JP3176201B2 - Wiring board connection method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of electrically connecting two substrates of different types or the same type (ceramic substrate, flexible substrate, printed substrate, silicon substrate, etc.) to each other by connecting electrode terminals to each other via a connecting material. The present invention relates to a method for connecting a wiring board to be mechanically connected .

[0002]

2. Description of the Related Art FIG. 11 shows an oblique view of a conventional liquid crystal display device among various display devices, and FIG.
Shows a cross section taken along the line BB 'in FIG. As shown in FIG. 11, this liquid crystal display device has a display panel 1 'and driving ICs (integrated circuits) 6, 5 for driving the display panel 1' on a substrate surface made of a polyimide resin, respectively. A plurality of flexible wiring boards 502 and 508, a circuit board 501 provided along the display panel 1 'for transmitting control signals to each flexible wiring board 502, and a control board 602 for outputting the control signals are provided. ing.

The display panel 1 'is, as shown in FIG.
A liquid crystal 505 is sealed between a pair of glass substrates 506 and 506 '(an area where the liquid crystal 505 is sealed displays an image). On the periphery 2 of one glass substrate 506 ', ITO (tin-added indium oxide), Ti, T
A large number of electrode terminals 504 made of a, Cr, Cu, Mo, Al or the like are provided. 511 is a base coat (insulating layer). As shown in FIG. 14, an opaque substrate surface 520 is provided on each of the flexible wiring boards 502 and 508.
In addition, an output terminal 606 and an input terminal 507 which are made of Cu or the like and are connected to the driving IC 6 are provided on opposite sides. All input terminals 507 on the substrate surface 520
The slit 510 penetrating the base material is provided in a region including. As shown in FIG. 11, a circuit board 501 includes an opaque bus line 60 extending in the longitudinal direction of the circuit board.
8 and electrode terminals 604 (FIG. 12) connected to the bus lines 608 and corresponding to the respective flexible wiring boards 502. The control board 602 includes an electronic component for generating the control signal, a bus line 608 ′ for transmitting the control signal, and an electrode terminal 60 connected to the bus line 608 ′ and corresponding to each flexible wiring board 508.
3 are provided.

In the mounted state, the peripheral portion 2 of the display panel 1 '
Electrode terminals 504 and flexible wiring boards 502 and 50
8 is connected to an output terminal 606 via an anisotropic conductive film 607. On the other hand, each of the flexible wiring boards 502 and 508
Input terminal 507 and the electrode terminal 60 of the circuit board 501.
4. The electrode terminals 603 of the control board 602 are connected with the respective solders 605 (FIG. 12).

More specifically, as shown in FIG. 12, first, a solder 605 is supplied to an electrode terminal 604 of a circuit board 501. Next, an anisotropic conductive film 607 is supplied onto the electrode terminals 504 on the peripheral portion of the display panel 1 '. Next, each electrode terminal 504 of the display panel 1 'and each flexible wiring board 50
2, 508 and the output terminals 606 are aligned.

Here, the glass substrate 506 'is transparent, and the anisotropic conductive film 607 is made of transparent resin in which conductive particles are dispersed.
The alignment marks (not shown) for alignment provided on both the flexible wiring board 502 and the flexible wiring board 502 can be seen from the direction A through the glass substrate 506 '. Therefore, the glass substrate 506 'and the flexible wiring board 50
The alignment with 2 is performed by finely adjusting the mutual positions while observing with the alignment mark. Next, the display panel 1 'and each of the flexible wiring boards 502 and 508 are thermocompression-bonded to connect each of the electrode terminals 504 and each of the output terminals 606. At this time, the resin component of the anisotropic conductive film 607 is liquefied and flows by heating. Alternatively, the flexible wiring boards 502 and 508 may expand due to heating. Therefore, even if the alignment is performed once as described above, the glass substrate 50
6 'and the flexible wiring board 502 are easily shifted from each other in the surface direction, and the shift becomes large unless the parallelism or flatness of the pressing tool is sufficient. Then, after the connection, the observation is made visually or automatically from the direction A through the glass substrate 506 'again. For example, as shown in FIG.
The quality of the alignment is determined by looking at the deviation d between the position and the output terminal 606. At the same time, as shown in FIG. Based on the above, the quality of the connection state is determined.

Next, as shown in FIG. 11, the respective flexible wiring boards 502 and 508 are aligned with the circuit board 501 and the control board 602, and the respective input terminals 507 of the respective flexible wiring boards 502 and 508 are connected to the circuit board. Substrate 5
01 and 602 are connected to each other using solder as a connecting material. The quality of the alignment and the quality of the connection state are determined by observing through the slit 510. After that, the electrode terminals 603 of the control board 602 and the bus lines 608 of the circuit board 501 are connected by the connector 601. Such a mounting technology is described in the National Technical Report (NATIONAL TELE
CHNICAL Rep. ) Vol. 38 No. 3 (199)
2) pp. 24 to 30 “Thin liquid crystal module using narrow frame LSI”.

[0008] During operation of the liquid crystal display device, the circuit board 50 is connected from the control board 602 via the connector 601.
A control signal is supplied to one bus line 608. This bus line 608, each flexible wiring board 502, 50
8, each of the flexible wiring boards 5
Control signals are input to the driving ICs 6 and 5 of the driving circuits 02 and 508. The signals output from the driving ICs 6 and 5 are output to an output terminal 6.
06, via the electrode terminals 504, each glass substrate 506,
The voltage is applied to a display electrode (not shown) formed on the opposite surface 506 '. As a result, the display panel 1 'is driven and display is performed.

[0009]

However, the above-mentioned conventional liquid crystal display has the following problems.

As shown in FIG. 14, since slits 510 are provided in the area including all input terminals 507 of flexible wiring board 502, relatively heavy liquid crystal panel 1 'and circuit board 501 can be made thin (thickness 10). ~ Several tens of μm
) And must be supported by a group of thin input terminals 507.
For this reason, the input terminal 507 may be damaged by a shock when the liquid crystal display device is dropped, a vibration while moving by a car or a train, or the like.
Is disconnected (so-called "terminal disconnection"). Actually, such troubles have occurred during the manufacture of the liquid crystal display device or after the liquid crystal display device has been put on the market.

As shown in FIG. 12, the input terminals 507 of the flexible wiring board 502 are connected to the electrode terminals 604 of the circuit board 501 by solder 605. It cannot exceed the limit of about 300 μm, or about 600 μm in a practical mass production level. For this reason, there is a problem that the mounting area becomes large.

An output terminal 608 of the flexible wiring board 502 is connected to an electrode terminal 504 of the glass substrate 506 'by an anisotropic conductive film 607. That is, the connection material is different between the input terminal 507 side and the output terminal 606 side of the flexible wiring board 502. For this reason, separate connection devices and processes are required for the input terminal 507 and the output terminal 606, and there is a problem that capital investment and man-hours increase, and the cost increases.

Here, in order to solve the above problems (1) to (4), for example, as shown in FIG. 13, no slit is provided in a region where the input terminal 507 exists on the substrate surface.
A method of connecting the input terminal 507 using an anisotropic conductive film 530 instead of solder (so-called fine pitch connection) has been proposed. In this case, the practical level is 10
The pitch can be reduced to 0 μm, or about 50 μm at the development level.

However, this method has the following problems.

In the fine pitch connection, the positioning accuracy between the terminals is strictly required. However, generally, the base material 520 of the flexible wiring board 502 is opaque,
Since the circuit board 501 is also opaque, there is a problem that if no slit is provided, the alignment mark cannot be observed through the substrate or the substrate, and it is not possible to perform fine alignment.

Since the alignment mark cannot be observed through the substrate or the substrate, the input terminal 50
It is difficult to confirm the positional deviation between the electrode terminal 7 and the electrode terminal 604.

Since the alignment mark cannot be observed through the base material or the substrate, there is a problem that it is difficult to judge the quality of the connection state. Conventionally, the connection method using solder has been adopted for the reason described above.

However, when the connection material is changed from solder to anisotropic conductive film 530 with the slit 510 provided as shown in FIG. 18, the terminal in the slit 510 is formed in the same manner as described above. The problem of cutting is not solved.
In addition, at the time of connection, as shown in FIG.
7, the anisotropic conductive film 5 that has flowed out to the tip of the heating tool 522 as shown in FIG.
21 'sticks, and the tool 522 is damaged (chipped), or is locally worn and has a short life. further,
The attachment (projection formation) of the foreign matter 521 ′ causes the flatness of the tool 522 to be lost, and as a result, the input terminal 50
There is a possibility that an even pressure is not applied to the whole 7 and a defective product is produced.

In general, two opaque substrates 51 are used.
As a method of aligning 5,516, a method as shown in FIG. 17 is known. That is, the first substrate 515
And the second substrate 516 are held on another stage in a state where they are displaced by a predetermined distance L in the horizontal direction in advance. The electrode terminal 517 or the alignment mark (not shown) on the first substrate is viewed by the first camera 518 ′ while the electrode terminal 519 or the alignment mark (not shown) on the second substrate 516 is viewed from the second camera 518 ′.
View with camera 518. Then, the second substrate 516 is horizontally moved by the distance L to the first substrate 515 side by a transfer device (not shown), and then the second substrate 516 is lowered to the first substrate 515.
It is brought into contact with the substrate 515.

However, in this method, there is a problem that the positioning accuracy is not good due to the variation of the moving amount L by the transfer device. In addition, since the second substrate 516 is moved an extra distance L, the operation time of the apparatus is prolonged, and the production amount is reduced. Also, in the components of the transfer device, for example, the stage for moving the second substrate 516 by L, the joint portion, the stopper, or the like may be worn or the screws may be loosened, and the amount of movement may suddenly go wrong. If automatic production is continued without knowing, there is a risk that a large number of defective products will be manufactured.

As a method of aligning the flexible wiring board 502 and the circuit board 501, a pair of positioning holes (about φ1 to φ3 mm) 521 are formed in the base surface 520 of the flexible wiring board 502 as shown in FIG. , 521
Is known. In this case, a pair of holes (about φ2 to φ5 mm) are also provided in the circuit board 501 shown in FIG. 11 and the like, and pins (not shown) are provided in the holes of both 502 and 501.
Positioning is performed through

However, in this method, the positioning accuracy is deteriorated due to abrasion of a pin or the like. For this reason, it takes time and effort to replace the pins, resulting in an increase in cost. In addition, an area for providing a positioning hole is required, and the mounting area and the size of the flexible wiring board are increased. Therefore, there is a problem that the cost is increased or the product size is increased.

Therefore, an object of the present invention is to make first and second wiring substrates having a plurality of electrode terminals arranged on a surface of a substrate oppose each other, and to electrically and mechanically connect the respective electrode terminals via a connecting material. A method of connecting a wiring board to be connected to a terminal, which can prevent disconnection of terminals during and after the connection process, can connect terminals at a fine pitch in a short time and with high positional accuracy, and can easily determine the alignment and the quality of the connection state It is an object of the present invention to provide a connection method of a wiring board which can be performed.

[0024]

[0025]

According to a first aspect of the present invention , there is provided a method for connecting a wiring board, comprising: a first wiring board having a plurality of first electrode terminals arranged on a surface of the board; A second electrode having a plurality of second electrode terminals arranged on the surface of the substrate;
Is opposed to the wiring board, the connection of a wiring board connected via a connecting member and the first electrode terminal and the second electrode terminal, to a particular region of the first wiring board, While providing a slit that penetrates the substrate,
A positioning mark having a shape corresponding to the shape of the slit is provided at a position of the second wiring substrate corresponding to the slit on the first wiring substrate, and the slit is formed.
The first wiring board and the second
Align the wiring board with the first electrode terminal and the second electrode terminal.
After connecting the first wiring board and the second
Pass / fail of the position deviation with the wiring board
It is characterized by observation and determination .

[0026]

[0027]

[0028]

[0029]

[0030]

[0031]

[0032]

According to a second aspect of the present invention, there is provided a method for connecting a wiring board, comprising: a first wiring board having a plurality of first electrode terminals arranged on a surface of the substrate; and a second electrode having a plurality of second electrodes arranged on the surface of the substrate. A second wiring board having terminals facing each other;
In the method for connecting a wiring board for connecting the electrode terminal and the second electrode terminal via a connecting material, a slit that penetrates the substrate is provided in a specific region of the first wiring board, A mark having a shape corresponding to the shape of the slit was provided in a portion of the wiring substrate corresponding to the slit of the first wiring substrate, and the first electrode terminal and the second electrode terminal were connected. Thereafter, the quality of the connection between the first electrode terminal and the second electrode terminal is determined by observing the location of the mark through the slit.

According to a third aspect of the present invention, there is provided a method of connecting a wiring board according to the second aspect .
It is characterized in that the quality of the connection between the first electrode terminal and the second electrode terminal is determined based on the amount of a portion of the connection material flowing out of the connection portion through the slit.

According to a fourth aspect of the present invention, in the method for connecting a wiring board according to the second or third aspect , the first wiring board is connected to the second wiring board by using the slit and the mark. After the alignment with the wiring board, the quality of the connection between the first electrode terminal and the second electrode terminal is determined by observing through the same slit.

[0036]

[0037]

[0038]

[0039]

[0040]

[0041]

[0042]

[0043]

[0044]

According to the first aspect of the present invention, the first wiring board is connected to the second wiring board by using the slit and the mark.
After the first electrode terminal and the second electrode terminal are connected to each other and the first electrode terminal and the second electrode terminal are connected to each other, the position of the first and second wiring substrates is observed through the slit. Therefore, it is possible to determine whether the positional accuracy is good or bad after the connection between the first wiring board and the second wiring board. As a result, an abnormality such as a one-sided contact of the pressure seal can be detected at an early stage, and a large number of defective products can be prevented.

In the method for connecting a wiring board according to a second aspect of the present invention, a slit penetrating the board is provided in a specific region of the first wiring board, and the first wiring board is provided with a slit. A mark having a shape corresponding to the shape of the slit is provided at a position corresponding to the slit on the wiring board of the above, and after connecting the first electrode terminal and the second electrode terminal, the first electrode terminal The quality of the connection between the first electrode terminal and the second electrode terminal is determined by observing the location of the mark through the slit, so that the connection state between the first electrode terminal and the second electrode terminal can be easily determined. You.

Further, by providing the above slit,
The connection state may change between the region where the slit is provided and the region where the slit is not provided. In such a case, the size of the slit is reduced to reduce the effect of the slit. As in the method for connecting a wiring board according to claim 3 , whether the connection state between the first electrode terminal and the second electrode terminal is good or not is determined by an amount of a portion of the connection material flowing out of a connection portion through the slit. May be determined based on
Thereby, even when the dimensions of the slit are minute,
The quality of the connection material can be reliably determined.

[0047] In the method of connecting wiring board according to claim 4, after aligning the said first wiring board and the second wiring substrate by using the above-described slit and the mark, the first electrode terminal Whether the connection state between the second electrode terminal and
Since the determination is made by observing through the same slit as that used for the alignment between the first wiring board and the second wiring board, the substrate area is reduced by that much compared to the case where the slits are separately provided. Reduced. Therefore, high-density mounting is possible.

[0048]

[0049]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for connecting a wiring board according to the present invention will be described in detail with reference to embodiments.

FIG. 1 illustrates a flexible wiring board 2 as a first wiring board. This flexible wiring board 2
The drive IC 6 is mounted substantially at the center of the substantially rectangular base material 20. The base material 20 is made of polyimide or the like,
It has the flexibility to bend. A plurality of output terminals 5 connected to the drive IC 6 are provided along one side of the base member 20, while a plurality of inputs as first electrode terminals connected to the drive IC 6 along a side opposite to the side are provided. Terminal 3 is provided. The driving IC 6 is the same as the driving IC 506 shown in FIG. 11, and can output a signal for driving the display panel 1 '. Both the output terminal 6 and the input terminal 3 have a fine pitch (for example, 1
20 μm). In this example, a pair of rectangular slits 4 penetrating the base material 20 are provided in a region including a part of the plurality of input terminals 3. The base material 20
A cutout portion 20a is provided at a corner on the input terminal 3 side for reducing the area. The holes, slits 4, 4 and notches 20a, 20a (not shown) for providing the driving IC 6 can be formed simultaneously in a manufacturing process for manufacturing a flexible wiring board.

FIG. 3 shows a connection material in which the input terminals 3 of the flexible wiring board 2 and the second electrode terminals 7 (shown in FIG. 2) of a circuit board 9 as a second wiring board are opposed to each other. 1 shows a cross-sectional structure in the case where connection is made via an anisotropic conductive film 10 as an example. The circuit board 9 is for supplying a signal to the driving IC 6 of the flexible wiring board 2 in the same manner as the circuit board 501 shown in FIG. In this example, the electrode terminal 7 of the circuit board 9 shown in FIG. 2 is a positioning mark corresponding to the shape of the input terminal 3 of the flexible wiring board 2.

When the connection is made, the flexible wiring board 2 and the circuit board 9 are connected to each other by using the input terminals 3 in the slits 4 of the flexible wiring board 2 and the electrode terminals 7 of the circuit board 9.
And position. At this time, the flexible wiring board 2
Of the input terminal 3 and the electrode terminal 7 of the circuit board 9 can be observed visually or by an automatic recognition device through the slit 4 from the outside. In this example, the input terminal 3 and the electrode terminal 9
It can be seen that a deviation d has occurred between the two. Therefore,
By using these as alignment marks, the flexible wiring board 2 and the circuit board 9 can be accurately positioned.

After the alignment, the input terminal 3 and the electrode terminal 9 are connected via the anisotropic conductive film 10. Connection is as shown in FIG.
This is performed by applying pressure and heat using a tool 522 as shown in FIG. Here, since the slit 4 is provided only in a region including a part of the plurality of input terminals 3 in the base material surface 20, the anisotropic conductive film 10 is provided at the tip of the connection tool as compared with the related art. There is little risk that the tool will be damaged (chipped) due to sticking, or will have a short life due to local wear.

After the connection, the quality of the alignment and the quality of the connection can be easily determined by externally observing through the slit 4. In particular, in this example, since the connection material is the anisotropic conductive film 10, the quality of the connection state can be easily determined by the degree of resin flowing out, the dispersion distribution of the conductive particles, the shape of the bubbles, and the like. Here, since observation is performed through the same slit 4 used for alignment, it is possible to prevent an increase in the area of the flexible wiring board 2 as compared with a case where separate slits are used for alignment and connection state confirmation. it can.

During and after the connection step, the remaining input terminals 3 not existing in the slits 4 among the plurality of input terminals 3 of the flexible wiring board 2 are lined with the base material 20 and protected. It is possible to prevent the input terminal 3 from being disconnected (causing disconnection of the terminal).

Since the positioning accuracy is improved as described above, the use of a so-called fine pitch connecting material such as the anisotropic conductive film 10 makes it possible to reduce the connection pitch and reduce the area required for connection. be able to. The reason why the fine pitch connecting material can be used as the connecting material is that the positioning accuracy is good as described above. As the connection material, a light-curing resin, a press-type clip, or the like may be used.

Further, since the flexible wiring board 2 or the circuit board 9 is not largely moved, the positioning can be performed in a shorter time as compared with the case where the substrate is positioned by the method shown in FIG. Therefore, the connection is completed in a short time. In addition, the possibility of producing a large number of defective products due to misalignment is reduced. Further, as compared with the method in which the pins are positioned through holes provided in the substrate, the area of the substrate is reduced by the absence of the holes, and the time and effort for exchanging the pins are reduced.

FIG. 3 shows an example in which the thickness of the connecting member 10 is smaller than the thickness t of the input terminal 3 of the flexible wiring board 2. In this case, if connection is made with a tool having high rigidity as a pressing tool, the base surface 2 of the flexible wiring board 2
0 are evenly pressed, so that the state of the connecting member 10a in the region where the slit 4 is provided and the connecting member 10b in the remaining region
Finished without much difference from the state.

However, as shown in FIG. 4, the thickness of the input terminal 3 'of the flexible wiring board 2' is larger than the thickness of the connecting member 1 '.
When the thickness of the connecting member 10a 'is large before the connection, or when the pressing tool is soft like rubber, the state of the connecting member 10a' in the region where the slit 4 'is provided and the connecting member 10 in the remaining region.
There is a difference from the state of b '.

In such a case, as shown in FIG. 5, a slit 4 "which is smaller than the width of the input terminal 3 is provided on the flexible wiring board 2 ', and the connection state flows out of the slit 4" to the outside. The determination may be made based on the amount (for example, the diameter D) of the connection material 10c ″. When the pressing force, the pressurization time, and the like are constant as the connection conditions, the connection temperature T and the connection material outflow amount (diameter D) are determined. It is known that there is a correlation as shown in Fig. 6. For each item of the connection condition, such a correlation can be taken in advance to determine the quality criterion for the connection condition. It is only necessary to judge that β is good, and the automated inspection is easy.

In this case, in order to prevent the connecting member 10c "flowing out from the slit 4" from adhering to the pressing tool, a position (within 5 mm or less) deviated from the area where the pressing tool presses. ) May be provided with a slit 4 ". Alternatively, as shown in FIG. 10, a release sheet having a release property with respect to the connection material 10 between the flexible wiring board 2" and the tip of the pressing tool. 10 "may be inserted for connection. For example, a silicone rubber or Teflon sheet having a thickness of about 0.1 to 0.5 mm can be used as the release sheet 10".

FIGS. 7 to 9 show various alignments (including a positional deviation inspection) in regions of the circuit board corresponding to the slits 4a, 4b, 4c of the flexible wiring board 2, respectively.
The figure shows an example in which a mark is provided. In the example of FIG. 7, a square mark 13 is provided on the circuit board corresponding to the square slit 4a. In the example of FIG. 8, when there is a cross wiring 14 in the square slit 4b, the cross wiring 1
Marks 13a, 13b, 13c, 13d corresponding to 4 are provided on the circuit board. In the example of FIG. 9, when the input terminal 3 and the wiring ends 14a and 14b are present in the rectangular slit 4c, the corner of the slit 4c, the side of the input terminal 3, and the wiring ends 14a and 14b correspond to each other. Mark 13
e is provided on the circuit board. In any case, the flexible wiring board 2 and the circuit board can be accurately positioned.

The electrode terminals provided on the peripheral portion 2 of the liquid crystal display panel 1 'shown in FIG. 11 and the output terminals 5 of the flexible wiring board 2 shown in FIG.
And the input terminal 3 of the flexible wiring board 2 and the electrode terminal 7 of the circuit board 9 shown in FIG. 3 are used as a second connection material in the above-described manner. The liquid crystal display device can be configured by connecting the above via the anisotropic conductive film 10. Since anisotropic conductive films are currently the mainstream of high-density connection materials, the labor (time and money) for development research can be reduced as compared with the case where new materials are used. In addition, conventional equipment and manufacturing know-how can be used. Since the output terminal 5 side and the input terminal 3 side of the flexible wiring board 2 are connected by the same anisotropic conductive film, there is no need to provide separate connection devices and processes.
Therefore, cost can be reduced by reducing capital investment and man-hours. Further, when one anisotropic conductive film is provided commonly to the output terminal 5 side and the input terminal 3 of the flexible wiring board 2, the capital investment and the number of steps can be further reduced.

In this embodiment, the flexible wiring board has been described as the first wiring board, but the present invention is not limited to this. The present invention can be widely applied to general wiring boards having no flexibility.

In addition, although the example in which the liquid crystal display panel is mounted has been described, the present invention can also be applied to a case where another display panel such as a plasma or an EL is mounted.

[0066]

[0067]

[0068]

[0069]

[0070]

[0071]

[0072]

[0073]

The method of connecting wiring board according to claim 1, according to the present invention, by using the above-described slit and the mark aligning the said first wiring board and the second wiring board, and the first electrode terminal After the connection to the second electrode terminal, the quality of the misalignment between the first wiring board and the second wiring board is determined by observing through the slits.
Of the positional accuracy after connection with the wiring board can be determined, and the yield rate can be improved.

In the method for connecting a wiring board according to a second aspect of the present invention, a slit penetrating the board is provided in a specific area of the first wiring board, and the first wiring board is provided with a slit. A mark having a shape corresponding to the shape of the slit is provided at a position corresponding to the slit on the wiring board of the above, and after connecting the first electrode terminal and the second electrode terminal, the first electrode terminal The quality of the connection between the first electrode terminal and the second electrode terminal is determined by observing the location of the mark through the slit, so that the connection state between the first electrode terminal and the second electrode terminal can be easily determined. .

According to a third aspect of the present invention, whether the connection state between the first electrode terminal and the second electrode terminal is good or bad is determined by flowing out of the connection material through the slit. If the determination is made based on the amount of the portion, the quality of the connection material can be reliably determined even when the size of the slit is minute.

According to a fourth aspect of the present invention, in the method for connecting a wiring board, the first wiring board and the second wiring board are aligned using the slit and the mark, and then the first electrode terminal is connected. Whether the connection state between the second electrode terminal and
Since the determination is made by observing through the same slit for positioning the first wiring board and the second wiring board, the board area is reduced by that much as compared with the case where slits are separately provided. Therefore, high-density mounting can be performed.

[0077]

[Brief description of the drawings]

FIG. 1 is a diagram showing a flexible wiring board used to carry out the present invention.

FIG. 2 is a diagram showing a state of a slit when the flexible wiring board and a circuit board are connected.

FIG. 3 is a cross-sectional view showing a state where the flexible wiring board and a circuit board are connected.

FIG. 4 is a diagram illustrating a state of the connection material when the thickness of the connection material is larger than the thickness of the input terminal of the flexible wiring board.

FIG. 5 is a diagram illustrating a connection state when a minute slit is provided on a base material surface of a flexible wiring board.

FIG. 6 is a diagram showing a correlation between a connection temperature and a connection material outflow amount.

FIG. 7 is a view exemplifying a slit and a mark for alignment.

FIG. 8 is a diagram illustrating a slit and a mark for alignment.

FIG. 9 is a diagram illustrating a slit and a mark for alignment.

FIG. 10 is a diagram showing a state in which a release sheet is inserted between the flexible wiring board and the connection tool for connection.

FIG. 11 is a view showing a conventional general liquid crystal display device.

FIG. 12 is a diagram showing a connection structure of a peripheral portion of the liquid crystal display device.

FIG. 13 is a diagram showing a modification of FIG.

FIG. 14 is a view showing a conventional flexible wiring board.

FIG. 15 is a diagram illustrating a positional shift between an electrode terminal of a display panel and an output terminal of a flexible wiring board.

FIG. 16 is a diagram showing a state of a connecting member after connecting an electrode terminal of a display panel and an output terminal of a flexible wiring board.

FIG. 17 is a diagram illustrating a positioning method using a transfer device.

FIG. 18 is a diagram illustrating a state in which an input terminal of a flexible wiring board and an electrode terminal of a circuit board are pressed by a connection tool using a connection material, and a state in which the connection material sticks to the tip of the connection tool.

[Explanation of symbols]

 1 'display panel 2, 2', 2 "flexible wiring board 3, 3 ', 3" input terminal 4, 4', 4 "slit 5 output terminal 7 electrode terminal 9 circuit board

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI // G02F 1/1345 H01R 9/09 C (56) References JP-A-5-283862 (JP, A) 92963 (JP, U) Fully open sho 63-90876 (JP, U) Fully open sho 54-19752 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 1/02 G09F 9 / 00 350 H01R 12/06 H01R 43/00 H05K 3/32 G02F 1/1345

Claims (4)

(57) [Claims] 1. A first wiring substrate having a plurality of first electrode terminals arranged on a surface of a substrate and a second wiring substrate having a plurality of second electrode terminals arranged on a surface of the substrate are opposed to each other. ,
In the method for connecting a wiring board for connecting the first electrode terminal and the second electrode terminal via a connecting material, a slit that penetrates the substrate is provided in a specific region of the first wiring board. A positioning mark having a shape corresponding to the shape of the slit is provided in a portion of the second wiring substrate corresponding to the slit on the first wiring substrate, and the slit and the mark are used. The first wiring base
Aligning the board and the second wiring board, the first electrode
After connecting the terminal and the second electrode terminal, the first wiring
The above slip is used to determine whether or not the board is misaligned with the second wiring board.
A connection method for a wiring board, characterized by observing and judging through a port. 2. The method according to claim 1 , wherein a plurality of first electrode terminals are arranged on a surface of the substrate.
Having a first wiring substrate and a plurality of second wiring substrates arranged on a surface of the substrate.
A second wiring board having electrode terminals facing each other,
The first electrode terminal and the second electrode terminal are connected via a connecting material.
In the method of connecting a wiring substrate, the substrate is penetrated into a specific region of the first wiring substrate.
And a slit for the second wiring board.
A portion corresponding to the slit of the first wiring board
A mark with a shape corresponding to the shape of the slit
Provided, after connecting the first electrode terminals and second electrode terminals,
Good connection between the first electrode terminal and the second electrode terminal.
No, observe the location of the mark through the slit
A method of connecting a wiring board. 3. A method for connecting a wiring board according to claim 2.
Here, the connection state between the first electrode terminal and the second electrode terminal is good.
No, the connection point through the slit of the connection material
The feature is that it is determined based on the amount of the part leaked from
Wiring board connection method. 4. The connection of the wiring board according to claim 2 or 3.
In connection method, above using the slit and the mark first wiring board
After aligning the first wiring and the second wiring board,
The quality of the connection between the pole terminal and the second electrode terminal is determined by the same
An arrangement characterized by observing and judging through a slit
Connection method of wire substrate.