JP3172292B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device with a built-in microcomputer in which a microcomputer is mounted on an integrated circuit board and the function of the microcomputer can be checked.

[0002]

2. Description of the Related Art Microcomputers having stored information already written in a mask ROM are preferably used in various electronic devices. Most of these microcomputers are currently mounted on printed wiring boards together with control or drive integrated circuits. In various electronic devices that are required to be reduced in size and weight, a semiconductor integrated circuit (IC) chip is directly mounted on a printed wiring board by a technique called chip-on-board, and after required wiring is applied, The IC chip including the wiring portion is covered with a synthetic resin, and extremely small and light weight is achieved.

FIG. 4 shows a mounting structure of such a conventional microcomputer. FIG. 4 is a perspective view having a partial cross section of a conventional microcomputer, showing an insulating substrate (42) made of glass epoxy resin or the like having a conductive wiring pattern (41) formed on a main surface. A microcomputer (44) incorporated in a cerdip type package is mounted in the through hole (43). The microcomputer (44) has a header (45) and a cap (46), and the header (45) is adhered to a ceramic base (47) by an external lead (48) or a low-melting glass material. The header (45) has an element mounting portion (50) obtained by sintering a so-called gold paste in which a large amount of gold powder is mixed into glass, and is adhered on the low melting point glass material or the ceramic base material (47). A microcomputer chip (5) is mounted on the element mounting portion (50).
1) is mounted, and the electrode of the chip (51) and the external lead (48) are connected by a thin metal wire (52). The cap (46) seals the microcomputer chip (51) disposed on the header (45) with low-melting glass. The microcomputer (44) in which the microcomputer chip (51) is sealed in this way is fixed by soldering by inserting an external lead (48) into the through hole (43) of the insulating substrate (42). This through hole (43) is provided with a required wiring by the conductive wiring pattern (41), and is connected from a male connector terminal portion (55) provided at an end of the insulating substrate to a female connector (not shown). Connected to

The mounting structure of such a conventional microcomputer element is a microcomputer chip (5).
Compared with 1), the package outer shape is extremely large, and the package occupancy is not only three-dimensional but also several times the height of the chip, which is extremely disadvantageous for thinning. Further, after the external lead is inserted into the through hole (43), it is necessary to fix the lead with solder or the like. A further significant disadvantage is that the microcomputer element is once assembled into a package prior to mounting on an insulating substrate.

Here, the description has been given of the cerdip package type microcomputer element, but the above-described problem also occurs in the resin sealing type package. The mounting structure shown in FIG. 5 has already been used to solve such a problem. The microcomputer mounting structure shown in FIG. 5 will be described below. A chip mounting area (6) for mounting a microcomputer chip (61) on an insulating substrate (60) such as a glass-epoxy resin plate having a conductive wiring pattern (60b) formed on a main surface (60a).
0c), the wiring pattern (60b) is routed on the main surface (60a) from near this area and connected to a male connector terminal portion (not shown). The area (60c) includes a microcomputer chip (61)
Is mounted, and the surface electrode of the chip (61) and the wiring pattern (60b) are connected by a thin metal wire (62). Of course, one of the thin metal wires (62) is wired to a wiring pattern (60b) on which the chip (61) is mounted in order to connect to the substrate of the chip (61). The integrated circuit board on which the microcomputer is mounted is applied to various products such as an inverter air conditioner and a washing machine.

However, in the microcomputer mounting structure shown in FIG. 5, since the chip of the microcomputer is die-bonded on the printed circuit board, it goes without saying that the size is reduced. However, the miniaturization referred to here is merely a miniaturization of the microcomputer itself. Although not evident from FIG. 5, the peripheral circuit elements fixed around the microcomputer are constituted by electronic components such as discretes. ing. Therefore, when the whole system as an integrated circuit for a printed circuit board equipped with a microcomputer is viewed, the size of the printed circuit board is not reduced as before, but the size of the entire system is increased as before, that is, the entire system is enlarged. There has been proposed a hybrid integrated circuit device in which a chip-shaped microcomputer is directly mounted on an integrated circuit substrate having a conductive pattern formed on a metal substrate such as aluminum via an insulating resin layer.

[0007]

In general, when a chip microcomputer is mounted on an integrated circuit board, the microcomputer checks the leakage current and the like inside the microcomputer before mounting the microcomputer. Is secured. However, as described above, when a chip-shaped microcomputer is mounted on an insulated metal substrate, an abnormal leakage current is generated inside the microcomputer due to a heat process when brazing the microcomputer on a pad. In the conventional hybrid integrated circuit device, after mounting a chip-shaped microcomputer, it is not possible to detect an abnormal leakage current generated by a heat process, and even if the device is defective. The product may be used as it is, and a malfunction of the microcomputer may cause a secondary disaster.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to mount a microcomputer on an integrated circuit board, detect and measure a leak current inside the microcomputer, and detect an abnormal leak. An object of the present invention is to provide a hybrid integrated circuit device which detects the presence or absence of generation of a current and mounts only a good microcomputer.

[0009]

Means for Solving the Problems The above-mentioned problems are solved,
In order to achieve the object, a hybrid integrated circuit device according to the present invention includes an integrated circuit board in which a circuit pattern having a desired shape is formed by copper foil on an insulating substrate, and a circuit pattern at a desired position formed on the board. A chip-shaped or resin-encapsulated microcomputer connected to and containing desired program data, and a predetermined control signal output from the microcomputer is supplied thereto and a peripheral portion connected to a conductive path on the substrate is connected to the microcomputer. A circuit element for applying a predetermined potential to the microcomputer, a part of a microcomputer power supply line of a circuit pattern is arranged in a disconnected state, and bonding pads are provided at both ends of the disconnected part. .

[0010]

In the hybrid integrated circuit device configured as described above, a part of the microcomputer power line of a circuit pattern for applying a predetermined potential to the microcomputer is arranged so as to be in a disconnected state. By providing the bonding pads at both ends, the abnormal leakage current inside the microcomputer can be measured with the microcomputer mounted on the substrate, using the circuit pattern at one end that has been disconnected.

As a result, it is possible to remove an integrated circuit board on which a defective product having an abnormal leakage current generated inside the microcomputer during the assembling process is mounted.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A hybrid integrated circuit device according to the present invention will be described below with reference to the embodiments shown in FIGS. FIG. 1 is an enlarged perspective view of a main part of a hybrid integrated circuit device according to the present invention. This hybrid integrated circuit device is used as an independent electronic component, and is mainly used for electric appliances such as an inverter air conditioner and a washing machine.

As shown in FIG. 1, the hybrid integrated circuit device (1) has an integrated circuit board (2), a conductive path (5) having a desired shape formed on the integrated circuit board (2), and a conductive path ( A microcomputer (6) (hereinafter referred to as a microcomputer) connected to the microcomputer (5), and a plurality of peripheral circuits connected to the conductive path (5) on the substrate (2) supplied with an output control signal from the microcomputer (6). It comprises an element (4) and a disconnection section (7) in which a part of the microcomputer power line conductive path (5A) is disconnected for operating the microcomputer (6). Below, it was disconnected
In the conductive path (5A) for the microcomputer power line,
The conductive path (5) on the side of the power supply line (6) is connected to the conductive path for the first power line.
(5A), and another conductive path (5) is connected to a second power supply.
It is referred to as a line conductive path (5A). Furthermore, the first
Formed at both ends of the power supply line conductive path (5A)
Of the microcomputer (6) on the first pad
And the other is the second bond
A pad (5B). And the second
Bondy on the broken part (7) side of the source line conductive path (5A)
The bonding pad is called a third bonding pad (5C).
It shall be.

As the integrated circuit board (2), a hard board made of ceramics, glass epoxy, metal or the like is used. In this embodiment, a metal board excellent in heat dissipation and mechanical strength is used. As the metal substrate, for example, 0.5 to 1.
An aluminum substrate having a thickness of 0 mm is used. The substrate (2)
An aluminum oxide film is formed by well-known anodic oxidation on the surface of the substrate, and an insulating resin layer (3) such as epoxy or polyimide having a thickness of 10 to 70 μ is adhered to one main surface thereof. Further, on the insulating resin layer (3), a copper foil having a thickness of 10 to 70 [mu] m is attached simultaneously with the insulating resin layer by means such as a roller or a hot press.

On a copper foil surface provided on one main surface of the substrate (2), a conductive path of a desired shape is exposed by screen printing and masked with a resist, and a noble metal (gold, silver, platinum) is used.
A plating layer is plated on the copper foil surface. After that, the resist is removed and the copper foil (11) using the noble metal plating layer as a mask
Is etched to form a desired conductive path (5).
Here, the fineness of the conductive path (5) by screen printing is 0.1.
Since 5 mm is the limit, when a fine wiring pattern is required, a fine conductive path (5) up to about 2 μm can be formed by a known photolithography technique.

A conductive path (5) formed on a substrate (2)
Although not clearly shown in FIG. 1, an external lead terminal or an external connector is connected to the peripheral end of the substrate (2), which is formed substantially on the entire surface of the substrate (2) and extends the conductive path (5). The fixing pad to be formed is formed. And
At a desired position on the conductive path (5), the microcomputer (6), LS
A plurality of circuit elements (4) such as an I chip, a transistor, a chip capacitor, and a chip resistor and a printed resistor are fixedly mounted.

As is well known, the microcomputer (6) mainly stores a program processor (CPU) in a program memory.
It is an element that combines an input / output interface with M, ROM, and peripheral devices. The microcomputer (6) used in this embodiment stores predetermined program data (RO) in advance.
M) is a masked chip ROM-type microcomputer with a mask, and will be described below using a chip-type microcomputer (6). However, the microcomputer (6) is not limited to a chip-type microcomputer, A so-called DIP microcomputer of a stop type may be used.

A feature of the present invention is that in order to make the microcomputer (6) operative, a part of the microcomputer power supply conductive path (5A) for applying a predetermined voltage to the microcomputer (6) is disconnected. And bonding pads are provided at both ends of the disconnection (7). More specifically, peripheral circuits connected to the microcomputer (6), such as a reset circuit and a full-wave interrupt circuit, are connected to the microcomputer (6), and a VDD (power supply) for operating the microcomputer (6). That is, only the line (5A) is disconnected.

The features of the present invention are as follows:
As described above, one of the second and third bonding pads (5B) and (5C) provided at both ends where the VDD conductive path (5) of the microcomputer (6) is disconnected. of
This is to measure the leakage current inside the microcomputer (6) using the second bonding pad (5B) side. Specifically, the conductive path for VDD (5A) of the microcomputer (6)
As shown in FIG. 1 and FIG. 2, it is considered that the disconnection portion (7) is formed at a position where the power supply electrode of the microcomputer (6) is not connected to another circuit element. this is,
This is because if the disconnection part (7) is arranged after the other circuit elements are connected, the leak current of the microcomputer (6) cannot be measured accurately.

Second and third bonding pads (5B) and (5C) are formed at both ends of the conductive path (5A) disconnected by the disconnection section (7). In the first power supply line conductive path (5A) on the microcomputer (6) side,
The second bonding pad (5B) and a measuring pad (5D) for measuring a leak current inside the microcomputer (6) are formed. A solder (not shown) is formed on the measurement pad (5D) so that the probe terminal is in contact with the measurement pad (5D) to improve the connection between them.

The microcomputer (6) and other circuit elements are mounted on the substrate (2), connected to peripheral conductive paths, and the leakage current of the microcomputer (6) is measured at the final stage of the manufacturing process. The microcomputer (6) itself is checked for abnormal leakage current at a stage before the manufacturing process, and only a good product is used. The microcomputer (6) has a problem in that an abnormality occurs due to stress or mechanical shock and a leak current occurs, and it is necessary to measure the leak current in a final step in order to improve reliability.

A specific method of measuring the leak current will be described. First, as shown in FIG.
D) The probe terminal of the measuring device is brought into contact with the microcomputer D, and a voltage of, for example, +5 V necessary for operating the microcomputer (6) is applied, thereby causing the microcomputer (6) to operate in a pseudo manner. Then, a voltage of +5 V is applied from a predetermined terminal of the hybrid integrated circuit (1) to put peripheral circuits of the microcomputer (6) into an operating state. Next, a mode switching signal is input into the microcomputer (6) from outside the hybrid integrated circuit (1), and a leak current in the microcomputer (6) is measured by a measuring device.

At this time, since the measurement pad (5D) is disconnected by the disconnection portion (7) and is not connected to other circuit elements and is in an independent state, even when VDD + 5V is applied to the hybrid integrated circuit, the microcomputer (6) 2, and the leak current of the loop of the reset circuit (A) and the loop of the full-wave interrupt circuit (B) to which VDD + 5 V is applied are not measured, and the leak current inside the microcomputer (6) is not measured. Only measured.

The presence or absence of the abnormal leakage current of the microcomputer (6) is detected, and if it is larger than the reference level, it is treated as a defective product, and only the non-defective product proceeds to the next step to complete the hybrid integrated circuit. That is, for those determined to have no abnormal leakage current, the second and third bonding pads (5B), (5) provided in the disconnection portion (7) of the VDD conductive path (5A)
C) is connected by bonding with a wire having a diameter of about 400 μm to complete a hybrid integrated circuit device equipped with the microcomputer (6).

[0025]

As described in detail above, according to the present invention,
A part of the microcomputer power line of the circuit pattern that applies a predetermined potential to the microcomputer is arranged so as to be in a disconnected state, and bonding pads are provided at both ends of the disconnected part, so that the circuit pattern of one disconnected end is used. Thus, the abnormal leakage current inside the microcomputer can be measured while the microcomputer is mounted on the board. As a result, it is possible to remove an integrated circuit board on which a defective product having abnormal leakage current generated inside the microcomputer during the assembling process is mounted, and to provide a high-quality hybrid integrated circuit with extremely few microcomputer malfunctions. it can.

According to the present invention, since the measuring pad for measuring the leak current is provided on the power supply conductive path to which no other circuit element is connected, only the leak current inside the microcomputer is accurately measured. be able to.

[Brief description of the drawings]

FIG. 1 is an enlarged view of a main part of a perspective view showing the present invention.

FIG. 2 is a circuit diagram showing the periphery of a microcomputer.

FIG. 3 is a wiring diagram for measuring a leakage current of a microcomputer.

FIG. 4 is a perspective view showing a conventional example.

FIG. 5 is a perspective view showing a conventional example.

[Explanation of symbols]

 (1) hybrid integrated circuit device (2) integrated circuit board (3) insulating resin layer (4) circuit element (5) circuit pattern (conductive path) (6) microcomputer

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G06F 1/18 H01L 21/66

Claims (2)

(57) [Claims] An integrated circuit board; a plurality of conductive paths formed in a desired shape on the integrated circuit board; a chip microcomputer fixed on the integrated circuit board; and a connection to the microcomputer. The first bondin
Bonding pad provided at the breaking pad at the other end
Connected to a microcomputer having a pad
Power line conductive path, and the second bond line of the first power line conductive path.
The second pad is separated from the pad and electrically connected to the peripheral circuit elements .
A second power supply line conductive path and a second power supply line conductive path.
3 bonding pads, the second bonding pads and the third bonding pads.
Hybrid integrated circuit device comprising: the fine metal wire for connecting the Gupaddo, the measuring pad provided on the first power supply line conducting path. 2. The method according to claim 1, wherein the measuring pad includes the first bond.
Formed between the Ingupaddo of the second bonding pads, claim 1 Symbol it was characterized by used as a terminal for measuring the leakage current of the microcomputer
Mounting of the hybrid integrated circuit device.