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JP3186294B2 - Light-emitting display unit - Google Patents
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JP3186294B2 - Light-emitting display unit - Google Patents

Light-emitting display unit

Info

Publication number
JP3186294B2
JP3186294B2 JP1801993A JP1801993A JP3186294B2 JP 3186294 B2 JP3186294 B2 JP 3186294B2 JP 1801993 A JP1801993 A JP 1801993A JP 1801993 A JP1801993 A JP 1801993A JP 3186294 B2 JP3186294 B2 JP 3186294B2
Authority
JP
Japan
Prior art keywords
light
layer
substrate
metal foil
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1801993A
Other languages
Japanese (ja)
Other versions
JPH06202568A (en
Inventor
俊浩 中谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiwa Electric Mfg Co Ltd
Original Assignee
Seiwa Electric Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiwa Electric Mfg Co Ltd filed Critical Seiwa Electric Mfg Co Ltd
Priority to JP1801993A priority Critical patent/JP3186294B2/en
Publication of JPH06202568A publication Critical patent/JPH06202568A/en
Application granted granted Critical
Publication of JP3186294B2 publication Critical patent/JP3186294B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PURPOSE:To obtain excellent front surface taking-out efficiency by removing metallic foil having a stabilization treated surface facing the front side of a substrate over the entire surface and reflecting the infiltrating light past the removed part to the metallic surface of the metallic foil existing on the rear side of the substrate. CONSTITUTION:The light infiltrating part x of the four-layered substrate A has a structure in which there is no copper foil of the second layer and the light infiltrating part x is covered by the copper foil 22b of the third layer. The stabilization treated layer 23a formed by a black treatment, etc., on the front surface of the copper foil 22a of the second layer faces the front side of the four-layered substrate A but the stabilization treated layer 23a does not exist in the light infiltrating part x and, therefore, the light infiltrating the light infiltrating part x infiltrates a resin plate 21 of the second sheet and passes this plate. Further, this light shines on the rear surface of the copper foil 22b of the third layer covering the light infiltrating part x. The stabilization treated layer 23a of the dark color formed on the front surface of the copper foil 22b faces the rear side of the four-layered substrate A and the metallic surface is exposed on the rear surface of the copper foil 22b on which the light shines without the presence of the stabilization treated layer 23a of the dark color thereon and, therefore, the light past the resin plate 21 is reflected to the metallic surface of the copper foil 22b.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、基板上に規則的に搭載
配列された複数個の発光素子の選択的な点灯により文字
等をドットパターン表示する発光表示ユニットに関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting display unit for displaying a character or the like in a dot pattern by selectively lighting a plurality of light emitting elements regularly mounted and arranged on a substrate.

【0002】[0002]

【従来の技術】文字等のドットパターン表示に使用され
るLED表示ユニットにおいては、その基板として配線
の高密度化等が可能な多層基板が使用され始めた。多層
基板として代表的な4層基板を使用した従来のLED表
示ユニットの構造例を図1に示す。
2. Description of the Related Art In an LED display unit used for displaying dot patterns of characters and the like, a multilayer substrate capable of increasing the density of wiring and the like has begun to be used as the substrate. FIG. 1 shows a structural example of a conventional LED display unit using a typical four-layer substrate as a multilayer substrate.

【0003】該LED表示ユニットは、4層基板Aと、
4層基板Aの表面に重ねられたハウジングBと、ハウジ
ングBの各開孔b内に位置して4層基板A上に搭載され
たLED素子Cとからなる。ここで、4層基板Aは3枚
の単位基板10,20,30からなる。
The LED display unit comprises a four-layer board A,
The housing B includes a housing B stacked on the surface of the four-layer board A, and an LED element C mounted on the four-layer board A in each opening b of the housing B. Here, the four-layer substrate A includes three unit substrates 10, 20, and 30.

【0004】表側の単位基板10は、ポリイミド樹脂等
の透光性樹脂からなる樹脂板11の表側の表面に銅箔1
2を接合し、その表面に金メッキ13を施した構成にな
っている。金メッキ13は、耐食性の改善やLED素子
Cのボンディング性、反射性等の改善を目的とするが、
LED素子Cに電流を通じるために、LED素子Cの周
囲では銅箔12と共にエッチングにより除去されてい
る。
A unit substrate 10 on the front side is made of a copper foil 1 on a front surface of a resin plate 11 made of a translucent resin such as a polyimide resin.
2 are joined, and the surface thereof is plated with gold 13. The purpose of the gold plating 13 is to improve the corrosion resistance, the bonding property of the LED element C, and the reflectivity.
In order to pass a current through the LED element C, the area around the LED element C is removed by etching together with the copper foil 12.

【0005】裏側の単位基板30は、ポリイミド樹脂等
の透光性樹脂からなる樹脂板31の裏側表面に銅箔32
を接合した構成になっている。
[0005] A unit board 30 on the back side is formed of a copper foil 32 on a back side surface of a resin plate 31 made of a translucent resin such as a polyimide resin.
Are joined.

【0006】中間の単位基板20は、ポリイミド樹脂等
の透光性樹脂からなる樹脂板21の表側の表面および裏
側の表面に銅箔22a,22bを接合した構成になって
いる。銅箔22a,22bの各表面は、単位基板10,
30の樹脂板11,31との接着性を高めるために、安
定化処理層23a,23bが形成されている。この安定
化処理としては、通常、硫化物より安定な黒色の化合物
を形成する黒色処理が用いられる。
The intermediate unit substrate 20 has a structure in which copper foils 22a and 22b are joined to a front surface and a back surface of a resin plate 21 made of a translucent resin such as a polyimide resin. Each surface of the copper foils 22a and 22b is
Stabilization layers 23a and 23b are formed in order to increase the adhesiveness of the 30 to the resin plates 11 and 31. As the stabilization treatment, a black treatment that forms a black compound more stable than sulfide is usually used.

【0007】以上のように4層基板Aは、3枚の樹脂板
11,21,31を介して積層された4層の銅箔12,
22a,22b,32を有する。故に、4層基板と呼ば
れる。いずれの銅箔12,22a,22b,32も所定
のパターン形状を有する。
[0007] As described above, the four-layer board A has four layers of copper foil 12, which are laminated via three resin plates 11, 21, 31.
22a, 22b, and 32. Therefore, it is called a four-layer substrate. Each of the copper foils 12, 22a, 22b, 32 has a predetermined pattern shape.

【0008】[0008]

【発明が解決しようとする課題】このようなLED表示
ユニットにおいては、4層基板A上のLED素子Cから
発せられた光が表側へ直接出射されるのみならず、いろ
いろな方向に出射される。ハウジングBの開孔bの内面
および4層基板Aに反射されて表側へ出射される。従っ
て、4層基板Aの開孔b内に位置する部分が反射部分X
となる。
In such an LED display unit, the light emitted from the LED element C on the four-layer substrate A is emitted not only directly to the front side but also in various directions. . The light is reflected by the inner surface of the opening b of the housing B and the four-layer substrate A and emitted to the front side. Therefore, the portion located in the opening b of the four-layer substrate A is the reflection portion X
Becomes

【0009】4層基板Aの反射部分Xのうち、金メッキ
13のある部分においては、LED素子Cから発せられ
た光が4層基板Aの表面の金メッキ13で反射されるの
で、その光は4層基板Aの内部に侵入しない()。し
かし、4層基板Aの表面から金メッキ13および銅箔1
2が除去されている部分においては、LED素子Cから
発せられた光が4層基板Aの内部に侵入する。
In a portion of the reflecting portion X of the four-layer substrate A where the gold plating 13 exists, the light emitted from the LED element C is reflected by the gold plating 13 on the surface of the four-layer substrate A. It does not enter the inside of the layer substrate A (). However, the gold plating 13 and copper foil 1
In the portion where 2 is removed, the light emitted from the LED element C enters the inside of the four-layer substrate A.

【0010】この光侵入部分xにおいては、2〜4層目
の銅箔22a,22b,32は無関係なパターン形状を
有している。また、2層目の銅箔22aは表面を表側に
向け、3層目および4層目の銅箔22b,32は表面を
裏側に向けている。従って、安定化処理層23aが表側
を向き、安定化処理層23bは裏側を向く。
In the light penetration portion x, the copper foils 22a, 22b and 32 of the second to fourth layers have an unrelated pattern shape. The surface of the second-layer copper foil 22a faces the front side, and the surfaces of the third-layer and fourth-layer copper foils 22b and 32 face the rear side. Therefore, the stabilization processing layer 23a faces the front side, and the stabilization processing layer 23b faces the back side.

【0011】ここで、銅表面は図2に示すように波長の
長い赤色系の光に対して高い反射率を示す。そのため、
光侵入部分xの中で、銅箔22aが存在せず銅箔22b
が存在する部分においては、侵入光が銅箔22bの裏面
(金属面)にて効率良く反射される()。また、銅箔
22aおよび銅箔22bが存在せず銅箔32が存在する
部分においても、侵入光が銅箔32の金属裏面にて反射
される()。
Here, as shown in FIG. 2, the copper surface has a high reflectance for red light having a long wavelength. for that reason,
In the light penetration part x, the copper foil 22a does not exist and the copper foil 22b
In the portion where there is, the intruding light is efficiently reflected on the back surface (metal surface) of the copper foil 22b (). Also, in a portion where the copper foil 32 is present without the copper foil 22a and the copper foil 22b, the intruding light is reflected on the metal back surface of the copper foil 32 ().

【0012】しかし、銅箔22aが存在する部分におい
ては、4層基板Aの内部に侵入した光が銅箔22a表面
の安定化処理層23bに吸収され、表側へ反射されない
()。従って、光の前面取り出し効率が低下する。銅
箔22a,22b,銅箔32のいずれも存在しない部分
においても、4層基板Aの内部に侵入した光が4層基板
Aの裏側へ抜けてしまうため、光の前面取り出し効率が
低下する()。
However, in the portion where the copper foil 22a is present, the light that has entered the inside of the four-layer substrate A is absorbed by the stabilizing layer 23b on the surface of the copper foil 22a and is not reflected to the front side (). Therefore, the efficiency of extracting light from the front decreases. Even in a portion where none of the copper foils 22a, 22b and the copper foil 32 is present, the light that has entered the inside of the four-layer substrate A escapes to the back side of the four-layer substrate A, so that the efficiency of extracting light from the front decreases. ).

【0013】最近は基板の放熱性を高めるために銅箔の
占有面積が大きく、4層基板Aを使用したLED表示ユ
ニットにおいては、4層基板Aの反射部分Xの中の光侵
入部分xに黒色の安定化処理層23aが存在することに
よる前面取り出し効率の低下が大きな問題になり始め
た。
Recently, the area occupied by the copper foil is large in order to enhance the heat radiation of the substrate, and in an LED display unit using the four-layer substrate A, the light penetration portion x in the reflection part X of the four-layer substrate A is The reduction in the front surface take-out efficiency due to the presence of the black stabilization layer 23a has begun to become a major problem.

【0014】本発明はかかる事情に鑑みて創案されたも
のであり、金属箔表面に暗色の安定化処理層を形成した
多層基板を使用するにもかかわらず、安定化処理層によ
る前面取り出し効率の低下がない発光表示ユニットを提
供することを目的とする。
The present invention has been made in view of such circumstances, and despite the use of a multi-layer substrate having a dark stabilization layer formed on the surface of a metal foil, the front surface extraction efficiency of the stabilization layer can be reduced. It is an object of the present invention to provide a light emitting display unit that does not deteriorate.

【0015】[0015]

【課題を解決するための手段】本発明にかかる発光表示
ユニットは、所定パターンの金属箔が透光性の樹脂板を
介して4層以上に積層され、中間層の金属箔表面に物質
的に安定な暗色の化合物を形成する安定化処理が施され
た多層基板上に、複数個の発光素子を規則的に搭載配列
し、該発光素子を選択的に点灯させることにより文字等
をドットパターン表示する発光表示ユニットにおいて、
多層基板の発光素子搭載位置近傍の反射部分の中の基板
表面の金属箔が除去された光侵入部分において、侵入光
が暗色の安定化処理層に吸収されないように、安定化処
理面が基板表側を向く金属箔を全面的に除去し、その除
去部分を通過した侵入光が除去された金属箔より基板裏
側に位置する金属箔に反射されるように、光侵入部分
は、除去部分より下層に位置するいずれかの金属箔によ
って覆われている。
According to the present invention, there is provided a light emitting display unit in which a metal foil having a predetermined pattern is laminated in four or more layers through a translucent resin plate, and a metal foil is physically formed on the surface of the metal foil of the intermediate layer. A plurality of light emitting devices are regularly mounted and arranged on a multi-layer substrate subjected to a stabilization process for forming a stable dark compound, and characters and the like are displayed in a dot pattern by selectively lighting the light emitting devices. Light emitting display unit,
In the light-entering portion where the metal foil on the substrate surface has been removed in the reflective portion near the light emitting element mounting position of the multilayer substrate, the stabilization processing surface is on the front side of the substrate so that the penetrating light is not absorbed by the dark stabilization processing layer. The metal foil facing toward the substrate is completely removed, and the light-entering portion is so set that the intruding light passing through the removed portion is reflected by the metal foil located on the back side of the substrate from the removed metal foil.
Of any metal foil located below the removed part
It is covered.

【0016】[0016]

【実施例】以下、図面を参照して本発明の実施例を説明
する。図3に本発明の1実施例を示す。図中の符号は、
図1の従来例に付した符号に対応している。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 3 shows one embodiment of the present invention. The symbols in the figure are
This corresponds to the reference numeral given to the conventional example in FIG.

【0017】本発光表示ユニットは、図1に示した従来
の発光表示ユニットとは4層基板Aの反射部分Xにおけ
る光侵入部分xの構造が相違している。本発光表示ユニ
ットにおける4層基板Aの光侵入部分xは、2層目の銅
箔22aがなく、3層目の銅箔22bにて光侵入部分x
を覆った構造になっている。
The present light emitting display unit is different from the conventional light emitting display unit shown in FIG. 1 in the structure of the light penetration part x in the reflection part X of the four-layer substrate A. The light penetration portion x of the four-layer substrate A in the present light emitting display unit does not have the second layer copper foil 22a, and the light penetration portion x is formed by the third layer copper foil 22b.
It is structured to cover.

【0018】2層目の銅箔22aの表面には黒色処理等
により暗色の安定化処理層23aが形成されている。こ
の安定化処理層23aは4層基板Aの表側を向くが、光
侵入部分xにはこの安定化処理層23aがないので、光
侵入部分xに侵入した光は安定化処理層23aのところ
を通過して2枚目の樹脂板21に侵入し、該樹脂板21
を通過する。
A dark stabilizing layer 23a is formed on the surface of the second layer of copper foil 22a by blackening or the like. The stabilizing layer 23a faces the front side of the four-layer substrate A, but the light penetrating portion x does not have the stabilizing layer 23a. Passes through the second resin plate 21 and enters the second resin plate 21.
Pass through.

【0019】樹脂板21を通過した光は、光侵入部分x
を覆う3層目の銅箔22bの裏面にあたる。銅箔22b
の表面に形成された暗色の安定化処理層23aは、4層
基板Aの裏側を向き、光が当たる銅箔22bの裏面に
は、暗色の安定化処理層23aがなく、金属面が露出し
ている。従って、樹脂板21を通過した光は、銅箔22
bの金属面に反射される。
The light that has passed through the resin plate 21 is reflected by a light entrance portion x
On the back surface of the third-layer copper foil 22b that covers the third layer. Copper foil 22b
The dark stabilization layer 23a formed on the surface of the substrate faces the back side of the four-layer substrate A, and there is no dark stabilization layer 23a on the back surface of the copper foil 22b to which light is applied, and the metal surface is exposed. ing. Therefore, the light that has passed through the resin plate 21
b is reflected on the metal surface.

【0020】かくして、反射部分Xの光侵入部分xに侵
入した光は、銅箔22a,22bの表面に形成された暗
色の安定化処理層23a,23bに吸収されることな
く、銅箔22bの金属面により効率良く反射される。
Thus, the light that has entered the light-entering portion x of the reflecting portion X is not absorbed by the dark stabilizing layers 23a and 23b formed on the surfaces of the copper foils 22a and 22b, and the light of the copper foil 22b is not absorbed. It is efficiently reflected by the metal surface.

【0021】上記実施例においては、樹脂板21を通過
した光を3層目の銅箔22bの裏面に反射させるが、図
4に示すように3層目の銅箔22bに抜けがあってもよ
く、その場合は銅箔22bの抜けを4層目の銅箔23に
よりカバーする。
In the above embodiment, the light passing through the resin plate 21 is reflected on the back surface of the third copper foil 22b. However, as shown in FIG. In this case, the copper foil 22b is covered with the copper foil 23 of the fourth layer.

【0022】図5に本考案の他の実施例を示す。本発光
表示ユニットは6層基板Dを使用している。6層基板D
においては、5枚の単位基板10〜50が重合され、5
枚の樹脂板11〜51を介して6層の銅箔12,22,
32a,32b,42,52が積層されている。
FIG. 5 shows another embodiment of the present invention. The present light emitting display unit uses a six-layer substrate D. 6-layer board D
In the above, five unit substrates 10 to 50 are polymerized,
6 layers of copper foils 12, 22,.
32a, 32b, 42, and 52 are stacked.

【0023】中間層の銅箔22,32a,32b,42
の表面には、暗色の安定化処理層23,33a,33
b,43が形成されている。安定化処理層23,33
a,33b,43のうち23,33aは6層基板Dの表
側を向き、33b,43は6層基板Dの表側を向いてい
る。
Copper foils 22, 32a, 32b, 42 of the intermediate layer
Are provided with dark stabilization layers 23, 33a, 33
b, 43 are formed. Stabilization layers 23, 33
a, 33b, 43, 23, 33a face the front side of the six-layer substrate D, and 33b, 43 face the front side of the six-layer substrate D.

【0024】反射部分Xの光侵入部分xにおいては、安
定化処理層に光が吸収されるのを防ぐために、安定化処
理層が6層基板Dの表側を向いた銅箔22,32aを除
去し、これらを通過した光を、安定化処理層が形成され
ていない4層目の銅箔32bの裏面に反射させる。
At the light entrance portion x of the reflection portion X, the copper foils 22 and 32a whose stabilization treatment layers face the front side of the six-layer substrate D are removed in order to prevent light from being absorbed by the stabilization treatment layers. Then, the light passing therethrough is reflected on the back surface of the fourth copper foil 32b on which the stabilization processing layer is not formed.

【0025】銅箔22,32aを通過した光は4〜6層
目の銅箔32b,42,52のいずれに反射させてもよ
い。要は、銅箔22,32aを除去した部分を通過した
光が6層基板Dの裏側に抜けないようにすればよい。
Light that has passed through the copper foils 22, 32a may be reflected by any of the fourth to sixth copper foil layers 32b, 42, 52. The point is that it is only necessary to prevent light that has passed through the portions from which the copper foils 22 and 32a have been removed from leaking to the back side of the six-layer substrate D.

【0026】なお本発明は4層以上の基板を使用する発
光表示ユニットに全て適用できる。その発光素子はLE
D素子に限らない。また、金属箔は銅箔に限らず、安定
化処理についても黒色処理以外の処理を適用できる。
The present invention can be applied to all light emitting display units using four or more layers of substrates. The light emitting element is LE
It is not limited to the D element. Further, the metal foil is not limited to the copper foil, and a stabilization process other than the black process can be applied.

【0027】[0027]

【発明の効果】以上に説明した通り、本発明にかかる発
光表示ユニットは、多層基板の反射部分の中の光侵入部
分において、侵入光が暗色の安定化処理層に吸収されな
いように、安定化処理面が基板表側を向く金属箔を全面
的に除去し、且つその除去部分を通過した侵入光を前記
金属箔より基板裏側に位置する金属箔の金属面に反射さ
せるようにしたので、金属箔表面に暗色の安定化処理層
を形成した多層基板を使用するにもかかわらず、優れた
前面取り出し効率を示す。また本発明は銅箔のパターン
設計の際に光侵入部分における光の通過・反射を考慮す
れば実施でき、実施が容易である。
As described above, in the light emitting display unit according to the present invention, the stabilizing process is performed so that the invading light is not absorbed by the dark stabilization processing layer at the light entering portion in the reflection portion of the multilayer substrate. Since the metal foil whose processing surface faces the front side of the substrate is completely removed, and the penetrating light passing through the removed portion is reflected on the metal surface of the metal foil located on the back side of the substrate from the metal foil, the metal foil Despite the use of a multilayer substrate having a dark stabilizing layer formed on the surface, it exhibits excellent front extraction efficiency. In addition, the present invention can be practiced by considering the passage and reflection of light at the light-entering portion when designing the pattern of the copper foil, and is easy to implement.

【図面の簡単な説明】[Brief description of the drawings]

【図1】従来の発光表示ユニットを示す断面図である。FIG. 1 is a cross-sectional view illustrating a conventional light emitting display unit.

【図2】銅反射面の反射率スペクトルを示すグラフであ
る。
FIG. 2 is a graph showing a reflectance spectrum of a copper reflecting surface.

【図3】本発明の発光表示ユニットの構成例を示す断面
図である。
FIG. 3 is a cross-sectional view illustrating a configuration example of a light emitting display unit of the present invention.

【図4】本発明の発光表示ユニットの他の構成を示す断
面図である。
FIG. 4 is a sectional view showing another configuration of the light emitting display unit of the present invention.

【図5】本発明の発光表示ユニットの他の構成を示す断
面図である。
FIG. 5 is a sectional view showing another configuration of the light emitting display unit of the present invention.

【符号の説明】[Explanation of symbols]

A 4層基板 B ハウジング C LED素子 D 6層基板 10〜50 基礎基板 11〜51 樹脂板 12〜62 銅箔 23〜53 安定化処理層 X 反射部分 x 光侵入部分 A Four-layer board B Housing C LED element D Six-layer board 10-50 Basic board 11-51 Resin plate 12-62 Copper foil 23-53 Stabilization treatment layer X Reflection part x Light penetration part

フロントページの続き (58)調査した分野(Int.Cl.7,DB名) G09F 9/33 G09F 13/20 H01L 33/00 Continuation of the front page (58) Field surveyed (Int.Cl. 7 , DB name) G09F 9/33 G09F 13/20 H01L 33/00

Claims (5)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 所定パターンの金属箔が透光性の樹脂板
を介して4層以上に積層され、中間層の金属箔表面に物
質的に安定な暗色の化合物を形成する安定化処理が施さ
れた多層基板上に、複数個の発光素子を規則的に搭載配
列し、該発光素子を選択的に点灯させることにより文字
等をドットパターン表示する発光表示ユニットにおい
て、 多層基板の発光素子搭載位置近傍の反射部分の中の基板
表面の金属箔が除去された光侵入部分において、侵入光
が暗色の安定化処理層に吸収されないように、安定化処
理面が基板表側を向く金属箔を全面的に除去し、その除
去部分を通過した侵入光が除去された金属箔より基板裏
側に位置する金属箔に反射されるように、光侵入部分
は、除去部分より下層に位置するいずれかの金属箔によ
って覆われていることを特徴とする発光表示ユニット。
1. A metal foil having a predetermined pattern is laminated in four or more layers via a light-transmitting resin plate, and a stabilization treatment for forming a physically stable dark compound on the surface of the metal foil of the intermediate layer is performed. A plurality of light emitting elements are regularly mounted and arranged on the formed multilayer substrate, and the light emitting elements are selectively lit to display a character or the like in a dot pattern. At the light-entering part where the metal foil on the substrate surface has been removed in the nearby reflective part, the metal foil whose stabilization surface faces the front side of the substrate is entirely covered so that the penetrating light is not absorbed by the dark stabilization layer. as reflected in the metal foil is removed, positioned on the substrate backside of a metal foil which penetrate light is removed which has passed through the removed portion, the light entering portion
Of any metal foil located below the removed part
A light-emitting display unit characterized by being covered with a light-emitting device.
【請求項2】 前記発光素子がLEDであることを特徴
とする請求項1に記載の発光表示ユニット。
2. The light emitting display unit according to claim 1, wherein the light emitting element is an LED.
【請求項3】 前記安定化処理が黒色処理であることを
特徴とする請求項1又は2に記載の発光表示ユニット。
3. The light emitting display unit according to claim 1, wherein the stabilization processing is black processing.
【請求項4】 前記金属箔が銅箔であることを特徴とす
る請求項1〜3のいずれかに記載の発光表示ユニット。
4. The light emitting display unit according to claim 1, wherein said metal foil is a copper foil.
【請求項5】 前記基板表面の金属箔表面に金メッキが
施されていることを特徴とする請求項1〜4のいずれか
に記載の発光表示ユニット。
5. The light emitting display unit according to claim 1, wherein a gold plating is applied to a surface of the metal foil on the surface of the substrate.
JP1801993A 1993-01-07 1993-01-07 Light-emitting display unit Expired - Lifetime JP3186294B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1801993A JP3186294B2 (en) 1993-01-07 1993-01-07 Light-emitting display unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1801993A JP3186294B2 (en) 1993-01-07 1993-01-07 Light-emitting display unit

Publications (2)

Publication Number Publication Date
JPH06202568A JPH06202568A (en) 1994-07-22
JP3186294B2 true JP3186294B2 (en) 2001-07-11

Family

ID=11959961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1801993A Expired - Lifetime JP3186294B2 (en) 1993-01-07 1993-01-07 Light-emitting display unit

Country Status (1)

Country Link
JP (1) JP3186294B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2491589C1 (en) * 2009-08-20 2013-08-27 Шарп Кабусики Кайся Display device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5040951B2 (en) 2009-03-31 2012-10-03 マツダ株式会社 Direct injection engine control method and direct injection engine

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5040951B2 (en) 2009-03-31 2012-10-03 マツダ株式会社 Direct injection engine control method and direct injection engine

Also Published As

Publication number Publication date
JPH06202568A (en) 1994-07-22

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