JP3198773B2 - Semiconductor pressure detector and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a so-called seal diaphragm type semiconductor pressure detector in which a liquid such as insulating oil is sealed in a pressure detection chamber sealed with a seal diaphragm.

[0002]

2. Description of the Related Art Conventionally, in a seal diaphragm type semiconductor pressure sensor, pressure is applied in a direction in which a pressure-sensitive element is pressed from a gauge surface to a pedestal. It can be used in places where the environment is bad because it has a part. Therefore, there is a high demand especially for automobiles.

The applicant of the present invention has already applied for a semiconductor pressure detector of this type shown in FIG. 11 in Japanese Patent Application No. 5-183838. In FIG. 11, a pressure detection chamber 31 in which a semiconductor pressure sensor element 30 is housed includes an element mounting board 32, a fixed base 33 mounted on the element mounting board 32, and a seal diaphragm 34 mounted on the fixed base 33. The sensor unit 35 having such a liquid seal structure is housed in a main body housing 37 in which a pressure introducing hole 36 is formed. And
A connector housing 39 provided with a terminal 38 is caulked to the main body housing 37 and an O-ring 40
a and 40b are hermetically sealed. Further, a lead 42 is inserted into the through hole 41 of the element mounting base 32, and hermetically sealed with components such as glass 43.
The lead 4 is provided in a location different from the pressure detection chamber 31, that is, in a so-called circuit chamber.
2 and the terminal 38 are electrically connected by a flexible conductor 44. Then, the lead 42 and the element mounting board 32
A capacitor 45 is provided on the side of the connector housing 39 between them.

[0006] Reference numeral 46 denotes a sealing hole for sealing a sealing liquid 47, which is sealed by press-fitting or welding a metal sealing ball 48 after the sealing is completed.

[0005]

As a result of further intensive studies on the semiconductor pressure detector having the above-mentioned structure, the present inventors have found that further improvements are necessary in the following points. That is, an airtight portion is required between the periphery of the hermetic seal portion, the sensor unit, and the housing, and an airtight member such as an adhesive, a full circumference weld, an O-ring, or the like is used for airtight sealing. As a result, an increase in the number of components due to the hermetic members and an increase in cost corresponding thereto, an increase in the number of hermetic steps in the manufacturing process, and a decrease in the withstand voltage reliability due to an increase in hermetic parts are inevitable.

Further, when the detector is used in a severe environment such as an automobile, it is necessary to maintain the reliability of the detector by hermetically isolating bonding wires and leads for exchanging electric signals from the outside world. Since it has two chambers, the pressure detection chamber and the circuit chamber, the structure becomes complicated, and it becomes difficult to airtight each other, which is a factor of reducing reliability.

As described above, the liquid sealing structure is complicated, and the use of the conventional semiconductor pressure detector is greatly restricted.
Therefore, the present invention has been made in view of the above problems, and provides a semiconductor pressure detector having a liquid-tight structure of only one chamber without providing a hermetic part of two chambers of a pressure detection chamber and a circuit chamber. As a first object.

It is a second object of the present invention to perform airtight sealing in a single chamber.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has a housing having a pressure detecting chamber for hermetically sealing a pressure transmitting medium, and a pressure sensitive sensor for outputting a signal corresponding to pressure. An element, a processing circuit electrically connected to and cooperating with the pressure-sensitive element, and signal transmission means for transmitting and receiving signals between the pressure-sensitive element and the outside via the processing circuit. A pressure element and the processing circuit are provided in the pressure detection chamber,
The signal transmission means electrically connected to the pressure-sensitive element and the processing circuit is held inside the housing to transmit and receive signals between the pressure-sensitive element and the outside. is there.

Further, the signal transmission means includes an adjustment signal transmission means for supplying an adjustment signal from outside to the pressure-sensitive element via the processing circuit so that the pressure-sensitive element outputs desired characteristics. Power transmission means for operating the pressure element;
Output signal transmission means for supplying an output signal from the pressure-sensitive element to the outside via the processing circuit. The adjusting signal transmitting means, the power transmitting means, and the output are arranged such that respective ends of the adjusting signal transmitting means, the power transmitting means, and the output signal transmitting means are opened in the pressure detecting chamber of the housing. The signal transmission means is held inside the housing, and an airtight member is inserted into a predetermined portion of the pressure detection chamber which is opened at each end to hermetically seal.

In addition, a seal diaphragm is provided at one end of the pressure introducing hole of the second housing, and an electric connection between the pressure-sensitive element and the outside is adjusted through the processing circuit by using a bonding wire. A groove having a taper in a concave portion of the first housing in which each end of the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission terminal is formed at the transmission terminal, the power transmission terminal, and the output signal transmission terminal. The adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission terminal are each provided with a bending point in the first housing, and the groove bottom surface is opened at each of the minus ends. From 0.5 mm to 3 mm, and the surface of the second housing having the seal diaphragm and the surface of the first housing having the recess are combined. As well as sealing, the pressure transmission medium sealed from the sealed holes provided in said first housing, to hermetically seal the encapsulating in hole by a sealing means by inserting the elastic member to the encapsulant in hole.

Each of the other ends of the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission terminal is opened in a concave portion on the fitting side of the first housing to be fitted with an external connector. Then, technical means relating to the manufacturing method of each part having the above configuration is adopted. Further, the pressure-sensitive element may be a processing circuit-body type pressure-sensitive element in which the processing circuit is integrated in the pressure-sensitive element.

[0013]

According to the present invention, external pressure is transmitted to the pressure-sensitive element provided in the pressure detection chamber via the pressure transmission medium. Then, the pressure-sensitive element outputs an electric signal corresponding to the transmitted pressure. This output signal is processed by the processing circuit and output to the outside via the signal transmission means.

Further, an external adjustment signal is supplied to the pressure-sensitive element via a processing circuit via a signal transmission means, and the pressure-sensitive element is electrically adjusted so as to output a desired characteristic.

[0015]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG. 1 is a cross-sectional view showing an overall outline of a semiconductor pressure detector of the present invention. A slidable thin metal sealing diaphragm 7 is hermetically joined to a metal main body housing 3 (second housing) together with a metal pressing member 14 at one end of a pressure introducing hole 3b to be described later by laser welding or the like. I have. However, the holding member 14 used in the present embodiment is not always necessary, and even without such a holding member 14, airtight joining at this portion is sufficiently possible. (First Step) A connector housing 1 (first housing) made of resin is provided with pins 2a and 2b which are insert-molded and molded so as to be held inside. At this time, the pins 2a, 2b
Are formed so that each of the ends protrudes, and a groove for accommodating an airtight member 11 to be described later is simultaneously formed around the opened portion.
The groove has a taper 20 described later. (Second Step) Although only one pin 2a is shown in the figure, there are a plurality of pins 2a, which are a power transmission terminal and an output signal transmission terminal used for exchanging signals when the semiconductor pressure detector is used. , For power supply, for grounding, for output, for adjustment, and the like. The negative pin 2b is an adjustment signal transmission terminal used exclusively for the adjustment terminal so that the semiconductor pressure detector has a desired output characteristic by electric writing or the like. The pin 2a in the semiconductor pressure detector according to the present embodiment actually manufactured by the present inventors is three pins, which are a 5V voltage supply terminal, an output terminal of the sensor, and a ground terminal, and the pin 2b is one pin and an adjustment terminal. For the actual adjustment, a total of four pins 2a and 2b were used.

Usually, such an adjustment terminal is located outside the connector housing 1 and hermetically sealed with an adhesive or the like in order to prevent a malfunction or a change in characteristics of the semiconductor pressure detector.
On the other hand, in the present embodiment, as shown in the drawing, the pins 2b, which are the adjustment terminals, are provided in the connector housing 1, and each of the ends is opened in a pressure detection chamber in the connector housing 1 to be described later. Is electrically connected to the pressure-sensitive element 5 by the bonding wire 12 through the processing circuit of FIG.
On the other hand, each other end is opened so as to protrude into a concave portion on the fitting side for fitting with an external connector (not shown), and is electrically connected to an external circuit (not shown).

Although only one pin 2b is shown in this embodiment, there may be a plurality of pins 2b on the processing circuit. Further, in this embodiment, different pins 2a and 2b are used for transmitting and receiving signals between the pressure-sensitive element 5 and the outside. Element 5
And a signal transmitting means for transmitting and receiving a signal by electrically connecting the external circuit (not shown) with the external circuit.

The interface between the pin 2a and the pin 2b and the connector housing 1 in a recess (described later) of the connector housing 1 in which the semiconductor pressure-sensitive element 5 is provided, and the pins 2a and 2b
The groove of the concave portion of the peripheral portion opened at each end of 2b in the pressure detection chamber is hermetically sealed with an airtight member 11 such as a sealant (adhesive) such as silicone. Here, in order to improve the airtight reliability against the temperature change, a filler (not shown) having a lower thermal expansion coefficient than the airtight member 11 is mixed into the airtight member 11 or a filler having a lower thermal expansion coefficient than the airtight member 11. By inserting a low insertion member 19, for example, a ring-shaped metal, the pin
The difference in the coefficient of thermal expansion between a and b is small. In this embodiment, a metal ring is inserted at a predetermined position of the pins 2a and 2b as the insertion member 19 to reduce the difference in thermal expansion coefficient. Furthermore, in order to prevent peeling and cracking at the pin-adhesive and resin-adhesive interfaces due to the difference in thermal expansion coefficient, the airtight member 1
The thermal stress at the interface can be reduced by the taper 20 (described later) of the groove of the connector housing 1 that fills the space 1. (Third Step) Also, in order to increase the pull-out strength of the pins 2a and 2b, the pins 2a and 2b are bent inside the connector housing 1 to improve the pressure resistance, and the resin of the connector housing 1 and the pins 2a and 2b are further improved. In order to minimize the stress on the bonding interface due to the difference in the coefficient of thermal expansion of the metal, the bending point is provided on the adhesive side, that is, on the groove bottom surface of the concave portion of the connector housing 1. In this regard, the present inventors have conducted intensive studies, and as a result, in the semiconductor pressure detector of the present embodiment, the bending point-
It was effective to set the distance between the bonded portions to 3 mm or less. The lower limit is preferably 0.5 mm as a level having no problem in resin molding, although it varies depending on molding conditions. As described above, in this embodiment, the effective range between the bending point and the bonding portion is set to 0.5 mm to 3 mm.

A circuit board 10 is electrically and mechanically connected to each end of the pins 2a and 2b in the recess of the connector housing 1 by a conductive joining member 15, for example, a conductive adhesive such as solder or silver paste. I have. (Fourth Step) The circuit board 10 is provided with a processing circuit that is electrically connected to and cooperates with the pressure-sensitive element 5, and processes or adjusts a signal from the pressure-sensitive element 5. When the pressure element 5 is an integrated sensor element having a processing circuit, it protects the pressure-sensitive element 5 or is a disk-shaped capacitor or the like for removing noise.
The pressure-sensitive element 5 is electrically connected to the pressure-sensitive element 5 via a bonding wire 12 via a chip terminal 6 fixed at 5 or the like.

The pedestal 4 is made of glass or the like, and is hermetically fixed to the connector housing 1 by a joining member 18 such as an adhesive (sealant) such as silicone. The pressure-sensitive element 5 is hermetically joined to the pedestal 4 by anodic bonding or the like. I have. in this way,
Pressure-sensitive element 5 provided in recess of connector housing 1
Are electrically connected to the circuit board 10 by bonding wires 12. (Fifth Step) Although not used this time, in order to enhance the airtight reliability against temperature change, a filler or an insertion member 19 is also inserted into the joining member 18 as in the case of the airtight member 11, and the pin 2 is inserted.
It is effective to reduce the difference between the coefficients of thermal expansion and a and b.

A pressure reference chamber 9 is formed between the pressure-sensitive element 5 and the pedestal 4, and can detect an absolute pressure by applying a vacuum. In the center of the pedestal 4 and the housing connector 1, ventilation holes 4a indicated by dotted lines as shown in FIG.
By providing 1a and bringing the reference pressure of the measured pressure into the connector, the relative pressure can be easily detected.

An O-ring 8 is provided between the connector housing 1 and the holding member 14 so as to be airtight. The O-ring 8 is sandwiched from above and below in the figure, and the entire circumference of the connector housing 1 is fixed by the upper end 3a of the main body housing 3. are doing. (Sixth Step) After the pressure-sensitive element 5 and the circuit board 10 are arranged in the concave portion of the connector housing 1 and the main body housing 3 is attached thereto, fluorosilicone oil or the like is sealed from the sealing hole 1b by vacuum sealing or the like. Liquid 1 acting as pressure transmission medium
3 is filled to form a pressure detection chamber. The sealing hole 1b after filling with the sealing liquid 13 is hermetically sealed. As a sealing means, an elastic material such as a packing made of spherical rubber (for example, rubber ball) or a cylindrical rubber having projections on the circumference thereof is used. Member 16
The elastic member 16 is inserted into the sealing hole 1b. The elastic member 16 is fixed by deforming the projection 1c by heat staking via a small plate-like member 17 such as a spacer, and the sealing hole 1b is hermetically sealed. If the small member 17 is fixed by ultrasonic welding or the like, the sealing hole 1b can be hermetically sealed without heat caulking. Also, 1
In the case of a low pressure of about 0 atm, it is also possible to hold the elastic member 16 only by heat staking without using the small member 17 and hermetically seal the sealing hole 1b. (Seventh Step) Here, when the elastic member 16 is inserted into the sealing hole 1b, the volume of the sealing liquid 13 pushes up the seal diaphragm 7, so that the internal pressure of the sealing liquid 13 increases. In order to minimize the increase in the internal pressure, the amount of increase in the internal pressure when the elastic member 16 is inserted in the manufacturing process is predicted, and the seal diaphragm 7 is pressurized through the pressure introduction hole 3b of the main body housing 3 in advance so that the seal diaphragm 7 is mounted. It shifts to the side.
(Eighth Step) When the semiconductor pressure detector of the present invention is manufactured, the eighth step is not necessarily required, and the necessity of the eighth step is determined according to the use environment of the semiconductor pressure detector. Is done. That is, it is required when the use environment is 15 atm or less, and is unnecessary when the use environment is 30 atm or more. When the use environment is more than 15 atm and less than 30 atm (15 to 30 atm), the output accuracy of the pressure-sensitive element 5 is appropriately determined. decide. Here, in the case of 15 to 30 atmospheres, the eighth step is appropriately performed depending on the application, for example, when high-precision output is required, it is necessary when high-precision output is not required. A negative decision is made.

In the semiconductor pressure detector having the above-described structure, a taper 20 is provided in the groove of the connector housing 1 in order to prevent a crack of the airtight member 11 and peeling of the adhesive interface due to a temperature change. Figure 20 shows the shape of 20
This will be described below with reference to FIG. In order to prevent cracking or peeling due to temperature change, it is important to consider the following three points. First, the airtight member 11
To minimize the volume change due to thermal expansion as much as possible. Second, the area of the open portion 21 serving as a free end is increased to minimize the stress given to the bonding interface by the change in volume. Third, the bonding area is increased as much as possible to improve the bonding strength. The shape as shown in FIG. 2 taking these three points into consideration is used as the basic shape of the groove of the connector housing 1 of this embodiment.

Further, as shown in FIG.
The surface of the taper 20 to be a curved surface with an R in order to reduce the amount of the surface, or to provide a gather (not shown) having a wavy uneven shape as viewed from above in order to increase the area of the bonding interface. Thereby, it is also possible to further increase the bonding area and the bonding strength. Thus, the taper 20
The sealing member 11 is inserted into the basic shape of the groove of the connector housing 1 having the above-described structure. Further, the insertion member 19 having a lower coefficient of thermal expansion than the sealing member 11 is inserted into the sealing member 11 to improve the sealing reliability. As a result, cracking of the airtight member 11 and peeling at the bonding interface are suppressed, and the reliability of the temperature resistance change is greatly improved.

Next, an electrical connection state between the pressure-sensitive element 5 and the circuit board 10 by the bonding wire 12 will be described below with reference to FIGS. FIG. 4 is an enlarged view of a main part showing a connection state of the present embodiment, in which a portion of a conductor 22 provided on a circuit board 10 and a pin 2a (2b) are connected by a conductive joining member 15, and The chip terminal 6 is provided on the other part by the conductive bonding member 15,
A protective film 23 is formed on at least the remaining portion of the conductor 22. The other end of the bonding wire 12 is connected to the chip terminal 6, and the other end is connected to the pressure-sensitive element 5.

As shown in FIG. 5, the bonding wire 12 can be directly connected to the conductor 22 without using the chip terminal 6. Thus, the circuit board 10 constituting the processing circuit is designed so that the pressure-sensitive element 5 outputs desired characteristics.
Adjustment signal transmitting means for supplying an adjustment signal from the outside to the pressure-sensitive element 5 through the power supply means for operating the pressure-sensitive element 5, and an output signal from the pressure-sensitive element 5 to the outside via the circuit board 10. An output signal transmitting means for supplying is provided, electrical connection is established between the pressure-sensitive element 5 and the circuit board 10, and an output characteristic with respect to a pressure change can be obtained.

Here, the electrical connection between the pressure-sensitive element 5 and the circuit board 10 may be configured as shown in FIG. 6 separately from the configurations shown in FIGS. That is, the end is the pressure-sensitive element 5
The other end of the bonding wire 12 connected to
a, 2b is directly bonded, and then the entirety of the heads 24 of the pins 2a, 2b is covered with the conductive bonding member 15 including the connection portion of the bonding wire 12,
Bonding wire 12, pins 2a, 2b and circuit board 1
This is a configuration for electrically connecting the conductor 22 on the zero. With such a configuration, since the pins 2a and 2b, the conductor 22 on the circuit board 10, and the connection portion of the bonding wire 12 are connected at one place, the area required for connection is eliminated because the chip terminal 6 is not required. Becomes smaller. Therefore, the circuit area can be reduced, and the size can be reduced. In addition, since the connection portion directly wire-bonded to the pins 2a and 2b is covered with the conductive bonding member 15, the reliability is improved, which is extremely effective under severe use conditions such as automobiles.

The circuit board 10 is applicable to all types of capacitors, such as resin, ceramic, and plate-like capacitors, on which conductors can be printed. Surface treatment of the pins 2a, 2b;
When wire bonding is difficult due to flatness, flatness, etc.,
As means for improving the reliability of fixing the circuit board 10, FIG.
It is preferable to employ a cap-like auxiliary member 25 as described above.
According to FIG. 7, a conductive joining member 27 such as solder or silver paste is provided on the end surfaces of the pins 2a and 2b, and an auxiliary member 25 is arranged. Subsequently, the bonding wire 5 is placed on the auxiliary member 25.
Are bonded, and a conductive bonding member 15 is provided so as to cover the connection portion and reach the conductor 22. The open end surface of the auxiliary member 25 is provided with a so-called collar 26 having a shape that is folded outward, and the collar 26 supports the circuit board 10 and reduces the strength load on the conductive bonding member 15. And the conductive bonding member 15
Is prevented from dropping downward in the figure, and the reliability is further improved.

Next, as a sealing means after the elastic member 16 is inserted into the sealing hole 1b, a structure shown in FIG. 8 or FIG. 9 described below is used instead of the structure shown in FIG. You may. 8 and 9 are explanatory views showing the hermetically sealed state of the sealing hole 1b. According to FIG. 8, as sealing means after the elastic member 16 is inserted into the sealing hole 1b after filling with the sealing liquid. The ring-shaped holding member 27 is viewed from the direction indicated by the arrow in the drawing.
The holding member 27a is fixed by caulking the lower caulking portion 28 by using a means for fitting a. -, Fig. 9
According to the method, a means for fitting a holding member 27b such as a C-shaped spring from a direction shown by an arrow in the drawing is employed as a sealing means, and the holding member 27b is fixed. It should be noted that the holding members 27a, 2
The corresponding portion of the connector housing 1 where the connector 7b is provided needs to have a shape adapted to each as shown in each drawing, and can be easily formed by ordinary resin molding.

As described above, since the protrusion 1c of the connector housing 1 is deformed by using the elastic member 16 and the holding members 27a, 27b are used as the means for hermetically sealing the sealing hole 1b, this is usually implemented. Higher airtightness can be obtained by simple processing and sealing of the housing as compared with a method of sealing the hole of the metal housing with a metal ball (both not shown).

Also, the pins 2 inside the connector housing 1
a, 2b are bent and the pins 2a, 2b are opened so as to protrude in the pressure detection chamber, that is, a position (0. (5 mm to 3 mm), the reliability is greatly improved in this respect.

Also, as shown in FIG. 1, one end of a pin 2b serving as an adjustment terminal is opened in a concave portion on the pressure receiving side of the connector housing 1, and the other end is provided on a fitting side to be fitted with an external connector (not shown). It is provided in the recess so as to project together with the pin 2a. As a result, it is possible to completely prevent a characteristic defect or the like due to contact with an external conductive member. Since the adhesive used for mounting the adjustment terminal, which is usually used, is not required, the reliability in this point is improved. Furthermore, if a waterproof connector housing is used, its reliability is further improved.

Further, in the case where the processing circuits shown in this embodiment are all pressure-sensitive elements integrated in the pressure-sensitive element 5, that is, a so-called processing circuit-body type pressure-sensitive element, the configuration shown in FIG. Can be taken. That is, FIG. 10 is a cross-sectional view of an essential part of a part of the overall schematic diagram in the case of using the processing circuit-body-type pressure-sensitive element. In the semiconductor pressure detector of FIG.
0 is removed, a processing circuit-body-type pressure-sensitive element 29 is placed on the pedestal 4 instead of the pressure-sensitive element 5, and the electrical connection with the pins 2a and 2b is performed by the bonding wire 12. . The configuration of the other parts other than this is exactly the same as that of the present embodiment, and the description thereof will be omitted.

In the semiconductor pressure detector having the above-described structure, parts such as hermetic seals which have been conventionally used are not used at all, and the connector housing 1 is provided with a recess having a liquid seal structure. Is a pressure detection chamber, and furthermore, all parts of the circuit such as the circuit board 10 are accommodated in the sealed liquid 13 in the pressure detection chamber. The liquid sealing structure of only one chamber without any parts is extremely simplified, inexpensive and has high productivity. And the connector housing 1
Surface between the body and the housing 3, and the pins 2a and 2b
The upper surface of the groove of the concave portion where each end is opened, and the filled liquid 13
Since each part such as the sealing hole 1b after sealing is sealed airtightly, it is possible to perform airtight sealing when one chamber is formed. Therefore, the use is not limited, and the range of use is greatly expanded.

Although the O-ring 8 is used to seal the space between the connector housing 1 and the holding member 14,
The connector housing 1 and the main body housing 3 can be hermetically bonded with an adhesive (sealant) such as silicone. When fluorosilicone is used as the airtight member 11, silicone oil can be used as the sealing liquid 13.

In this embodiment, the other ends of the pins 2a and 2b, each of which is open in the pressure detection chamber, are formed in a recess on the fitting side of the connector housing 1 in which the external connector is fitted. However, when it is not necessary to connect with an external connector, a wire harness or the like (not shown) is directly connected to each of the other ends.
And a signal is exchanged with the outside by hermetically sealing this connection portion with a filler or the like.

Further, in the semiconductor pressure detector of the present invention, various measures are devised at each position, but it goes without saying that various modifications can be made without departing from the spirit of the invention.

[0038]

As described above, according to the present invention, a pressure sensing element and a processing circuit are provided in a pressure detecting chamber in a housing, and a signal to and from an external device is transmitted through signal transmitting means internally connected to the housing. Since the exchange is performed, there is an excellent effect that the liquid sealing structure of only one chamber can be formed without providing the two airtight portions of the pressure detection chamber and the circuit chamber.

Further, the joint surface between the first housing and the second housing, the upper surface of the groove of the concave portion in which each end of the adjustment signal transmission terminal, the power transmission terminal and the output signal transmission terminal is opened, and the pressure transmission medium Each part of the sealing hole after sealing is hermetically sealed without using a component such as a hermetic seal, so that the hermetic sealing when one chamber is formed can be satisfactorily performed.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an overall outline of a semiconductor pressure detector of the present invention.

FIG. 2 is an enlarged view of a main part of a tapered portion of the present invention.

FIG. 3 is an enlarged view of a main part of another tapered portion of the present invention.

FIG. 4 is an enlarged view of a main part of connection between the pressure-sensitive element of the present invention and a circuit board.

FIG. 5 is an enlarged view of another main part of the connection between the pressure-sensitive element of the present invention and a circuit board.

FIG. 6 is an enlarged view of still another main part of the connection between the pressure-sensitive element of the present invention and a circuit board.

FIG. 7 is an enlarged view of still another main part of connection between the pressure-sensitive element of the present invention and a circuit board.

FIG. 8 is an explanatory diagram showing another hermetically sealed state of the sealing hole of the present invention.

FIG. 9 is an explanatory view showing still another hermetically sealed state of the sealing hole of the present invention.

FIG. 10 is a cross-sectional view of a main part using a processing circuit-body type pressure-sensitive element of the present invention.

FIG. 11 shows a cross-sectional view of a conventional semiconductor pressure detector.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Connector housing (1st housing) 1b Enclosure hole 2a Pin (power transmission terminal, output signal transmission terminal) 2b Pin (adjustment signal transmission terminal) 3 Main body housing (2nd housing) 5 Pressure sensitive element 7 Seal diaphragm 8 O Ring 10 Circuit board 11 Airtight member 13 Filling liquid (pressure transmitting medium) 14 Pressing member 15 Conductive joining member 16 Elastic member 18 Joining member 19 Inserting member 20 Taper 21 Free end 22 Conductor 24 Head 25 Auxiliary member 27a, 27b Holding member 29 Processing circuit-body-shaped pressure-sensitive element

Continuation of the front page (72) Inventor Takashi Nagasaka 1-1-1, Showa-cho, Kariya-shi, Aichi Japan Denso Co., Ltd. (56) References JP-A-6-18344 (JP, A) JP-A-5-288620 (JP) JP-A-61-175537 (JP, A) JP-A-63-298129 (JP, A) JP-A-4-370727 (JP, A) JP-A-5-36334 (JP, U) JP-A-5-36334 (JP, U) 3-68036 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) G01L 9/04

Claims (18)

(57) [Claims] 1. A housing having a pressure detecting chamber for hermetically sealing a pressure transmitting medium, a pressure-sensitive element for outputting a signal corresponding to pressure, and a processing circuit electrically connected to and cooperating with the pressure-sensitive element. Signal transmitting means for transmitting and receiving signals between the pressure-sensitive element and the outside via the processing circuit, wherein the pressure-sensitive element and the processing circuit are provided in the pressure detection chamber, and A semiconductor pressure detector, wherein the signal transmission means electrically connected to the processing circuit is held inside the housing to transmit and receive signals between the pressure-sensitive element and the outside. 2. A housing having a pressure detection chamber for hermetically sealing a pressure transmitting medium, a pressure-sensitive element for outputting a signal corresponding to pressure, and a processing circuit electrically connected to and cooperating with the pressure-sensitive element. Adjusting signal transmitting means for supplying an adjusting signal to the pressure-sensitive element from the outside via the processing circuit so that the pressure-sensitive element outputs a desired characteristic; power transmitting means for operating the pressure-sensitive element; Output signal transmitting means for supplying an output signal from the pressure-sensitive element to the outside via the processing circuit, wherein the pressure-sensitive element and the processing circuit are provided in the pressure detection chamber, and the pressure-sensitive element and the processing A semiconductor pressure detector for transmitting and receiving signals between the pressure-sensitive element and the outside while holding the adjustment signal transmission means and the output signal transmission means electrically connected to a circuit inside the housing; . 3. An end of each of the adjusting signal transmitting means and the output signal transmitting means held inside the housing is opened in the pressure detecting chamber, and a predetermined portion of the pressure detecting chamber is opened by each of the negative ends. 3. The semiconductor pressure detector according to claim 2, further comprising an airtight member. 4. A pressure-sensitive element for outputting an electric signal corresponding to a pressure, a processing circuit electrically connected to and cooperating with the pressure-sensitive element, and an electrical connection between the pressure-sensitive element and the processing circuit. A bonding wire to be taken; an adjustment signal transmission terminal for supplying an adjustment signal to the pressure-sensitive element via the processing circuit so that the pressure-sensitive element outputs desired characteristics; and a power transmission terminal for operating the pressure-sensitive element. An output signal transmission terminal for supplying an output signal from the pressure-sensitive element to the outside via the processing circuit; and a recess, wherein the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission are provided in the depression. A first terminal provided with an encapsulating hole for enclosing a pressure transmitting medium for internally holding each terminal of the terminal so as to open the terminal and indirectly transmitting external pressure to the pressure-sensitive element;
And a second housing having a pressure introducing hole for introducing pressure from the outside, and sealed in the concave portion between the first housing and the second housing which is hermetically sealed via a seal diaphragm. There is the pressure-sensitive element, the processing circuit, and the wire bonding in the filled pressure transmitting medium, and when external pressure is guided from the pressure introducing hole, the seal diaphragm receives pressure and passes through the pressure transmitting medium. A semiconductor pressure detector for transmitting the pressure to the pressure-sensitive element. 5. The semiconductor pressure detector according to claim 4, wherein said seal diaphragm is provided at one end of said pressure introducing hole of said second housing. 6. A taper is provided in a groove of the recess where each of the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission terminal is opened, and an airtight member is provided inside the taper. The semiconductor pressure detector according to claim 4 or 5, wherein 7. The semiconductor pressure detector according to claim 6, wherein an insertion member having a lower coefficient of thermal expansion than the airtight member is provided inside the airtight member. 8. The terminal according to claim 4, wherein the adjustment signal transmission terminal, the transmission terminal, and the output signal transmission terminal held inside the first housing are bent inside the first housing. 8. The semiconductor pressure detector according to any one of claims 1 to 7. 9. A bending point at which the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission terminal bend inside the first housing are the adjustment signal transmission terminal, the power transmission terminal, and the output signal. 9. The semiconductor pressure detector according to claim 8, wherein each of the ends of the transmission terminal is 0.5 mm to 3 mm from the bottom of the groove of the concave portion in which the open end is formed. 10. The semiconductor pressure detector according to claim 4, wherein an elastic member is inserted into the sealing hole, and the sealing hole is hermetically sealed by sealing means. 11. The semiconductor pressure detector according to claim 10, wherein said sealing means is means for caulking around said sealing hole of said first housing via a small member. 12. The sealing device according to claim 1, wherein the holding member is a first member.
11. A semiconductor pressure detector according to claim 10, wherein said means is a means for fitting to said housing. 13. The pressure sensing element has one end of the bonding wire bonded thereto, and each of the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission terminal opened in the pressure detection chamber. The head of the end has the other end of the bonding wire directly bonded, and a conductive bonding member is simultaneously attached to at least a connection portion of the bonding wire of the head and a portion of the peripheral circuit to achieve the above-described sensing. 13. The semiconductor pressure according to claim 4, wherein electrical connection is established between the voltage element, the peripheral circuit, the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission terminal. Detector. 14. A conductive joining member is provided on the head at each of the ends of the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission terminal which are opened in the pressure detection chamber,
14. The semiconductor pressure detector according to claim 13, further comprising an auxiliary member, and bonding the other end of the bonding wire to the auxiliary member. 15. The other end of each of the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission terminal having one end opened in the pressure detection chamber, and the other end of the first housing fitted with an external connector. The semiconductor pressure detector according to any one of claims 4 to 14, wherein the semiconductor pressure detector is provided in a recess on the fitting side. 16. The semiconductor according to claim 1, wherein the pressure-sensitive element is a processing circuit-body type pressure-sensitive element in which the processing circuit is integrated in the pressure-sensitive element. Pressure detector. 17. A first step of hermetically joining a seal diaphragm to a negative end of a pressure introducing hole of a second housing, and an adjusting signal transmitting terminal and an electric power so that each negative end is opened in a concave portion of the first housing. A second step of internally holding the transmission terminal and the output signal transmission terminal in the first housing, and providing a tapered groove in the first housing around the opening, and inserting after the second step A third step of providing an airtight member having a member in the groove; and a processing circuit provided at each of the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission terminal, which is opened in a concave portion of the first housing. A fourth step of electrically connecting a circuit board that constitutes the first step, and a fourth step of joining a pressure-sensitive element to a pedestal fixed to the recess of the first housing and electrically connecting the circuit board to the circuit board via a bonding wire. 5 Forming a pressure detection chamber by interposing an O-ring between the airtightly joined surface of the second housing and the surface having the concave portion of the first housing, and forming the first housing and the second housing. After the sixth step of hermetically sealing the space between the pressure transmitting medium and the housing, the pressure transmitting medium is sealed and filled from the sealing hole, and then the elastic member is inserted into the sealing hole. And a seventh step of hermetically sealing the sealing hole. 18. The seal diaphragm by inserting the elastic member into the sealing hole and pressurizing the internal pressure rise generated in the pressure detection chamber from the pressure introducing hole in advance before the seventh step. 18. The method according to claim 17, further comprising an eighth step of shifting the pressure toward the pressure-sensitive element.