the rail 16 in the figure. The pad 17 moves in the vertical direction in the figure along the rail 18, and the rail 18 moves in the horizontal direction in the figure along the rail 16.

The rectilinear carrier 7 on which the preheated IC is mounted moves vertically in the figure along the rail 19, and the rotating carrier 8 on which the tested IC is mounted.
Is rotated 90 degrees by the rotation of the shaft 20 as shown by the broken line in the figure.

The suction pad 21 of the unloading robot 11 moves vertically along the rail 22 in the figure,
The rail 22 moves in the horizontal direction of the drawing along the rail 23, the IC suction pad 24 of the unloading robot 12 moves in the vertical direction of the drawing along the rail 25, and the rail 25 moves along the rail 23. It moves in the left-right direction of the figure.

The rotary head section 5 rotates intermittently at a fixed angle (90 degrees in the figure), and transports the IC transported to the IC supply section by the rectilinear carrier 7 to a predetermined section (measurement section) of the test apparatus 6 for measurement. The completed IC is mounted on the rotating carrier 8. Therefore, a plurality of IC holders 26 that move up and down are mounted at regular angular intervals (in the figure, at 90 ° intervals).

FIG. 2 is an explanatory view of the rotary head portion in the embodiment, FIG. 3 is a developed view of the cylindrical body shown in FIG. 2, FIG. 4 is a perspective view of the drive source shown in FIG. 2, and FIG. FIG. 6 is a time chart showing the operation of the drive shaft and the pressing means, FIG. 6 is an explanatory diagram of the stop position of the rotary drive shaft in FIG. 2, and FIG. 7 is an explanatory diagram of the intake pipe and wiring of the IC holder shown in FIG.

In FIG. 2, a rotary head unit 5 for transporting two ICs to a measuring unit of an IC test apparatus 6 by mounting a driving source 32 on a substrate 31 and rotating the IC 31 intermittently at a fixed angle from the substrate 31. The moving shaft 34 and the cylindrical body 35 surrounding the outside of the rotating shaft 34 hang down.

The plurality of IC holders 26 that adsorb the IC 36 on the lower surface move up and down while being guided by a guide 38 provided on a rotating shaft 34. A plurality of (eight in the figure) guides 38 extending in the longitudinal direction (up-down direction) of the rotating shaft 34
Two are formed at four locations that equally divide the four in the circumferential direction.

A guide groove 40 having a U-shaped cross section and a predetermined curve as shown in FIG. 3 is formed on the outer cylindrical surface of the cylindrical body 35.
The IC 36 held by the IC holder 26 is attached to the measuring jig 6 provided in the measuring section 73 (see FIG. 6A) of the test apparatus 6.
The guide groove 40 to be brought into contact with 1 is a curve that gradually lowers the IC holder 26 toward the position corresponding to the measuring section 73 and then raises it.

[0023] Then, the predetermined portion of the groove 40, notch IC holder 26 to allow drops off from the groove 40, i.e., a notch 40 _-1 corresponding to the measuring unit 73, IC supply unit 71 (FIG. 6 and notch 40 _-2 corresponding to (a) refer), I
Notch portion 40 corresponding to C discharge portion 74 (see FIG. 6A)
_-3 is formed.

IC holder for holding IC 36 on the lower surface by vacuum
26 is a groove (not shown) that fits into the rotating shaft guide 38.
Main body 39 formed with_-1Roller support bracket on top of
39 _-2Is attached, and the support bracket 39 is attached._-2Protruding inward
Rollable roller (first engaging means of IC holder) 3
9_-3And a roller (IC holder)
Second engagement means) 39_-FourIs mounted on the roller 3
9_-3Are fitted into the cylindrical body guide groove 40 and roll.
You.

[0025] On the lower surface of the IC holder body 39 _-1, IC
36 through the heater block 39 _-6 heating to a suitable temperature, IC 36 and the suction member 39 _-5 to vacuum suction is attached to the entire IC holders 26 are tensioning upward constantly by the coil spring 27 tension I have.

The pressing means 41 for inserting and pressing the IC 36 into the measuring jig 61 of the test apparatus 6 comprises a pair of plate cams 42 and 4
A composite lever 45 that moves up and down by swinging the lever 44;
A sliding member 46 that slides in the vertical direction by the vertical movement of the lever 45, and a guide 47 that guides the vertical movement of the sliding member 46
And the roller 3 of the IC holder 26
_9-4 is formed by an engaging member 49 or the like to be fitted.

The engagement member 49 of the U-shaped when viewed from the side is mounted on the sliding member 46 is adapted to be positioned corresponding to the cutout portion 41 _-1, roller 39 _-3 IC holders 26
At the same time but located in the notch 41 _-1, IC holders 26
The roller _39-4 is fitted to the engagement member 49.

The lever 44 and the lever 45 are connected to a connecting member 50.
When the position of the connecting member 50 is moved along the rail 57 of the lever 44, the angle of the lever 44 with respect to the vertical line changes, and as a result, the sliding member 46 is moved.
Can be adjusted.

The composite lever 45 is provided with an overload prevention member 45 _-1.
And a structure lowering the sliding member 46 via the load cell 45 _2. Therefore, the lowering movement of the sliding member 46 causes I
When the C holder 26 is lowered and the IC 36 adsorbed on the IC holder 26 is pressed against the measuring unit of the test apparatus,
The pressing force as well as monitored by the load cell 45 _-2, overload protection member 45 _-1 work for pressure damaging the IC36, so that the IC36 is not damaged.

2 and 4, the servo motor 32
Drive source 32 which operates by rotating _-1, when applying a predetermined current to the servo motor 32 _-1, horizontal shaft 32
_-3 while constant speed, as the vertical shaft 32 _-2 intermittently rotated by Roragyakamu a built, i.e., a rotation shaft 32 _-3 rotates one rotation shaft 32 _-2, once a predetermined angle (the (In the embodiment, 90 degrees).

[0031] Then, both to mount the pulley 51 to the rotating shaft 32 _-3 as shown in FIG. 2, the rotary shaft 32 driven rotor 32 of the same diameter as the pulley 51 _-4 driven pulley 5 running parallel to _-3
2, a timing belt 53 is stretched over a pair of pulleys 51 and 52.

A pair of plate cams 42 and 43 are mounted on the driven rotary shaft _32-4 , and a driven lever 55 that supports a roller 54 that comes into contact with the cam surface of the plate cam 42 and a cam surface of the plate cam 43. A driven lever 57 that supports the roller 56 is mounted on a rotation shaft 58 on which the lever 44 is mounted.

Therefore, in this embodiment, the servo motor 3
2_-1And the driven rotary shaft 32 _-FourOne rotation (360
5), the driven rotary shaft 32 as shown in FIG.
_-FourSliding within a rotation angle of 20 to 340 degrees for one rotation of
The member 46 reciprocates once in the vertical direction, and the driven rotary shaft 3
2_-FourThe rotation shaft 34 is rotated while the rotation is 115 to 245 degrees.
It will rotate 90 degrees.

[0034] Thus, by using a rotatable servo motor 32 _-1 to 1600 rpm, when the rotational speed of the driven rotating shaft _32-4 was 167Rpm, the time required for exchange of the IC36 for pressing the measuring unit of the test apparatus is about It takes about 0.36 seconds.

FIG. 5 shows the vertical movement of the sliding member 46 started with the sliding member 46 lowered, and the operation of the rotary shaft 34 in response to the vertical movement of the sliding member 46. time required for the measurement of the IC36 in section is in a state where the rotary shaft _32-4 is stopped by the control of the servo motor 32 _-1.

In FIG. 6, (a) is an explanatory diagram of four positions of the rotary head portion 5 intermittently rotated by 90 degrees, and (b) is an explanatory diagram of three positions of the rotary head portion 5 intermittently rotated by 120 degrees. In.

In FIG. 6B, when the rotary head unit 5 stops, the IC holder 26
And the measuring unit 73 and the discharging unit 74, and the IC holder 26 is intermittently rotated by the rotary head unit 5.
Moves in the order of IC supply unit 71 → measurement unit 73 → discharge unit 74.

In the three-position rotary head section 5, the IC holder 26 is provided in the IC supply section 71.
Adsorbs the IC 36, the measuring unit 73 presses the IC 36 adsorbed on the IC holder 26 that has moved down, and the discharging unit 74 presses the IC 36 adsorbed on the IC holder 26.
The adsorption of C36 is released.

In FIG. 6A, when the rotary head unit 5 stops, the IC holder 26
And the non-working position 72, the measuring unit 73, and the discharging unit 74, respectively, and the IC holder 26 is moved by the intermittent rotation of the rotary head unit 5 so that the IC supplying unit 71 → the non-working position 72 → the measuring unit 73 → the discharging unit 74. It will move in order.

In the rotary head unit 5 having such a four-position configuration, in the non-working position 64, nothing is performed on the IC 36 adsorbed on the IC holder 26 located there.

However, by providing the no-work position 62, the rotation angle of the rotary head 5 becomes 90 degrees, which is smaller than 120 degrees in the three-position configuration. Therefore, the moving distance of the IC holder 26 is reduced, and the moving time of the IC 36 in the rotary head unit 5 can be reduced.

In FIG. 7, reference numeral 81 denotes a substrate, and 82 denotes a substrate 8
1 is a rotary joint for an intake pipe mounted on the upper surface of the rotary joint 82, and the rotary joint 82 is located immediately below the rotary shaft 34, protrudes into a hollow portion at the lower end of the rotary shaft 34, and from the upper end of the rotary joint 82. A protruding piece 83 protruding laterally is connected to a member 84 inside the hollow portion of the rotating shaft 34. Therefore, the rotary joint 82 rotates together with the rotation shaft 34.

A pipe connecting the vacuum device and the rotary joint 82 is provided along the substrate 81 and is provided with an IC.
Suction member 39 _-5 and piping 85 for connecting the rotary joint 82 of the holder 26, and heater block 39 _-6 IC holder 26 is introduced from the top of the pivot shaft 34
Are provided through a hole provided in the lower part of the rotating shaft 34 and a plastic chain duct 88.

Generally, the measuring jig 61 of the IC test apparatus 6
Can be moved up and down. Therefore, in the initial setting example of the IC handler of the present invention, the sliding member 46 is positioned at the bottom dead center, and the IC holder 26 with the sliding member 46 lowered.
The measurement jig 61 is raised and brought into contact with the IC 36.

[0045] The pressure during the contact is configured to set the detection value of the load cell 45 _-2 to a predetermined value, the measurement jig 61 is fixed to the level at the time of the pressure setting. Therefore, 2
The new IC 36 is pressed against the fixed measuring jig 61 for the subsequent measurements.

As another method of using the handler of the present invention,
A method of dropping the IC 36 into the measuring jig 61, that is, using a clamp provided in the measuring jig 61,
This is a method for fixing C36.

In this IC dropping method, the measuring unit 7
The IC 36 of the IC holder 26 located at 3 is stopped at a position above the measuring jig 61 by an appropriate amount, and the holding (adsorption) is released.

Then, the IC remote from the IC holder 26
When 36 falls into measurement jig 61, a clamper provided in measurement jig 61 presses down IC 36.

[0049]

As described above, according to the present invention, in the process of transporting an IC to a predetermined portion and pressing the IC transported to the predetermined portion with an appropriate pressing force, the replacement time of the IC is 0.5 seconds. For example, when the process is a test for measuring the characteristics of an IC, the operation rate of a test apparatus is improved, and damage due to overload of a tester or a measurement board of the IC and the test apparatus is significantly reduced. The effect is remarkable.

[Brief description of the drawings]

FIG. 1 shows an IC handler according to an embodiment of the present invention.
Plan view showing a schematic configuration used for a test apparatus

FIG. 2 is an explanatory diagram of a rotary head unit in the embodiment.

FIG. 3 is a development view of the cylindrical body shown in FIG. 2;

FIG. 4 is a perspective view of a driving source shown in FIG. 2;

FIG. 5 is a time chart showing the operation of the rotary drive shaft and the pressing means of FIG. 2;

FIG. 6 is an explanatory diagram of a stop position of the rotary drive shaft in FIG. 2;

FIG. 7 is an explanatory view of a suction pipe and wiring of the IC holder shown in FIG. 2;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Loading tray 2 Preheat panel 3 Cooling panel 4 Unloading tray 5 Rotary head part (IC carrier) 9, 10 Loading robot 11, 12 Unloading robot 26 IC holder 32 Drive source 34 Rotation axis 35 Cylindrical body 36 IC 38 times shaft of IC holders guiding guide 39 _-3 roller (first engaging means) 39 _-4 roller (second engaging means) 40 cylinder with a guide 40 _-1 cylindrical body guide notch 41 pressing means 45 _-1 overload protection member 45 _-2 load cell 61 measuring jig 71 IC supply unit 73 measuring unit (predetermined portion) 74 discharge portion

──────────────────────────────────────────────────の Continuing from the front page (72) Inventor Yoshihiro Iwata 4, Kadotacho Industrial Park, Aizuwakamatsu-shi, Fukushima Prefecture Inside Fujitsu Tohoku Electronics Co., Ltd. (72) Hideki Akiyama 4, Kadotamachi Industrial Park, Aizuwakamatsu-shi, Fukushima Stock (72) Inventor Tokuwa Kainuma 3-124, Tanigawa, Tategawa, Yamagata City, Yamagata Prefecture Inside (72) Shigeo Onuma 3-124, Tanigawa, Tategawa, Yamagata City, Yamagata Prefecture Tohoku Seiki Co., Ltd. In-house (56) References JP-A-5-107306 (JP, A) JP-A-8-152458 (JP, A) JP-A-3-156946 (JP, A) (58) Fields investigated (Int. . ^7, DB name) G01R 31/26 H01L 21/66

Claims (7)

(57) [Claims] A rotating shaft intermittently rotating by a predetermined angle;
Holding the IC at the C supply unit and intermittently rotating with the rotating shaft,
A plurality of IC holders for separating the ICs at an IC discharging portion, and a guide formed to move the plurality of IC holders in the longitudinal direction of the rotating shaft, the cylindrical shape being disposed outside the rotating shaft. A body, pressing means for pressing the IC holder facing the predetermined part toward the predetermined part, and a drive source for intermittently rotating the rotating shaft and reciprocating the pressing means toward the predetermined part. The rotation shaft is provided with at least one guide extending at a predetermined angular interval, the guide extending in the length direction of the rotation shaft, and the IC holder sliding in the length direction of the rotation shaft. The plurality of IC holders sliding along the guide include first engagement means projecting toward the guide of the cylindrical body and engaging with the guide, and a first engagement means opposite to the first engagement means. A second engaging means projecting in the direction and engaging with the pressing means, In the guide of the cylindrical body, which is formed in a curved line in which the IC holder approaches the predetermined portion, a cutout portion is formed in which the first engagement means of the IC holder approaching the predetermined portion is disengaged. The IC handler, wherein the IC holder is configured to be positioned at least in the IC supply unit, the predetermined unit, and the IC discharge unit when the rotation shaft stops rotating. 2. A loading tray for supplying an IC,
A preheat panel for preheating C, a rotary head unit, a cooling panel for cooling the IC, an unloading tray for sending out the IC, and a first carrier for transferring the IC to an IC supply unit of the rotary head unit; A second carrier for transferring the IC from the rotary head unit to the cooling panel; a first loading robot for transferring the IC on the loading tray to the preheating panel; A second loading robot mounted on the carrier of FIG. 2, a first unloading robot for transferring ICs on the second carrier to the cooling panel, and a first unloading robot for transferring ICs of the cooling panel to the unloading tray FIG. An unloading robot, wherein the rotary head portion rotates intermittently by a predetermined angle, A plurality of IC holders holding the IC in the IC supply unit and intermittently rotating together with the rotating shaft, and separating the IC in the IC discharging unit, and moving the plurality of IC holders in the length direction of the rotating shaft. A tubular body provided with a guide to be formed and disposed outside the rotating shaft, pressing means for pressing the IC holder facing the predetermined portion toward the predetermined portion, and intermittently rotating the rotating shaft. A drive source for reciprocating the pressing means toward the predetermined portion, the rotation shaft extending in the length direction thereof, and the IC holder sliding in the length direction of the rotation shaft. At least one guide is provided at a predetermined angular interval, and the plurality of IC holders sliding along the guide of the rotating shaft project toward the guide of the cylindrical body and engage with the guide. A first engaging means which projects in a direction opposite to the first engaging means and engages with the pressing means; A second engaging means provided at the position facing the predetermined portion, wherein the IC holder has a curved guide that approaches the predetermined portion, and the IC holder has a curved guide that is close to the predetermined portion. A notch portion is formed in which the first engagement means of the IC holder is disengaged, and the IC holder is positioned at least at the IC supply portion, the predetermined portion, and the IC discharge portion when the rotation shaft stops rotating. An IC handler, characterized in that: 3. The IC handler according to claim 1, wherein the predetermined angle is 120 degrees. 4. The IC handler according to claim 1, wherein the predetermined angle is 90 degrees. 5. The IC handler according to claim 1, wherein the predetermined unit is a measurement unit of an IC test device. 6. An overload prevention member and a load cell are provided at an intermediate portion of the pressing means, and the transfer IC of the IC holder is provided at the predetermined portion via the overload prevention member and the load cell.
The IC handler according to claim 1, wherein the IC handler is configured to press. 7. The IC holder of the IC holder is vacuum suction, and the IC holder is provided with an IC heating heater, and the vacuum suction pipe is connected to each IC holder under the rotation shaft. The IC handler according to claim 1 or 2, wherein the wiring of the heater is connected through the rotation shaft.