JP3167747B2 - Die cutting / supplying method for thin film members - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sheet adhesive used for fixing a card base and an IC module in an IC card, an insulating member used for insulating a battery in a wristwatch, or a spot used for manufacturing an IC lead frame. The present invention relates to a method for die-cutting an extremely thin thin film member such as a partially-shaped clad material into a predetermined shape, removing the thin-film member from a mold, and supplying the thin-film member to a predetermined position.

[0002]

2. Description of the Related Art Conventionally, a thin film member such as a sheet-like adhesive, an insulating member, or a spot-like partial cladding material is extremely thin and difficult to handle. In addition, the work of taking out the die-cut thin film member from the mold, transporting it to a predetermined position and supplying it is performed separately,
It was not done automatically.

[0003]

As described above, conventionally, the die-cutting, unloading, transporting, and supplying of the thin-film member have been performed separately and non-automatically. For this reason, in a method of manufacturing a product using a thin film member, for example, in a method of manufacturing an IC card by fixing an IC module to a card base using a sheet-like adhesive, a sheet-like adhesive cut into a predetermined shape by a mold is used. The operator removes the agent from the mold, transports the agent to the card base, and supplies the agent to a predetermined position of the card base. As described above, since a method of manufacturing a product using a thin film member cannot be completely automated, there has been a serious problem from the viewpoint of safety or productivity improvement. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has been made in consideration of the above circumstances, and has been made in consideration of the above circumstances, and has been made in consideration of the above circumstances. The purpose is to provide die cutting and supply methods.

[0004]

In order to achieve the above object, a method of cutting and supplying a thin film member according to the present invention is characterized in that an upper die and a lower die are clamped and a predetermined shape is formed from a thin film sheet interposed between the upper and lower dies. A step of punching the thin film member, a step of opening the upper mold and the lower mold while adsorbing the thin film member to the lower mold, a step of stopping the suction of the thin film member by the lower mold, and adsorbing the thin film member by an air chuck, A step of removing the thin film member from the lower mold by sandwiching the thin film member between the air chuck and the ejector pin, a step of moving the air chuck that has absorbed the thin film member to the substrate position, stopping the suction of the thin film member by the air chuck, And supplying to a predetermined position of the base material. In addition, if necessary, the suction of the thin film member by the lower mold is temporarily interrupted, and wrinkling of the thin film member,
This is a method in which a step of removing a slack or the like and / or a step of holding the thin film member supplied to the base material with an air chuck and temporarily fixing the thin film member to the base material by thermocompression bonding are added.

[0005]

According to the above-described method of cutting and supplying the thin film member, the thin film member cut into a predetermined shape from the thin film sheet in the mold is removed from the mold while being clamped by the air chuck and the ejector pin, and the air is removed. It is transported to the substrate by the chuck and supplied to a predetermined position. At this time, if necessary, wrinkles of the thin film member are removed before being sandwiched between the air chuck and the ejector pins, and the thin film member is temporarily fixed to the base material.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As an embodiment of the method of the present invention, a method for cutting and supplying a sheet adhesive used for fixing a card base and an IC module in manufacturing an IC card will be described below.

The thin film member 1 to be used in the method of the present embodiment is
As shown in FIG. 3, a sheet-like adhesive used when the IC module 3 is fixed to the substrate recess 2a of the card base (base material) 2 of the IC card, the outer periphery is substantially square, and a through hole is provided at the center. It has a shape having a ring-shaped body 1a.

First, an example of an apparatus for performing the above method will be described with reference to FIGS. FIG. 1A is a front view of a mold apparatus having a cross section of a lower mold, FIG. 1B is an enlarged plan view of the lower mold, and FIG. 2A is an arrangement of the mold apparatus and a supply apparatus. FIG. 2B is a bottom view of the chuck portion of the air chuck, and FIG. 2C is a bottom view of the heater portion. In these drawings, reference numeral 10 denotes a mold device,
A lower mold 12 is provided on an upper portion of the base 11. The lower mold 12 is
Four ejector pins 13 moving up and down by respective cylinders 13a are arranged at four corners of the thin film member 1 at positions corresponding to the ring-shaped body 1a.
A suction nozzle 14 is arranged between 3 and 13.

At four corners of the base 11, column guides 16 of an elevating base 15 which move up and down by driving means (not shown) are provided upright. The elevating base 15 has an upper die 17 at a position facing the lower die 12, and holding rolls 18 for holding the thin film sheet 1 'on both left and right sides.

In FIG. 2A, reference numeral 20 denotes a supply device which is arranged near the mold device 10. The supply device 20 has an air chuck 21 for transporting and supplying the thin film member 1 from the mold device 10 to the substrate 2. The air chuck 21 is attached to the moving body 13 via a cylinder 22 so as to be vertically movable.
Can be moved laterally along the horizontal guide 24 by a driving means (not shown). Air chuck 21
Is formed in a ring shape having substantially the same shape as the thin film member 1 as shown in FIG. 2 (b). is there. In addition, cooling air can be blown out from the suction nozzle 21a. Reference numeral 25 denotes a heater section which is moved up and down by driving means (not shown) so as to be able to penetrate into the hollow portion of the air chuck 21. Here, the inner diameter D1 of the hollow hole of the thin film member 1, the inner diameter D2 of the hollow hole of the air chuck 21, and the outer diameter D3 of the heater unit 25 are D2>D3> D.
There is one.

Next, the method of the embodiment of the present invention will be described with reference to the flowchart of FIG. 4 and the operation explanatory diagrams of FIGS. The method of the present embodiment includes the following steps (1) to (10).

(1) Die-cutting step (101) The elevating base 15 is lowered along the columnar guide 16 and the upper die 1 is removed.
By clamping the mold 7 and the lower mold 12, the thin film adhesive sheet (thin film) 1 ′ interposed between the upper and lower molds is moved from FIG.
(See FIG. 5).

(2) Suction process by lower mold (102) After the mold is released, the sheet adhesive 1 is sucked by the suction nozzle 14 of the lower mold 12, and the sheet adhesive 1 is sucked by the lower mold 12 and the upper adhesive is lifted. The mold 17 (elevation base 15) is raised (FIG. 6).

(3) Wrinkle Removal Step (103) If the sheet-like adhesive 1 adsorbed on the lower mold 12 has wrinkles or slacks, it adversely affects the subsequent steps, and finally the IC module 3 The adhesion of the sheet adhesive 1 to the card base 2 becomes poor, so that wrinkles and slack of the sheet adhesive 1 are removed. That is, the suction of the sheet adhesive 1 by the suction nozzle 14 of the lower mold 12 is temporarily stopped, and the sheet adhesive 1 is released. As a result, the on-sheet adhesive 1 becomes flat due to its own elasticity and removes wrinkles and slack. Therefore, when the sheet-like adhesive 1 is sucked again by the suction nozzle 14, the sheet-like adhesive 1 is adsorbed to the lower mold 12 in a state where wrinkles and slack are removed.

(4) Adsorption process by air chuck (1)
04) The air chuck 21 is moved by the lateral movement of the moving body 23 and the lowering of the air chuck 21 by the cylinder 22.
Is positioned on the upper surface of the sheet-like adhesive 1 adsorbed on the lower mold 12. Then, the suction of the sheet adhesive 1 by the suction nozzle 14 of the lower mold 12 is stopped, and the sheet adhesive 1 is sucked by the suction nozzle 21a of the air chuck 21 (FIG. 7).

(5) Removing Step (105) Simultaneously with the suction of the sheet adhesive 1 by the air chuck 21, the cylinder 13a is operated to raise the four ejector pins 13. At this time, the air chuck 21
Although it is pressed downward by the cylinder 22, it rises together with the ejector pins 13 due to the upward pressing force of the four ejector pin cylinders 13 a. As a result, the sheet adhesive 1 is taken out of the lower mold 12 while being held between the four ejector pins 13 and the air chuck 21 (FIG. 8). By taking out the sheet adhesive 1 while holding it between the ejector pins 13 and the air chuck 21, even if the sheet adhesive 1 is extremely thin, it can be taken out from the lower mold smoothly in a flat state.

(6) Conveying step by air chuck (1)
06) When the sheet adhesive 1 is taken out from the lower mold 12, the ejector pins 13 are lowered, and the sheet adhesive 1 is in a state of being sucked and held by only the air chuck 21. Thereafter, the moving body 23 is positioned above the substrate recess 2a of the card base (base) 2 by the lateral movement of the moving body 23 (FIG. 9).

(7) Step of Supplying to Substrate Concave (107) The air chuck 21 is lowered by the cylinder 22,
The sheet adhesive 1 is applied to the substrate recess 2 of the card base (base) 2.
a (FIG. 10).

(8) Temporary fixing step (108) The heater section 25 is lowered and penetrated through the hollow hole of the air chuck 21. As described above, the inner diameter D1 of the hollow hole of the adhesive sheet 1 and the inner diameter D2 of the hollow hole of the air chuck 21 are determined.
And the outer diameter D3 of the heater section 25 satisfies D2>D3> D1, so that the sheet-like adhesive 1 is welded in the vicinity of the inner periphery of the ring-shaped body and temporarily fixed to the substrate recess 2a (FIG. 11). .

(9) Cooling Step of Welding Part (109) When the welding of the sheet adhesive 1 to the substrate recess 2a is completed, cooling air is blown out from the suction nozzle 21a of the air chuck 21 to solidify the welded part. Avoid peeling.

(10) Evacuation process of the air chuck (11)
0) When the temporary fixing of the sheet adhesive 1 to the substrate recess 2a is completed, the heater 25 and the air chuck 21 are raised and retracted to the standby position. As described above, the sheet adhesive is die-cut from the thin-film adhesive sheet, taken out of the die, and supplied to the substrate recess of the card base and temporarily fixed.

The method of cutting and supplying a thin film member of the present invention can be applied to the cutting and supplying of a thin film member such as a spot-shaped partial clad material used for manufacturing a battery insulating member or an IC lead frame in a wristwatch. In addition, each step in the above-described embodiment may be appropriately omitted or a known step may be appropriately added depending on the type of the target thin film member or the material of the member even if the thin film member is of the same type. You can also.

[0023]

As described above, according to the method of the present invention, die-cutting of a thin-film member, which is difficult to handle with a thin film, removal from a mold, supply to a substrate, and the like are performed automatically and reliably. be able to. Further, when there is a wrinkle, a slack or the like in the thin film member, it is surely removed. Further, when temporary fixing of the thin film member is required, this is surely performed.

[Brief description of the drawings]

FIG. 1A is a front view of a mold apparatus in which a lower mold is sectioned, and FIG. 1B is an enlarged plan view of the lower mold.

FIG. 2 (a) is a diagram showing an arrangement relationship between a mold device and a supply device, FIG. 2 (b) is a bottom view of a chuck portion of an air chuck,
FIG. 2C shows a bottom view of the heater section.

FIG. 3 shows a perspective view of one embodiment of a thin film member to which the method of the present invention is applied.

FIG. 4 is a flowchart illustrating a method according to an embodiment of the present invention;

FIG. 5 is an operation explanatory diagram for explaining a method of an embodiment of the present invention.

FIG. 6 is an operation explanatory diagram for explaining a method of an embodiment of the present invention.

FIG. 7 is an operation explanatory diagram for explaining a method of an embodiment of the present invention.

FIG. 8 is an operation explanatory diagram for explaining a method of one embodiment of the present invention.

FIG. 9 is an operation explanatory diagram for explaining a method of one embodiment of the present invention.

FIG. 10 is an operation explanatory diagram for explaining a method according to an embodiment of the present invention.

FIG. 11 is an operation explanatory diagram for explaining a method of an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Thin film member (sheet adhesive) 2 ... Substrate (card base) 10 ... Mold apparatus 12 ... Lower mold 13 ... Ejector pin 14 ... Suction nozzle 17 ... Upper mold 20 ... Supply device 21 ... Air chuck 23 ... Movement Body 25: heater

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI B26F 1/02 B26F 1/02 Z

Claims (3)

(57) [Claims] 1. A step of clamping an upper mold and a lower mold to punch a thin film member of a predetermined shape from a thin film sheet interposed between the upper and lower molds. Opening the mold, stopping the suction of the thin film member by the lower mold, and adsorbing the thin film member by the air chuck, sandwiching the thin film member by the air chuck and the ejector pin, and taking out the thin film member from the lower mold. A step of moving the air chuck having sucked the member to the substrate position, stopping the suction of the thin film member by the air chuck, and supplying the thin film member to a predetermined position of the substrate. Extraction / supply method. 2. The method according to claim 1, further comprising the step of temporarily suspending the adsorption of the thin film member by the lower mold to remove wrinkles, slack, and the like of the thin film member. 3. The die-cutting method for a thin-film member according to claim 1, further comprising a step of holding down the thin-film member supplied to the base material with an air chuck, and thermally bonding a part of the thin-film member to the base material. -Supply method.