JP3164084B2 - Semiconductor device frame - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a frame of a semiconductor device for mounting a semiconductor element.

[0002]

2. Description of the Related Art In a semiconductor device, a substrate made of glass epoxy resin is used as a frame, an island for mounting a semiconductor element is provided in a central portion on the substrate, a copper wiring pattern is formed around the island, and the substrate is mounted on the island. There is a structure in which an electrode of a semiconductor element is soldered to a copper wiring pattern and the semiconductor element is sealed with a resin.

In this type of semiconductor device, when soldering an electrode of a semiconductor element and a copper wiring pattern in a resin-encapsulated region, the substrate is warped due to the heat and cut off the copper wiring. May occur.

Therefore, conventionally, means for preventing disconnection of the copper wiring due to the influence of heat have been taken (Japanese Patent Laid-Open No. 2-206).
193, JP-A-8-264647 and JP-A-9-260579).

[0005]

However, in the conventional example, it is possible to prevent the copper wiring from being cut in the resin-sealed area, but a portion of the copper wiring is exposed from the resin-sealed area. There is something to do. In this case, the exposed portion of the copper wiring is affected by the heat generated at the time of resin sealing, and there is a problem that the exposed copper wiring is cut.

An object of the present invention is to provide a frame of a semiconductor device in which a copper wiring exposed outside a resin sealing region is prevented from being disconnected due to a thermal effect of resin sealing.

[0007]

In order to achieve the above object, a semiconductor device frame according to the present invention is provided with a frame at a central portion.
Has an island for mounting conductive elements, and copper wiring around it
Has pattern and dummy wiring, mounted on the island
Electrical connection between the electrode of the semiconductor element and the copper wiring pattern.
Semiconductor device for electrically connecting and resin sealing the semiconductor element
A frame, the copper wiring pattern of the resin sealing
And the dummy wirings are arranged inside and outside the stop region.
In the area where the copper wiring pattern is formed,
Extend over the rough portion of the adjacent copper wiring pattern.
To suppress the warpage of the frame due to heat .

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view showing an embodiment of the present invention. A semiconductor device according to an embodiment of the present invention shown in FIG. 1 uses a substrate made of glass epoxy resin as a frame 1, an island 1 a for mounting a semiconductor element is provided in a central portion on the frame 1, and a copper wiring pattern is provided around the island 1 a. 2 and a semiconductor element (not shown) installed on the island 1a
And the copper wiring pattern 2 are soldered, and the semiconductor element is sealed with resin.

A copper wiring pattern 2 has a pad 2 for soldering to an electrode of a semiconductor element at an end on the island 1a side.
a is provided, and the end 2 b on the opposite side of the copper wiring pattern 2 is exposed outside beyond the resin sealing region 4.
It is designed to be soldered to an external circuit or the like.

Here, the interior portion 1b of the frame 1 in which the copper wiring pattern 2 is formed in the resin sealing region 4 is warped by the heat at the time of soldering to the electrodes of the semiconductor element, and the resin sealing region 4 is warped. The exterior portion 1c of the frame 1 on which the copper wiring pattern 2 exposed to the outside is formed, when the semiconductor element is sealed with a resin, and when the exposed copper wiring pattern (end portion 2b) 2 is soldered to an external circuit or the like. In such a case, there is a possibility that the copper wiring pattern 2 is disconnected due to warpage caused by the heat received.

As a result of a technical analysis of a portion of the frame 1 where warping occurs due to heat, it was found that the copper wiring pattern 2 provided on the frame 1 was concentrated on a rough portion. Further, the same can be said for a portion exposed from the resin sealing region 4.

Therefore, in the embodiment of the present invention, of the copper wiring patterns 2 provided substantially at right angles to the sides of the frame 1, the portion 1 where the space between the adjacent copper wiring patterns 2 is widened and roughened is provided.
The dummy wiring 3 is provided substantially parallel to the copper wiring pattern 2 at d. In the frame 1, there is a portion where the copper wiring patterns 2 are arranged inside and outside. However, since this portion is densely provided adjacent to the copper wiring patterns 2 inside and outside, the dense portion 1e has There is no warpage, and there is no need to provide the dummy wiring 3. As described above, the dummy wirings 3 are provided in places where wirings are not originally required in order to eliminate the density of the adjacent copper wiring patterns 2.

Further, in the corner 1f of the frame 1 where the horizontal copper wiring pattern 2 and the vertical copper wiring pattern 2 intersect, the dummy wiring 3 is connected to the other (horizontal or vertical) copper wiring pattern. 2 is provided in a direction substantially perpendicular to the frame 2 so as to suppress the warp generated at the corner 1 f of the frame 1.

Further, the dummy wiring 3 is provided so as to extend over the inside and outside of the resin sealing region 4 for sealing the semiconductor element with the resin.

The interior portion 1b of the frame 1 in which the copper wiring pattern 2 in the resin sealing region 4 is formed is affected by heat when soldered to the electrodes of the semiconductor element. The pattern 2 and the dummy wiring 3 provided in the rough portion of the copper wiring pattern 2 suppress the warpage of the frame 1.

The exterior portion 1c of the frame 1 on which the copper wiring pattern 2 exposed outside the resin sealing region 4 is formed, when the semiconductor element is sealed with resin, and when the exposed copper wiring pattern (end portion 2b) 2 is formed. In the case of soldering to an external circuit or the like, it is affected by heat. However, it is provided on the copper wiring pattern 2 which is closely adjacent and the rough portion of the copper wiring pattern 2 which is exposed to the outside from the resin sealing region 4. The dummy wiring 3 suppresses the warpage of the frame 1.

[0018]

As described above, according to the present invention, it is possible to prevent the frame from being warped due to heat at any point regardless of the inside and outside of the resin sealing area, and to prevent disconnection of the copper wiring pattern. it can.

[Brief description of the drawings]

FIG. 1 is a plan view showing a frame of a semiconductor device according to an embodiment of the present invention.

[Explanation of symbols]

 1 frame 2 copper wiring pattern 3 dummy wiring 4 resin sealing area

Claims (1)

(57) [Claims] 1. An island for mounting a semiconductor element in a central portion.
With a copper wiring pattern and dummy wiring around it.
And the electrodes of the semiconductor element mounted on the island
Electrically connecting the copper wiring pattern to the semiconductor element;
The is disposed a frame of a semiconductor device of a resin sealing, the copper wiring pattern on the inside and outside of the resin encapsulation region
And the dummy wiring has a shape of the copper wiring pattern.
In the resin forming area and the adjacent area.
Provided in the rough part of the copper wiring pattern
A frame for a semiconductor device, which suppresses warpage of a camera .