JP3187922B2 - Connector for solid-state imaging device and mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[Table of Contents] The present invention will be described in the following order. Industrial Application Conventional Technology (FIG. 6) Problems to be Solved by the Invention (FIG. 6) Means for Solving the Problems (FIGS. 1 to 3) Function (FIGS. 1 to 3) Example (1) Configuration of Embodiment (FIGS. 1 to 3) (2) Effects of Embodiment (3) Other Embodiments (FIGS. 4 and 5) Effects of the Invention

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector for a solid-state image pickup device and a mounting method, and can be applied to an image pickup apparatus such as a video tape recorder integrated with a camera.

[0003]

2. Description of the Related Art Conventionally, in an image pickup apparatus such as a video tape recorder integrated with a camera, a video signal is generated using a solid-state image pickup device.

That is, as shown in FIG. 6, in the conventional image pickup apparatus 1, a multilayer wiring board 2 is used so that the mounting density can be improved. 4 is implemented. At this time, the imaging apparatus 1 inserts a predetermined sheet metal 6 between the multilayer wiring board 2 and the solid-state imaging device 4, and mounts an optical low-pass filter 8 using the sheet metal 6.

That is, the imaging device 1 is held from the upper surface of the solid-state imaging device 4 so as to cover the entire solid-state imaging device 4 with a rubber cover 10, and by utilizing the elasticity of the cover 10,
An optical low-pass filter 8 is held in front of the imaging surface of the solid-state imaging device 4. Further, in the imaging device 1, the cover 14 is arranged so as to entirely cover the cover 10 from above, and the cover 14 is screwed to the sheet metal 6 using the screws 14.

Accordingly, the image pickup apparatus 1 is configured to assemble the solid-state image pickup device 4 integrally with peripheral related components and then attach the solid-state image pickup device 4 to a lens system. At this time, the solid-state imaging device 4 is entirely covered with the multilayer wiring board 2, the metal plate 6, the optical low-pass filter 8 and the cover 10, so that intrusion of dust and the like from the outside can be prevented. It has been done.

[0007]

When the solid-state imaging device 4 is mounted on the multilayer wiring board 2 using the through-holes as described above, the amount of the through-hole formed in the multilayer wiring board 2 corresponds to that of the multilayer wiring board 2. Mounting density is reduced. Further, the multilayer wiring board 2 has a feature that it is difficult to avoid distortion when drilling a through hole, and it is difficult to select the pattern width and the interval to be small values accordingly.

For this reason, in the image pickup apparatus, there is a problem that the miniaturization of the peripheral device of the solid-state image pickup device is still insufficient even though the multilayer wiring board 2 is employed. That is, in the imaging device, if the multilayer wiring board can be reduced in size and the peripheral components of the solid-state imaging device can be reduced, the overall shape can be further reduced.

On the other hand, there is a problem that not only dust and the like entering from outside, but also dust from the multilayer wiring board 2, and such dust enters the imaging surface.

The present invention has been made in view of the above points, and an object of the present invention is to propose a connector and a mounting method of a solid-state imaging device which can solve these problems at once.

[0011]

According to a first aspect of the present invention, a solid-state imaging device is fixed on a positioning board for positioning with respect to an optical system, and is then surface-mounted on a wiring board. The solid-state imaging device 4 and the positioning board 28 are housed integrally in the connector 26.

Further, in the second invention, the optical system 22
After the solid-state imaging device 4 is fixed to the positioning substrate 28 for positioning with respect to the solid-state imaging device 4, the solid-state imaging device 4 and the positioning substrate 28 are integrally housed in the connector 26 surface-mounted on the wiring board 24, and the solid-state imaging device 4 is To fix the solid-state imaging device 4 to the optical system 22, the solid-state image sensor 4 is fixed to the optical system 22 by inserting a positioning projection 22 </ b> A provided on the lens barrel of the optical system 22 into a positioning hole 28 </ b> A provided on the positioning substrate 28. Perform positioning.

In the third aspect of the present invention, the terminal 4A of the solid-state imaging device 4 is connected to the wiring substrate 24 in the connector 26 of the solid-state imaging device 4 mounted on the predetermined wiring board 24 and holding the solid-state imaging device 4. And a case 29 that holds the terminal 4A. The case 29 includes side plates 29A and 29B that surround the periphery of the side surface of the solid-state imaging device 4.
And a bottom plate 27 connecting the side plates 29A and 29B,
The side plates 29A and 29B are formed by a pair of opposed side plate 29A of the terminal holding portion and a pair of holding side plates 29B formed between the side plates 29A of the terminal holding portion.
A groove 2 which is located substantially at the center and connects between the holding side plates 29B.
6B, the side plate 29 of the terminal holding portion is formed.
The shape between A is formed stepwise by the groove 26B, and when the solid-state imaging device 4 is inserted, the bottom surface of the solid-state imaging device 4 is pressed against the stepped portion 27A to hold the solid-state imaging device 4 at a predetermined position. A pair of holding side plates 29B has a rectangular notch formed in an extension of the groove 26B,
And the notch allows the solid-state imaging device 4 to be held at a predetermined position through a predetermined plate-shaped member 28, and the side plate 29A of the terminal holding portion aligns and holds the terminal 26A on the inner wall side. The terminal 26A is a side plate 29A of a terminal holding portion.
After extending from the bottom plate 27 and extending through the bottom plate 27, the base plate 27 is extended in parallel with the bottom plate 27.

[0014]

The connector 26 is mounted on the surface of the wiring board 24.
If the solid-state imaging device 4 and the positioning board 28 are housed integrally by using, the mounting density of the wiring board 24 can be improved accordingly.

Further, if the positioning substrate 28 is positioned by inserting the positioning projections 22A into the positioning holes 28A, and the solid-state imaging device 4 is fixed to the optical system 22, the positioning is easily performed and the solid-state imaging device 4 is held. And can prevent dust from entering if necessary.

When the solid-state image pickup device 4 is inserted, the bottom surface of the solid-state image pickup device 4 is pressed against the stepped portion 27A so that the solid-state image pickup device 4 can be held at a predetermined position. A notch is formed in a rectangular shape on the bottom plate 2
7, the solid-state imaging device 4 can be held at a predetermined position by interposing a predetermined plate-shaped member 28 by the notch of this rectangular shape, and positioning can be performed using the plate-shaped member 28. In addition, the solid-state imaging device 4 can be easily held.

[0017]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.

(1) Configuration of the Embodiment In FIG. 1 in which the same reference numerals are assigned to corresponding parts to FIG. 6, reference numeral 20 denotes an image pickup apparatus as a whole. In this embodiment, peripheral components of the solid-state image pickup device 4 To the lens barrel 22 at the rear of the lens.

That is, in the image pickup apparatus 20, the connector 26 is surface-mounted on the multilayer wiring board 24, and the solid-state image pickup device 4 is mounted using the connector 26. At this time, in the imaging device 20, first, the solid-state imaging device 4 is fixed to the rear lens barrel 22, and then the solid-state imaging device 4 is inserted into the connector 26.

That is, in the imaging device 20, first, the solid-state imaging device 4 is bonded to the positioning substrate 28. Here, the positioning substrate 28 is a front H-shaped aluminum plate material, and the bottom surface of the solid-state imaging device 4 is bonded so as to straddle the central horizontal plate portion.

Further, the positioning substrate 28 has through holes 2 at four corners.
8A, and the solid-state imaging device 20 positions the solid-state imaging device 4 using the through-hole 28A. That is, the lens barrel 2
2, a projection 22A and a screw hole 22B are formed corresponding to the through hole 28A. In the image pickup device 20, the projection 22A is inserted into the through hole 28A to position the solid-state imaging device 4 with respect to the optical system. After that, the remaining holes 2
The solid state imaging device 4 is solidified by screwing the screw 30 into the screw hole 22B through the hole 8A.

After the solid-state image pickup device 4 is bonded to the positioning substrate 28 in advance, the assembling is performed using the positioning substrate 28, so that the assembling work can be automated using the positioning substrate 28. Assembly work can be simplified. Further protrusion 2
Since the positioning can be performed by using the 2A and the through hole 28A, the solid-state imaging device 4 can be positioned by a simple positioning operation, and the entire assembling operation can be simplified accordingly.

Further, in the imaging device 20, the lens barrel 22
The solid-state imaging device 4 is fixed to the lens barrel 22 by sequentially inserting an optical low-pass filter 8 and a cylindrical rubber sealing member 32 between the solid-state imaging device 4 and the solid-state imaging device 4. The sealing member 32 is pressed by the optical low-pass filter 8 to form a closed space. Thereby, in the imaging device 20,
With a simple configuration in which only the sealing member 32 is inserted between the solid-state imaging device 4 and the optical low-pass filter 8, dust generated from the multilayer wiring board 24 enters between the solid-state imaging device 4 and the optical low-pass filter 8. Not to be done.

Thus, when the solid-state imaging device 4 is fixed to the lens barrel 22, the optical low-pass filter 8 and the sealing member 3 are simply used.
The dust can be prevented from entering by a simple assembling operation only by inserting the second member 2, and the entire assembling operation can be simplified accordingly. At this time, it is possible to prevent dust from entering simply by using the rubber sealing member 32 having a cylindrical shape, so that the overall configuration can be simplified and reduced in size.

After the solid-state imaging device 4 is assembled in the lens barrel 22 in this manner, in the imaging device 20, the solid-state imaging device 4 is inserted into the connector 26. Here, FIGS. 2 and 3
As shown in FIG. 2, the connector 26 has side plates 29A and 29B formed so as to surround the solid-state imaging device 4 from the periphery, and connects the side plates 29A and 29B with a bottom plate 27.

A groove 26B is formed at the center of the bottom plate 27,
In the side plate 29B, a rectangular notch is formed in an extension of the groove 26B. The connector 26 has a terminal 26A disposed on a side plate 29A orthogonal to the side plate 29B, thereby forming a bottom plate 26B in a stepwise manner from the side plate 29A side. When the solid-state imaging device 4 is inserted integrally with the positioning board 28, The bottom surface of the image pickup device 4 abuts on the step-like portion 27A, and in this state, the solid-state image pickup device 4 can be held at a predetermined holding position.

At this time, the connector 26 is
The heights of the side plates 29A and 29B are selected so that the upper end surfaces of the A and 29B and the upper surface of the solid-state imaging device 4 are substantially coincident with each other, so that it is easily confirmed whether or not the solid-state imaging device 4 is securely inserted. It is made to be able to do. Further, by prolonging the side plates 29A and 29B as described above, the stroke when inserting the solid-state imaging device 4 can be selected to be long as shown by an arrow a, and the solid-state imaging device 4 can be reliably inserted and after the insertion. Can be stably held.

On the other hand, the side plate 29A arranges the terminals 26A on the inner wall surface, thereby connecting the lead terminals 4A of the solid-state imaging device 4 to the multilayer wiring board 24. Here, after the terminal 26A rises upward on the inner wall surface of the side plate 29A, it is bent at an angle close to 180 degrees and falls downward to contact the lead terminal 4A. Further, after the terminal 26A comes into contact with the lead terminal 4A, it penetrates the bottom plate 27, where it is bent at substantially a right angle,
It is made to extend around.

As a result, the terminal 26A is connected to the lead terminal 4A.
Of the lead terminal 4A can be effectively avoided even when the solid-state imaging device 4 is inserted, and a high dimensional accuracy is maintained and stable. It is designed to ensure contact. Furthermore, the terminal 26A can make contact with the lead terminal 4A in a wide range, and the entire spring length can be selected to be large, so that a stable contact can be secured accordingly.

Further, since the solid-state image pickup device 4 can be held so as to surround the solid-state image pickup device 4 from the periphery in this manner, in addition to the conventional lead frame type solid-state image pickup device 4, a surface-mount type solid-state image pickup device 4B without a lead frame is also provided. The connector 26 can be inserted and held, and the usability of the connector 26 can be improved accordingly. Furthermore, by forming the tip of the terminal 26A so as to extend to the periphery, the connector 26 is surface-mounted on the multilayer wiring board 24. In this case, in the multilayer wiring board 24, since other electronic components can be mounted using the back side of the mounting surface of the solid-state imaging device 4, the mounting density can be improved accordingly.

Further, since the through holes need not be formed, the wiring patterns can be formed at a high density, and the wiring patterns themselves can be selected to be narrow. Accordingly, the multilayer wiring board 24
In, the overall shape can be reduced as compared to the related art, and the overall shape of the imaging device 20 can also be reduced. Thus, in the multilayer wiring board 24, after inserting the solid-state imaging device 4 into the connector 26,
4A, the screw 34 is screwed to the lens barrel 22. Thus, in the imaging device 20, the assembly of the solid-state imaging device 4 is completed.

(2) Effects of Embodiment According to the above configuration, after the solid-state imaging device is adhered to the positioning board, it is housed integrally in the connector mounted on the surface, thereby improving the mounting density of the multilayer wiring board. As a result, the size of the multilayer wiring board can be reduced accordingly.

At this time, the solid-state image pickup device is preliminarily held in the lens barrel by using the positioning substrate, and then housed in the connector, thereby preventing dust from entering beforehand and assembling the solid-state image pickup device with a simple structure. Therefore, the overall configuration can be reduced and simplified accordingly.

(3) Other Embodiments In the above-described embodiments, the case where the solid-state imaging device is inserted into the frame-shaped connector has been described. However, the present invention is not limited to this, and as shown in FIGS. Alternatively, the terminal 40A may be moved and pressed from the side. That is, in the connector 40, the whole is opened and closed in two parts. When the solid-state imaging device 4 is pressed against a portion corresponding to the bottom plate and pressed, the case 42 is closed, and the terminal 40A contacts the lead terminal 4A. It has been made to be. Even if the connector is configured in this manner, the same effect as in the above-described embodiment can be obtained, and the case can be opened and closed, so that the bending of the lead terminal 4A can be further effectively avoided.

Further, in the above-described embodiment, the case of sealing with the cylindrical sealing member 32 has been described. However, the present invention is not limited to this, and various shapes such as a ring shape and a frame shape are used. The stop member can be widely applied.

Further, in the above-described embodiment, the case where the solid-state image pickup device is first fixed to the lens barrel and then inserted into the connector has been described. However, the present invention is not limited to this. It may be fixed.

Further, in the above-described embodiment, the case where the connector is used in common with the surface mount type solid-state imaging device has been described. However, the present invention is not limited to this. Can be widely applied.

[0038]

As described above, according to the present invention, after the solid-state imaging device is fixed to the positioning board, it is housed integrally in the connector mounted on the surface. The positioning can be performed, the overall configuration can be simplified accordingly, the mounting density of the wiring board can be improved, and the overall shape can be reduced in size. Further, the ingress of dust can be prevented beforehand by using a predetermined sealing member. Further, by forming the positioning board and the solid-state imaging device so as to be integrally housed in the connector, the assembling work and the overall configuration can be simplified accordingly.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view illustrating an imaging apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing the periphery of the connector.

FIG. 3 is a plan view showing the connector with a partial cross section.

FIG. 4 is a sectional view showing a connector according to another embodiment.

FIG. 5 is a cross-sectional view showing the mounting state.

FIG. 6 is a perspective view showing a conventional imaging device.

[Explanation of symbols]

1, 20... Imaging device, 2, 24... Multilayer wiring board, 4
…… Solid-state imaging device, 8 …… Optical low-pass filter, 2
2 ... lens barrel, 26, 40 ... connector, 28 ... positioning board, 32 ... sealing member.

────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Kunio Nakatani Okado Todocho, Kyoto, Kyoto City, Omron Co., Ltd. (56) References JP-A-62-163473 (JP, A) JP-A-59-171462 (JP, U) JP-A-3-67457 (JP, U) (58) Fields investigated (Int) .Cl. ⁷ , DB name) H01L 27/14 H04N 5/335

Claims (3)

(57) [Claims] 1. A solid-state imaging device is fixed to a positioning substrate for positioning with respect to an optical system, and then the solid-state imaging device and the positioning substrate are integrally housed in a connector surface-mounted on a wiring board. Mounting method of a solid-state imaging device. 2. A solid-state imaging device is fixed to a positioning substrate for positioning with respect to an optical system. Then, the solid-state imaging device and the positioning substrate are integrally housed in a connector surface-mounted on a wiring board, and An image sensor is fixed to the optical system. To fix the solid-state image sensor to the optical system, a positioning projection provided on a barrel of the optical system is inserted into a positioning hole provided on the positioning substrate. A method for mounting a solid-state imaging device, characterized in that the positioning is performed by: 3. A connector for a solid-state imaging device mounted on a predetermined wiring board and holding a solid-state imaging device, comprising: a terminal for connecting a terminal of the solid-state imaging device to the wiring board; and a case for holding the terminal. The case is formed of a side plate surrounding a side surface of the solid-state imaging device, and a bottom plate connecting the side plates, wherein the side plate is a pair of opposing side plates of a terminal holding portion, and the terminal holding portion. And a pair of holding side plates formed between the side plates. The bottom plate is formed at a substantially central portion and a groove connecting the holding side plates is formed. Is formed in a step-like shape by the groove, and when the solid-state imaging device is inserted, the bottom surface of the solid-state imaging device is pressed against the step-like portion to hold the solid-state imaging device in a predetermined position, The above one set In the holding side plate, a notch is formed in a rectangular shape at an extension of the groove, and the groove and the notch can hold the solid-state imaging device at the predetermined position by inserting a predetermined plate-shaped member. The side plate of the terminal holding portion aligns and holds the terminal on the inner wall side, and the terminal extends from the side plate of the terminal holding portion, penetrates the bottom plate, and is parallel to the bottom plate. A connector for a solid-state imaging device, which is extended.