JP3172995B2 - Punching method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a punching method for punching a workpiece such as a sheet.

[0002]

2. Description of the Related Art As described in, for example, JP-A-7-25510, a magnetic recording card such as a credit card is manufactured by punching a product portion from a sheet made of vinyl chloride or the like.

By the way, even when the final shape of the product is the same, the dimensions of the product portion at the time of punching where the ambient temperature is different from that at the time of using the card are different due to the difference in the coefficient of thermal expansion depending on the material of the sheet. Conventionally, mold dimensions have been set in consideration of dimensional changes due to thermal expansion. Therefore, even if the final shape of the product is the same, if the material of the sheet is different, the punching is performed using a different mold.

[0004]

As described above, in the past, even if the final shape of the product was the same, if the material of the work was different, punching was performed using different dies. There was a problem that costs increased in terms of management and management.

An object of the present invention is to solve such a problem, and an object of the present invention is to provide a punching method capable of sharing a mold for works having different characteristics such as materials.

[0006]

According to a first aspect of the present invention, there is provided a punching method , in which a die on which a sheet is placed is fitted in a hole formed in the die so as to be freely inserted and removed. Ru and a punch disconnect rather than hit the product portion from the sheet
Together, they are connected to a flow path formed in the die temperature
A liquid supply source for supplying a preparation liquid, and a vicinity of a hole of the die.
Temperature sensor and detection of this temperature sensor
Control device for controlling the liquid supply source based on the temperature
Using a punching device equipped with a temperature control device consisting of
By passing the temperature control liquid through the flow passage,
Adjust the temperature to a predetermined temperature and make sure that the final product shape is the same.
Higher coefficient of thermal expansion for sheets of different materials
For materials with a low coefficient of thermal expansion,
The temperature of the die is adjusted to be lower .

[0007] Then, in a state where the sheet is placed on the die, the punch is fitted into the hole of the die, so that the sheet is removed from the sheet.
Product portion is either out disconnect. In this punching, the liquid temperature adjusting supplied from the temperature control device by passing through the flow passage in the die, the temperature in the vicinity of each hole of the die is adjusted to a Jo Tokoro temperature. More specifically, the temperature sensor
Based on the die temperature detected by the
The connected liquid supply connected to the passage is controlled and
As a result, the temperature near each hole of the die is adjusted to a predetermined temperature.
It is. Then, the final shape of the product is the same material are different
By appropriately setting the predetermined temperature respectively over preparative, i.e., thermal expansion rate to greater material
The die temperature more than for materials with a lower coefficient of thermal expansion.
By adjusting the temperature lower , the phase of the material
Corresponding to the difference , a die including a die and a punch can be shared for a plurality of types of workpieces.

[0008] According to a second aspect of the invention, the punching method of the invention of claim 1, wherein the punching device, form a plurality of holes in a row of Pas <br/> inch is fitted to each of the die
Together form comprising, those formed by providing said flow passage surrounds collectively the plurality of the holes from the outside.

[0009] Each of the holes of the die is formed by a temperature control liquid passing through a flow passage surrounding them collectively from the outside.
The temperature is adjusted.

[0010]

[Embodiment of the Invention Hereinafter, an embodiment of the present invention,
This will be described with reference to the drawings. In FIG. 6, reference numeral 1 denotes a sheet serving as a work. The sheet 1 has a base made of, for example, vinyl chloride resin, a magnetic material for information recording applied to the back surface, and decorations and indications are printed on both sides. . This printing is performed before punching. Reference numeral 2 denotes a product part to be stamped. These product parts 2 are formed at predetermined positions on the sheet 1 in a line in a number of rows and columns.

In the drawings, reference numeral 11 denotes a lower die attached to the upper surface of a bolster (not shown) of the press, and 12 denotes an upper die attached to the lower surface of an upper ram (not shown) of the press. When the upper ram is driven by a hydraulic drive or the like to move up and down, the lower mold 11 and the upper mold 12 open and close with each other.

As shown in FIG. 2 and FIG.
The receiving plate 17 is fixed on the substrate 16, and the die 18 is fixed on the receiving plate 17. The material of the receiving plate 17 is S
The material of the die 18 is a hard metal, such as KD or SKH. The die 18 is formed with a plurality of holes 21 whose upper planar shape is a product shape, arranged in a line on the left and right. The receiving plate 17 is formed with a plurality of pairs of holes 22 that form a pair at the front and rear sides. Each pair of these holes 22 is positioned so as to overlap with each hole 21 of the die 18. The hole 22 of the receiving plate 17 has a small-diameter portion 22c having a reduced diameter between the upper portion 22a and the lower portion 22b. A pushback shedder 23 is incorporated in each of the holes 21 and 22 of the die 18 and the receiving plate 17 so as to be vertically slidable. Each shedder 23 is a flat plate portion that fits into the hole 21 of the die 18.
24 is provided at the upper end, and shaft portions 25 that fit into the pair of front and rear holes 22 of the receiving plate 17 from the flat plate portion 24 are formed to protrude downward. And the lower part of the hole 22
A flange-like stopper 26 that regulates the upper limit position of the shedder 23 is fixed to the lower end of the shaft portion 25 that protrudes to 22b. The upper surface of the uppermost shedder 23 and the upper surface of the die 18 are located on the same horizontal plane. A spring 27 that pushes the shedder 23 upward is incorporated below the stopper 26 in the lower portion 22b of the hole 22. Further, a slide bearing 29 is interposed between the bush 28 fitted in the upper portion 22a of the hole 22 and the shaft portion 25 of the shedder 23.

As shown in FIG. 1, a plurality of holes 21 are collectively surrounded from the outside in a substantially rectangular shape around the inside of the die 18 to form a flow passage for passing a temperature controlling liquid such as water. 31 are formed. It is preferable that the flow passage 31 be as close as possible to the hole 21 for accurate temperature adjustment.However, if the distance is too close, there is a problem such as a decrease in strength or deterioration in workability. It is appropriate that the distance between them is about 10 mm. The flow passage 31 is connected to a liquid supply source 32 that supplies the temperature control liquid to the flow passage 31. In the liquid supply source 32, the supply amount and temperature of the temperature control liquid are controlled by the control device 33. And the hole of the die 18
The controller 33 controls the liquid supply source 32 based on the temperature detected by the temperature sensor 34 provided near the 21 so that the temperature near the hole 21 of the die 18 is adjusted to a predetermined temperature. Has become. As described above, the temperature control device 35 of the die 18 is configured.

On the other hand, as shown in FIGS. 2, 4 and 5, the upper die 12 has a receiving plate 52 fixed to the lower surface of a substrate 51, and a plurality of punches on the lower surface of the receiving plate 52. 53
Are fixed side by side. Each of the punches 53 has a lower portion removably fitted into an upper portion of each of the holes 21 of the die 18. The lower surface of each punch 53 is a horizontal plane. On the lower side of the receiving plate 52, a holding member 54 surrounding the punch 53 is supported so as to be vertically movable within a predetermined range. That is, the lower part of each punch 53 is slidably fitted in a plurality of openings 55 formed in the plate-shaped holding body 54. And, in order to support the holding body 54, this holding body
Pin 56 fixed to 54 slide bearing on backing plate 52
It is slidably supported through 57. A stopper 58 fixed above the holding body 54 is fitted into a hole 59 formed in the receiving plate 52. In addition to gravity, a spring 60 located above the stopper 58 is used to hold the holding body 58. 54 is always biased downward. On the other hand, the lower limit position of the pressing body 54 is regulated by the stopper 58 abutting on the upward step surface 61 formed in the hole 59.

Further, guide pins 66 are fixed to both left and right sides of the upper die 12 so as to protrude downward. on the other hand,
The lower die 11, the bush 68 in which the guide pin 66 incorporating the slide bearing 6 9 fitted vertically slidably
Is provided.

Next, the operation of the above configuration will be described. The sheet 1 is intermittently transported on the die 18 by a transport mechanism (not shown) including rollers and the like.
In the meantime, the product portions 2 are sequentially punched from the predetermined position of the sheet 1 line by line. The sheet 1 is conveyed while the lower mold 11 and the upper mold 12 are open, and when the sheet 1 stops, the upper mold 12 descends and closes. Accordingly, the punch 53 fits into the hole 21 of the die 18 in a state where the non-product portion of the sheet 1 is sandwiched between the pressing body 54 of the upper die 12 and the die 18 of the lower die 11, The product part 2 is punched from the sheet 1. At this time, the pressing body 54 rises relatively to the punch 53. Further, the shedder 23 is pushed down with respect to the die 18 by the punch 53. Then, the upper mold 12 is lifted and opened, and the punch 53 comes out of the hole 21 of the die 18. Along with this, the shedder 23 is lifted up by the spring 27 and pushes the punched product portion 2 back to the sheet 1 once. Thereafter, the sheet 1 including the product portion 2 is conveyed, and the punched product portion 2 is combined with the lower mold 11 and the upper mold.
After exiting from the interval 12, the sheet is extracted from the sheet 1 by a product extracting mechanism (not shown).

In the above punching, a temperature control device
The temperature control liquid supplied from the 35 liquid supply sources 32 passes through the flow passage 31 in the die 18, whereby the temperature near each hole 21 of the die 18 is adjusted. More specifically, based on the temperature of the die 18 detected by the temperature sensor 34, the controller 33 adjusts the flow rate or the temperature of the temperature control liquid supplied from the liquid supply source 32, whereby The temperature near the hole 21 is adjusted to a predetermined temperature.

For example, by appropriately setting the above-mentioned predetermined temperature for each sheet 1 having the same final shape of the product and different materials, the lower mold 11 can be adapted to the difference in the properties such as the coefficient of thermal expansion of the material. In addition, the upper mold 12 can be used in common for a plurality of types of sheets 1. For example, for a material having a higher coefficient of thermal expansion, the temperature of the die 18 may be adjusted lower than for a material having a lower coefficient of thermal expansion.
And by being able to share the lower mold 11 and the upper mold 12,
Cost can be reduced in mold production and management.

In the mold of the above embodiment, the die 18 has a hole 21 for punching the product portion 2 from the sheet 1.
Are arranged in a line, but since the holes 21 are collectively surrounded from the outside and the flow passage 31 is provided, the holes 21 can be positioned close to each other to improve the yield of the sheet 1 and to improve the flow rate. The configuration of the path 31 is simple, and its processing is also easy. In addition, the temperature control can be more reliably performed by providing a flow passage between the holes 21, but since each hole 21 is along the flow passage 31, the temperature near each hole 21 is appropriately adjusted. it can.

It should be noted that the present invention is not limited to the above embodiment, and various modifications can be made. For example ,
In the previous SL embodiment has been described taking as an example a case of punching the magnetic recording card from the sheet 1, the present invention is also applicable to other punching.

[0021]

According to the punching method of the first aspect of the present invention, a flow passage for passing a temperature control liquid is formed in a die, and the flow passage is provided with a liquid supply source, a temperature sensor, and a control device.
The composed temperature controller connected, passing the liquid temperature adjusting a flow passage
Predetermined around the hole where the punch is fitted in the die
In addition to adjusting the temperature, for sheets with the same final shape and different materials,
For materials with lower coefficients of thermal expansion,
Is adjusted to be lower, a die including a die and a punch can be shared for the different sheets , and costs can be reduced in manufacturing and managing the die.

According to the punching method of the second aspect of the present invention,
In addition to the effect of the invention of claim 1, while the die has a plurality of holes arranged in a line, the flow passage is provided so as to surround the plurality of holes collectively from the outside. Can be positioned close to each other to improve the sheet yield, and the temperature in the vicinity of each hole can be appropriately adjusted by the flow passage having a simple configuration that is easy to process.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing one embodiment of a punching device of the present invention.

FIG. 2 is a cross-sectional view of the upper and lower molds and the upper mold.

FIG. 3 is a plan view of the upper and lower molds.

FIG. 4 is a bottom view of the upper die.

FIG. 5 is a longitudinal sectional view of the upper die.

FIG. 6 is a plan view of a sheet.

[Explanation of symbols]

1 Sheet 2 Product part 18 Die 21 Hole 31 Flow passage 32 Liquid supply source 33 Controller 34 Temperature sensor 35 Temperature controller 53 Punch

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) B26F 1/14 B26F 1/44 B30B 15/34

Claims (2)

(57) [Claims] 1. A die on which a sheet is placed, and a product part which is removably fitted into a hole formed in the die and is inserted into the hole.
And a disconnect rather punch out the partial Rutotomoni, liquid supplies connected to the liquid temperature adjusting a flow path which is <br/> formed in the die
A supply source and a temperature sensor provided near the hole of the die
And, based on the temperature detected by the temperature sensor,
A temperature controller consisting of a controller for controlling the liquid supply
Using the punching device obtained above, pass the temperature control liquid through the flow passage.
By adjusting the temperature around the hole of the die to a predetermined temperature
In addition, sheets with the same final shape of the product but different materials
For materials with a higher coefficient of thermal expansion, thermal expansion
Lower die temperature than for lower rate materials
A punching method characterized by fine adjustment . 2. The punching device according to claim 1 , wherein the punch is formed with a plurality of holes arranged in a line in the die.
2. A punching method according to claim 1, wherein said flow passage is provided by surrounding said plurality of holes collectively from outside.