JP3175336B2 - Hybrid IC lead forming method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming leads of a hybrid IC.

[0002]

2. Description of the Related Art In a conventional hybrid IC manufacturing process, leads are formed as follows. First, in the state of the collective substrate 50 as shown in FIG. 9, semiconductor elements and other individual components are mounted on each individual substrate 52 defined by the long holes 51. When the component mounting is completed, the hanging portion 53 of the board is shot down by a mold, and one collective board 50 is divided into a plurality of individual boards 52.

[0003] With respect to the individual substrate 52 thus divided,
Lead frame (F-type lead) 54 manufactured in another process
Are arranged facing each other from both sides of the individual substrate 52 as shown in FIG. Subsequently, as shown in FIG.
Then, the lead frame 54 is assembled from both sides, and the individual substrate 52 and the lead frame 54 are further connected by soldering. Thereafter, the lead frame 54 is cut leaving a predetermined length as indicated by a broken line in the figure, and then formed into a predetermined shape as necessary.

[0004]

However, in the above-described conventional lead forming method, the individual substrate 52 and the lead frame 54 are manufactured in separate steps, respectively, and both are combined in a later step. Therefore, there is a problem that the manufacturing process becomes very complicated. In addition, since the individual substrate 52 and the lead frame 54 are connected by soldering so that an electrical connection between them can be obtained, the work is labor-intensive and requires a great deal of man-hour. Product cost has increased.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a method for forming a lead of a hybrid IC which can form a lead in a series of manufacturing steps and which can greatly reduce the number of steps. The purpose is to provide.

[0006]

Means for Solving the Problems The present invention has been made to achieve the above-mentioned object, and has a structure in which a substrate is partitioned by long holes,
A step of forming an individual substrate in the base material, a step of laminating a copper foil on the surface of the base material, a step of applying a resist to a predetermined portion of the copper foil, and a step of forming a copper except for the portion where the resist is applied. The step of removing the foil and leaving the copper foil in a state of straddling the long hole provided in the base material, separating the individual substrate from the base material, and simultaneously cutting and bending the remaining copper foil to form the individual substrate And forming a lead around the lead.

A step of dividing the base material into long holes and forming an individual substrate in the base material; and a step of forming a flat copper plate along the surface of the base plate while straddling the long holes provided in the base material. And forming a lead around the individual substrate by cutting and bending the copper plate while separating the individual substrate from the base material.

Further, a step of dividing the base material by long holes and forming an individual substrate in the base material, and mounting a copper plate formed into a predetermined shape in a state of straddling the long holes provided in the base material. And forming a lead around the individual substrate by cutting the copper plate at the same time as separating the individual substrate from the base material.

[0009]

In the method for forming a lead of a hybrid IC according to the present invention, the lead is formed in a series of steps from partitioning the base material into long holes to dividing the base material into several individual substrates. A copper foil or copper plate to be formed is formed in a state of straddling the long hole provided in the base material, and the copper foil or copper plate is cut and bent at the same time as the substrate is divided and formed as leads around the individual substrate. Is done. Here, when the copper plate is formed into a predetermined shape in advance, the bending of the copper plate at the time of dividing the substrate becomes unnecessary.

[0010]

Embodiments of the present invention will be described below in detail with reference to the drawings. First, the hybrid I according to the present invention
A first embodiment of a method for forming leads C will be described with reference to FIGS. First, as shown in FIG. 2, an elongated hole 11 is provided at a predetermined position of a base material 10 serving as an aggregate substrate and partitioned, and four individual substrates 12 are formed in the base material 10, for example, as shown in FIG. . Each individual substrate 12 is held integrally with the base material 10 by a suspension portion 13 formed near the end of the long hole 11. Next, the copper foil 14 is laminated on the surface of the base material 10 having the outer shape processed as described above (see FIG. 3). Thereby, the long hole 11 and the individual substrate 12 provided in the base material 10 are completely covered with the copper foil 14.

Subsequently, a resist is applied to a predetermined portion of the copper foil 14 laminated on the surface of the substrate 10. Here, a resist is applied only to a portion to be left as the copper foil 14 on the surface of the base material 10. For example, a wiring pattern formed on the individual substrate 12 and a lead (described later) formed by connecting to the wiring pattern correspond to the portion.

Next, the copper foil 14 is removed by etching except for the portion to which the resist is applied, and the wiring pattern of the individual substrate 12 (not shown) is straddled over the long hole 11 of the base material 10 as shown in FIG. To leave the copper foil 14.

[0013] Finally, using a mold (not shown), the base material 10
At the same time when the individual substrate 12 is separated from the substrate, the copper foil 14 left on the base material 10 is moved to the position indicated by the broken line in FIG. 4 (the center of the copper foil 14).
Then, as shown in FIG. 5, the copper foil 14 is bent to form leads (14) around the individual substrate 12.
Incidentally, the individual substrate 12 is separated from the base material 10 by dropping the hanging portion 13 with a mold.

As described above, in the lead forming method of the first embodiment, since the portion to be the lead of the hybrid IC is formed at the same time as the patterning on the base material 10, the conventional lead forming method is employed. It is not necessary to provide a separate step for forming the leads, and it is possible to form leads in a series of substrate manufacturing steps. Further, by forming the copper foil 14 serving as a lead simultaneously with the operation of forming the wiring pattern on the individual substrate 12, the lead can be formed with almost no increase in the man-hour required for manufacturing the substrate. Become. As a result, the man-hour for manufacturing the lead frame and the man-hour for incorporating the same into the individual substrate in the conventional method are not required at all, so that the number of man-hours can be significantly reduced.

Next, a second embodiment of a method for forming leads of a hybrid IC according to the present invention will be described with reference to FIGS. First, as in the case of the first embodiment, the substrate 2
0, a long hole 21 is provided at a predetermined position,
Several individual substrates 22 are formed therein. Here, each individual substrate 22 is held integrally with the base material 20 by a suspension portion 23 formed at an end of the long hole 21.

Subsequently, as shown in FIG. 6, a thin copper plate 24 is mounted so as to straddle a long hole 21 provided in the base material 20.
The copper plate 24 is formed into a predetermined shape in advance as shown in FIG. 7, and the respective copper plates 24 are connected by an elongated resin material 25. More specifically, the connecting portion of the copper plate 24 is cut out in a wedge shape,
Each of the copper plates 24 is connected by pouring and melting the resin material 25 dissolved in the cutout portion.

Copper plate 24 connected by resin material 25
Are mounted on the base material 20 by a mounting machine (not shown), like the semiconductor elements and other individual components mounted on the individual substrate 22. Here, lands (not shown) are formed on the periphery of the individual substrate 22 defined by the long holes 21.
The copper plate 24 is mounted on the substrate 20 such that both ends of the copper plate 24 are located exactly on the lands. Further, a predetermined amount of solder is supplied to the lands of the individual substrate 22 in advance similarly to the lands for mounting other components, and the mounted copper plate 24 is temporarily attached on the base material 20. By heating the base material 20 to a predetermined temperature through, for example, a reflow furnace from such a state, the lands of the individual substrate 22 and both ends of the copper plate 24 are joined by solder.

Finally, using a mold (not shown),
At the same time, the copper plate 24 mounted on the base material 20 is separated at the connection portion of the resin material 25,
As shown in FIG. 8, leads (24) are provided around the individual substrate 22.
To form Incidentally, the separation of the individual substrate 22 from the base material 20 is performed by dropping the hanging portion 23 with a mold as in the previous embodiment. Further, the copper plates 24 are separated from each other by cutting a connection portion with the resin material 25 with a mold.

As described above, in the lead forming method according to the second embodiment, the copper plate 24 serving as the lead of the hybrid IC is surface-mounted on the base material 20 in the same manner as other components, and when the substrate is divided. Since it is cut and bent to form a lead around the individual substrate 22, there is no need to provide a separate step for lead attachment as in the first embodiment, and a hybrid process is performed in a series of substrate manufacturing steps. I
C lead formation can be performed. Also, since the copper plate 24 serving as the lead and the land of the individual substrate 22 are joined by a reflow method, all the work involved in forming the lead can be performed by an automatic machine. Man-hours can be reduced.

In the second embodiment, the copper plate 24 is formed into a predetermined shape in advance and then mounted on the substrate 20. However, the present invention is not limited to this. A flat copper plate may be mounted on a base material, which may be cut and bent at the same time as dividing the substrate to form leads.

[0021]

As described above, according to the present invention,
Since the leads can be formed in a series of substrate manufacturing steps, the complexity of the steps of manufacturing a lead frame in a separate step and incorporating it into an individual substrate as in the related art is eliminated. In addition, since the electrical connection between the individual substrate and the lead can be obtained in the above-described series of substrate manufacturing steps, the individual substrate and the lead frame manufactured in separate steps as in the conventional method are soldered. It is not necessary to perform a troublesome work such as connection by attaching, so that it is possible to greatly reduce the number of work steps, and at the same time, it is possible to expect a reduction in product cost.

[Brief description of the drawings]

FIG. 1 is a diagram (part 1) for explaining a lead forming method according to a first embodiment of the present invention;

FIG. 2 is a diagram (part 2) for explaining the lead forming method according to the first embodiment of the present invention;

FIG. 3 is a diagram (part 3) for explaining the lead forming method according to the first embodiment of the present invention;

FIG. 4 is a diagram (part 4) for explaining the lead forming method according to the first embodiment of the present invention;

FIG. 5 is a view (No. 5) for explaining the lead forming method according to the first embodiment of the present invention;

FIG. 6 is a diagram (part 1) for explaining a lead forming method according to a second embodiment of the present invention;

FIG. 7 is an explanatory view of a copper plate in a second embodiment.

FIG. 8 is a diagram (part 2) for explaining the lead forming method according to the second embodiment of the present invention;

FIG. 9 is a view for explaining a conventional lead forming method (part 1);
It is.

FIG. 10 is a diagram (part 2) for explaining a conventional lead forming method;

FIG. 11 is a diagram (part 3) for explaining a conventional lead forming method;

[Explanation of symbols]

 10, 20 Substrate 11, 21 Slot 12, 22 Individual substrate 14 Copper foil 24 Copper plate

Continuation of the front page (72) Inventor Katsuya Kosuge 6-7-35 Kita Shinagawa, Shinagawa-ku, Tokyo Inside Sony Corporation (56) References JP-A-60-242631 (JP, A) (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H01L 23/50 H05K 1/02

Claims (3)

(57) [Claims] A step of dividing a base material into long holes and forming an individual substrate in the base material; a step of laminating a copper foil on a surface of the base material; A step of applying a resist, a step of removing the copper foil except for a portion where the resist is applied, and a step of leaving the copper foil in a state of straddling a long hole provided in the base material; Forming a lead around the individual substrate by cutting and bending the remaining copper foil simultaneously with separating the single substrate. 2. A step of dividing a base material by long holes, forming an individual substrate in the base material, and flattening the substrate along the surface of the substrate while straddling the long holes provided in the base material.
A step of mounting a plate-shaped copper plate, and a step of cutting and bending the copper plate and forming leads around the individual substrate at the same time as separating the individual substrate from the base material. Of forming a hybrid IC lead. 3. A step of dividing a base material into long holes and forming an individual substrate in the base material, and forming a copper plate formed into a predetermined shape in a state of straddling the long holes provided in the base material. A method of forming a lead for a hybrid IC, comprising: a step of mounting; and a step of cutting the copper plate and forming leads around the individual substrate at the same time as separating the individual substrate from the base material. .